JP3059869B2 - Substrate for printed wiring board - Google Patents
Substrate for printed wiring boardInfo
- Publication number
- JP3059869B2 JP3059869B2 JP5274888A JP27488893A JP3059869B2 JP 3059869 B2 JP3059869 B2 JP 3059869B2 JP 5274888 A JP5274888 A JP 5274888A JP 27488893 A JP27488893 A JP 27488893A JP 3059869 B2 JP3059869 B2 JP 3059869B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- substrate
- thickness
- resin layer
- steel sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【０００１】[0001]
【産業上の利用分野】本発明は、密着性、耐熱性に優
れ、また、導電性金属箔のエッチング作業性にも優れた
プリント基板用基材に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate for a printed circuit board which is excellent in adhesiveness and heat resistance and excellent in workability of etching a conductive metal foil.
【０００２】[0002]
【従来技術】銅張りプリント配線基板の基材には、フェ
ノ−ル樹脂板やエポキシ樹脂板と紙の積層板、ガラス繊
維入りエポキシ樹脂板、ポリイミド系樹脂板などが広く
使用されているが、ＶＴＲやビデオカメラなどのように
電磁波の発信や放熱を伴う小型モ−タ−を搭載する家電
製品のプリント基板の基材には電磁シ−ルド性や強度を
考慮して金属板が用いられている。このような金属系基
材によるプリント配線基板の製造は、金属板が導電性を
有するため、金属板の片側にガラス繊維にエポキシ樹脂
などの絶縁性樹脂を含浸させたプレプリグや接着剤を積
層して、絶縁層を形成し、その上に銅箔を積層する方法
により行われている。これらの絶縁層、銅箔の金属板へ
の積層は加熱圧着法により同時に行っているが、生産性
を向上させるため、銅箔同士が合わさるように段重ねに
して、数セットを同時に積層している。2. Description of the Related Art As a base material of a copper-clad printed wiring board, a phenol resin plate, a laminated plate of an epoxy resin plate and paper, an epoxy resin plate containing glass fiber, a polyimide resin plate and the like are widely used. A metal plate is used for the base material of the printed circuit board of a home electric appliance, such as a VTR or a video camera, which is equipped with a small motor that emits and emits electromagnetic waves, in consideration of electromagnetic shielding properties and strength. I have. When manufacturing a printed wiring board using such a metal base material, a prepreg or an adhesive obtained by impregnating glass fiber with an insulating resin such as an epoxy resin is laminated on one side of the metal plate because the metal plate has conductivity. Then, an insulating layer is formed, and a copper foil is laminated thereon. Lamination of these insulating layers and copper foil on the metal plate is performed simultaneously by the heat compression method, but in order to improve productivity, several sets are laminated at the same time by stacking them so that the copper foils fit together. I have.
【０００３】しかし、この方法で金属板の表面に銅箔を
プレプリグや接着剤を介して直接積層しても、鋼板とプ
レプリグや接着剤との密着性が劣り、十分な接着力が得
られない。特に、ハンダ浴でのハンダ付けで鋼板温度が
上昇すると、密着性が大きく低下してしまう。また、プ
リント基板の反対側は金属板が露出しており、銅箔エッ
チング工程で腐食されるので、これを防止するのに反対
側に保護フィルムを貼付け、エッチング後剥離しなけれ
ばならず、作業性に劣る。However, even if copper foil is directly laminated on the surface of a metal plate via a prepreg or an adhesive by this method, the adhesion between the steel sheet and the prepreg or the adhesive is poor, and a sufficient adhesive force cannot be obtained. . In particular, when the temperature of the steel sheet is increased by soldering in a solder bath, the adhesion is greatly reduced. In addition, the metal plate is exposed on the other side of the printed circuit board, and it is corroded in the copper foil etching process, so to prevent this, a protective film must be attached to the other side, and it must be peeled off after etching. Poor sex.
【０００４】[0004]
【発明が解決しようとする課題】そこで、本発明は、密
着性、耐熱性に優れ、また、銅箔のような導電性金属箔
のエッチング作業性にも優れたプリント基板用基材を提
供するものである。SUMMARY OF THE INVENTION Accordingly, the present invention provides a substrate for a printed circuit board which is excellent in adhesiveness and heat resistance and excellent in workability of etching a conductive metal foil such as a copper foil. Things.
【０００５】[0005]
【課題を解決するための手段】本発明は、基材の樹脂絶
縁層積層側にエポキシ樹脂または臭素化エポキシ樹脂を
骨格とし、フェノ−ル樹脂を硬化剤とする熱硬化型樹脂
層を焼付硬化により１０〜５０μｍ設けて、密着性、耐
熱性を向上させた。また、基材の樹脂絶縁層積層側との
反対側にポリオレフィン樹脂、フッ素樹脂の少なくとも
一方を２〜２０重量部含有する数平均分子量１０,００
０以上の熱硬化型ポリエステル樹脂層を焼付硬化により
５〜３０μｍ設けて、エッチング作業性を高めた。According to the present invention, a thermosetting resin layer having an epoxy resin or a brominated epoxy resin as a skeleton and a phenol resin as a curing agent is baked and cured on the resin insulating layer lamination side of the substrate. To improve the adhesion and heat resistance. A polyolefin resin and a number average molecular weight of 10,000 containing at least one of a fluororesin and 2 to 20 parts by weight on the side opposite to the resin insulating layer lamination side of the base material.
