JP3088207U - Radiation temperature detector - Google Patents
Radiation temperature detectorInfo
- Publication number
- JP3088207U JP3088207U JP2002000943U JP2002000943U JP3088207U JP 3088207 U JP3088207 U JP 3088207U JP 2002000943 U JP2002000943 U JP 2002000943U JP 2002000943 U JP2002000943 U JP 2002000943U JP 3088207 U JP3088207 U JP 3088207U
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- temperature
- infrared sensor
- radiation
- heat sink
- radiation temperature
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Abstract
(57)【要約】
【課題】従来の方式では、急激な温度変化が発生した場
合、サーミスタ部と感熱受光部との温度に熱時定数の差
が生じ、この熱時定数の差は、対象温度の計測精度に影
響を及ぼし、急激な環境温度変化がある場合は、正確な
放射温度計測が行われないと云う問題点があった。
【解決手段】赤外線センサと放射温度検出装置の配線基
板との間に、赤外線センサと配線基板に面接続するヒー
トシンクを具備する事で、急激な環境温度の変化があっ
た場合に於いても、赤外線センサ自身の熱容量を増加さ
せる事で温度追従性を故意的に遅らせる事で環境温度の
変化に左右されない温度計測を実現させる。
(57) [Summary] In a conventional method, when a sudden temperature change occurs, a difference in thermal time constant occurs between the temperature of the thermistor unit and the temperature of the heat-sensitive light-receiving unit. There is a problem that accurate measurement of the radiation temperature is not performed when there is a sudden change in the environmental temperature, which affects the measurement accuracy of the temperature. A heat sink is provided between an infrared sensor and a wiring board of a radiation temperature detecting device, the heat sink being connected to a surface of the infrared sensor and the wiring board. By increasing the heat capacity of the infrared sensor itself, it is possible to intentionally delay the temperature followability, thereby realizing temperature measurement independent of changes in the environmental temperature.
Description
【０００１】[0001]
本考案は、対象物の放射温度を測温し、対象物の温度制御機能を具備した調理 器、エアコン、車載用エアコン、放射温度計等に搭載する放射温度検出装置の構 成に関する。 The present invention relates to a configuration of a radiation temperature detecting device which measures a radiation temperature of a target object and is mounted on a cooking device, an air conditioner, an air conditioner for a vehicle, a radiation thermometer, etc. having a temperature control function of the target object.
【０００２】[0002]
従来、対象物の温度を検出し、対象物の温度を制御する機能を具備した調理器 、エアコン、車載用エアコン、放射温度計等に搭載する放射温度検出装置の構成 は、図４の様に抵抗、コンデンサ、オペアンプ等の電子部品を実装し増幅回路が 形成された配線基板に赤外線センサが実装される。 この放射温度検出装置は、その使用用途に応じた保証環境温度範囲内で、正しく 放射温度計測が出来る様に構成かつ、設計されている。 Conventionally, the configuration of a radiant temperature detecting device mounted on a cooker, an air conditioner, a vehicle-mounted air conditioner, a radiant thermometer, etc. having a function of detecting the temperature of the target and controlling the temperature of the target is as shown in FIG. An infrared sensor is mounted on a wiring board on which electronic components such as resistors, capacitors, operational amplifiers, etc. are mounted and an amplification circuit is formed. This radiation temperature detector is constructed and designed so that it can measure radiation temperature correctly within the guaranteed environmental temperature range according to the intended use.
【０００３】 また、これらをエアコン、車載用エアコン、放射温度計等に搭載される場合は 、赤外線センサが表面に露出する形となり、装飾上の面より、赤外線センサの前 面に赤外線を透過するカバー材を用いる事が多い。 この様に構成された放射温度検出装置は、用途毎の環境温度、並びに環境温度変 化に左右される事なく対象物の放射温度を計測される。When these are mounted on an air conditioner, an on-vehicle air conditioner, a radiation thermometer, or the like, the infrared sensor is exposed on the surface, and the infrared light is transmitted from the decorative surface to the front surface of the infrared sensor. Cover materials are often used. The radiation temperature detector configured as described above measures the ambient temperature for each application and the radiation temperature of the target object without being affected by changes in the environmental temperature.
