JP3078620B2 - Printed circuit board braking device and braking method - Google Patents
Printed circuit board braking device and braking methodInfo
- Publication number
- JP3078620B2 JP3078620B2 JP03263463A JP26346391A JP3078620B2 JP 3078620 B2 JP3078620 B2 JP 3078620B2 JP 03263463 A JP03263463 A JP 03263463A JP 26346391 A JP26346391 A JP 26346391A JP 3078620 B2 JP3078620 B2 JP 3078620B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- mounting part
- mounting
- mounting portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Laser Beam Processing (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子機器製造分野にお
けるプリント基板の製造に関し、特に、実装完了後のプ
リント基板を製品部と不要部に切り離す、プリント基板
ブレーキング装置およびブレーキング方法に関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the manufacture of printed circuit boards in the field of electronic equipment manufacturing, and more particularly to a printed circuit board braking apparatus and method for separating a mounted printed circuit board into a product part and an unnecessary part. It is.
【０００２】[0002]
【従来の技術】従来の技術を図５から図８に基づいて説
明する。2. Description of the Related Art A conventional technique will be described with reference to FIGS.
【０００３】従来の第１の方法は、図５に示すように、
実装が完了したプリント基板を製品になる実装部１８と
不要になる非実装部１９に切り離す際に、人手によっ
て、それ等の接続部２０に剪断力を加えて実装部１８と
非実装部１９とを切り離している。The first conventional method is as shown in FIG.
When the printed circuit board on which mounting has been completed is separated into the mounting portion 18 that becomes a product and the non-mounting portion 19 that becomes unnecessary, a shearing force is applied to the connecting portions 20 by hand, and the mounting portion 18 and the non-mounting portion 19 are separated. Is disconnected.
【０００４】従来の第２の方法は、図６に示すように、
実装が完了したプリント基板（図示せず）を切り離し台
２４上に置いて、レバー２１をＡ方向に引き、切り離し
用金型２２をガイド２３に沿って下降させて、前記接続
部２０を切断して前記実装部１８と前記非実装部１９と
を切り離している。The second conventional method is as shown in FIG.
The printed circuit board (not shown) on which the mounting is completed is placed on the separation table 24, the lever 21 is pulled in the direction A, and the separation mold 22 is lowered along the guide 23 to cut the connection section 20. Thus, the mounting part 18 and the non-mounting part 19 are separated.
【０００５】[0005]
【発明が解決しようとする課題】上記の従来の方法で
は、人手や切り離し用金型によってプリント基板に機械
的な外力を加えて切り離しているので、電子部品が実装
された基板の実装部にも力や衝撃が加わり、極く少数で
はあるが、半田付けされた電子部品が飛散したり、部品
が損傷したり、多層基板の層間が剥離したりして、良品
の実装済み基板が破壊されるという問題点があった。In the above-mentioned conventional method, the printed circuit board is separated by applying a mechanical external force to the printed circuit board manually or by a separating mold. Forces and shocks are applied, but in a very small number, soldered electronic components are scattered, components are damaged, and layers of the multilayer board are peeled off, destroying good mounted boards There was a problem.
【０００６】又、人手によって作業する場合には、無人
化ができず、組立工程の自動化ができないという問題点
があった。Further, when working manually, there has been a problem that unmanned operation cannot be performed and the assembling process cannot be automated.
【０００７】一方、金型によって作業する場合にも、そ
の刃先の磨耗や劣化によって、接続部の切り離しがスム
ーズに行えなくなり、実装された基板への衝撃が増大す
る恐れがある。そして、この刃先の劣化を常時定量的に
管理できないので、作業の安定化が難しく、品質安定化
の障害になるという問題点があった。On the other hand, even when working with a mold, the connection portion cannot be cut off smoothly due to wear and deterioration of the cutting edge, and the impact on the mounted board may increase. Since the deterioration of the cutting edge cannot always be quantitatively managed, there has been a problem that it is difficult to stabilize the work and hinder quality stabilization.
