JP3060855B2 - Wire bonding equipment - Google Patents

Wire bonding equipment

Info

Publication number
JP3060855B2
JP3060855B2 JP6251895A JP25189594A JP3060855B2 JP 3060855 B2 JP3060855 B2 JP 3060855B2 JP 6251895 A JP6251895 A JP 6251895A JP 25189594 A JP25189594 A JP 25189594A JP 3060855 B2 JP3060855 B2 JP 3060855B2
Authority
JP
Japan
Prior art keywords
spark
wire
torch electrode
wire bonding
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP6251895A
Other languages
Japanese (ja)
Other versions
JPH08115937A (en
Inventor
潔 有田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP6251895A priority Critical patent/JP3060855B2/en
Publication of JPH08115937A publication Critical patent/JPH08115937A/en
Application granted granted Critical
Publication of JP3060855B2 publication Critical patent/JP3060855B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78268—Discharge electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10162—Shape being a cuboid with a square active surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【産業上の利用分野】本発明は、ボールの形状を安定さ
せ得るようにしたワイヤボンディング装置に関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire bonding apparatus capable of stabilizing the shape of a ball.

【０００２】[0002]

【従来の技術】基板の電極とこの基板に搭載されたチッ
プの電極をワイヤで接続するワイヤボンディングにおい
て、ワイヤの下端部にボールを形成するため、トーチ電
極とワイヤに電位差を持たせ、両者間にスパークを発生
させる工程が行われる。2. Description of the Related Art In wire bonding for connecting electrodes of a substrate and electrodes of a chip mounted on the substrate by wires, a ball is formed at the lower end of the wire. The step of generating a spark is performed.

【０００３】図３（ａ）は従来のワイヤボンディング装
置におけるスパーク発生工程を示す側面図、図３
（ｂ）、図３（ｃ）は従来のワイヤボンディング装置に
より形成されたボールの拡大図である。図３（ａ）にお
いて、Ａはトーチ電極、ＢはワイヤＣを保持するキャピ
ラリツールである。図３（ａ）に示すように、この工程
ではワイヤＣの下端部とトーチ電極Ａを近接させ、本来
トーチ電極Ａの先端とワイヤＣの下端部とを結ぶ経路ａ
により、スパークさせるように意図されている。このと
きの経路ａの距離Ｌ１をギャップ長という。ここで、ワ
イヤＣの下端部に形成されるべきボールＤは、図３
（ｂ）に示すように、ワイヤＣと同軸的でかつ対称な形
状になっていなければならない。FIG. 3A is a side view showing a spark generation step in a conventional wire bonding apparatus.
FIGS. 3B and 3C are enlarged views of a ball formed by a conventional wire bonding apparatus. In FIG. 3A, A is a torch electrode, and B is a capillary tool holding a wire C. As shown in FIG. 3A, in this step, the lower end of the wire C is brought close to the torch electrode A, and a path a originally connecting the tip of the torch electrode A and the lower end of the wire C is formed.
Is intended to spark. The distance L1 of the path a at this time is called a gap length. Here, the ball D to be formed at the lower end of the wire C is shown in FIG.
As shown in (b), it must be coaxial and symmetrical with the wire C.

【０００４】[0004]

【発明が解決しようとする課題】ここで、ワイヤＣの下
端部に形成されるボールＤの直径（ボール径）は、ギャ
ップ長や流れる電流等によって定まるものであり、一定
のボール径を有するボールを形成するためには、ギャッ
プ長を一定にする必要がある。しかしながら、従来のワ
イヤボンディング装置では、トーチ電極を取り付けた直
後等にしばしば、本来の経路ａではなく、図３（ａ）の
経路ｂのように異なる経路を通るスパークが発生するこ
とがある。当然このときのギャップ長Ｌ２は、本来のギ
ャップ長Ｌ１と相違する。このように、スパークが発生
する位置がばらつくと、形成されるボール径が一定せ
ず、その結果安定したボンディングが行えない。Here, the diameter (ball diameter) of the ball D formed at the lower end of the wire C is determined by the gap length, flowing current, and the like. , It is necessary to make the gap length constant. However, in the conventional wire bonding apparatus, immediately after the torch electrode is attached or the like, a spark sometimes passes through a different path such as the path b in FIG. 3A instead of the original path a. Naturally, the gap length L2 at this time is different from the original gap length L1. As described above, when the position where the spark occurs varies, the diameter of the formed ball is not constant, and as a result, stable bonding cannot be performed.

【０００５】またギャップ長Ｌ２がたまたま本来のギャ
ップ長Ｌ１と一致していても、スパークの経路の傾き
が、本来の傾きとずれることによって、図３（ｃ）に示
すように、ボールＤ１がワイヤＣの中心から偏心した形
状になってしまい、その結果ボンディングが不安定にな
るという問題点がある。Further, even if the gap length L2 happens to coincide with the original gap length L1, the inclination of the spark path deviates from the original inclination. There is a problem that the shape becomes eccentric from the center of C, and as a result, bonding becomes unstable.