【０００４】[0004]
放射温度検出装置に搭載された赤外線センサは、自己温度と対象物の温度差に よって、出力信号が得られる。赤外線センサにとって、対象物の温度を正確に計 測する上では、赤外線センサ自身の自己温度が限りなく安定している事が望まし い。 The infrared sensor mounted on the radiation temperature detector can obtain an output signal based on the difference between its own temperature and the temperature of the object. For an infrared sensor to accurately measure the temperature of an object, it is desirable that the self-temperature of the infrared sensor itself be as stable as possible.
【０００５】 しかし、それぞれの用途に応じて、放射温度検出装置は搭載されるが、あらゆる 実使用条件下を想定すると赤外線センサを搭載した放射温度検出装置を取り巻く 環境温度は、急激な環境温度の変化が十分想定される。However, a radiation temperature detection device is mounted in accordance with each application. However, assuming all actual use conditions, the environmental temperature surrounding the radiation temperature detection device equipped with the infrared sensor becomes a sharp environmental temperature. Changes are expected.
【０００６】 赤外線センサ自身の自己温度をモニターする場合は、一般的にサーミスタ等の部 品を用いられ、対象物の温度計測は、感熱受光部となる。 急激な温度変化が発生した場合、その温度変化の追従性に於いて、サーミスタ部 と感熱受光部との温度に熱時定数の差が生じる。この温度追従に於いて熱時定数 の差は、対象温度の計測精度に影響を及ぼし、結果的に急激な環境温度変化があ る場合は、正確な放射温度計測が行われないと云う問題点があった。When monitoring the self-temperature of the infrared sensor itself, components such as a thermistor are generally used, and the temperature measurement of an object is performed by a heat-sensitive light receiving unit. When a sudden temperature change occurs, a difference in thermal time constant occurs between the temperature of the thermistor unit and the temperature of the heat-sensitive light receiving unit in the followability of the temperature change. The difference between the thermal time constants in this temperature tracking affects the measurement accuracy of the target temperature. As a result, if there is a sudden environmental temperature change, accurate radiation temperature measurement cannot be performed. was there.
【０００７】 また、エアコン、車載用エアコン、放射温度計等に搭載される場合は、赤外線セ ンサが表面に露出する形となり、装飾上の面より、赤外線センサの前面に赤外線 を透過するカバー材を用いる事が多いが、このカバー材自身の表面温度と赤外線 センサの自己温度と温差がある場合、装飾上のカバー材自身の温度を計測してし まうと云う課題もあった。 本考案は、これら環境温度の急激な変化による対象物の放射温度の計測誤差を軽 減させる事にあり、環境温度変化に左右されない放射温度検出装置を提供するも のである。Further, when the infrared sensor is mounted on an air conditioner, a vehicle air conditioner, a radiation thermometer, or the like, the infrared sensor is exposed on the surface, and a cover material that transmits infrared light from the decorative surface to the front of the infrared sensor. However, when there is a difference between the surface temperature of the cover material itself and the self-temperature of the infrared sensor, there is also a problem that the temperature of the cover material itself on the decoration is measured. The present invention is to reduce the measurement error of the radiation temperature of the object due to the rapid change of the environmental temperature, and to provide a radiation temperature detection device which is not affected by the environmental temperature change.
【０００８】[0008]
本考案は、前記の環境温度の変化による対象物の計測温度誤差の課題を解決す る為に、図１の様に、赤外線センサと放射温度検出装置の配線基板との間に、赤 外線センサと配線基板に面接触するヒートシンクを具備する事を特徴とし、また 装飾上の面より、赤外線センサの前面に赤外線を透過するカバー材がある場合は 、このカバー材と前記ヒートシンクとを面接触する事を特徴とした放射温度検出 装置である。 The present invention solves the above-mentioned problem of the measurement temperature error of the target object due to the change of the environmental temperature, as shown in FIG. 1, between the infrared sensor and the wiring board of the radiation temperature detection device by an infrared sensor. And a heat sink that makes surface contact with the wiring board, and when there is a cover material that transmits infrared light on the front surface of the infrared sensor from the surface on the decoration, this cover material makes surface contact with the heat sink. This is a radiation temperature detection device characterized by the following facts.