【０００８】これらの対策として、最近では、図７に示
すように、切り離し案内溝孔２５の部分を大きくし、接
続部２０を細長くして、切り離し時の機械的衝撃を和ら
げるようにしているが、この結果、非実装部１９が接続
部２０を介して実装部１８を支持する強度が低下し、電
子部品実装工程通過中に、特に、リフロー工程通過中
に、リフローの熱によって、基板の剛性が低下し、実装
部品の重量の影響を受けて、基板に下反り現象が起こる
という問題点があった。この下反り現象があると、リフ
ロー後に、この基板の裏面に印刷する際に、図８に示す
ように、基板２６と基板支持板７の支持ピン６とのぎャ
ップ２７が不揃いとなり、基板の下面のバックアップが
不均一になるために、印刷工程で、印刷圧が基板中央部
と基板端部とで一定にならず、にじみが発生する場合が
あり、部品装着工程では基板の反りによる弾性のために
スプリングバック現象が起こり、部品を基板に正確に装
着出来ないという問題点が起こっている。As a countermeasure for these problems, recently, as shown in FIG. 7, the portion of the separation guide slot 25 is made large and the connecting portion 20 is made elongated to reduce the mechanical shock at the time of separation. As a result, the strength of the non-mounting portion 19 supporting the mounting portion 18 via the connection portion 20 is reduced, and the rigidity of the substrate is reduced by the heat of the reflow during the passage of the electronic component mounting process, particularly, during the reflow process. And there is a problem that the substrate is warped under the influence of the weight of the mounted components. When this downward warpage phenomenon occurs, when printing is performed on the back surface of the substrate after reflow, the gap 27 between the substrate 26 and the support pins 6 of the substrate support plate 7 becomes irregular as shown in FIG. Since the back-up of the lower surface is not uniform, the printing pressure may not be constant between the center of the board and the edge of the board during the printing process, and bleeding may occur. As a result, a springback phenomenon occurs, which causes a problem that components cannot be accurately mounted on a substrate.
【０００９】本発明は、上記に問題点を解決して、実装
済のプリント基板に剪断力を加えることなくその実装部
１８と非実装部１９とを切り離すことができるプリント
基板ブレーキング装置を提供することをその課題として
いる。The present invention solves the above-mentioned problems, and provides a printed circuit board breaking device capable of separating a mounted portion 18 and a non-mounted portion 19 without applying a shearing force to a mounted printed circuit board. Is the task.
【００１０】又、実装済のプリント基板を、その実装部
１８と非実装部１９とを切り離す際に、人手が不必要
で、その切断条件をディジタル的に制御できるプリント
基板ブレーキング装置を提供することをその課題として
いる。Further, there is provided a printed circuit board braking device which requires no manual operation when the mounted printed circuit board is separated from the mounting portion 18 and the non-mounting portion 19 and which can digitally control the cutting conditions. That is the challenge.
【００１１】更に、切り離し案内溝孔を不要にして、図
７に示す反り現象を軽減することができ、印刷工程での
印刷信頼性の向上と、電子部品装着工程での歩留りの向
上とを可能にするプリント基板ブレーキング装置を提供
することをその課題としている。Further, the need for the separation guide groove is eliminated, and the warpage phenomenon shown in FIG. 7 can be reduced, so that the printing reliability in the printing process and the yield in the electronic component mounting process can be improved. It is an object of the present invention to provide a printed circuit board braking device that performs the following.
