JP3077884B2 - Cooling structure of electronic equipment unit - Google Patents
Cooling structure of electronic equipment unitInfo
- Publication number
- JP3077884B2 JP3077884B2 JP07191127A JP19112795A JP3077884B2 JP 3077884 B2 JP3077884 B2 JP 3077884B2 JP 07191127 A JP07191127 A JP 07191127A JP 19112795 A JP19112795 A JP 19112795A JP 3077884 B2 JP3077884 B2 JP 3077884B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- metal plate
- high heat
- stud
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、インテル社「ｉ４８
６」等の大型の高発熱ＩＣを１つ有する電子機器ユニッ
トであって、特に工場の製造現場等で長時間連続運転さ
れる産業用電子機器ユニットの冷却構造に関する。BACKGROUND OF THE INVENTION The present invention relates to an i48
More particularly, the present invention relates to a cooling structure for an industrial electronic device unit that is operated continuously for a long time at a manufacturing site of a factory or the like.
【０００２】[0002]
【従来の技術】インテル社「ｉ４８６」等の大型の高発
熱ＩＣを冷却するため、そのＩＣ上に直接、そのＩＣの
垂直上方から見てほぼ同じ大きさの超小型の電動ファン
を取り付けて、強制冷却する方式が知られている。一
方、実開平１−１３９４９４号公報には、複数のＩＣの
上面部に金属ブロックを接着し、その複数の金属ブロッ
ク上に共通して１枚の放熱板を密接固着し、その放熱板
が筐体に固着されたものが開示されている。2. Description of the Related Art In order to cool a large high-heat IC such as an Intel "i486", an ultra-small electric fan having the same size as that of the IC as viewed from vertically above the IC is mounted directly on the IC. A method of forcibly cooling is known. On the other hand, Japanese Utility Model Laid-Open Publication No. 1-139494 discloses that a metal block is adhered to the upper surface of a plurality of ICs, and a single heat sink is tightly fixed in common on the plurality of metal blocks. An object secured to the body is disclosed.
【０００３】[0003]
【発明が解決しようとする課題】ところが、電動ファン
を使用する従来のものは、電動ファンの耐久性や、電動
ファンからの電磁ノイズの発生等に難点があり、工場の
製造現場等で長時間連続運転されるものには適用できな
かった。また、実開平１−１３９４９４号公報に示され
るものは、複数のＩＣに対して共通の１枚の放熱板とな
るので、放熱効果が低く、さらに、その放熱板が金属の
場合は、筐体接地（フレームグランド）となり、電磁ノ
イズを拾ってしまい、ＩＣに悪影響を与えるという問題
がある。そこで、本発明は、電磁ノイズを拾うことな
く、また強制冷却手段を用いることなく大型の高発熱Ｉ
Ｃを冷却できる電子機器ユニットを提供することを目的
とする。However, the conventional fan using an electric fan has drawbacks such as durability of the electric fan and generation of electromagnetic noise from the electric fan. It could not be applied to those operated continuously. Further, the one disclosed in Japanese Utility Model Laid-Open Publication No. 1-139494 has a low heat radiation effect because it serves as one common heat sink for a plurality of ICs. There is a problem that the ground becomes (frame ground) and electromagnetic noise is picked up, which adversely affects the IC. Therefore, the present invention provides a large high heat generation I without picking up electromagnetic noise and without using forced cooling means.
It is an object to provide an electronic device unit that can cool C.