【０００６】そこで本発明は、トーチ電極のスパークを
安定させる得るワイヤボンディング装置を提供すること
を目的とする。Accordingly, an object of the present invention is to provide a wire bonding apparatus capable of stabilizing a spark of a torch electrode.

【０００７】[0007]

【課題を解決するための手段】本発明のワイヤボンディ
ング装置は、ワイヤが挿通されたキャピラリツールと、
キャピラリツールを昇降させるアームと、ワイヤに対し
て電位差を有し、かつワイヤの下端部に接近してスパー
クを発生し、ボールを形成するトーチ電極とを備え、こ
のトーチ電極は、母材と、母材の円錐状の先端部に局所
的に設けられ、かつ母材よりも仕事関数が低いスパーク
スタート領域とを有する。According to the present invention, there is provided a wire bonding apparatus comprising: a capillary tool having a wire inserted therein;
An arm for raising and lowering the capillary tool, having a potential difference with respect to the wire, and generating a spark by approaching the lower end of the wire, comprising a torch electrode forming a ball, the torch electrode includes a base material, A spark start region is provided locally at the conical tip of the base material and has a lower work function than the base material.

【０００８】[0008]

【作用】上記構成により、ワイヤの下端部とトーチ電極
の間にスパークを発生させる工程において、トーチ電極
側のスパーク発生位置は、仕事関数が低いスパークスタ
ート領域に集中する。このため、スパーク時のギャップ
長が安定し、一定のボール径を有するボールが形成され
る。よって、ワイヤボンディングの品質を向上すること
ができる。With the above arrangement, in the step of generating a spark between the lower end of the wire and the torch electrode, the spark generation position on the torch electrode side is concentrated in a spark start region having a low work function. For this reason, the gap length at the time of spark is stabilized, and a ball having a constant ball diameter is formed. Therefore, the quality of wire bonding can be improved.

【０００９】[0009]

【実施例】次に図面を参照しながら本発明の実施例を説
明する。図１は本発明の第１の実施例におけるワイヤボ
ンディング装置の斜視図、図２は本発明の実施例におけ
るトーチ電極の拡大図である。Next, an embodiment of the present invention will be described with reference to the drawings. Figure 1 is a perspective view of a wire bonding apparatus in the first embodiment of the present invention, FIG. 2 is an enlarged view of the torch electrode in the real施例of the present invention.

【００１０】図１において、１はリードフレーム又は厚
膜セラミックス基板などの基板２をＸ方向に搬送あるい
は位置決めする搬送レール、３は基板２上において基板
２に搭載されたチップ４を囲むように形成された電極で
ある。５は搬送レール１上の基板２を上方から押さえる
押え部材であり、押え部材５には、チップ４や電極３を
露呈させるための開口部５ａが開けられている。In FIG. 1, reference numeral 1 denotes a transport rail for transporting or positioning a substrate 2 such as a lead frame or a thick-film ceramic substrate in the X direction, and 3 is formed on the substrate 2 so as to surround a chip 4 mounted on the substrate 2. Electrode. Reference numeral 5 denotes a pressing member that presses the substrate 2 on the transport rail 1 from above, and the pressing member 5 has an opening 5a for exposing the chip 4 and the electrode 3.

【００１１】７は搬送レール１と対面するように配設さ
れ、かつＸテーブル９、Ｙテーブル８上に載置されたユ
ニットボックスであり、ユニットボックス７内には公知
の（例えば特開平４−２９１７３５号公報）に記載の駆
動機構が収納され、この駆動機構により、キャピラリツ
ール１２を先端部に保持するアーム１０を揺動させるこ
とにより、キャピラリツール１２を昇降させる。１３は
キャピラリツール１２の側方に位置するようユニットボ
ックス７に固定されたトーチ電極であり、キャピラリツ
ール１２に挿通されたワイヤ１１の下端部にスパークを
飛ばしてボールを形成する。Reference numeral 7 denotes a unit box disposed so as to face the transport rail 1 and mounted on the X table 9 and the Y table 8. No. 291735) is housed, and the capillary mechanism 12 is moved up and down by swinging the arm 10 that holds the capillary tool 12 at the distal end by the drive mechanism. Reference numeral 13 denotes a torch electrode fixed to the unit box 7 so as to be located on the side of the capillary tool 12, and forms a ball by blowing a spark at the lower end of the wire 11 inserted through the capillary tool 12.