A thermosetting polyester resin layer of 0 or more was provided in a thickness of 5 to 30 μm by baking to improve the etching workability.
【０００６】[0006]
【作用】エポキシ樹脂または臭素化エポキシ樹脂を骨格
とし、フェノ−ル樹脂を硬化剤とする熱硬化型樹脂は、
密着性、耐熱性に優れているので、この樹脂層を基材の
樹脂絶縁層積層側に焼付硬化により設けた場合、両側の
基材とプレプリグ（接着剤）と強固に密着し、ハンダ付
けにより加熱されても、密着性が低下しない。この熱硬
化型樹脂層は骨格樹脂がポリエステル樹脂、アクリル樹
脂、ポリウレタン樹脂、メラミン樹脂で、硬化剤がイソ
シアネ−ト、メラミンである場合より密着性、耐熱性に
優れている。The thermosetting resin which has an epoxy resin or a brominated epoxy resin as a skeleton and a phenol resin as a curing agent,
Since this resin layer has excellent adhesion and heat resistance, when this resin layer is provided by baking and curing on the resin insulation layer lamination side of the base material, the base material on both sides and the prepreg (adhesive) are firmly adhered, and soldering is performed. Even when heated, the adhesion does not decrease. This thermosetting resin layer has better adhesion and heat resistance than the case where the skeleton resin is a polyester resin, an acrylic resin, a polyurethane resin, or a melamine resin, and the curing agent is isocyanate or melamine.
【０００７】基材の樹脂絶縁層積層側との反対側に設け
る熱硬化型樹脂層では、ポリオレフィン樹脂、フッ素樹
脂がポリエステル樹脂と相溶しにくいので、焼付硬化の
際樹脂層の表面に移行して、偏在するようになる。この
ため、樹脂層の表面はポリエステル樹脂と相溶しにくく
なり、銅箔積層の際に基材の樹脂層同士を合わせて、加
熱圧着してもブロッキングを起こさない。従って、熱硬
化型樹脂層は銅箔積層後も全面に正常な状態で残存し、
銅箔エッチングの際に基材が腐食されることがない。In the thermosetting resin layer provided on the side of the substrate opposite to the side on which the resin insulating layer is laminated, the polyolefin resin and the fluororesin are hardly compatible with the polyester resin. And become unevenly distributed. For this reason, the surface of the resin layer becomes difficult to be compatible with the polyester resin, and blocking does not occur even when the resin layers of the base material are combined and heated and pressed together when laminating the copper foil. Therefore, the thermosetting resin layer remains in a normal state on the entire surface even after laminating the copper foil,
The substrate is not corroded during copper foil etching.
【０００８】本発明の基材に使用する金属板は、剛性を
有する金属板であればよく、例えば、溶融亜鉛めっき鋼
板、電気亜鉛めっき鋼板、溶融アルミニウムめっき鋼
板、真空蒸着亜鉛めっき鋼板、ケイ素鋼板、ステンレス
鋼板、アルミニウム板などを使用できる。厚みは０.３
〜１.５ｍｍであることが好ましい。熱硬化型樹脂層を
設けるにあたってはいずれの樹脂層の場合も化成処理を
施すが、この化成処理は塗布型クロメ−ト処理（例え
ば、特開昭６０−５０１８０号、同６０−５０１８１
号）によりクロム付着量が５〜１００mg/ｍ2にするのが
好ましい。クロム付着量が５mg/ｍ2未満であると、クロ
メ−ト皮膜による密着性改善効果が小さく、１００mg/
ｍ2を超えると、クロメ−ト皮膜より熱硬化型樹脂層中
にクロムが拡散し、樹脂層を劣化させる。また、化成処
理後必要に応じてプライマ−層を設けてもよい。The metal plate used for the substrate of the present invention may be a rigid metal plate, for example, a hot-dip galvanized steel sheet, an electro-galvanized steel sheet, a hot-dip aluminum coated steel sheet, a vacuum-deposited galvanized steel sheet, a silicon steel sheet. , A stainless steel plate, an aluminum plate and the like can be used. The thickness is 0.3
It is preferably 1.5 mm. When providing a thermosetting resin layer, any of the resin layers is subjected to a chemical conversion treatment. The chemical conversion treatment is a coating type chromate treatment (for example, JP-A-60-50180 and JP-A-60-50181).
), The chromium deposition amount is preferably 5 to 100 mg / m 2 . When the chromium adhesion amount is less than 5 mg / m 2 , the effect of improving the adhesion by the chromate film is small, and
If it exceeds m 2 , chromium diffuses from the chromate film into the thermosetting resin layer and deteriorates the resin layer. After the chemical conversion treatment, a primer layer may be provided if necessary.