【０００４】[0004]
【課題を解決するための手段】 高発熱ＩＣを実装した
プリント基板と、前記高発熱ＩＣの上面部に接着した金
属ブロックと、前記金属ブロック上にネジ止めしたプリ
ント基板と略同一の大きさの放熱用金属板とを備え、前
記放熱用金属板の周辺部の少なくとも１箇所は前記プリ
ント基板にスタッドを介して固定してあり、前記金属ブ
ロックの高さは、前記スタッドの高さから前記高発熱Ｉ
Ｃの高さを引いた値である電子機器ユニットにおいて、
前記放熱用金属板の周辺部の少なくとも一箇所は、前記
プリント基板との間を固定してなる前記スタッドを介し
て、高発熱ＩＣの信号電位にグランドさせることを特徴
とする電子機器ユニットの冷却構造である。Means for Solving the Problems A printed circuit board on which a high heat generating IC is mounted , a metal block adhered to an upper surface of the high heat generating IC, and a printed circuit board having substantially the same size as the printed circuit board screwed on the metal block and a radiating metal plate, said at least one portion of the peripheral portion of the radiating metal plate Yes fixed via studs on the printed circuit board, said metal blanking
The height of the lock is determined by the height of the high heat I from the height of the stud.
In the electronic device unit, which is a value obtained by subtracting the height of C ,
At least one portion of the peripheral portion of the metal plate for heat radiation is
Via the stud, which is fixed between the printed circuit board
And a ground for the signal potential of the high heat generating IC .
【０００５】[0005]
【作用】上記手段により、工場の製造現場等で長時間連
続運転されるものには適用できない小型の電動ファンに
よる強制空冷を施すことなく、インテル社「ｉ４８６」
等の大型の高発熱ＩＣを容易にかつ長時間の運転に供す
ることのできる高信頼性を持った冷却方式を提供するこ
とができる。According to the above-mentioned means, the "i486" Intel Corporation can be used without performing forced air cooling with a small electric fan which cannot be applied to a device which is operated continuously for a long time at a manufacturing site of a factory.
It is possible to provide a highly reliable cooling system that can easily provide a large-sized high-heat-generating IC such as that described above for a long-time operation.
【０００６】[0006]
【実施例】以下、本発明の実施例を図に基づいて説明す
る。図１は構成図、図２は基板上のプリント配線例であ
る。図１（Ａ）は斜視図、図１（Ｂ）は、図１のＢ方向
から見た図である。さて、プリント基板１に実装された
高発熱ＩＣ２の上部に金属ブロック３を熱伝導性接着剤
４により接着する。この金属ブロック３と密着するよう
に、熱伝導性グリース９を介してプリント基板と概ね同
寸法の金属板５を実装する。熱伝導性グリース９は伝熱
性をよくするためのものであり、必須のものではない。
金属板５は放熱用であり、アルミ板が望ましい。金属板
５の４隅には、導電性のスタッド６によりプリント基板
１のシグナルグランドと接続するべく、スタッド固定用
の穴７を設けている。プリント基板にも、スタッド６を
介して金属板５と電気的に接続するためにスタッド固定
用の穴７とその周囲に配設されたランド１０を設けてい
る。すなわち、プリント基板１、プリント基板と概ね同
寸法の金属板５、スタッド６、金属ブロック３はネジ８
で固定し、高発熱ＩＣ２とその上部の金属ブロック３は
熱伝導性の接着剤で接着する。スタッド６の高さは、高
発熱ＩＣ２に金属ブロック３を積み重ねた高さと等しい
高さを有するものである。逆にいうと、金属ブロック３
の高さは、スタッド６の高さから高発熱ＩＣ２の高さを
差し引いたものとも言える。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a configuration diagram, and FIG. 2 is an example of printed wiring on a substrate. 1A is a perspective view, and FIG. 1B is a view as viewed from a direction B in FIG. Now, the metal block 3 is adhered to the upper part of the high heat generation IC 2 mounted on the printed circuit board 1 by the heat conductive adhesive 4. A metal plate 5 having substantially the same dimensions as the printed circuit board is mounted via a thermally conductive grease 9 so as to be in close contact with the metal block 3. The heat conductive grease 9 is for improving heat conductivity and is not essential.
