JP3067239B2 - Inkjet head - Google Patents
Inkjet headInfo
- Publication number
- JP3067239B2 JP3067239B2 JP7771691A JP7771691A JP3067239B2 JP 3067239 B2 JP3067239 B2 JP 3067239B2 JP 7771691 A JP7771691 A JP 7771691A JP 7771691 A JP7771691 A JP 7771691A JP 3067239 B2 JP3067239 B2 JP 3067239B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- flow
- substrates
- flow path
- side wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/10—Finger type piezoelectric elements
Description
【０００１】[0001]
【産業上の利用分野】本発明は、インク液滴を画像記録
媒体上へ選択的に付着させるインクジェットヘッドに関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ink jet head for selectively depositing ink droplets on an image recording medium.
【０００２】[0002]
【従来の技術】従来のインクジェットヘッドの構造は、
特開昭６３-２５２７５０号公報、あるいは特開昭６３-
２４７０５１号公報に開示されてある。2. Description of the Related Art The structure of a conventional inkjet head is as follows.
JP-A-63-252750 or JP-A-63-252750
No. 2,470,51.
【０００３】これらのインクジェットヘッドは、図９に
示すように、ノズルの並び方向に互いに間隔を有する多
数の平行な流路３５を有しており、これら流路は、流路
の長手方向及び長手方向とノズル並び方向の両方に垂直
に伸びる側壁３６により区画されている。As shown in FIG. 9, these ink jet heads have a large number of parallel flow paths 35 spaced from each other in the direction in which the nozzles are arranged. It is defined by a side wall 36 extending vertically in both the direction and the nozzle arrangement direction.
【０００４】これら流路の一端は、複数のノズル３を有
するノズルプレート２に接続され、他の一端は、インク
を各チャンネルに補充するインク供給手段９に接続され
ている。側壁３６は、その一部あるいは全体が圧電物質
で構成され、電気的アクチュエート手段により剪断モー
ドなどのノズルの並び方向に平行な変形を引き起こし、
流路を圧力発生室５としてインクの圧力を変化させノズ
ル３からインク滴を噴射させるものであった。[0004] One end of these flow paths is connected to a nozzle plate 2 having a plurality of nozzles 3, and the other end is connected to ink supply means 9 for replenishing ink to each channel. The side wall 36 is partially or entirely made of a piezoelectric material, and causes deformation in a shear mode or the like parallel to the direction in which the nozzles are arranged by an electric actuating means.
The flow path is used as a pressure generating chamber 5 to change the pressure of the ink and eject the ink droplets from the nozzle 3.
【０００５】また、その製造方法は、図１０に示すよう
に、厚さ方向に分極された圧電セラミクス基板２０上
に、平行な流路溝３７を複数加工する工程と、図１１に
示すように、隣接する流路溝３７を区画する側壁３６
に、電極４０と導電線４１を流路溝ごとに形成する工程
と、図１２に示すように、上記工程を施した圧電セラミ
クス基板からなる上部基板２１と下部基板２２を、両基
板の流路溝同士が対向して重なり、上部基板２１の導電
線と下部基板２２の導電線が両基板の表面部４３で電気
的に接続されるように、接合して、流路３５を形成する
工程からなるものであった。As shown in FIG. 10, the manufacturing method includes a step of processing a plurality of parallel flow grooves 37 on the piezoelectric ceramics substrate 20 polarized in the thickness direction, as shown in FIG. , A side wall 36 defining an adjacent flow channel 37
Next, a step of forming the electrodes 40 and the conductive wires 41 for each flow channel groove, and as shown in FIG. From the step of forming the flow path 35 by joining so that the grooves overlap each other and the conductive lines of the upper substrate 21 and the conductive lines of the lower substrate 22 are electrically connected at the surface portions 43 of both substrates. It was something.