【０００９】基材の樹脂絶縁層積層側と反対側に設ける
熱硬化型樹脂層に添加するポリオレフィン樹脂として
は、ポリエチレン、ポリプロピレンなどが挙げられる
が、これらは分子量２００〜２０,０００低分子量のも
のが好ましい。また、フッ素樹脂としては、ポリ四フッ
化エチレン樹脂（ＰＴＦＥ）、四フッ化エチレン−パ−
フルオロアルキルビニルエ−テル共重合体樹脂（ＰＦ
Ａ）、テトラフルオロエチレン−エチレン共重合体樹脂
（ＥＴＦ）などが挙げられる。これらのポリエステル樹
脂への配合は２重量部より少ないと、樹脂層表面に充分
移行して、偏在するようにならないため、充分なる耐ブ
ロッキング性が得られない。一方、２０重量部より多い
と、樹脂層表面への移行量が過度に多くなるため、ポリ
エステル樹脂の凝集力が低下し、表層が欠落する。ま
た、ポリエステル樹脂は数平均分子量が１０,０００未
満であると、ポリオレフィン樹脂やフッ素樹脂と相溶し
易くなるため、それらの樹脂層表面への移行が起こらな
くなる。Polyolefin resins to be added to the thermosetting resin layer provided on the side opposite to the resin insulating layer lamination side of the base material include polyethylene, polypropylene and the like, and these have a low molecular weight of 200 to 20,000. Is preferred. Examples of the fluorine resin include polytetrafluoroethylene resin (PTFE),
Fluoroalkyl vinyl ether copolymer resin (PF
A), tetrafluoroethylene-ethylene copolymer resin (ETF) and the like. If the amount of these compounds is less than 2 parts by weight, they will sufficiently migrate to the surface of the resin layer and will not be unevenly distributed, so that sufficient blocking resistance cannot be obtained. On the other hand, if it is more than 20 parts by weight, the amount of transfer to the surface of the resin layer becomes excessively large, so that the cohesive force of the polyester resin is reduced and the surface layer is lost. When the number average molecular weight of the polyester resin is less than 10,000, the polyester resin is easily compatible with the polyolefin resin and the fluororesin, and thus does not migrate to the surface of the resin layer.
【００１０】熱硬化型樹脂層の厚みは、樹脂絶縁層積層
側に設ける場合、１０〜５０μｍに、その反対側に設け
る場合は５〜３０μｍにする。前者の場合、厚みが１０
μｍ未満であると、プレプリグや接着剤との接着力が低
下し、５０μｍを超えると、焼付硬化の際溶剤による膨
れが発生し易くなる。一方、後者の場合は、５μｍ未満
であると、熱硬化型樹脂層中のポリオレフィン樹脂やフ
ッ素樹脂の絶対量が少ないため、焼付硬化の際樹脂層表
面に移行する量が少なくなり、十分なる耐ブロッキング
性や耐エッチング性が得られず、３０μｍを超えると、
逆に焼付硬化の際の樹脂層表面への移行量が過度に多く
なるため、ポリエステル樹脂の凝集力が低下し、表層が
欠落する。鋼板への熱硬化型樹脂層形成はロ−ルコ−ト
法、スプレ−法、カ−テンフ−ロ−コ−ト法、ダイコ−
ト法などによればよい。The thickness of the thermosetting resin layer is 10 to 50 μm when provided on the resin insulating layer lamination side, and 5 to 30 μm when provided on the opposite side. In the former case, the thickness is 10
If it is less than μm, the adhesive strength with a prepreg or an adhesive will be reduced, and if it exceeds 50 μm, blistering due to a solvent will easily occur during baking and curing. On the other hand, in the latter case, if it is less than 5 μm, the amount of the polyolefin resin or the fluororesin in the thermosetting resin layer is small, so that the amount transferred to the resin layer surface during baking hardening is small, and sufficient resistance When the blocking property and the etching resistance cannot be obtained and the thickness exceeds 30 μm,
Conversely, the amount of transfer to the resin layer surface during bake hardening becomes excessively large, so that the cohesive force of the polyester resin is reduced and the surface layer is lost. The thermosetting resin layer is formed on a steel sheet by a roll coating method, a spraying method, a curtain coating method, a die coating method.
And the like.
【００１１】[0011]
【実施例】 実施例１ 厚さ０.５ｍｍの電気亜鉛めっき鋼板に塗布型クロメ−
ト処理によりクロム付着量が５０mg/ｍ2になるように前
処理し、骨格樹脂としてエポキシ樹脂、硬化剤としてフ
ェノ−ル樹脂３０重量部を混合した樹脂組成物を乾燥厚
さで２２μｍになるようにロ−ルコ−タ−で塗装し、鋼
板最高到達温度２３０℃で４５秒間焼付け、樹脂層を設
けた。次に、この基材樹脂層の上にエポキシ樹脂を主成
分とする接着剤を塗布した３５μｍ厚さの銅箔を載置し
たものを２セット準備して、銅箔同士が対向するように
段ずみし、圧力１００ｋｇ/ｃｍ2、温度１７０℃で２時
間加熱圧下することにより積層した。EXAMPLES Example 1 Application type chrome coating on electrogalvanized steel sheet having a thickness of 0.5 mm
Pretreatment so that the amount of chromium adhered becomes 50 mg / m 2 by a heat treatment, and a resin composition obtained by mixing an epoxy resin as a skeleton resin and 30 parts by weight of a phenol resin as a curing agent to a dry thickness of 22 μm. Was coated with a roll coater and baked at a maximum temperature of 230 ° C. for 45 seconds to form a resin layer. Next, two sets of 35 μm-thick copper foils on which an adhesive mainly composed of epoxy resin was applied were prepared on the base resin layer, and steps were prepared so that the copper foils faced each other. The layers were stacked by heating and reducing at a pressure of 100 kg / cm 2 and a temperature of 170 ° C. for 2 hours.