【０００９】[0009]
本考案は、図１の様に、赤外線センサと放射温度検出装置の配線基板との間に 、赤外線センサと配線基板に面接触するヒートシンクを具備し、また装飾上の面 より、赤外線センサの前面に赤外線を透過するカバー材がある場合は、このカバ ー材と前記ヒートシンクとを面接触する事で、急激な環境温度の変化があった場 合に於いて、赤外線センサ自身の熱容量を増加させる事で温度追従性を故意的に 遅らせ、またヒートシンクを介してカバー材と赤外線センサとを同一温度にする 事で、環境温度の変化に左右されない計測温度を実現できる。 As shown in FIG. 1, the present invention includes a heat sink between the infrared sensor and the wiring board of the radiation temperature detecting device, which is in surface contact with the infrared sensor and the wiring board. If there is a cover material that transmits infrared light, the heat capacity of the infrared sensor itself can be increased in the case of a sudden change in environmental temperature by making surface contact between the cover material and the heat sink. By deliberately delaying the temperature followability, and by making the cover and the infrared sensor the same temperature via a heat sink, it is possible to achieve a measurement temperature that is not affected by changes in the environmental temperature.
【００１０】[0010]
図１に本考案の放射温度検出装置の構成図を示す。図２には、本考案の放射 温度検出装置にカバー材を用いられる場合の構成図を示す。以下、これらの図に て本考案の実施例を具体的に述べる。 FIG. 1 shows a configuration diagram of the radiation temperature detecting device of the present invention. FIG. 2 shows a configuration diagram when a cover material is used in the radiation temperature detecting device of the present invention. Hereinafter, the embodiment of the present invention will be specifically described with reference to these drawings.
【００１１】 抵抗、コンデンサ、オペアンプ等の電子部品やコネクターを実装し増幅回路が 形成された配線基板（図１では、図が煩雑となる為こららの電子部品や配線パタ ーンは割愛した）上に、アルミ製のヒートシンクが、赤外線センサと配線基板に 挟まれる形で搭載、実装される。尚、この場合の赤外線センサは、温度計測に於 いて、チョッパ機構を必要としないサーモパイル型の赤外線センサを搭載した。 このアルミ製ヒートシンクは、配線基板面とヒートシンク面、赤外線センサの ステム底面とヒートシンク面が、それぞれ面接触させる様に、機械的に固定され る。 この様にして作製された放射温度検出装置を対象物の放射温度を非接触で計測 し、制御される機器に搭載し対象物の温度を５０℃で固定し、環境温度２５℃に 安定させた時点から放射温度計測装置の測温温度をモニター開始した。数分後、 実験的に環境温度を２℃/分の温度勾配で４０℃まで上昇させ、放射温度計測装 置から得られる計測温度をプロットした結果を図３の実線に示す。同時評価に於 いて、従来のヒートシンクを具備しない放射温度検出装置の結果を同様に図３の 点線に示す。この結果を見ると、ヒートシンクを具備した本考案の放射温度検出 装置から得られる計測温度は、環境温度が急激に変化しても対象物の温度５０℃ を示している事が分かる。これに対し、従来型は、急激な環境温度変化が始まり 、４０℃で安定するまでの間、対象物の温度を実際の５０℃よりも高く表示して しまい、正確な温度計測が行えたと云えない結果を示した。 これは、赤外線センサと配線基板にそれぞれ面接触する様に、アルミ製のヒー トシンクを具備する事により、熱容量を増加させ、急激な環境温度の変化を赤外 線センサ自身が直接受ける事を緩和させた効果があると云える。[0011] A wiring board on which an amplifier circuit is formed by mounting electronic components and connectors such as resistors, capacitors, operational amplifiers, etc. (In FIG. 1, these electronic components and wiring patterns are omitted because the diagram is complicated). On top, an aluminum heat sink is mounted and mounted between the infrared sensor and the wiring board. The infrared sensor used in this case was a thermopile type infrared sensor that did not require a chopper mechanism for temperature measurement. This aluminum heat sink is mechanically fixed so that the wiring board surface and the heat sink surface, and the stem bottom surface of the infrared sensor and the heat sink surface are in surface contact with each other. The radiation temperature detector thus fabricated was measured for the radiation temperature of the object in a non-contact manner, mounted on a controlled device, the temperature of the object was fixed at 50 ° C, and the ambient temperature was stabilized at 25 ° C. Monitoring of the temperature measured by the radiation thermometer was started from the time point. After a few minutes, the environmental temperature was experimentally raised to 40 ° C. with a temperature gradient of 2 ° C./min, and the result of plotting the measured temperature obtained from the radiation temperature measuring device is shown by the solid line in FIG. In the simultaneous evaluation, the results of the conventional radiation temperature detector without a heat sink are also shown by the dotted line in FIG. From these results, it can be seen that the measured temperature obtained from the radiation temperature detecting device of the present invention equipped with a heat sink indicates the temperature of the object at 50 ° C. even if the ambient temperature changes rapidly. On the other hand, in the conventional type, the temperature of the object is displayed higher than the actual temperature of 50 ° C. until a rapid change in the environmental temperature starts and stabilizes at 40 ° C., so that accurate temperature measurement can be performed. Showed no results. This is achieved by increasing the heat capacity by equipping the heat sink made of aluminum so that the infrared sensor and the wiring board are in surface contact with each other, and alleviating the infrared sensor itself from directly receiving sudden changes in environmental temperature. It can be said that there is an effect.