【０００６】[0006]
【発明が解決しようとする課題】しかし、上部基板と下
部基板とに流路溝をそれぞれ加工し、各流路溝を区画す
る側壁に変形を引き起こすための電極を形成した後、上
部基板と下部基板をその流路溝が重なるように接合し、
両基板が面接触する場所で両基板の対向する導電線同士
を電気的に接続する従来技術では、次のような問題点が
あった。However, after the flow grooves are formed on the upper substrate and the lower substrate, and electrodes for causing deformation are formed on the side walls defining the flow grooves, the upper substrate and the lower substrate are formed. Join the substrates so that their flow grooves overlap,
The related art in which the opposing conductive lines of both substrates are electrically connected to each other at a place where both substrates are in surface contact has the following problems.
【０００７】（ｉ）両基板の接合・固着に使用する接着
材が両基板の導電線の間に入り、電気的な接続不良を生
じる。（ｉｉ）両基板の導電線を電気的に接続する半田
が導電線外に広がり、隣接する導電線が電気的に接続し
てしまう。（ｉｉｉ）両基板の導電線を電気的に接続す
る半田を融解する時に両基板が加熱され、圧電特性が劣
化する。(I) An adhesive used for bonding and fixing the two substrates enters between the conductive wires of the two substrates, resulting in poor electrical connection. (Ii) Solder for electrically connecting the conductive lines of both substrates spreads out of the conductive lines, and adjacent conductive lines are electrically connected. (Iii) Both substrates are heated when the solder for electrically connecting the conductive wires of both substrates is melted, and the piezoelectric characteristics are degraded.
【０００８】そこで本発明の課題は、これらの問題点を
解決することで、その目的とするところは、流路溝と電
極と導電線を形成した上部基板と下部基板の導電線を電
気的に接合する場所を、両基板の導電線が外部に露出す
る場所にすることにより、高密度、高ノズル数、そして
信頼性の高いインクジェットヘッドを提供することにあ
る。Accordingly, an object of the present invention is to solve these problems, and an object of the present invention is to electrically connect conductive lines of an upper substrate and a lower substrate in which a flow path groove, an electrode, and a conductive line are formed. An object of the present invention is to provide a high-density, high-number-of-nozzles, and highly-reliable ink-jet head by setting a bonding location to a location where conductive lines of both substrates are exposed to the outside.
【０００９】[0009]
【課題を解決するための手段】本発明によるインクジェ
ットヘッドは、ノズルの並び方向に互いに間隔を有する
多数の平行な流路を有し、これら流路内の側壁の一部ま
たは全表面に電極が形成され、前記側壁はその一部また
は全体が圧電物質で構成され、この側壁の電気的アクチ
ュエート手段による変形により前記流路内の圧力を変化
させて、流路に接続されたノズルからインク滴を噴射せ
しめるインクジェットヘッドにおいて、前記流路は２つ
の基板を表面に形成された流路溝同士が対向して重なる
ように接合して成り、前記流路溝内に形成された電極
は、基板表面に流路溝毎に配置された導電線に接続し、
これら導電線が配置された前記２つの基板の基板表面の
少なくとも一方は、流路溝が形成された面に鈍角あるい
は曲面で接続する面を有することを特徴とする。The ink jet head according to the present invention has a number of parallel flow paths spaced from each other in the direction in which the nozzles are arranged, and electrodes are formed on some or all of the side walls in these flow paths. The side wall is formed partially or entirely of a piezoelectric material, and the side wall is deformed by an electric actuating means to change the pressure in the flow path, so that an ink droplet is formed from a nozzle connected to the flow path. In the ink jet head, the flow path is formed by joining two substrates so that flow path grooves formed on the surface thereof are opposed to each other and overlaps, and an electrode formed in the flow path groove is formed on the substrate surface. Connected to the conductive wire arranged for each flow channel,
At least one of the substrate surfaces of the two substrates on which the conductive lines are arranged has a surface connected to the surface on which the flow channel is formed at an obtuse angle or a curved surface.