【００１２】実施例２ 厚さ０.８ｍｍの溶融亜鉛めっき鋼板に塗布型クロメ−
ト処理によりクロム付着量が５０mg/ｍ2になるように前
処理し、骨格樹脂として臭素化エポキシ樹脂、硬化剤と
してフェノ−ル樹脂２０重量部を混合した樹脂組成物を
乾燥厚さで３５μｍになるようにロ−ルコ−タ−で塗装
し、鋼板最高到達温度２１５℃で６０秒間焼付け、樹脂
層を設けた。次に、この基材の樹脂層上に実施例１と同
要領で同一厚さの３５μｍの銅箔を積層した。EXAMPLE 2 A coating type chrome coating on a hot-dip galvanized steel sheet having a thickness of 0.8 mm.
Pretreatment so that the amount of chromium adhered becomes 50 mg / m 2 by a heat treatment, and a resin composition obtained by mixing a brominated epoxy resin as a skeleton resin and 20 parts by weight of a phenol resin as a curing agent to a dry thickness of 35 μm. The resultant was coated with a roll coater and baked at a maximum steel sheet temperature of 215 ° C. for 60 seconds to form a resin layer. Next, a 35 μm-thick copper foil having the same thickness was laminated on the resin layer of the base material in the same manner as in Example 1.
【００１３】実施例３ 厚さ１.０ｍｍの電気亜鉛めっき鋼板に塗布型クロメ−
ト処理によりクロム付着量が１５mg/ｍ2になるように前
処理し、骨格樹脂としてエポキシ樹脂、硬化剤としてフ
ェノ−ル樹脂３０重量部を混合した樹脂組成物を乾燥厚
さで１５μｍになるようにロ−ルコ−タ−で塗装し、鋼
板最高到達温度２４０℃で５０秒間焼付け、樹脂層を設
けた。次に、この基材の樹脂層上に実施例１と同要領で
同一厚さの３５μｍの銅箔を積層した。Example 3 A coating type chrome coating on an electrogalvanized steel sheet having a thickness of 1.0 mm.
Pretreatment so that the amount of chromium adhered becomes 15 mg / m 2 by a heat treatment, and a resin composition obtained by mixing an epoxy resin as a skeleton resin and 30 parts by weight of a phenol resin as a curing agent so as to have a dry thickness of 15 μm. Was coated with a roll coater and baked at a steel plate maximum temperature of 240 ° C. for 50 seconds to form a resin layer. Next, a 35 μm-thick copper foil having the same thickness was laminated on the resin layer of the base material in the same manner as in Example 1.
【００１４】実施例４ 厚さ０.８ｍｍの溶融アルミニウムめっき鋼板に塗布型
クロメ−ト処理によりクロム付着量が８０mg/ｍ2になる
ように前処理し、骨格樹脂として臭素化エポキシ樹脂、
硬化剤としてフェノ−ル樹脂２５重量部を混合した樹脂
組成物を乾燥厚さで１５μｍになるようにロ−ルコ−タ
−で塗装し、鋼板最高到達温度２２０℃で５０秒間焼付
け、樹脂層を設けた。次に、この基材の樹脂層上に実施
例１と同要領で同一厚さの３５μｍの銅箔を積層した。Example 4 A hot-dip aluminized steel sheet having a thickness of 0.8 mm was pretreated by a coating-type chromate treatment so that the amount of chromium adhered was 80 mg / m 2, and a brominated epoxy resin was used as a skeleton resin.
A resin composition containing 25 parts by weight of a phenolic resin as a curing agent was coated with a roll coater to a dry thickness of 15 μm, and baked at a steel plate maximum temperature of 220 ° C. for 50 seconds to form a resin layer. Provided. Next, a 35 μm-thick copper foil having the same thickness was laminated on the resin layer of the base material in the same manner as in Example 1.
【００１５】実施例５ 厚さ１.０ｍｍの溶融アルミニウムめっき鋼板に塗布型
クロメ−ト処理によりクロム付着量が７０mg/ｍ2になる
ように前処理し、骨格樹脂として臭素化エポキシ樹脂、
硬化剤としてフェノ−ル樹脂２５重量部を混合した樹脂
組成物を乾燥厚さで２５μｍになるようにロ−ルコ−タ
−で塗装し、鋼板最高到達温度２３０℃で５０秒間焼付
け、樹脂層を設けた。次に、この基材の樹脂層上に実施
例１と同要領で同一厚さの３５μｍの銅箔を積層した。Example 5 A hot-dip aluminized steel sheet having a thickness of 1.0 mm was pre-treated by a coating type chromate treatment so that the amount of chromium adhered became 70 mg / m 2, and a brominated epoxy resin was used as a skeleton resin.
A resin composition containing 25 parts by weight of a phenolic resin as a curing agent is coated with a roll coater to a dry thickness of 25 μm, and baked at a steel plate maximum temperature of 230 ° C. for 50 seconds to form a resin layer. Provided. Next, a 35 μm-thick copper foil having the same thickness was laminated on the resin layer of the base material in the same manner as in Example 1.
