JP3077382B2 - Liquid crystal display panel manufacturing method - Google Patents
Liquid crystal display panel manufacturing methodInfo
- Publication number
- JP3077382B2 JP3077382B2 JP04137202A JP13720292A JP3077382B2 JP 3077382 B2 JP3077382 B2 JP 3077382B2 JP 04137202 A JP04137202 A JP 04137202A JP 13720292 A JP13720292 A JP 13720292A JP 3077382 B2 JP3077382 B2 JP 3077382B2
- Authority
- JP
- Japan
- Prior art keywords
- substrates
- liquid crystal
- crystal display
- conductive
- sealing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【０００１】[0001]
【産業上の利用分野】この発明は、液晶表示パネルの製
造方法に係り、詳しくは、例えば、ＴＦＴ基板（薄膜ト
ランジスタ基板）とＣＦ基板（カラーフィルタ基板）を
貼り合わせてセルを組み立てるための液晶表示パネルの
製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a liquid crystal display panel, and more particularly, to a liquid crystal display for assembling cells by bonding a TFT substrate (thin film transistor substrate) and a CF substrate (color filter substrate). The present invention relates to a panel manufacturing method.
【０００２】[0002]
【従来の技術】従来、液晶表示素子のＴＦＴ基板とＣＦ
基板を貼り合わせるセル組立工程においては、図５に示
すように、熱硬化性のシール材を基板に印刷するととも
に導電ペーストを塗布し図６に示すように両基板１，２
を重ね合わせ、基板１，２の仮止めとして治具等で基板
を押さえ図６のＢで示す箇所に紫外線硬化性接着剤を塗
布し紫外線を照射して紫外線硬化性接着剤を硬化させ、
その後に熱処理してシール材を硬化させていた。つま
り、両基板１，２を接着するための熱硬化性のシール材
を印刷するとともに、両基板１，２の導通を確保するた
めの導電ペーストを塗布した後に、直ちにシール材を熱
硬化させると、シール材が熱硬化するまでの間に熱や圧
力や時間の影響により両基板間にズレが生じる。そのた
めに、特開平３−５９５３０号公報に開示されているよ
うに、両基板１，２を重ね合わせた後に紫外線硬化性接
着剤の塗布及び紫外線の照射を行って仮止めを行ってい
る。2. Description of the Related Art Conventionally, a TFT substrate of a liquid crystal display element and CF
In the cell assembling step of bonding the substrates, as shown in FIG. 5, a thermosetting sealing material is printed on the substrates, a conductive paste is applied, and both substrates 1 and 2 are coated as shown in FIG.
And holding the substrate with a jig or the like as a temporary fixing of the substrates 1 and 2, applying an ultraviolet-curable adhesive to a portion shown by B in FIG. 6 and irradiating ultraviolet rays to cure the ultraviolet-curable adhesive,
Thereafter, heat treatment was performed to cure the sealing material. That is, a thermosetting sealing material for bonding the two substrates 1 and 2 is printed, and after applying a conductive paste for ensuring conduction between the two substrates 1 and 2, the sealing material is immediately thermoset. In addition, a shift occurs between the two substrates due to the influence of heat, pressure and time until the sealing material is thermally cured. For this purpose, as disclosed in Japanese Patent Application Laid-Open No. 3-59530, after the two substrates 1 and 2 are overlaid, temporary fixing is performed by applying an ultraviolet-curable adhesive and irradiating ultraviolet rays.
【０００３】[0003]
【発明が解決しようとする課題】しかし、この仮止め工
程を導入した場合、作業性が悪く、その分、時間的にも
効率が悪くなるという不具合が生じてしまう。However, when the temporary fixing step is introduced, the workability is poor, and the efficiency is degraded in terms of time.
【０００４】そこで、この発明の目的は、ズレを防止し
つつ効率よく２枚の基板を貼り合わせることができる液
晶表示パネルの製造方法を提供することにある。An object of the present invention is to provide a method of manufacturing a liquid crystal display panel which can efficiently bond two substrates while preventing a displacement.