【００１２】次にトーチ電極１３の構成について、図２
を参照しながら説明する。図２は固定トーチ型の例を示
すものであり、基部の周囲には不要なスパークを防止す
るべく、絶縁コートが表面に被覆されている。また先端
部１３ａは、純タングステンを母材とする円錐状に形成
され、当然絶縁コートは施されていない。そして、先端
部１３ａの頂部にスパークスタート領域１３ｂが局所的
に設けられている。スパークスタート領域１３ｂは、母
材に母材よりも仕事関数が低い材料をロー付けしてな
る。ここで、仕事関数とは、金属内部の電子をアーク空
間内に引き出すために必要な仕事量（エネルギ）を電圧
に換算したものである。Next, the structure of the torch electrode 13 will be described with reference to FIG.
This will be described with reference to FIG. FIG. 2 shows an example of a fixed torch type, and an insulating coat is coated on the periphery of the base to prevent unnecessary sparks. Further, the tip portion 13a is formed in a conical shape using pure tungsten as a base material, and is naturally not provided with an insulating coat. A spark start area 13b is locally provided at the top of the tip 13a. The spark start region 13b is formed by brazing a base material with a material having a lower work function than the base material. Here, the work function is a value obtained by converting a work amount (energy) necessary for extracting electrons inside the metal into the arc space into a voltage.

【００１３】スパークスタート領域１３ｂは、酸化トリ
ウム（ＴｈＯ2 ）を１〜２％含むタングステン、酸化ラ
ンタン（ＬａＯ3 ）を２％前後含むタングステン、酸化
セリウム（ＣｅＯ2 ）を１％前後含むタングステン、酸
化イットリウム（Ｙ2 Ｏ3 ）を２％前後含むタングステ
ンのうち、一種又は二種以上の結合から形成するとよ
い。The spark start region 13b is made of tungsten containing 1 to 2% thorium oxide (ThO2), tungsten containing about 2% lanthanum oxide (LaO3), tungsten containing about 1% cerium oxide (CeO2), and yttrium oxide (Y2 Of the tungsten containing about 2% O3), it is preferable to form one or two or more kinds of bonds.

【００１４】すなわち、トーチ電極１３の内、局所的に
仕事関数が低いスパークスタート領域１３ｂを形成する
ことにより、スパークの発生箇所をスパークスタート領
域１３ｂに集中させ、もってスパークのギャップ長を一
定にするものである。That is, by forming the spark start region 13b having a locally low work function in the torch electrode 13, the spot where the spark is generated is concentrated in the spark start region 13b, and the gap length of the spark is made constant. Things.

【００１５】また、スパークスタート領域１３ｂを設け
たことにより、スパーク発生箇所の温度を低くすること
ができ、その結果、トーチ電極１３の消耗を少なくして
トーチ電極１３の寿命を延ばすこともできる。Further, the provision of the spark start region 13b makes it possible to lower the temperature of the place where the spark is generated, thereby reducing the consumption of the torch electrode 13 and extending the life of the torch electrode 13.

【００１６】[0016]

【００１７】[0017]

【発明の効果】本発明のワイヤボンディング装置は、ワ
イヤが挿通されたキャピラリツールと、キャピラリツー
ルを昇降させるアームと、ワイヤに対して電位差を有
し、かつワイヤの下端部に接近してスパークを発生し、
ボールを形成するトーチ電極とを備え、このトーチ電極
は、母材と、母材の円錐状の先端部に局所的に設けら
れ、かつ母材よりも仕事関数が低いスパークスタート領
域とを有するので、トーチ電極におけるスパーク発生箇
所をスパークスタート領域に集中させることができ、そ
のためスパーク時の実際のギャップ長を一定にして安定
したボール径を有するボールを形成して、良好なボンデ
ィング品質を実現することができる。またトーチ電極に
おけるスパーク発生箇所の仕事関数が低いので、トーチ
電極の動作温度を低くすることができ、トーチ電極の寿
命を延ばすことができる。またトーチ電極の基部の周囲
に絶縁コートを施したことにより、基部の周囲に不要な
スパークが発生するのを防止できる。 According to the wire bonding apparatus of the present invention, a capillary tool into which a wire is inserted, an arm for raising and lowering the capillary tool, a potential difference with respect to the wire, and a spark coming close to the lower end of the wire. Occurs
A torch electrode forming a ball, the torch electrode having a base material and a spark start region locally provided at the conical tip of the base material and having a lower work function than the base material. Therefore, it is possible to concentrate a spark generation point on a torch electrode in a spark start region, thereby forming a ball having a stable ball diameter with a constant actual gap length at the time of spark, and realizing good bonding quality. Can be. Further, since the work function of the spark generating portion in the torch electrode is low, the operating temperature of the torch electrode can be lowered, and the life of the torch electrode can be extended. Also around the base of the torch electrode
Unnecessary around the base due to insulation coating
Sparks can be prevented from occurring.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の第１の実施例におけるワイヤボンディ
ング装置の斜視図FIG. 1 is a perspective view of a wire bonding apparatus according to a first embodiment of the present invention.