【００１６】比較例１ 厚さ０.５ｍｍの溶融亜鉛めっき鋼板に塗布型クロメ−
ト処理によりクロム付着量が２００mg/ｍ2になるように
前処理し、骨格樹脂としてポリエステル樹脂、硬化剤と
してイソシアネ−ト樹脂３０重量部を混合した樹脂組成
物を乾燥厚さで２５μｍになるようにロ−ルコ−タ−で
塗装し、鋼板最高到達温度２１０℃で４０秒間焼付け、
樹脂層を設けた。次に、この基材の樹脂層上に実施例１
と同要領で同一厚さの３５μｍの銅箔を積層した。COMPARATIVE EXAMPLE 1 Coating-type chrome on a hot-dip galvanized steel sheet having a thickness of 0.5 mm
Pretreatment so that the amount of chromium adhered becomes 200 mg / m 2 , and a resin composition obtained by mixing a polyester resin as a skeleton resin and 30 parts by weight of an isocyanate resin as a curing agent to a dry thickness of 25 μm. Is coated with a roll coater and baked at a maximum temperature of 210 ° C. for 40 seconds.
A resin layer was provided. Next, Example 1 was placed on the resin layer of the base material.
A 35 μm-thick copper foil having the same thickness was laminated in the same manner as described above.
【００１７】比較例２ 厚さ０.５ｍｍの電気亜鉛めっき鋼板に塗布型クロメ−
ト処理によりクロム付着量が５０mg/ｍ2になるように前
処理し、骨格樹脂としてエポキシ樹脂、硬化剤としてフ
ェノ−ル樹脂３０重量部を混合した樹脂組成物を乾燥厚
さで７０μｍになるようにロ−ルコ−タ−で塗装し、鋼
板最高到達温度２２０℃で６０秒間焼付け、樹脂層を設
けた。次に、この基材の樹脂層上に実施例１と同要領で
同一厚さの３５μｍの銅箔を積層した。COMPARATIVE EXAMPLE 2 Coating-type chrome on an electrogalvanized steel sheet having a thickness of 0.5 mm
Pretreatment so that the amount of chromium adhered becomes 50 mg / m 2 , and a resin composition obtained by mixing an epoxy resin as a skeleton resin and 30 parts by weight of a phenol resin as a curing agent to a dry thickness of 70 μm. Was coated with a roll coater and baked at a maximum temperature of 220 ° C. for 60 seconds to provide a resin layer. Next, a 35 μm-thick copper foil having the same thickness was laminated on the resin layer of the base material in the same manner as in Example 1.
【００１８】比較例３ 厚さ１.０ｍｍの溶融亜鉛めっき鋼板に塗布型クロメ−
ト処理によりクロム付着量が５０mg/ｍ2になるように前
処理し、骨格樹脂として臭素化エポキシ樹脂、硬化剤と
してフェノ−ル樹脂２０重量部を混合した樹脂組成物を
乾燥厚さで５μｍになるようにロ−ルコ−タ−で塗装
し、鋼板最高到達温度２３０℃で５０秒間焼付け、樹脂
層を設けた。次に、この基材の樹脂層上に実施例１と同
要領で同一厚さの３５μｍの銅箔を積層した。Comparative Example 3 Coating-type chrome coating on a hot-dip galvanized steel sheet having a thickness of 1.0 mm.
Pretreatment so that the amount of chromium adhered becomes 50 mg / m 2 , and a resin composition obtained by mixing a brominated epoxy resin as a skeleton resin and 20 parts by weight of a phenol resin as a curing agent to a dry thickness of 5 μm. The resultant was coated with a roll coater and baked at a maximum temperature of 230 ° C. for 50 seconds to form a resin layer. Next, a 35 μm-thick copper foil having the same thickness was laminated on the resin layer of the base material in the same manner as in Example 1.
【００１９】実施例１〜５および比較例１〜３で製造し
たプリント配線基板の基材と銅箔の密着性、ハンダ耐熱
性、オ−ブン耐熱性および絶縁性を調査した。基材と銅
箔の密着性は銅箔表面に直径２ｍｍの銅棒をハンダ付け
し、その銅棒に直角方向から荷重をかけて、剥離する際
の荷重を測定した。また、ハンダ耐熱性は２６０℃のハ
ンダ浴に基板を浮かべて、表面に膨れが発生するので時
間を測定した。さらに、オ−ブン耐熱性は表面に膨れが
発生する温度を測定した。また、絶縁性は６０℃、相対
湿度９５％の雰囲気中に直流電圧１００Ｖを印加した状
態で５００時間放置した後、２０℃、相対湿度６５％の
雰囲気中に２４時間放置して、直流電圧５００Ｖを印加
した時の抵抗を測定した。これらの結果を表１に示す。
なお、基材と銅箔の密着性は剥離強度が２０Ｎ以上、ハ
ンダ耐熱性は膨れの発生するまでの時間が１分以上、オ
−ブン耐熱性は膨れの発生する温度が２２０℃以上、絶
縁性は１×１０8Ω以上が良好な性能である。The adhesiveness, solder heat resistance, oven heat resistance and insulation properties of the copper foil and the substrate of the printed wiring boards produced in Examples 1 to 5 and Comparative Examples 1 to 3 were investigated. The adhesion between the substrate and the copper foil was measured by soldering a copper rod having a diameter of 2 mm to the surface of the copper foil, applying a load to the copper rod in a direction perpendicular to the copper rod, and measuring the load at the time of peeling. The solder heat resistance was measured by floating a substrate in a solder bath at 260 ° C. and causing swelling on the surface. Furthermore, the oven heat resistance measured the temperature at which swelling occurred on the surface. Insulation was performed for 500 hours with a DC voltage of 100 V applied in an atmosphere of 60 ° C. and 95% relative humidity, and then left for 24 hours in an atmosphere of 20 ° C. and 65% relative humidity to obtain a DC voltage of 500 V Was measured when the resistance was applied. Table 1 shows the results.