【００１２】 また、この考案の放射温度計測装置をエアコンへの搭載を試みた。但し、エ アコンの場合、赤外線センサ部が表面に露出すると装飾上ふさわしく無いため、 対象物の赤外線波長を透過させるカバー材を赤外線センサの前面に装着する必要 がある。この実験でのカバー材は、対象温度の赤外線波長範囲からポリエチレン を採用した。実験ではまず、本考案の放射温度検出装置とポリエチレンカバーと を接触させない状態での検証を行い、低温環境下から暖房運転させた。暖房運転 させる事で、放射温度検出装置周辺の環境温度が急激に変化するが、同様にポリ エチレンカバーの温度変化も発生した。本考案により、ヒートシンクを儲ける事 で、環境温度が変化しても対象物の温度を確実に検出する事が可能だが、このポ リエチレンカバーと放射温度検出装置は、接触していない為、それぞれの自己温 度に温度差が生じた為、計測温度がポリエチレン表面温度を計測してしまい、正 確な温度測定が出来ない結果となった。 次に、図２に示す様に、このポリエチレンカバーと放射温度検出装置に実装し たアルミ製のヒートシンクを面で機械的に接続し、同様に暖房運転を実施した。 その結果、ポリエチレンカバー温度と放射温度検出装置の赤外線センサ自己温度 は、温度的に同一温度となり一体化し、対象物の計測も正確に測温する事が出来 た。Further, an attempt was made to mount the radiation temperature measuring device of the present invention on an air conditioner. However, in the case of an air conditioner, if the infrared sensor part is exposed on the surface, it is not suitable for decoration, so it is necessary to attach a cover material that transmits the infrared wavelength of the object to the front of the infrared sensor. As the cover material in this experiment, polyethylene was adopted from the infrared wavelength range at the target temperature. In the experiment, first, the radiation temperature detector of the present invention was verified without contact with the polyethylene cover, and heating operation was performed in a low-temperature environment. The heating operation caused the ambient temperature around the radiation temperature detector to change rapidly, but the temperature of the polyethylene cover also changed. According to the present invention, it is possible to reliably detect the temperature of the target object even if the environmental temperature changes by increasing the heat sink, but since the polyethylene cover and the radiation temperature detection device are not in contact, Since the temperature difference occurred in the self-temperature, the measured temperature measured the polyethylene surface temperature, resulting in an inaccurate temperature measurement. Next, as shown in FIG. 2, the polyethylene cover and the aluminum heat sink mounted on the radiation temperature detection device were mechanically connected on the surface, and the heating operation was performed similarly. As a result, the temperature of the polyethylene cover and the self-temperature of the infrared sensor of the radiation temperature detection device became the same in terms of temperature, and they were integrated.
【００１３】 尚、これら実施例では、ヒートシンクの材質は加工容易性、経済性の面より アルミ選択したが、他の金属材質で同様の検証を行った結果でも同様の効果を得 ることが出来た。 また、装飾上の面で赤外線センサ前面に施されたポリエチレン製のカバー材も 赤外線を透過させる事ができるシリコンフィルターをカバー材として選択した場 合に於いても同様の効果を得る事が出来た。In these examples, the material of the heat sink was selected from aluminum in terms of workability and economy, but the same effect can be obtained by performing the same verification with other metal materials. Was. In addition, the same effect could be obtained when a silicone filter that can transmit infrared light was selected as the cover material for the polyethylene cover material applied to the front of the infrared sensor on the decorative surface. .