【００１２】[0012]
【課題を解決するための手段】本発明のプリント基板ブ
レーキング装置は、上記の課題を解決するために、実装
が完了したプリント基板を、製品になる実装部とその周
囲に位置して不要になった非実装部とに切り離すプリン
ト基板ブレーキング装置であって、前記実装部と非実装
部とのうちでいずれか一方を保持する保持手段と、プリ
ント基板の前記実装部と非実装部との境界部を光線で照
射することにより前記実装部と非実装部とを切り離す光
線照射手段と、前記光線照射手段が前記プリント基板の
実装部と非実装部との境界部に沿って移動するように前
記保持手段と光線照射手段との相対位置を変化させる位
置決め手段と、前記光線照射手段により前記実装部と非
実装部との切り離しを行う時に前記保持手段よりわずか
に低い位置にあり、前記実装部と非実装部とのうちで前
記保持手段が保持しない方が自重で落下したものを搬出
する搬出手段とを備えたことを特徴とする。また、本発
明のプリント基板ブレーキング方法は、実装が完了した
プリント基板を、製品になる実装部とその周囲に位置し
て不要になった非実装部とに切り離すプリント基板ブレ
ーキング方法であって、前記実装部と非実装部とのうち
でいずれか一方を保持し、プリント基板の前記実装部と
非実装部との境界部を光線で照射することにより前記実
装部と非実装部とを切り離し、前記実装部と非実装部と
の切り離しを行う時に前記保持位置よりわずかに低い位
置にある搬出手段で前記実装部と非実装部とのうちで前
記保持手段が保持しない方が自重で落下したものを搬出
することを特徴とする。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, a printed circuit board breaking device according to the present invention disposes a printed circuit board, which has been mounted, on a mounting portion to be a product and around the mounting portion. A printed circuit board breaking device that separates the mounting part and the non-mounting part from each other, the holding means holding one of the mounting part and the non-mounting part, and the mounting part and the non-mounting part of the printed circuit board. A light beam irradiating unit that separates the mounting unit and the non-mounting unit by irradiating the boundary with a light beam, and the light beam irradiating unit moves along the boundary between the mounting unit and the non-mounting unit of the printed circuit board. Positioning means for changing the relative position between the holding means and the light irradiation means, and a position slightly lower than the holding means when the mounting part and the non-mounting part are separated by the light irradiation means. Characterized in that a discharge means for unloading those who said holding means does not hold among said mounting portion and a non-mounting portion is dropped by its own weight. Further, the printed circuit board braking method of the present invention is a printed circuit board braking method for separating a printed circuit board on which mounting has been completed into a mounting part that becomes a product and a non-mounting part that is unnecessary around the mounting part. Holding one of the mounting portion and the non-mounting portion, and separating the mounting portion and the non-mounting portion by irradiating a light beam on a boundary portion between the mounting portion and the non-mounting portion of the printed circuit board. When the mounting part and the non-mounting part are separated, the one of the mounting part and the non-mounting part which is not held by the holding means among the mounting part and the non-mounting part falls by its own weight with the unloading means located at a position slightly lower than the holding position. It is characterized by taking things out.
【００１３】[0013]
【作用】本発明のプリント基板ブレーキング装置および
ブレーキング方法は、上記した構成により、切り離し次
第、プリント基板の実装部と非実装部との中で保持手段
が保持しない方が、保持手段よりわずかに低い位置にあ
る搬出手段上に自重で落下することにより、実装部と非
実装部とが自然にきれいに分離されるため、強制的に押
外しする必要がない。従って、強制的に押外しすること
により、プリント基板の実装部や実装済みの部品が破損
することを防ぐことができ、自動的に安全に分離するこ
とができる。また、光線照射手段により切り離しを行う
だけで、保持手段が保持しない方が自然に分離され、わ
ずかに低い位置にある搬出手段上に落下するので、強制
的に押外すことが不要になるため、押外しに掛かる時間
分のタクトを短縮することができる。According to the printed circuit board braking apparatus and the braking method of the present invention, the holding means does not hold the mounting part and the non-mounting part of the printed circuit board as soon as they are separated. Since the mounting portion and the non-mounting portion are naturally and clearly separated from each other by their own weight on the carrying-out means located at a lower position, there is no need to forcibly remove the mounting portion. Therefore, by forcibly removing the printed circuit board, it is possible to prevent the mounting portion of the printed circuit board and the mounted components from being damaged, and to automatically and safely separate the printed circuit board. Also, only by separating by the light beam irradiation means, the one that is not held by the holding means is naturally separated and falls onto the carrying means at a slightly lower position, so that it becomes unnecessary to forcibly remove it, It is possible to reduce the tact of the time required for pushing and removing.