In addition, the adhesion between the substrate and the copper foil is such that the peel strength is 20 N or more, the solder heat resistance is 1 minute or more before blistering occurs, the oven heat resistance is 220 ° C. or more when blistering occurs, Good performance is 1 × 10 8 Ω or more.
【００２０】[0020]
【表１】 [Table 1]
【００２１】実施例６ 厚さ０.５ｍｍの電気亜鉛めっき鋼板に塗布型クロメ−
ト処理によりクロム付着量が５０mg/ｍ2になるように前
処理して、メラミン硬化剤配合ポリエステル樹脂（数平
均分子量：４０,０００）にポリエチレン樹脂（分子
量：５,０００）およびＰＴＦＥ樹脂（分子量：２,００
０）を夫々４重量部合計で８重量部混合した樹脂組成物
を乾燥厚さで２０μｍになるようにロ−ルコ−タ−で塗
装し、鋼板最高到達温度２１５℃で４５秒間焼付け、樹
脂層を設けた。Example 6 A coating type chromate is applied to an electrogalvanized steel sheet having a thickness of 0.5 mm.
Chromium deposition amount by preparative treatment is pretreated so as to 50 mg / m 2, a melamine curing agent compounded polyester resin (number average molecular weight: 40,000) in a polyethylene resin (molecular weight: 5,000) and PTFE resin (molecular weight : 2,000
0) was coated with a roll coater so as to have a dry thickness of 20 μm, and baked at a maximum steel sheet temperature of 215 ° C. for 45 seconds to obtain a resin layer. Was provided.
【００２２】実施例７ 厚さ０.８ｍｍの溶融亜鉛めっき鋼板に塗布型クロメ−
ト処理によりクロム付着量が８０mg/ｍ2になるように前
処理して、イソシアネ−ト硬化剤配合ポリエステル樹脂
（数平均分子量：３６,０００）にポリエチレン樹脂
（分子量：２,０００）を４重量部混合した樹脂組成物
を乾燥厚さで２５μｍになるようにロ−ルコ−タ−で塗
装し、鋼板最高到達温度２１５℃で４５秒間焼付け、樹
脂層を設けた。Example 7 A coating type chrome coating on a hot-dip galvanized steel sheet having a thickness of 0.8 mm.
Pretreatment so that the amount of chromium adhered becomes 80 mg / m 2 , and 4 weights of a polyethylene resin (molecular weight: 2,000) and a polyester resin (number average molecular weight: 36,000) containing an isocyanate curing agent. The partially mixed resin composition was coated with a roll coater so as to have a dry thickness of 25 μm, and was baked at a maximum steel sheet temperature of 215 ° C. for 45 seconds to form a resin layer.
【００２３】実施例８ 厚さ０.８ｍｍの溶融亜鉛めっき鋼板に塗布型クロメ−
ト処理によりクロム付着量が４５mg/ｍ2になるように前
処理して、ポリエステル樹脂系プライマ−４μｍを塗装
した後、メラミン硬化剤配合ポリエステル樹脂（数平均
分子量：５２,０００）にＰＴＦＥ樹脂（分子量：５,０
００）を１０重量部混合した樹脂組成物を乾燥厚さで１
０μｍになるようにロ−ルコ−タ−で塗装し、鋼板最高
到達温度２１５℃で４５秒間焼付け、樹脂層を設けた。Example 8 A coating type chrome coating on a hot-dip galvanized steel sheet having a thickness of 0.8 mm.
After pre-treatment so that the chromium adhesion amount becomes 45 mg / m 2 by coating and coating a polyester resin-based primer-4 μm, a PTFE resin (number average molecular weight: 52,000) containing a melamine curing agent-containing polyester resin (number average molecular weight: 52,000) Molecular weight: 5.0
00) in a dry thickness of 1 part by weight.
It was coated with a roll coater so as to have a thickness of 0 μm, and baked at a maximum temperature of 215 ° C. for 45 seconds to form a resin layer.
【００２４】実施例９ 厚さ０.８ｍｍの溶融アルミニウムめっき鋼板に塗布型
クロメ−ト処理によりクロム付着量が７０mg/ｍ2になる
ように前処理して、イソシアネ−ト硬化剤配合ポリエス
テル樹脂（数平均分子量：２３,０００）にポリプロピ
レン樹脂（分子量：２,０００）およびＰＦＡ樹脂（分
子量：５,０００）を夫々１０重量部、合計で２０重量
部混合した樹脂組成物を乾燥厚さで３０μｍになるよう
にロ−ルコ−タ−で塗装し、鋼板最高到達温度２１５℃
で４５秒間焼付け、樹脂層を設けた。Example 9 A hot-dip aluminized steel sheet having a thickness of 0.8 mm was pretreated by a coating-type chromate treatment so that the amount of chromium adhered became 70 mg / m 2, and a polyester resin containing an isocyanate curing agent ( A resin composition obtained by mixing 10 parts by weight of a polypropylene resin (molecular weight: 2,000) and 10 parts by weight of a PFA resin (molecular weight: 5,000) with a total of 20 parts by weight in total to 30 μm in dry thickness. Paint with a roll coater so that the maximum temperature of the steel sheet is 215 ° C
For 45 seconds to provide a resin layer.