【０００５】[0005]
【課題を解決するための手段】上記目的を達成するため
に、請求項１に記載の発明は、電極を有する第１及び第
２の基板の少なくともいずれか一方に熱硬化性のシール
材を塗布するとともに、導電粒子を配合した導電性紫外
線硬化接着剤を塗布する第１工程と、前記両基板を重ね
合わせる第２工程と、前記導電性紫外線硬化接着剤に紫
外線を照射して、前記両基板の仮止め及び導通の確保を
同時に行う第３工程と、前記シール材を硬化させるため
に熱処理する第４工程とを備えた液晶表示パネルの製造
方法をその要旨とするものである。さらに、請求項２に
記載の発明は、請求項１に記載の発明において、導電性
紫外線硬化接着剤は、ウレタン系紫外線硬化接着剤に銀
粒子を分散して構成されており、前記接着剤の中の銀粒
子は、その粒径が１〜３μｍで、かつ、配合比が６０〜
７０重量％となっている液晶表示パネルの製造方法をそ
の要旨とするものである。 [MEANS FOR SOLVING THE PROBLEMS] To achieve the above object
In addition, the invention according to claim 1 is to apply a thermosetting sealing material to at least one of the first and second substrates having electrodes and to mix a conductive ultraviolet curable adhesive containing conductive particles. a first step of applying the second step of superimposing the substrates is irradiated with ultraviolet rays to the conductive UV curable adhesive, to secure temporary fixing and conduction of the two substrates
The gist is a method of manufacturing a liquid crystal display panel including a third step performed at the same time and a fourth step of performing a heat treatment to cure the sealing material. Further, in claim 2
The invention described in claim 1 is the invention according to claim 1,
UV-curable adhesives use urethane-based UV-curable adhesives with silver
Silver particles in the adhesive
The particles have a particle size of 1 to 3 μm and a mixing ratio of 60 to
70% by weight of the liquid crystal display panel manufacturing method.
The gist of this is.
【０００６】[0006]
【作用】請求項１に記載の発明によれば、第１工程によ
り、電極を有する第１及び第２の基板の少なくともいず
れか一方に熱硬化性のシール材が塗布されるとともに、
導電粒子を配合した導電性紫外線硬化接着剤が塗布さ
れ、第２工程により両基板が重ね合わされる。そして、
第３工程により導電性紫外線硬化接着剤に紫外線が照射
されて両基板の仮止め及び導通が確保され、第４工程に
よりシール材を硬化させるために熱処理される。その結
果、シール材印刷からシール硬化の熱処理までの工程が
簡略化される。また、請求項２に記載の発明によれば、
請求項１に記載の発明の作用に加えて、紫外線の透過率
に基づいて銀粒子の粒径及び配合比が決定された導電性
紫外線硬化接着剤を塗布することにより、紫外線の照射
で導電性紫外線硬化接着剤が充分に硬化されて両基板の
仮止め及び導通が確保される。 According to the first aspect of the present invention, in the first step, a thermosetting sealing material is applied to at least one of the first and second substrates having electrodes.
A conductive ultraviolet-curing adhesive containing conductive particles is applied, and the two substrates are superposed in the second step. And
In the third step, the conductive UV-curable adhesive is irradiated with ultraviolet rays to secure the temporary fixing and conduction between the two substrates , and in the fourth step, heat treatment is performed to cure the sealing material. As a result, the steps from the printing of the seal material to the heat treatment for hardening the seal are simplified. According to the second aspect of the present invention,
In addition to the function of the invention according to claim 1, the transmittance of ultraviolet rays
Conductivity determined silver particle size and compounding ratio based on
UV irradiation by applying UV curing adhesive
The conductive UV curable adhesive is fully cured by
Temporary fixing and conduction are ensured.
【０００７】[0007]
【実施例】以下、この発明を具体化した一実施例を図面
に従って説明する。図１には、液晶表示パネルの分解斜
視図を示す。液晶表示パネルは、ＴＦＴ基板（薄膜トラ
ンジスタ基板）１０とＣＦ基板（カラーフィルタ基板）
１１とを貼り合わすことにより製造されるものである。
又、図２には液晶表示パネルの平面図を示し、図３には
図２のＡ−Ａ断面を示す。DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is an exploded perspective view of the liquid crystal display panel. The liquid crystal display panel includes a TFT substrate (thin film transistor substrate) 10 and a CF substrate (color filter substrate).
It is manufactured by laminating with No. 11.
FIG. 2 is a plan view of the liquid crystal display panel, and FIG. 3 is a sectional view taken along line AA of FIG.
【０００８】図２に示すように、ＴＦＴ基板１０には薄
膜トランジスタや薄膜ダイオード等のアクティブ素子が
マトリックス状に配置されるとともに電極が形成されて
いる。又、ＣＦ基板１１には、共通電極やカラーフィル
タが配置されている。As shown in FIG. 2, on a TFT substrate 10, active elements such as thin film transistors and thin film diodes are arranged in a matrix and electrodes are formed. Further, a common electrode and a color filter are arranged on the CF substrate 11.