The metal plate 5 is for heat dissipation, and is preferably an aluminum plate. Stud fixing holes 7 are provided at four corners of the metal plate 5 so as to be connected to the signal ground of the printed circuit board 1 by conductive studs 6. The printed circuit board is also provided with a stud fixing hole 7 and a land 10 disposed around the hole 7 for electrically connecting to the metal plate 5 via the stud 6. That is, the printed board 1, the metal plate 5, the stud 6, and the metal block 3 having substantially the same dimensions as the printed board are the screws 8
And the high heat generating IC 2 and the metal block 3 on the high heat generating IC 2 are bonded with a heat conductive adhesive. The height of the stud 6 is the same as the height of the metal block 3 stacked on the high heat generating IC 2. Conversely, the metal block 3
Can be said to be a value obtained by subtracting the height of the high heat generating IC 2 from the height of the stud 6.
【０００７】図２において、プリント基板上のプリント
配線は、プリント基板と概ね同寸法の金属板５を固定す
るスタッドをプリント基板のシグナルグランドに短絡さ
せるために、スタッド固定用穴７のランド１０をシグナ
ルグランドに配線している。多層基板であれば、そのラ
ンド１０からスルホールを介してシグナルグランド層に
接続し、両面基板であればシグナルグランドのパターン
配線に接続する。工場現場では、保安用のフレームグラ
ンドに接地すると、かえってノイズを拾う恐れがあるた
め、フレームグランドとは絶縁されているＣＰＵのシグ
ナルグランド（ＯＶ）に接地させるのである。これによ
り、放射雑音等の外部からの雑音に対しての耐久性が増
す効果がある。したがって、金属板５は放熱と耐雑音の
２面効果を有するのである。なお、図２では、四隅のス
タッド固定用穴７のランド１０から全てシグナルグラン
ドに接続している例を示しているが、ノイズ試験の結果
次第では必ずしも四隅ともシグナルグランドに接続する
必要はない。さらに、金属板５は平面であり、これを垂
直方向になるように電子機器を設置すれば、プリント基
板１と金属板５で熱気が上昇する空気の対流路が確保さ
れることになり、放射放熱より効果的である。In FIG. 2, the printed wiring on the printed circuit board has a land 10 of a stud fixing hole 7 for short-circuiting a stud for fixing a metal plate 5 having substantially the same dimensions as the printed circuit board to a signal ground of the printed circuit board. Wired to signal ground. In the case of a multi-layer board, the land 10 is connected to the signal ground layer via a through hole, and in the case of a double-sided board, it is connected to the signal wiring of the signal ground. At a factory site, if the ground is grounded to a frame ground for security, noise may be picked up. Therefore, the frame ground is grounded to the signal ground (OV) of the CPU which is insulated from the frame ground. This has the effect of increasing the durability against external noise such as radiation noise. Therefore, the metal plate 5 has two effects of heat radiation and noise resistance. FIG. 2 shows an example in which all the lands 10 of the stud fixing holes 7 at the four corners are connected to the signal ground, but it is not always necessary to connect the four corners to the signal ground depending on the result of the noise test. Further, the metal plate 5 is a flat surface, and if electronic devices are installed so as to be perpendicular to the metal plate 5, a convection path for air in which the hot air rises between the printed circuit board 1 and the metal plate 5 is secured. More effective than heat dissipation.
【０００８】[0008]
【発明の効果】以上述べたように、本発明によれば、工
場の製造現場等で長時間連続運転されているものには適
用できない小型の電動ファンによる強制空冷を施すこと
なく、大型の高発熱ＩＣを容易にかつ長時間の運転に供
することのできる高信頼性を持った冷却構造を提供する
ことができるばかりでなく、放熱用金属板を高発熱ＩＣ
の信号電位にグランドさせることにより、放射雑音等の
外部からの雑音に対しての耐久性が増し、また、電動フ
ァンを使用することが無いためにコストの削減などを見
込むことができる。As described above, according to the present invention, it is possible to eliminate the need for forced air cooling with a small electric fan, which cannot be applied to a machine that has been operated continuously for a long time at a manufacturing site in a factory, without using a large electric fan. In addition to providing a highly reliable cooling structure that can easily provide the heat-generating IC for long-term operation, the heat-dissipating metal plate can be used for the heat-generating IC.
By setting the signal potential to the ground, the durability against external noise such as radiated noise is increased, and the cost can be reduced because an electric fan is not used.