【００１４】又、境界部をその熱によって切り離してい
るので、境界部の切り離し案内溝孔を大きくする必要が
なくなり、実装部と非実装部とを接続する接続部を細長
くする必要がなくなり、接続部に実装部を支持するに充
分な強度を持たせ得るので、リフロー工程で問題となる
基板の反り現象を軽減できる。Further, since the boundary portion is separated by the heat, it is not necessary to enlarge the separation guide groove at the boundary portion, and it is not necessary to make the connecting portion connecting the mounting portion and the non-mounting portion elongated, and the connection portion is not elongated. Since the portion can have sufficient strength to support the mounting portion, the warping phenomenon of the substrate, which is a problem in the reflow process, can be reduced.
【００１５】[0015]
【実施例】本発明の第１実施例を図１に基づいて説明す
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described with reference to FIG.
【００１６】図１において、本発明の第１実施例は、レ
ーザ電源１と、光ファイバ５と、前記レーザ電源１が出
力するレーザを前記光ファイバ５に入射させるレーザ光
学系２と、前記光ファイバ５からのレーザを照射するレ
ーザ照射部４と、基板支持ピン６を有する基板支持板７
と、前記レーザ照射部４をＸＹ方向に移動させるＸＹロ
ボット３と、ガイド８に沿って上下して前記基板支持板
７を昇降させる上下シリンダ９と、切り離し前の実装済
のプリント基板を前記基板支持板７まで搬入し、切り離
し後の前記非実装部を搬出する搬送手段１０ａと、切り
離されて製品になる前記プリント基板の実装部を搬出す
る搬送手段１０ｂとを有する。Referring to FIG. 1, a first embodiment of the present invention comprises a laser power supply 1, an optical fiber 5, a laser optical system 2 for causing a laser output from the laser power supply 1 to enter the optical fiber 5, and A laser irradiator 4 for irradiating a laser from a fiber 5 and a substrate support plate 7 having substrate support pins 6
An XY robot 3 for moving the laser irradiation unit 4 in the XY directions, an upper and lower cylinder 9 for raising and lowering the substrate support plate 7 by moving up and down along a guide 8, and mounting the printed circuit board before separation to the substrate It has a transporting means 10a for carrying in the support plate 7 and unloading the non-mounted portion after the separation, and a transporting means 10b for unloading the mounted portion of the printed circuit board which is separated and becomes a product.
【００１７】次に、本発明の第１実施例の動作を図１、
図３、図４に基づいて説明する。Next, the operation of the first embodiment of the present invention will be described with reference to FIG.
A description will be given based on FIGS.
【００１８】始めに、上下シリンダ９が下降し、基板支
持板７は搬送手段１０ａより下に位置する。部品装着が
完了したプリント基板が搬送手段１０ａによって基板支
持板７の位置まで搬入される。上下シリンダ９が基板支
持板７を支持して、基板支持板７が搬送手段１０ａより
上にくるまで上昇し、基板支持板７によって、前記の搬
入されてきたプリント基板を、実装されて製品になる実
装部分で支持する。ＸＹロボット３が、図３に示すよう
に、レーザ照射部４を、前記実装部１８と前記非実装部
１９との間の境界部上にそって移動させ、レーザ照射部
４はレーザ３０を照射して、前記実装部１８と前記非実
装部１９とを接続する接続部２０を切り離しながら、或
いは、図４に示すように、前記実装部１８と前記非実装
部１９とを接続する境界線４０を切り離しながら移動す
る。基板支持板７は前記実装部１８よりも長さ幅ともに
短いので、前記の切り離し作業が終了すると、切り離さ
れた非実装部１９は、搬送手段１０ａ上に落下し、搬送
手段１０ａによって、所定の廃棄場所まで搬出される。
一方、搬送手段１０ｂのレールの間に、ガイド８と上下
シリンダ９とがあり、この搬送手段１０ｂのレールの間
隔は、基板支持板７の幅よりも大きく、前記の切り離さ
れた実装部の幅よりも小さくなっているので、上下シリ
ンダ９が基板支持板７及び前記実装部１８と共にガイド
８に沿って下降すると、その下降途中で、前記実装部１
８は搬送手段１０ｂのレールに載置され、搬送手段１０
ｂによって外部に搬出される。First, the upper and lower cylinders 9 are lowered, and the substrate support plate 7 is located below the transfer means 10a. The printed circuit board on which the component mounting is completed is carried into the position of the board support plate 7 by the transporting means 10a. The upper and lower cylinders 9 support the substrate support plate 7 and move up until the substrate support plate 7 is higher than the transporting means 10a. The printed circuit board thus loaded is mounted on the product by the substrate support plate 7 and mounted on a product. It is supported by the mounting part. As shown in FIG. 3, the XY robot 3 moves the laser irradiation unit 4 along the boundary between the mounting unit 18 and the non-mounting unit 19, and the laser irradiation unit 4 irradiates the laser 30. Then, while disconnecting the connecting portion 20 connecting the mounting portion 18 and the non-mounting portion 19, or as shown in FIG. 4, a boundary line 40 connecting the mounting portion 18 and the non-mounting portion 19 is formed. Move while disconnecting. Since the board supporting plate 7 is shorter in length and width than the mounting portion 18, when the separating operation is completed, the separated non-mounting portion 19 falls onto the transporting means 10a, and is fixed by the transporting means 10a. It is transported to the disposal site.