【００１０】[0010]
【実施例】本発明の実施例を以下で詳細に説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described in detail below.
【００１１】（第１実施例）図１は、本発明の実施例の
インクジェットヘッドの斜視図ある。図１において、厚
さ方向に分極されたチタン酸ジルコン酸鉛の圧電物質か
らなる、厚さ１ｍｍの上部基板２１と下部基板２２に
は、ノズル３の並び方向に互いに間隔を有する多数の平
行な流路３５が同一形状で形成されている。(First Embodiment) FIG. 1 is a perspective view of an ink jet head according to an embodiment of the present invention. In FIG. 1, an upper substrate 21 and a lower substrate 22 each made of a piezoelectric material of lead zirconate titanate polarized in the thickness direction and having a thickness of 1 mm are provided with a large number of parallel substrates spaced from each other in the direction in which the nozzles 3 are arranged. The channels 35 are formed in the same shape.
【００１２】これら流路３５は、流路３５の長手方向及
び長手方向とノズル３の並び方向の両方に垂直に伸びる
側壁３６により区画されている。これら流路の一端は複
数のノズル３を有するノズルプレート２に接続され、他
の一端はインクを各チャンネルに補充するインク供給手
段９に接続されている。上部基板２１と下部基板２２
は、両基板の流路溝同士が対向して重なるように接合さ
れ、圧力発生室５を形成している。The channels 35 are defined by a longitudinal direction of the channels 35 and side walls 36 extending perpendicularly to both the longitudinal direction and the direction in which the nozzles 3 are arranged. One end of these channels is connected to a nozzle plate 2 having a plurality of nozzles 3, and the other end is connected to ink supply means 9 for replenishing ink to each channel. Upper substrate 21 and lower substrate 22
Are joined so that the flow grooves of both substrates face each other and overlap each other to form a pressure generating chamber 5.
【００１３】上部基板２１は、図２に示すように、流路
溝３７が形成される側の基板表面の一端が斜に面取りさ
れ、流路溝３７が形成される面に鈍角で接続する面４５
を有する。流路溝３７を面取り部４５に対向する一端か
ら、基板表面の途中まで形成する。As shown in FIG. 2, the upper substrate 21 has an obliquely chamfered one end of the substrate surface on the side where the flow channel 37 is formed, and is connected to the surface on which the flow channel 37 is formed at an obtuse angle. 45
Having. The flow channel 37 is formed from one end facing the chamfered portion 45 to halfway on the substrate surface.
【００１４】次に、図３に示すように、各流路溝３７の
内部電極４０と流路溝内部から基板表面の面取り部に伸
びる導電線４１を形成する。図１に示した下部基板２２
にも、上部基板２１の導電線と対向する導電線４１を形
成する。Next, as shown in FIG. 3, an internal electrode 40 of each flow channel 37 and a conductive wire 41 extending from the inside of the flow channel to the chamfered portion of the substrate surface are formed. Lower substrate 22 shown in FIG.
Also, a conductive line 41 facing the conductive line of the upper substrate 21 is formed.
【００１５】図４は、流路溝及び電極及び導電線が形成
された両基板を流路溝及び導電線同士が対向して重なる
ように接合した時の、流路に沿った断面を示す。図４に
おいて、上部基板２１と下部基板２２の接合に使われな
い面取り部４５において、上部基板２１と下部基板２２
の導電線４１が対向している。従って、上部基板２１と
下部基板２２を接合した後に、両基板の導電線の電気的
接続が可能となる。FIG. 4 shows a cross section along the flow path when the two substrates on which the flow path grooves, electrodes, and conductive lines are formed are joined so that the flow path grooves and the conductive lines face each other and overlap. In FIG. 4, in the chamfered portion 45 not used for joining the upper substrate 21 and the lower substrate 22,
Conductive lines 41 are opposed to each other. Therefore, after the upper substrate 21 and the lower substrate 22 are joined, electrical connection of the conductive lines of both substrates becomes possible.