【０００９】ＣＦ基板１１には、エポキシ系熱硬化性シ
ール材１２が四角枠状に塗布されている。このシール材
１２の四隅部にはそれぞれ斜状部１２ａが形成されてい
る。尚、このシール材１２は四角枠状に塗布されている
が、その一部にはシール材１２が無く、この部分が液晶
材料の注入口１２ｂとなっている。An epoxy-based thermosetting sealing material 12 is applied on a CF substrate 11 in a square frame shape. At each of the four corners of the sealing material 12, slanted portions 12a are formed. Although the sealing material 12 is applied in a square frame shape, the sealing material 12 is not provided in a part thereof, and this part serves as a liquid crystal material inlet 12b.
【００１０】又、ＣＦ基板１１でのシール材１２の外周
側における四隅部にはそれぞれ導電性紫外線硬化接着剤
（速硬化性導電ペースト）１３が円形に塗布され、この
導電性紫外線硬化接着剤１３により両基板１０，１１の
導通が確保されている。導電性紫外線硬化接着剤１３
は、ウレタン系紫外線硬化接着剤に導電性粒子である銀
（Ａｇ）粒子を分散したものである。この銀粒子の粒径
は１〜３μｍで、粒子の配合比は６０〜７０重量％であ
る。この銀粒子の粒径及び配合比は、紫外線の透過率に
より決定したものであり、この範囲ならば紫外線を照射
したときに充分に硬化させることができるものである。A conductive UV-curing adhesive (rapid-curing conductive paste) 13 is applied to each of four corners of the CF substrate 11 on the outer peripheral side of the sealing material 12 in a circular shape. As a result, conduction between the two substrates 10 and 11 is ensured. Conductive ultraviolet curing adhesive 13
Is obtained by dispersing silver (Ag) particles, which are conductive particles, in a urethane-based ultraviolet curable adhesive. The particle size of the silver particles is 1 to 3 μm, and the mixing ratio of the particles is 60 to 70% by weight. The particle size and the compounding ratio of the silver particles are determined by the transmittance of ultraviolet rays, and within this range, they can be sufficiently cured when irradiated with ultraviolet rays.
【００１１】次に、上記のように構成した液晶表示パネ
ルの製造方法を図４に従って説明する。まず、ＴＦＴ基
板１０とＣＦ基板１１を用意し、ＣＦ基板１１にシール
材１２を四角枠状に印刷する。そして、ＣＦ基板１１の
四隅部に導電性紫外線硬化接着剤（速硬化性導電ペース
ト）１３を塗布する。さらに、両基板１０，１１を圧縮
圧力６０〜７０ｋｇｆ／６インチ角で重ね合わせる。そ
の後、導電性紫外線硬化接着剤（速硬化性導電ペース
ト）１３に紫外線を室温で約１分間照射して硬化させ
る。その結果、両基板１０，１１が仮止めされる。Next, a method of manufacturing the liquid crystal display panel configured as described above will be described with reference to FIG. First, a TFT substrate 10 and a CF substrate 11 are prepared, and a sealing material 12 is printed on the CF substrate 11 in a rectangular frame shape. Then, a conductive ultraviolet curable adhesive (rapid curable conductive paste) 13 is applied to the four corners of the CF substrate 11. Further, both substrates 10 and 11 are superposed at a compression pressure of 60 to 70 kgf / 6 inch square. Thereafter, the conductive ultraviolet curing adhesive (rapidly curable conductive paste) 13 is irradiated with ultraviolet rays at room temperature for about 1 minute to be cured. As a result, both substrates 10 and 11 are temporarily fixed.
【００１２】その後、熱処理してシール材１２を硬化さ
せる。この際、シール材１２が熱硬化するまでの間、基
板１０，１１にズレが発生しようとするが、両基板１
０，１１が仮止めされているので、基板１０，１１のズ
レが回避される。この仮止めを行わないと両基板１０，
１１を重ね合わせてからシール材１２が熱硬化するまで
の間にズレの許容量である５μｍに対し１０μｍ以上の
ズレが生じてしまう。Thereafter, heat treatment is performed to cure the sealing material 12. At this time, the substrates 10 and 11 tend to be displaced until the sealing material 12 is thermally cured.