On the other hand, there is a guide 8 and an upper and lower cylinder 9 between the rails of the transporting means 10b, and the distance between the rails of the transporting means 10b is larger than the width of the substrate support plate 7, and the width of the separated mounting portion. When the upper and lower cylinders 9 descend along the guide 8 together with the substrate support plate 7 and the mounting portion 18, the mounting portion 1
8 is mounted on the rail of the conveying means 10b,
b is carried out to the outside.
【００１９】本発明の第２実施例を図２、図３、図４に
基づいて説明する。A second embodiment of the present invention will be described with reference to FIGS.
【００２０】図２において、本発明の第２実施例は、レ
ーザ電源１と、光ファイバ５と、前記レーザ電源１が出
力するレーザを前記光ファイバ５に入射させるレーザ光
学系２と、前記光ファイバ５からのレーザを照射するレ
ーザ照射部４と、切り離し前の実装済のプリント基板を
搬入し、所定の位置に保持し、切り離し後の前記非実装
部１９を搬出する搬送手段１１ａと、切り離されて製品
になる前記プリント基板の実装部１８を搬出する搬送手
段１１ｂと、搬送手段１１ａをＸＹ方向に移動させるＸ
Ｙロボット３とを有する。Referring to FIG. 2, a second embodiment of the present invention comprises a laser power supply 1, an optical fiber 5, a laser optical system 2 for causing a laser output from the laser power supply 1 to enter the optical fiber 5, and The laser irradiating unit 4 for irradiating the laser from the fiber 5, the mounted printed circuit board before separation is carried in, held at a predetermined position, and the transporting unit 11a for carrying out the non-mounted part 19 after separation is separated. Conveying means 11b for carrying out the mounting portion 18 of the printed circuit board, which is to be turned into a product, and X for moving the conveying means 11a in the XY directions.
And a Y robot 3.
【００２１】次に、本発明の第２実施例の動作を図２、
図３に基づいて説明する。Next, the operation of the second embodiment of the present invention will be described with reference to FIG.
This will be described with reference to FIG.