【図２】本発明の実施例におけるトーチ電極の拡大図 FIG. 2 is an enlarged view of a torch electrode according to the embodiment of the present invention.

【図３】（ａ）従来のワイヤボンディング装置における
スパーク発生工程を示す側面図 （ｂ）従来のワイヤボンディング装置により形成された
ボールの拡大図 （ｃ）従来のワイヤボンディング装置により形成された
ボールの拡大図FIG. 3A is a side view showing a spark generation step in a conventional wire bonding apparatus. FIG. 3B is an enlarged view of a ball formed by the conventional wire bonding apparatus. Enlarged view

【符号の説明】[Explanation of symbols]

１０ アーム １１ ワイヤ １２ キャピラリツール １３ トーチ電極 １３ｂ スパークスタート領域 DESCRIPTION OF SYMBOLS 10 Arm 11 Wire 12 Capillary tool 13 Torch electrode 13b Spark start area

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】ワイヤが挿通されたキャピラリツールと、
前記キャピラリツールを昇降させるアームと、前記ワイ
ヤに対して電位差を有し、かつ前記ワイヤの下端部に接
近してスパークを発生し、ボールを形成するトーチ電極
とを備えたワイヤボンディング装置であって、 前記トーチ電極は、母材と、前記母材の円錐状の先端部
に局所的に設けられ、かつ前記母材よりも仕事関数が低
いスパークスタート領域とを有することを特徴とするワ
イヤボンディング装置。1. A capillary tool having a wire inserted therein,
A wire bonding apparatus comprising: an arm for raising and lowering the capillary tool; and a torch electrode having a potential difference with respect to the wire, generating a spark by approaching a lower end of the wire, and forming a ball. The torch electrode has a base material and a spark start region locally provided at a conical tip of the base material and having a lower work function than the base material. Wire bonding equipment. 【請求項２】前記トーチ電極の基部の周囲に絶縁コート
を施したことを特徴とする請求項１記載のワイヤボンデ
ィング装置。2. An insulating coat around a base of the torch electrode.
Wire bonding apparatus according to claim 1, wherein the subjected to.
JP6251895A 1994-10-18 1994-10-18 Wire bonding equipment Expired - Fee Related JP3060855B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6251895A JP3060855B2 (en) 1994-10-18 1994-10-18 Wire bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6251895A JP3060855B2 (en) 1994-10-18 1994-10-18 Wire bonding equipment

Publications (2)

Publication Number Publication Date
JPH08115937A JPH08115937A (en) 1996-05-07
JP3060855B2 true JP3060855B2 (en) 2000-07-10

Family

ID=17229553

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6251895A Expired - Fee Related JP3060855B2 (en) 1994-10-18 1994-10-18 Wire bonding equipment

Country Status (1)

Country Link
JP (1) JP3060855B2 (en)

Also Published As

Publication number Publication date
JPH08115937A (en) 1996-05-07

Similar Documents

Publication Publication Date Title
US4909427A (en) Bonding wire ball formation
US4705204A (en) Method of ball forming for wire bonding
US4998002A (en) Wire-bonding method, wire-bonding apparatus, and semiconductor device produced by the wire-bonding method
US4098447A (en) Bonding method and apparatus
US7795557B2 (en) Electronic flame-off electrode with ball-shaped tip
US4564734A (en) Wire bonder
US5285949A (en) Wire-bonding method, wire-bonding apparatus, and semiconductor device produced by the wire-bonding method
US5152450A (en) Wire-bonding method, wire-bonding apparatus,and semiconductor device produced by the wire-bonding method
US4575602A (en) Apparatus for forming bonding balls on bonding wires
JP3041812B2 (en) Wire bonding equipment
JP3060855B2 (en) Wire bonding equipment
JP2758819B2 (en) Wire bonding method
JP3211318B2 (en) Torch for TIG arc welding and pulse TIG arc welding method
JPH0536748A (en) Wire bonding device
JPH08115938A (en) Wire bonder
JPS60211951A (en) Wire-bonding device
US6739494B2 (en) Device with electrodes for the formation of a ball at the end of a wire
KR910005701B1 (en) Method of ball forming for wire bonding
KR200294154Y1 (en) Torch device of semiconductor wire bonder
JP3105477B2 (en) Wire bonding equipment
JP4588308B2 (en) Pressure contact type semiconductor device
JP2927862B2 (en) Wire bonding equipment
JPH0529374A (en) Ball forming apparatus for use with wire bonder
JPS6156425A (en) Bonding device
JPS6390835A (en) Wire bonding apparatus

Legal Events

Date Code Title Description
FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080428

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090428

Year of fee payment: 9

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100428

Year of fee payment: 10

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110428

Year of fee payment: 11

LAPS Cancellation because of no payment of annual fees