Since the positions 0 and 11 are temporarily fixed, the displacement of the substrates 10 and 11 is avoided. If this temporary fixing is not performed, both substrates 10,
A gap of 10 μm or more occurs between 5 μm, which is an allowable amount of the gap, and the sealing material 12 is thermally cured after the stacking of the pieces 11.
【００１３】そして、このように製造された液晶表示パ
ネルに対し、両基板１０，１１とシール材１２により形
成された空間部に液晶材料を充填して液晶表示素子とす
る。このように本実施例では、電極を有するＴＦＴ及び
ＣＦ基板１０，１１を用意しＣＦ基板１１に熱硬化性の
シール材１２を塗布するとともに、銀粒子を配合した導
電性紫外線硬化接着剤１３を塗布し（第１工程）、両基
板１０，１１を重ね合わせ（第２工程）、導電性紫外線
硬化接着剤１３に紫外線を照射して両基板１０，１１を
仮止めし（第３工程）、シール材１２を硬化させるため
に熱処理した（第４工程）。その結果、シール材印刷か
らシール硬化の熱処理までの工程が簡略化される。より
具体的には、図５の従来の方法において導電ペースト塗
布から紫外線照射までに５．５分かかっていたのが、図
４に示す本実施例の方法では導電性紫外線硬化接着剤１
３の塗布から紫外線照射までを３分に短縮できた。この
ようにして、ズレを防止しつつ効率よく２枚の基板１
０，１１を貼り合わせることができる。The liquid crystal display panel thus manufactured is filled with a liquid crystal material in a space formed by the substrates 10, 11 and the sealing material 12 to form a liquid crystal display element. As described above, in this embodiment, a TFT having electrodes and CF substrates 10 and 11 are prepared, a thermosetting sealing material 12 is applied to the CF substrate 11, and a conductive ultraviolet curable adhesive 13 containing silver particles is applied. After applying (first step), the two substrates 10 and 11 are overlapped (second step), the conductive ultraviolet curing adhesive 13 is irradiated with ultraviolet rays to temporarily fix both substrates 10 and 11 (third step), Heat treatment was performed to cure the sealing material 12 (fourth step). As a result, the steps from the printing of the seal material to the heat treatment for hardening the seal are simplified. More specifically, it took 5.5 minutes from the application of the conductive paste to the irradiation of the ultraviolet ray in the conventional method of FIG. 5, but the method of the present embodiment shown in FIG.
The time from application of No. 3 to irradiation of ultraviolet rays could be shortened to 3 minutes. In this manner, the two substrates 1 can be efficiently prevented while preventing displacement.
0 and 11 can be bonded together.
【００１４】又、導電性紫外線硬化接着剤１３は、粒径
が１〜３μｍの銀粒子をウレタン系紫外線硬化接着剤に
６０〜７０重量％となるよう配合することにより、紫外
線を照射したときに確実に硬化させることができる。The conductive ultraviolet-curing adhesive 13 is prepared by blending silver particles having a particle size of 1 to 3 μm with a urethane-based ultraviolet-curing adhesive in an amount of 60 to 70% by weight so that the ultraviolet light is irradiated. It can be surely cured.
【００１５】尚、この発明は上記実施例に限定されるも
のではなく、例えば、上記実施例ではＣＦ基板１１に熱
硬化性のシール材１２及び導電性紫外線硬化接着剤１３
を塗布したが、ＴＦＴ基板１０とＣＦ基板１１の少なく
ともいずれか一方に熱硬化性のシール材１２及び導電性
紫外線硬化接着剤１３を塗布すればよい。The present invention is not limited to the above embodiment. For example, in the above embodiment, a thermosetting sealing material 12 and a conductive ultraviolet curing adhesive 13 are applied to a CF substrate 11.
However, a thermosetting sealing material 12 and a conductive ultraviolet curing adhesive 13 may be applied to at least one of the TFT substrate 10 and the CF substrate 11.
【００１６】[0016]
【発明の効果】以上詳述したようにこの発明によれば、
導電性紫外線硬化接着剤により両基板の仮止めと導通の
確保を同時に行うことで、ズレを防止しつつ効率よく２
枚の基板を貼り合わせることができる優れた効果を発揮
する。As described in detail above, according to the present invention,
Temporary fixing and conduction of both substrates with conductive UV curing adhesive
By simultaneously securing, 2
It has an excellent effect of bonding two substrates.