【００１４】[0014]
本考案の様に、赤外線センサと放射温度検出装置の配線基板との間に、赤外 線センサと配線基板に面接触するヒートシンクを具備し、また装飾上の面より、 赤外線センサの前面に赤外線を透過するカバー材がある場合は、このカバー材と 前記ヒートシンクとを面接触する事で、急激な環境温度の変化があった場合に於 いて、赤外線センサ自身の熱容量を増加させる事で温度追従性を故意的に遅らせ 、またヒートシンクを介してカバー材と赤外線センサとを同一温度にする事で、 環境温度の変化に左右されない計測温度を実現できる効果がある。 これらに於いて本考案は、工業的に価値がある。 As in the present invention, a heat sink is provided between the infrared sensor and the wiring board of the radiation temperature detection device to make surface contact with the infrared sensor and the wiring board. If there is a cover material that transmits light, this cover material comes into surface contact with the heat sink to increase the heat capacity of the infrared sensor itself in the event of a sudden change in environmental temperature. By intentionally delaying the performance and making the cover member and the infrared sensor the same temperature via a heat sink, there is an effect that a measurement temperature independent of a change in environmental temperature can be realized. In these, the present invention is industrially valuable.
【図１】本考案に於ける赤外線センサと配線基盤に面接
触するヒートシンクを具備した放射温度検出装置の概略
構造図。FIG. 1 is a schematic structural view of a radiation temperature detecting device having a heat sink in surface contact with an infrared sensor and a wiring board according to the present invention.
【図２】本考案の赤外線センサと配線基板に面接触する
ヒートシンクを具備した放射温度検出装置の前面にカバ
ー材を用いられる場合の構造図。FIG. 2 is a structural view of a case where a cover material is used on the front surface of a radiation temperature detecting device having a heat sink in surface contact with the infrared sensor and the wiring board according to the present invention.
【図３】検証結果のグラフ。FIG. 3 is a graph of a verification result.
【図４】従来の放射温度検出装置の概略構造図。FIG. 4 is a schematic structural view of a conventional radiation temperature detecting device.
１ 赤外線センサ ２ ヒートシンク ３ 配線基板 ４ 実装部品 ５ カバー材 DESCRIPTION OF SYMBOLS 1 Infrared sensor 2 Heat sink 3 Wiring board 4 Mounting component 5 Cover material
Claims (2)
温度検出装置に於いて、赤外線センサと放射温度検出装
置の配線基板との間に、赤外線センサと配線基板に面接
触するヒートシンクを具備する事を特徴とした放射温度
検出装置。1. A radiation temperature detecting device for measuring a radiation temperature of an object in a non-contact manner, wherein a heat sink is provided between an infrared sensor and a wiring board of the radiation temperature detecting device in surface contact with the infrared sensor and the wiring substrate. A radiation temperature detecting device comprising:
の放射温度検出装置が搭載される本体にヒートシンクを
面接触する事を特徴とした放射温度検出装置。2. A radiation temperature detecting device according to claim 1, wherein a heat sink is brought into surface contact with a main body on which the radiation temperature detecting device is mounted.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002000943U JP3088207U (en) | 2002-02-27 | 2002-02-27 | Radiation temperature detector |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002000943U JP3088207U (en) | 2002-02-27 | 2002-02-27 | Radiation temperature detector |
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|---|---|
| JP3088207U true JP3088207U (en) | 2002-09-06 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010100697A1 (en) * | 2009-03-04 | 2010-09-10 | パナソニック株式会社 | Induction heating device |
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2002
- 2002-02-27 JP JP2002000943U patent/JP3088207U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010100697A1 (en) * | 2009-03-04 | 2010-09-10 | パナソニック株式会社 | Induction heating device |
| CN102342176B (en) * | 2009-03-04 | 2013-10-02 | 松下电器产业株式会社 | Induction heating device |
| US9414443B2 (en) | 2009-03-04 | 2016-08-09 | Panasonic Intellectual Property Management Co., Ltd. | Induction heating device |
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