【００１６】本実施例においては、図４の表面に露出し
た対向導電線部４６にクリーム半田を塗工した後、赤外
線加熱装置を用いて対向導電線部４６を加熱することに
より、両基板の導電線の電気的接続が良好に行なえた。In this embodiment, after applying cream solder to the opposing conductive wire portion 46 exposed on the surface of FIG. 4, the opposing conductive wire portion 46 is heated using an infrared heating device, so that the two conductive substrates are heated. The electrical connection of the conductive wire was successfully performed.
【００１７】また、表面に露出した対向導電線部４６の
みを局所的に加熱できるため、電気的アクチュエート手
段となる側壁３６に熱が伝わらず、側壁３６の圧電材料
の圧電特性を劣化させることも無かった。また、両基板
の導電線の他の電気的接続方法として、図４の基板端部
を、溶融半田にディッピングすることによっても、両基
板の導電線の電気的接続が良好に行なえた。この場合に
も、対向導電線部が表面に露出しているため、側壁部３
６への熱の伝導を小さく抑えることが可能であった。Further, since only the opposing conductive wire portion 46 exposed on the surface can be locally heated, heat is not transmitted to the side wall 36 serving as an electric actuating means, and the piezoelectric characteristics of the piezoelectric material on the side wall 36 are degraded. There was no. In addition, as another method of electrically connecting the conductive lines of the two substrates, the ends of the substrate shown in FIG. 4 were dipped in molten solder, so that the electrical connection of the conductive lines of the two substrates was successfully performed. Also in this case, since the opposing conductive wire portion is exposed on the surface, the side wall portion 3 is formed.
It was possible to reduce the heat conduction to 6.
【００１８】次に、本実施例の圧力発生室を用いたイン
クジェットヘッドの動作原理を図７、８を用いて概説す
る。図７において、圧力発生室５内に形成されている電
極４０ａ、４０ｂは電気的に接続され、各流路ごとに電
気的アクチュエート手段である駆動用ドライバ素子７０
に接続されている。ドライバ素子７０は制御部７１から
の制御信号７２に対応して、直流電源７３より高電圧出
力あるいは低電圧出力を各圧力発生室５内の電極４０に
選択的に供給する。各圧力発生室５は一つ飛ばし（偶数
番と奇数番）の２つにグループ化され、それぞれのグル
ープごとに時間で区画化され交互に駆動される。Next, the principle of operation of the ink jet head using the pressure generating chamber of this embodiment will be outlined with reference to FIGS. In FIG. 7, electrodes 40a and 40b formed in the pressure generating chamber 5 are electrically connected, and a driving driver element 70 as an electric actuating means is provided for each flow path.
It is connected to the. The driver element 70 selectively supplies a high voltage output or a low voltage output from the DC power supply 73 to the electrode 40 in each pressure generating chamber 5 in response to a control signal 72 from the control unit 71. Each of the pressure generating chambers 5 is divided into two groups (one even number and one odd number), and each group is divided into time groups and driven alternately.
【００１９】図８に示すように、選択された圧力発生室
５ａとその隣接する圧力発生室５ｂ、５ｂとを区画する
側壁である変形部３６、３６に、圧電物質の分極方向５
０、５１と直交するように、選択された圧力発生室５ａ
とその隣接する圧力発生室５ｂ、５ｂとに接続されるド
ライバ素子を制御すると、圧電物質からなる変形部３６
は剪断モードで図示のように変形する。この変形によっ
て、選択された圧力発生室５ａの容積が縮小し圧力発生
室５ａを満たすインク６に圧力が発生する。発生した圧
力は、圧力発生室５ａ内を伝搬し、ノズル３（図１参
照）からインク滴を吐出させる。As shown in FIG. 8, the deformed portions 36, 36, which are the side walls that partition the selected pressure generating chamber 5a and the adjacent pressure generating chambers 5b, 5b, have polarization directions 5 of the piezoelectric material.