【図１】液晶表示パネルの分解斜視図である。FIG. 1 is an exploded perspective view of a liquid crystal display panel.
【図２】液晶表示パネルの平面図である。FIG. 2 is a plan view of the liquid crystal display panel.
【図３】図２のＡ−Ａ断面を示す図である。FIG. 3 is a diagram showing a cross section taken along line AA of FIG. 2;
【図４】製造工程を示す図である。FIG. 4 is a view showing a manufacturing process.
【図５】従来の製造工程を示す図である。FIG. 5 is a view showing a conventional manufacturing process.
【図６】従来の液晶表示パネルの斜視図である。FIG. 6 is a perspective view of a conventional liquid crystal display panel.
１０ ＴＦＴ基板 １１ ＣＦ基板 １２ シール材 １３ 導電性紫外線硬化接着剤 Reference Signs List 10 TFT substrate 11 CF substrate 12 Sealing material 13 Conductive ultraviolet curing adhesive
フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) G02F 1/1339 505 G02F 1/13 101 G02F 1/1345 Continuation of front page (58) Field surveyed (Int.Cl. 7 , DB name) G02F 1/1339 505 G02F 1/13 101 G02F 1/1345
Claims (2)
くともいずれか一方に熱硬化性のシール材を塗布すると
ともに、導電粒子を配合した導電性紫外線硬化接着剤を
塗布する第１工程と、 前記両基板を重ね合わせる第２工程と、 前記導電性紫外線硬化接着剤に紫外線を照射して、前記
両基板の仮止め及び導通の確保を同時に行う第３工程
と、 前記シール材を硬化させるために熱処理する第４工程と
を備えたことを特徴とする液晶表示パネルの製造方法。A first step of applying a thermosetting sealing material to at least one of the first and second substrates having electrodes and applying a conductive ultraviolet curing adhesive containing conductive particles; a second step of superimposing the two substrates, and irradiated with ultraviolet rays to the conductive UV curable adhesive, and a third step for securing the temporary fixing and conduction of the two substrates simultaneously, curing the sealing material And a fourth step of performing a heat treatment for the liquid crystal display panel.
ン系紫外線硬化接着剤に銀粒子を分散して構成されておSilver particles dispersed in UV-curable adhesive
り、前記接着剤の中の銀粒子は、その粒径が１〜３μｍThe silver particles in the adhesive have a particle size of 1 to 3 μm
で、かつ、配合比が６０〜７０重量％となっていることAnd the mixing ratio is 60 to 70% by weight.
を特徴とする請求項１に記載の液晶表示パネルの製造方The method for manufacturing a liquid crystal display panel according to claim 1, wherein
法。Law.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04137202A JP3077382B2 (en) | 1992-05-28 | 1992-05-28 | Liquid crystal display panel manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04137202A JP3077382B2 (en) | 1992-05-28 | 1992-05-28 | Liquid crystal display panel manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05333351A JPH05333351A (en) | 1993-12-17 |
| JP3077382B2 true JP3077382B2 (en) | 2000-08-14 |
Family
ID=15193182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP04137202A Expired - Fee Related JP3077382B2 (en) | 1992-05-28 | 1992-05-28 | Liquid crystal display panel manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3077382B2 (en) |
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|---|---|---|---|---|
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001222017A (en) | 1999-05-24 | 2001-08-17 | Fujitsu Ltd | Liquid crystal display device and its manufacturing method |
| EP1629323A1 (en) * | 2003-06-05 | 2006-03-01 | Eastman Kodak Company | Uv curable conductive materials in displays |
| JP4760180B2 (en) * | 2005-07-20 | 2011-08-31 | セイコーエプソン株式会社 | Manufacturing method of liquid crystal device |
| CN101896860B (en) * | 2007-12-13 | 2012-09-05 | 夏普株式会社 | Liquid crystal panel, method for manufacturing liquid crystal panel, and coating apparatus |
| JP5336834B2 (en) * | 2008-12-16 | 2013-11-06 | テスコム株式会社 | Liquid crystal display |
| US11306217B2 (en) * | 2016-12-08 | 2022-04-19 | Lg Chem, Ltd. | Method for bonding substrate and substrate for display manufactured by the same |
-
1992
- 1992-05-28 JP JP04137202A patent/JP3077382B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8552514B2 (en) | 2010-07-02 | 2013-10-08 | Denso Corporation | Semiconductor physical quantity sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05333351A (en) | 1993-12-17 |
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