【００２２】始めは、ＸＹロボット３の移動によって、
これに一体に設けた搬送手段１１ａが、部品装着が完了
したプリント基板を前工程から搬送してくる外部の搬送
装置（図示せず）に接続していて、そこから、部品装着
が完了したプリント基板を受け取り、プリント基板の切
り離し後は不要になる非実装部１９を保持する。次い
で、ＸＹロボット３が移動して、前記プリント基板を、
レーザ照射部４の下の所定の位置に位置決めする。レー
ザ照射部４がレーザを照射し、ＸＹロボット３が前記プ
リント基板を保持して移動し、前記レーザは、前記実装
部１８と前記非実装部１９との境界部にそって、前記プ
リント基板の前記実装部１８と前記非実装部１９とを切
り離す。切り離された実装部１８は、搬送手段１１ｂ上
に落下する。搬送手段１１ｂは、前記実装部１８が落下
してくる衝撃を充分に吸収できるような素材のベルトコ
ンベアによって構成されており、落下してくる前記実装
部１８を受け止めて外部に搬出する。本発明のプリント
基板ブレーキング装置は、上記の実施例に限らず種々の
態様が可能である。例えば、第２実施例のベルトコンベ
ア型の搬送手段１１ｂを、第１実施例の基板支持板７
と、ガイド８と、上下シリンダ９と、搬送手段１０ｂの
代わりに、搬送手段１０ａの下に設置しても良い。又、
第１、第２実施例では、実装部１８と非実装部１９とを
切り離す光線として、レーザ３０を使用したが、レーザ
３０と同様に前記の切り離しができるものであれば、他
の種類の光線を使用しても良い。At first, by the movement of the XY robot 3,
Conveying means 11a provided integrally with this is connected to an external conveying device (not shown) that conveys the printed circuit board on which the components have been mounted from the previous process, from which the printed circuit on which the components have been mounted is connected. The board receives the board and holds the non-mounting portion 19 which becomes unnecessary after the printed board is separated. Next, the XY robot 3 moves to move the printed circuit board,
It is positioned at a predetermined position below the laser irradiation unit 4. The laser irradiating unit 4 irradiates a laser, and the XY robot 3 moves while holding the printed board, and the laser irradiates the printed board along the boundary between the mounting unit 18 and the non-mounting unit 19. The mounting part 18 and the non-mounting part 19 are separated. The separated mounting part 18 falls onto the transporting means 11b. The conveying means 11b is constituted by a belt conveyor made of a material capable of sufficiently absorbing the impact of the mounting portion 18 falling, and receives the falling mounting portion 18 and carries it out. The printed circuit board braking device of the present invention is not limited to the above-described embodiment, and various modes are possible. For example, the belt conveyor type transfer means 11b of the second embodiment is replaced with the substrate support plate 7 of the first embodiment.
Instead of the guide 8, the vertical cylinder 9, and the transporting means 10b, they may be installed below the transporting means 10a. or,
In the first and second embodiments, the laser 30 is used as a light beam for separating the mounting portion 18 from the non-mounting portion 19, but other types of light beams can be used as long as the laser 30 can be separated. May be used.
【００２３】[0023]
【発明の効果】本発明のプリント基板ブレーキング装置
は、従来は手作業で行っていたプリント基板ブレーキン
グ工程を自動化できるという効果を奏する。The printed circuit board breaking device of the present invention has an effect that the printed circuit board breaking process which has been conventionally performed manually can be automated.
【００２４】又、切り離し次第、プリント基板の実装部
と非実装部との中で保持手段が保持しない方が、保持手
段よりわずかに低い位置にある搬出手段上に自重で落下
することにより、実装部と非実装部とが自然にきれいに
分離されるため、強制的に押外しする必要がない。従っ
て、強制的に押外しすることにより、プリント基板の実
装部や実装済みの部品が破損することを防ぐことがで
き、自動的に安全に分離することができる。又、光線照
射手段により切り離しを行うだけで、保持手段が保持し
ない方が自然に分離され、わずかに低い位置にある搬出
手段上に落下するので、強制的に押外すことが不要にな
るため、押外しに掛かる時間分のタクトを短縮すること
ができる。Further, as soon as the holding means is not held between the mounting part and the non-mounting part of the printed circuit board as soon as it is detached, the holding means falls by its own weight onto the carrying-out means which is slightly lower than the holding means. Since the part and the non-mounting part are separated naturally and neatly, there is no need to forcibly remove the part. Therefore, by forcibly removing the printed circuit board, it is possible to prevent the mounting portion of the printed circuit board and the mounted components from being damaged, and to automatically and safely separate the printed circuit board. Also, only by separating by the light beam irradiation means, the one that is not held by the holding means is naturally separated and falls onto the carrying means at a slightly lower position, so that it becomes unnecessary to forcibly remove it, It is possible to reduce the tact of the time required for pushing and removing.
【００２５】又、実装部と非実装部との切り離し案内溝
孔を無くすることができるので、リフロー工程で発生す
るプリント基板の反り現象を軽減でき、リフロー工程後
に基板の裏面に施す、印刷の精度が向上し、又、電子部
品装着の不良率を低下させるという効果を奏する。Further, since the guide groove for separating the mounting portion from the non-mounting portion can be eliminated, the warping phenomenon of the printed circuit board generated in the reflow process can be reduced, and the printing process performed on the back surface of the substrate after the reflow process can be performed. This has the effect of improving accuracy and lowering the failure rate of mounting electronic components.