【００２５】実施例１０ 厚さ１.２ｍｍの真空蒸着亜鉛めっき鋼板に塗布型クロ
メ−ト処理によりクロム付着量が１５mg/ｍ2になるよう
に前処理して、メラミン硬化剤配合ポリエステル樹脂
（数平均分子量：３５,０００）にポリエチレンン樹脂
（分子量：５,０００）を１５重量部混合した樹脂組成
物を乾燥厚さで５μｍになるようにロ−ルコ−タ−で塗
装し、鋼板最高到達温度２１５℃で４５秒間焼付け、樹
脂層を設けた。Example 10 A vacuum-deposited galvanized steel sheet having a thickness of 1.2 mm was pretreated by a coating-type chromate treatment so that the amount of chromium adhered became 15 mg / m 2 , and a melamine curing agent-containing polyester resin (number A resin composition obtained by mixing 15 parts by weight of polyethylene resin (average molecular weight: 35,000) with 15 parts by weight of polyethylene resin (molecular weight: 5,000) is coated with a roll coater so that the dry thickness becomes 5 μm, and the steel sheet reaches the highest. Baking was performed at a temperature of 215 ° C. for 45 seconds to provide a resin layer.
【００２６】比較例４ 厚さ０.８ｍｍの溶融アルミニウムめっき鋼板に塗布型
クロメ−ト処理によりクロム付着量が２００mg/ｍ2にな
るように前処理して、イソシアネ−ト硬化剤配合ポリエ
ステル樹脂（数平均分子量：５,０００）を乾燥厚さで
２０μｍになるようにロ−ルコ−タ−で塗装し、鋼板最
高到達温度２１５℃で４５秒間焼付け、樹脂層を設け
た。Comparative Example 4 A hot-dip aluminized steel sheet having a thickness of 0.8 mm was pre-treated by a coating-type chromate treatment so that the amount of chromium adhered became 200 mg / m 2, and a polyester resin containing an isocyanate hardener was prepared. (Number average molecular weight: 5,000) was applied with a roll coater to a dry thickness of 20 μm, and baked at a maximum steel sheet temperature of 215 ° C. for 45 seconds to provide a resin layer.
【００２７】比較例５ 厚さ１.０ｍｍの溶融亜鉛めっき鋼板に塗布型クロメ−
ト処理によりクロム付着量が５０mg/ｍ2になるように前
処理して、シリコンポリエステル樹脂にポリエチレン樹
脂（分子量：５,０００）およびＰＴＦＥ樹脂（分子
量：２,０００）を夫々６重量部合計で１２重量部混合
した樹脂組成物を乾燥厚さで２５μｍになるようにロ−
ルコ−タ−で塗装し、鋼板最高到達温度２１５℃で４５
秒間焼付け、樹脂層を設けた。COMPARATIVE EXAMPLE 5 A coating type chrome coating on a hot-dip galvanized steel sheet having a thickness of 1.0 mm.
Pretreatment so that the amount of chromium adhered becomes 50 mg / m 2 , and a polyethylene resin (molecular weight: 5,000) and a PTFE resin (molecular weight: 2,000) are added to the silicone polyester resin in a total of 6 parts by weight. A resin composition mixed with 12 parts by weight was dried to a dry thickness of 25 μm.
Painted with a coater, 45 at maximum temperature of 215 ° C
After baking for 2 seconds, a resin layer was provided.
【００２８】比較例６ 厚さ０.５ｍｍの溶融アルミニウムめっき鋼板に塗布型
クロメ−ト処理によりクロム付着量が５０mg/ｍ2になる
ように前処理して、ポリエステル樹脂（数平均分子量：
２１,０００）にポリエチレン樹脂（分子量：５,００
０）１重量部混合した樹脂組成物を乾燥厚さで５μｍに
なるようにロ−ルコ−タ−で塗装し、鋼板最高到達温度
２１５℃で４５秒間焼付け、樹脂層を設けた。Comparative Example 6 A hot-dip aluminized steel sheet having a thickness of 0.5 mm was pretreated by a coating-type chromate treatment so that the amount of chromium adhered was 50 mg / m 2 , and a polyester resin (number average molecular weight:
21,000) and a polyethylene resin (molecular weight: 5,000)
0) The resin composition mixed with 1 part by weight was coated with a roll coater to a dry thickness of 5 μm, and baked at a maximum steel sheet temperature of 215 ° C. for 45 seconds to form a resin layer.
【００２９】実施例６〜１０および比較例４〜６で製造
した基材の樹脂層同士を重ね合わせて、加圧力８０ｋｇ
/ｃｍ2、温度１８０℃で２時間加熱圧着することにより
積層し、耐ブロッキング性を調査した。また、基材を１
０％塩化鉄溶液に浸漬して耐エッチング性を調査した。
この結果を表２に示す。なお、これらの評価は次の基準
によった。 記号 耐ブロッキング性 耐エッチング性 ○； ブロッキング無し ピンホ−ル無し △； 肌荒れ有り − ×； ブロッキング有り ピンホ−ル有りThe resin layers of the substrates produced in Examples 6 to 10 and Comparative Examples 4 to 6 were overlaid with each other, and a pressure of 80 kg was applied.