0, 51, the selected pressure generation chamber 5a
When the driver elements connected to the pressure generating chambers 5b and 5b adjacent thereto are controlled, the deformed portion 36 made of piezoelectric material is controlled.
Is deformed in the shear mode as shown. Due to this deformation, the volume of the selected pressure generating chamber 5a is reduced, and pressure is generated in the ink 6 filling the pressure generating chamber 5a. The generated pressure propagates in the pressure generating chamber 5a, and ejects ink droplets from the nozzle 3 (see FIG. 1).
【００２０】（第２実施例）図５は、流路溝及び電極及
び導電線が形成された両基板を流路溝及び導電線同士が
対向して重なるように接合した時の、流路３５に沿った
断面を示す。流路溝及び電極及び導電線の形成方法及び
インクジェットヘッドの全体構成は、第１実施例と同様
である。以下においては、第１実施例と異なる部分のみ
説明する。(Second Embodiment) FIG. 5 shows a flow path 35 when two substrates on which a flow channel, an electrode, and a conductive wire are formed are joined so that the flow channel and the conductive wire face each other and overlap. 2 shows a cross section taken along the line. The method of forming the flow channel, the electrodes, and the conductive lines and the overall configuration of the ink jet head are the same as in the first embodiment. In the following, only portions different from the first embodiment will be described.
【００２１】図５において、上部基板２１の下部基板２
２と接合される基板表面から斜に切り落とされている面
取り部４５の下部基板側かど４７は、曲線で形成されて
いる。In FIG. 5, the lower substrate 2 of the upper substrate 21
The lower substrate side corner 47 of the chamfered portion 45, which is cut off obliquely from the surface of the substrate to be joined to 2, is formed in a curved line.
【００２２】本実施例において、各流路溝の内部から基
板表面の面取り部４５に伸びる導電線４１の形成方法
は、上部基板２１に流路溝及び面取り部４５の加工を行
なった後、流路溝が形成されている基板表面全体に、電
極層を形成し、流路溝内を含む基板表面にレジストを塗
工し、レジストパターン形成を行ない、電極層をエッチ
ングすることにより、各流路溝毎の電極及び導電線４１
を形成するものである。この時、面取り部４５に直線で
形成されるかどが有ると、かどの部分にレジストが厚く
塗工され、電極層パターンが正確にエッチングできない
場合がある。本実施例では、面取り部４５のかど４７
は、曲線で形成されている為、導電線４１が正確に形成
できた。In the present embodiment, the method of forming the conductive wire 41 extending from the inside of each flow channel to the chamfered portion 45 on the substrate surface is as follows. An electrode layer is formed on the entire surface of the substrate on which the channel groove is formed, a resist is applied to the surface of the substrate including the inside of the channel groove, a resist pattern is formed, and the electrode layer is etched. Electrode and conductive wire 41 for each groove
Is formed. At this time, if there is a corner formed in the chamfered portion 45 in a straight line, a thick resist is applied to the corner, and the electrode layer pattern may not be etched accurately. In this embodiment, the corner 47 of the chamfered portion 45 is set.
Was formed in a curved line, so that the conductive wire 41 could be formed accurately.
【００２３】（第３実施例）図６は、流路溝及び電極及
び導電線が形成された両基板を流路溝及び導電線同士が
対向して重なるように接合した時の、流路３５に沿った
断面を示す。流路溝及び電極及び導電線の形成方法及び
インクジェットヘッドの全体構成は、第１実施例と同様
である。以下においては、第１実施例と異なる部分のみ
説明する。(Third Embodiment) FIG. 6 shows a flow path 35 when two substrates having flow grooves, electrodes and conductive lines formed thereon are joined so that the flow grooves and conductive lines face each other and overlap. 2 shows a cross section taken along the line. The method of forming the flow channel, the electrodes, and the conductive lines and the overall configuration of the ink jet head are the same as in the first embodiment. In the following, only portions different from the first embodiment will be described.