【００２６】更に、光線照射の出力条件を制御すること
ができるので、基板の切り離し条件が安定し、切り離さ
れた実装部の品質を安定化できるという効果を奏する。Further, since the output condition of the light beam irradiation can be controlled, there is an effect that the condition for separating the substrate is stabilized and the quality of the separated mounting portion can be stabilized.
【図１】本発明の第１実施例の斜視図である。FIG. 1 is a perspective view of a first embodiment of the present invention.
【図２】本発明の第２実施例の斜視図である。FIG. 2 is a perspective view of a second embodiment of the present invention.
【図３】本発明の光線照射手段の斜視図である。FIG. 3 is a perspective view of a light beam irradiation means of the present invention.
【図４】本発明で使用するプリント基板の平面図と正面
図である。FIG. 4 is a plan view and a front view of a printed circuit board used in the present invention.
【図５】第１の従来例の斜視図である。FIG. 5 is a perspective view of a first conventional example.
【図６】第２の従来例の斜視図である。FIG. 6 is a perspective view of a second conventional example.
【図７】従来例におけるプリント基板の平面図と正面図
である。FIG. 7 is a plan view and a front view of a printed circuit board in a conventional example.
【図８】従来例におけるプリント基板の反り現象の正面
図である。FIG. 8 is a front view of a warpage phenomenon of a printed circuit board in a conventional example.
３ ＸＹロボット（位置決め手段） ４ レーザ照射手段（光線照射手段） １０ａ 搬送手段 １０ｂ 搬送手段 １１ａ 搬送手段 １１ｂ 搬送手段 3 XY robot (positioning means) 4 Laser irradiation means (light beam irradiation means) 10a Transport means 10b Transport means 11a Transport means 11b Transport means
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平２−16789（ＪＰ，Ａ) 実開 平３−36380（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 3/00 H05K 13/00 ──────────────────────────────────────────────────続 き Continuation of front page (56) References JP-A-2-16789 (JP, A) JP-A-3-36380 (JP, U) (58) Fields investigated (Int. Cl. 7 , DB name) H05K 3/00 H05K 13/00
Claims (6)
なる実装部とその周囲に位置して不要になった非実装部
とに切り離すプリント基板ブレーキング装置であって、
前記実装部と非実装部とのうちでいずれか一方を保持す
る保持手段と、プリント基板の前記実装部と非実装部と
の境界部を光線で照射することにより前記実装部と非実
装部とを切り離す光線照射手段と、前記光線照射手段が
前記プリント基板の実装部と非実装部との境界部に沿っ
て移動するように前記保持手段と光線照射手段との相対
位置を変化させる位置決め手段と、前記光線照射手段に
より前記実装部と非実装部との切り離しを行う時に前記
保持手段よりわずかに低い位置にあり、前記実装部と非
実装部とのうちで前記保持手段が保持しない方が自重で
落下したものを搬出する搬出手段とを備えたことを特徴
とするプリント基板ブレーキング装置。1. A printed circuit board breaking device for separating a printed circuit board on which mounting has been completed into a mounting part to be a product and a non-mounting part that is unnecessary around the mounting part ,
Holds one of the mounting part and the non-mounting part
Holding means, and the mounting portion and the non-mounting portion of the printed circuit board.
By irradiating the border of the
Light beam irradiating means for separating the mounting part,
Along the boundary between the mounting part and the non-mounting part of the printed circuit board
Relative to the holding means and the light irradiation means so as to move
Positioning means for changing the position;
When separating the mounting part and the non-mounting part,
Slightly lower than the holding means,
Of the mounting parts, the one that the holding means does not hold is
A printed circuit board braking device, comprising: a discharging means for discharging a dropped object.
を下から支持する基板支持板からなり、搬出手段は、プ
リント基板の非実装部を搬出する請求項１記載のプリン
ト基板ブレーキング装置。 2. The printed circuit board braking device according to claim 1, wherein said holding means comprises a board supporting plate for supporting only a mounting portion of the printed circuit board from below, and said carrying out means carries out a non-mounted portion of said printed circuit board.