The layers were laminated by thermocompression bonding at a temperature of 180 ° C./cm 2 for 2 hours, and the blocking resistance was examined. The base material is
It was immersed in a 0% iron chloride solution to investigate the etching resistance.
Table 2 shows the results. These evaluations were based on the following criteria. Symbol Blocking resistance Etching resistance ；: No blocking No pinhole △; Rough skin-×; Blocking Pinhole
【００３０】[0030]
【表２】 [Table 2]
【００３１】[0031]
【発明の効果】以上のように、本発明の基材は、樹脂絶
縁層との密着性、耐熱性に優れているので、ハンダ浴で
加熱されても密着性が低下することがない。また、導電
性金属箔積層側と反対側に樹脂皮膜を設けてあるので、
プリント配線基板の導電性金属箔エッチングの際に保護
フィルムを貼付ける必要がなく、作業性が良い。As described above, the substrate of the present invention has excellent adhesion to the resin insulating layer and excellent heat resistance, so that the adhesion does not decrease even when heated in a solder bath. Also, since a resin film is provided on the side opposite to the conductive metal foil lamination side,
There is no need to attach a protective film during the etching of the conductive metal foil of the printed wiring board, and the workability is good.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 輿石 謙二 千葉県市川市高谷新町７番地―１ 日新 製鋼株式会社鉄鋼研究所塗覆装研究部内 (56)参考文献 特開 昭62−176836（ＪＰ，Ａ) 特開 平２−97085（ＪＰ，Ａ) 特開 平２−66176（ＪＰ，Ａ) 特開 平５−43656（ＪＰ，Ａ) 特開 平４−307795（ＪＰ，Ａ) 特開 昭62−289275（ＪＰ，Ａ) 特開 平３−140382（ＪＰ，Ａ) 実開 昭62−154928（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 1/05 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Kenji Koshiishi 7-1 Takatani Shinmachi, Ichikawa-shi, Chiba Pref. Nisshin Steel Co., Ltd. Steel Research Laboratory Paint Coating Research Department (56) References JP 62-177686 (JP) JP-A-2-97085 (JP, A) JP-A-2-66176 (JP, A) JP-A-5-43656 (JP, A) JP-A-4-3077795 (JP, A) JP-A Sho 62-289275 (JP, A) JP-A-3-140382 (JP, A) JP-A-62-154928 (JP, U) (58) Fields investigated (Int. Cl. 7 , DB name) H05K 1/05
Claims (2)
を順次積層してなるプリント配線基板に使用する金属板
基材において、該基材の樹脂絶縁層積層側にエポキシ樹
脂または臭素化エポキシ樹脂を骨格とし、フェノ−ル樹
脂を硬化剤とする熱硬化型樹脂層を焼付硬化により１０
〜５０μｍ設けたことを特徴とするプリント配線基板用
基材。1. A metal plate substrate used for a printed wiring board in which a resin insulating layer and a conductive metal foil are sequentially laminated on the surface of a substrate, wherein an epoxy resin or a brominated resin is provided on the resin insulating layer laminated side of the substrate. A thermosetting resin layer having an epoxy resin as a skeleton and a phenol resin as a curing agent is cured by baking.
A substrate for a printed wiring board, which is provided with a thickness of 50 μm.
を順次積層してなるプリント配線基板に使用する金属板
基材において、該基材の樹脂絶縁層積層側との反対側に
ポリオレフィン樹脂、フッ素樹脂の少なくとも一方を２
〜２０重量部含有する数平均分子量１０,０００以上の
熱硬化型ポリエステル樹脂層を焼付硬化により５〜３０
μｍ設けたことを特徴とするプリント配線基板用基材。2. A metal plate substrate for use in a printed wiring board in which a resin insulating layer and a conductive metal foil are sequentially laminated on the surface of a substrate, wherein a polyolefin is provided on the side of the substrate opposite to the side on which the resin insulating layer is laminated. At least one of resin and fluororesin
A thermosetting polyester resin layer having a number average molecular weight of 10,000 or more containing 20 to 20 parts by weight is baked and hardened to 5 to 30 parts.
A printed wiring board base material provided with μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5274888A JP3059869B2 (en) | 1993-10-06 | 1993-10-06 | Substrate for printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5274888A JP3059869B2 (en) | 1993-10-06 | 1993-10-06 | Substrate for printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH088502A JPH088502A (en) | 1996-01-12 |
| JP3059869B2 true JP3059869B2 (en) | 2000-07-04 |
Family
ID=17547937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5274888A Expired - Fee Related JP3059869B2 (en) | 1993-10-06 | 1993-10-06 | Substrate for printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3059869B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101765671B1 (en) * | 2015-09-09 | 2017-08-08 | 주식회사 에프에이치아이코리아 | a hair dryer |
-
1993
- 1993-10-06 JP JP5274888A patent/JP3059869B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101765671B1 (en) * | 2015-09-09 | 2017-08-08 | 주식회사 에프에이치아이코리아 | a hair dryer |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH088502A (en) | 1996-01-12 |
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