【００２４】図６において、上部基板２１と下部基板２
２の端部４８、４９は、接合される基板表面から浅く切
り取られ、各流路溝の内部から基板端部４８、４９表面
に伸びる導電線４１が形成されている。上部基板２１と
下部基板２２の導電線４１は、基板端部４６において対
向している。In FIG. 6, an upper substrate 21 and a lower substrate 2
The ends 48, 49 of the second are cut shallowly from the surface of the substrate to be joined, and the conductive wires 41 extending from the inside of each flow channel to the surfaces of the substrate ends 48, 49 are formed. The conductive lines 41 of the upper substrate 21 and the lower substrate 22 face each other at a substrate end 46.
【００２５】本実施例では、上部基板２１と下部基板２
２の両方の端部４８、４９が加工されているため、両基
板２１、２２の導電線４１が露出している部分の開口が
広くなり、半田の塗工が容易になった。In this embodiment, the upper substrate 21 and the lower substrate 2
Since both ends 48 and 49 of the second substrate 2 are processed, the openings of the portions where the conductive wires 41 of both the substrates 21 and 22 are exposed are widened, and the application of solder is facilitated.
【００２６】[0026]
【発明の効果】本発明によれば、流路溝と、流路溝内の
電極と、基板表面に配置し流路溝内の電極に接続する導
電線が形成された２つの基板の、導電線が配置された基
板表面の少なくとも一方は、流路溝が形成された面に鈍
角あるいは曲面で接続する面を有することにより、上部
基板と下部基板の対向した流路溝内の電極を確実に接続
することができ、隣接する流路間で電極の短絡も生じな
いと言う効果が得られる。また、両基板の導電線を接続
するときに、表面のみ加熱できるため、熱によって圧電
特性が劣化することが無いと言う効果が得られる。According to the present invention, the conductivity of the two substrates formed with the flow grooves, the electrodes in the flow grooves, and the conductive lines arranged on the substrate surface and connected to the electrodes in the flow grooves is formed. At least one of the substrate surfaces on which the lines are disposed has a surface that connects at an obtuse angle or a curved surface to the surface on which the flow channel is formed, so that the electrodes in the opposing flow channels of the upper substrate and the lower substrate are reliably formed. It is possible to obtain an effect that the electrodes can be connected and no short circuit of the electrodes occurs between the adjacent flow paths. Further, when the conductive wires of both substrates are connected, only the surface can be heated, so that an effect is obtained that the piezoelectric characteristics are not deteriorated by heat.
【図１】本発明によるインクジェットヘッドの第１実施
例の構成を示す図。FIG. 1 is a diagram showing a configuration of a first embodiment of an inkjet head according to the present invention.
【図２】本発明によるインクジェットヘッドの第１実施
例の基板の構造を示す図。FIG. 2 is a diagram showing a structure of a substrate of the first embodiment of the ink jet head according to the present invention.
【図３】同じく構造を示す図。FIG. 3 is a view showing the same structure.
【図４】本発明によるインクジェットヘッドの第１実施
例の基板の断面構造を示す図。FIG. 4 is a diagram showing a sectional structure of a substrate of the first embodiment of the ink jet head according to the present invention.
【図５】本発明によるインクジェットヘッドの第２実施
例の基板の断面構造を示す図。FIG. 5 is a diagram showing a sectional structure of a substrate of a second embodiment of the ink jet head according to the present invention.
【図６】本発明によるインクジェットヘッドの第３実施
例の基板の断面構造を示す図。FIG. 6 is a diagram showing a sectional structure of a substrate of a third embodiment of the ink jet head according to the present invention.
【図７】本発明によるインクジェットヘッドの動作原理
説明図。FIG. 7 is a diagram illustrating the operation principle of an ink jet head according to the present invention.
【図８】同じく動作原理説明図。FIG. 8 is an explanatory view of the operation principle.