【図１】本発明の実施例を示す構造図FIG. 1 is a structural diagram showing an embodiment of the present invention.
【図２】本発明の実施例の基板上のプリント配線例FIG. 2 is an example of printed wiring on a substrate according to an embodiment of the present invention.
１…プリント基板、２…高発熱ＩＣ、３…金属ブロッ
ク、４…熱伝導性接着剤、５…金属板、６…スタッド、
７…スタッド固定用の穴、８…ネジ、９…熱伝導性グリ
ース、１０…ランドDESCRIPTION OF SYMBOLS 1 ... Printed circuit board, 2 ... High heat generation IC, 3 ... Metal block, 4 ... Thermal conductive adhesive, 5 ... Metal plate, 6 ... Stud,
7: Stud fixing hole, 8: Screw, 9: Thermal conductive grease, 10: Land
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 実開 昭59−159955（ＪＰ，Ｕ) 実開 平３−21895（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 23/40 H01L 23/36 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-59-159955 (JP, U) JP-A-3-21895 (JP, U) (58) Fields surveyed (Int. Cl. 7 , DB name) H01L 23/40 H01L 23/36
Claims (1)
前記高発熱ＩＣの上面部に接着した金属ブロックと、前
記金属ブロック上にネジ止めしたプリント基板と略同一
の大きさの放熱用金属板とを備え、前記放熱用金属板の
周辺部の少なくとも１箇所は前記プリント基板にスタッ
ドを介して固定してあり、前記金属ブロックの高さは、
前記スタッドの高さから前記高発熱ＩＣの高さを引いた
値である電子機器ユニットにおいて、前記放熱用金属板の周辺部の少なくとも一箇所は、前記
プリント基板との間を固定してなる前記スタッドを介し
て、高発熱ＩＣの信号電位にグランドさせる ことを特徴
とする電子機器ユニットの冷却構造。A printed circuit board on which a high heat generation IC is mounted ;
A metal block which is bonded to the upper surface portion of the high heat generating IC, and a said metal locking screw on the block and the printed board and having substantially the same size of the radiating metal plate, at a minimum in the periphery of the radiating metal plate One portion is fixed to the printed circuit board via studs, and the height of the metal block is
The height of the high heat generating IC was subtracted from the height of the stud.
In the electronic device unit that is the value, at least one portion of the peripheral portion of the heat dissipation metal plate is
Via the stud, which is fixed between the printed circuit board
Wherein the signal potential of the high heat generating IC is grounded .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP07191127A JP3077884B2 (en) | 1995-07-03 | 1995-07-03 | Cooling structure of electronic equipment unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP07191127A JP3077884B2 (en) | 1995-07-03 | 1995-07-03 | Cooling structure of electronic equipment unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0917921A JPH0917921A (en) | 1997-01-17 |
| JP3077884B2 true JP3077884B2 (en) | 2000-08-21 |
Family
ID=16269326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP07191127A Expired - Fee Related JP3077884B2 (en) | 1995-07-03 | 1995-07-03 | Cooling structure of electronic equipment unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3077884B2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005294312A (en) * | 2004-03-31 | 2005-10-20 | Matsushita Electric Ind Co Ltd | Substrate device |
| JP2007258385A (en) * | 2006-03-23 | 2007-10-04 | Yokogawa Electric Corp | Heat-sink device |
| JP5805114B2 (en) * | 2013-01-23 | 2015-11-04 | キヤノン株式会社 | Imaging apparatus and electronic apparatus |
| JP7130916B2 (en) * | 2017-01-13 | 2022-09-06 | ブラザー工業株式会社 | electronic device |
| JP6645487B2 (en) | 2017-10-30 | 2020-02-14 | セイコーエプソン株式会社 | Printed circuit board |
| JP7145413B2 (en) | 2018-10-25 | 2022-10-03 | セイコーエプソン株式会社 | Printed circuit boards, electronics, and thermal sheets |
-
1995
- 1995-07-03 JP JP07191127A patent/JP3077884B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0917921A (en) | 1997-01-17 |
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