けた請求項２記載のプリント基板ブレーキング装置。 3. The printed circuit board braking device according to claim 2, wherein the substrate support plate has substrate support pins provided on an upper surface.
基板の実装部の幅よりも小さいレール幅を有する実装部
搬出手段を備え、前期基板支持板は前記実装部搬出手段
のレールの間に位置し、その位置にて上下動可能に備え
られ、プリント基板の非実装部が搬出手段により搬出さ
れた後に、前記実装部搬出手段よりも高い位置にあった
前記基板支持板が下降することにより、前記実装部が前
記実装部搬出手段のレール上に載置され搬出される請求
項２または請求項３記載のプリント基板ブレーキング装
置。 4. A mounting part carrying means having a rail width larger than the width of the board supporting plate and smaller than the width of the mounting part of the printed board, wherein the board supporting plate is located between the rails of the mounting part carrying means. Position, is provided so as to be able to move up and down at that position, after the non-mounting portion of the printed circuit board is unloaded by the unloading means, the board support plate that was at a higher position than the mounting portion unloading means descends 4. The printed circuit board breaking device according to claim 2, wherein the mounting portion is mounted on a rail of the mounting portion carrying-out means and carried out.
保持し、搬出手段は、プリント基板の実装部を搬出する
ベルトコンベアからなる請求項１記載のプリント基板ブ
レーキング装置。 5. The printed circuit board braking device according to claim 1, wherein the holding means holds a non-mounting portion of the printed circuit board, and the unloading means comprises a belt conveyor for unloading the mounted portion of the printed circuit board.
なる実装部とその周囲に位置して不要になった非実装部
とに切り離すプリント基板ブレーキング方法であって、
前記実装部と非実装部とのうちでいずれか一方を保持
し、プリント基板の前記実装部と非実装部との境界部を
光線で照射することにより前記実装部と非実装部とを切
り離し、前記実装部と非実装部との切り離しを行う時に
前記保持位置よりわずかに低い位置にある搬出手段で前
記実装部と非実装部とのうちで前記保持手段が保持しな
い方が自重で落下したものを搬出することを特徴とする
プリント基板ブレーキング方法。 6. A printed circuit board breaking method for separating a mounted printed circuit board into a mounting part to be a product and a non-mounting part which is unnecessary around the mounting part.
Hold either one of the mounting part and the non-mounting part, and separate the mounting part and the non-mounting part by irradiating a boundary part between the mounting part and the non-mounting part of the printed circuit board with light rays, When the mounting portion and the non-mounting portion are separated from each other, the unloading device located at a position slightly lower than the holding position and the one of the mounting portion and the non-mounting portion which is not held by the holding device falls by its own weight. A printed circuit board braking method, which comprises carrying out a work.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03263463A JP3078620B2 (en) | 1991-10-11 | 1991-10-11 | Printed circuit board braking device and braking method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03263463A JP3078620B2 (en) | 1991-10-11 | 1991-10-11 | Printed circuit board braking device and braking method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05102639A JPH05102639A (en) | 1993-04-23 |
| JP3078620B2 true JP3078620B2 (en) | 2000-08-21 |
Family
ID=17389858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP03263463A Expired - Fee Related JP3078620B2 (en) | 1991-10-11 | 1991-10-11 | Printed circuit board braking device and braking method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3078620B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101990480A (en) * | 2008-04-10 | 2011-03-23 | 应用材料股份有限公司 | Laser-scribing platform and hybrid writing strategy |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101990481A (en) * | 2008-04-10 | 2011-03-23 | 应用材料股份有限公司 | Laser-scribing platform |
| KR20120061865A (en) | 2009-08-06 | 2012-06-13 | 어플라이드 머티어리얼스, 인코포레이티드 | Methods and related systems for thin-film laser scribing with enhanced throughput |
-
1991
- 1991-10-11 JP JP03263463A patent/JP3078620B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101990480A (en) * | 2008-04-10 | 2011-03-23 | 应用材料股份有限公司 | Laser-scribing platform and hybrid writing strategy |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05102639A (en) | 1993-04-23 |
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