【図９】従来のインクジェットヘッドの構成を示す図。FIG. 9 is a diagram showing a configuration of a conventional inkjet head.
【図１０】従来のインクジェットヘッドの製造方法を示
す工程図。FIG. 10 is a process chart showing a conventional method for manufacturing an ink jet head.
【図１１】同じく工程図。FIG. 11 is a process drawing.
【図１２】従来のインクジェットヘッドの基板の断面構
造を示す図。FIG. 12 is a diagram showing a cross-sectional structure of a substrate of a conventional inkjet head.
２・・・ノズルプレート ３・・・ノズル ５・・・圧力発生室 ９・・・インク供給手段 ２１・・・上部基板 ２２・・・下部基板 ３５・・・流路 ３６・・・側壁（変形部） ３７・・・流路溝 ４０・・・電極 ４１・・・導電線 ４５・・・面取り部 ４６・・・対向導電線部 ４７・・・かど ４８・・・端部 ４９・・・端部 2 ... Nozzle plate 3 ... Nozzle 5 ... Pressure generating chamber 9 ... Ink supply means 21 ... Upper substrate 22 ... Lower substrate 35 ... Flow path 36 ... Side wall (deformation) 37) Channel groove 40 ... Electrode 41 ... Conductive wire 45 ... Chamfered part 46 ... Opposite conductive wire part 47 ... Corner 48 ... End 49 ... End Department
Claims (1)
多数の平行な流路を有し、これら流路内の側壁の一部ま
たは全表面に電極が形成され、前記側壁はその一部また
は全体が圧電物質で構成され、前記側壁の電気的アクチ
ュエート手段による変形により前記流路内の圧力を変化
させて、流路に接続されたノズルからインク滴を噴射せ
しめるインクジェットヘッドにおいて、前記流路は２つ
の基板を表面に形成された流路溝同士が対向して重なる
ように接合して成り、前記流路溝内に形成された電極
は、基板表面に流路溝毎に配置された導電線に接続し、
これら導電線が配置された前記２つの基板の基板表面の
少なくとも一方は、流路溝が形成された面に鈍角あるい
は曲面で接続する面を有することを特徴とするインクジ
ェットヘッド。An electrode is formed on a part or the whole surface of a side wall in these flow paths, and the side wall is partially or entirely formed in the flow path. Is composed of a piezoelectric material, the pressure in the flow path is changed by deformation of the side wall by an electrical actuating means, and an ink jet head that ejects ink droplets from a nozzle connected to the flow path, wherein the flow path is The two substrates are joined so that the flow grooves formed on the surface thereof are opposed to each other and overlap with each other, and the electrodes formed in the flow grooves are electrically conductive wires arranged on the surface of the substrate for each flow groove. Connect to
At least one of the substrate surfaces of the two substrates on which the conductive lines are arranged has an obtuse or curved surface that is connected to the surface on which the flow channel is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7771691A JP3067239B2 (en) | 1991-04-10 | 1991-04-10 | Inkjet head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7771691A JP3067239B2 (en) | 1991-04-10 | 1991-04-10 | Inkjet head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04310746A JPH04310746A (en) | 1992-11-02 |
| JP3067239B2 true JP3067239B2 (en) | 2000-07-17 |
Family
ID=13641616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7771691A Expired - Lifetime JP3067239B2 (en) | 1991-04-10 | 1991-04-10 | Inkjet head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3067239B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4726195B2 (en) * | 2005-04-14 | 2011-07-20 | キヤノン株式会社 | Liquid discharge recording head and liquid discharge recording apparatus including the same |
| JP2008201022A (en) * | 2007-02-21 | 2008-09-04 | Sii Printek Inc | Head jet head, inkjet printer using the same, and manufacturing method of inkjet head |
-
1991
- 1991-04-10 JP JP7771691A patent/JP3067239B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04310746A (en) | 1992-11-02 |
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