JP3059254B2 - Manufacturing method of tape wound insulated wire - Google Patents
Manufacturing method of tape wound insulated wireInfo
- Publication number
- JP3059254B2 JP3059254B2 JP3236178A JP23617891A JP3059254B2 JP 3059254 B2 JP3059254 B2 JP 3059254B2 JP 3236178 A JP3236178 A JP 3236178A JP 23617891 A JP23617891 A JP 23617891A JP 3059254 B2 JP3059254 B2 JP 3059254B2
- Authority
- JP
- Japan
- Prior art keywords
- polyimide
- tape
- insulated wire
- manufacturing
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Organic Insulating Materials (AREA)
- Processes Specially Adapted For Manufacturing Cables (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、接着剤層を持たない高
耐熱用ポリイミドテープ巻き絶縁電線の製造方法に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a polyimide tape insulated wire having high heat resistance and having no adhesive layer.
【０００２】[0002]
【従来の技術】従来の高耐熱用絶縁電線は、フッ素樹脂
系の接着剤などの付いたカプトン（東レ・デュポン社
製）フィルムなどの市販のポリイミドテープを心線外周
に巻き付け、焼成したり、心線をポリイミドの前駆体で
あるポリアミック酸ワニスに直接浸漬した後、加熱・乾
燥イミド化することにより製造されているが、前者は接
着剤としてフッ素樹脂などを用いることから耐熱性が充
分とはいえず、また後者はワニス中に心線を浸漬するこ
とからポリイミド層の厚みを任意にコントロールするこ
とが難しかった。2. Description of the Related Art Conventional insulated wires for high heat resistance are produced by winding a commercially available polyimide tape such as a Kapton (made by Toray DuPont) film with a fluororesin adhesive or the like around the core wire and firing it. It is manufactured by directly immersing the core wire in a polyamic acid varnish that is a precursor of polyimide, and then heating and drying and imidizing it.However, the former is not sufficient in heat resistance because it uses a fluororesin or the like as an adhesive. In the latter, it is difficult to arbitrarily control the thickness of the polyimide layer because the core is immersed in the varnish.
【０００３】[0003]
【発明が解決しようとする課題】本発明の目的とすると
ころは、ポリイミドの本来持っている耐アルカリ性、耐
溶剤性、耐熱性、電気特性をそのまま生かした、接着剤
層のないポリイミドテープ巻き絶縁電線の製造方法を提
供するものである。SUMMARY OF THE INVENTION An object of the present invention is to provide a polyimide tape wound insulation without an adhesive layer, which makes use of the inherent alkali resistance, solvent resistance, heat resistance and electric characteristics of polyimide. An object of the present invention is to provide a method for manufacturing an electric wire.
【０００４】[0004]
【課題を解決するための手段】本発明は、心線外周に熱
可塑性ポリイミドテープを巻き付け加熱・融着すること
を特徴とするテープ巻き絶縁電線の製造方法である。SUMMARY OF THE INVENTION The present invention is a method for manufacturing a tape-wound insulated wire, which comprises heating and fusing a thermoplastic polyimide tape around a core wire.
【０００５】即ち、離型フィルム上にもしくは離型ドラ
ム上に熱可塑性ポリイミドの前駆体であるポリアミック
酸溶液を塗布し、タックフリー状態になるまで乾燥し、
離型フィルムもしくは離型ドラムから剥離しイミド化が
完結するまでさらに加熱・乾燥を施し、熱可塑性のポリ
イミドフィルムとする。このとき必要により延伸しなが
ら加熱・乾燥することによりポリイミドフィルムを形成
することもできる。その後このフィルムは、所定の幅に
スリットし、熱可塑性ポリイミドテープとする。このテ
ープを心線外周に巻き付けた後、充分に加熱・融着させ
ることにより高耐熱性絶縁被覆電線とする。That is, a polyamic acid solution which is a precursor of a thermoplastic polyimide is applied on a release film or a release drum, and dried until a tack-free state is obtained.
The film is further heated and dried until the imidization is completed after peeling from the release film or the release drum to obtain a thermoplastic polyimide film. At this time, if necessary, the polyimide film can be formed by heating and drying while stretching. Thereafter, the film is slit into a predetermined width to form a thermoplastic polyimide tape. After winding the tape around the core wire, the tape is sufficiently heated and fused to obtain a high heat resistant insulated wire.
【０００６】本発明において、ポリアミック酸溶液を乾
燥させ、ポリイミドフィルムを形成させる条件として
は、通常のポリイミドフィルムを作製する条件を適用で
きる。即ち、通常は60℃付近からから段階的に300℃前
後まで加熱するが、使用する熱可塑性のポリイミドの種
類に応じて、フィルム中の溶剤が充分に揮散し、イミド
化率が98％以上になるような条件であれば特に限定され
るものではない。In the present invention, as a condition for drying a polyamic acid solution to form a polyimide film, a condition for producing a usual polyimide film can be applied. That is, usually heating from around 60 ℃ to about 300 ℃ step by step, depending on the type of thermoplastic polyimide used, the solvent in the film is sufficiently volatilized, imidization rate to 98% or more There is no particular limitation as long as the conditions are satisfied.
【０００７】本発明において、熱可塑性ポリイミドフィ
ルムと導体芯線とを加熱・融着する条件としては熱可塑
性ポリイミド樹脂のガラス転移温度より0〜200℃高い温
度で加熱するのが好ましい。特に30〜100℃高い温度で
実施することが望ましい。加熱温度がガラス転移温度よ
り低いとポリイミド樹脂が溶融せずフィルムが融着しな
い。一方、200℃以上高い温度で加熱するとポリイミド
樹脂の分解が始まる恐れがあり好ましくない。In the present invention, as a condition for heating and fusing the thermoplastic polyimide film and the conductor core wire, it is preferable to heat at a temperature higher by 0 to 200 ° C. than the glass transition temperature of the thermoplastic polyimide resin. In particular, it is desirable to carry out at a temperature higher by 30 to 100 ° C. If the heating temperature is lower than the glass transition temperature, the polyimide resin does not melt and the film does not fuse. On the other hand, heating at a temperature higher than 200 ° C. is not preferable because decomposition of the polyimide resin may start.
【０００８】本発明におけるポリアミック酸は、ポリイ
ミドとなったとき熱可塑性を示すものなら特に限定され
ない。即ち通常ジアミンと酸無水物とを反応させること
により得られる。ジアミンとしては、フェニレンジアミ
ン、ジアミノジフェニルメタン、ジアミノジフェニルス
ルホン、ジアミノジフェニルエ−テル、2,2-ビス［4-
（4-アミノフェノキシ）フェニル］プロパン、1,3-ビス
（3-アミノフェノキシ）ベンゼン、4,4'-ジアミノジフ
ェニルメタン、3,3'-ジメチルベンジジン、4,4'-シ゛アミノ-P
-テルフェニル、4,4'-ジアミノ-P-クォーターフェニ
ル、2,8-ジアミノジフェニレンオキサイドなどを、酸無
水物としては、トリメリット酸無水物、ピロメリット酸
二無水物、ビフェニルテトラカルボン酸二無水物、ベン
ゾフェノンテトラカルボン酸二無水物などを使用するこ
とができ、それぞれ１種又は２種以上を適宜組み合わせ
て用いることができる。The polyamic acid in the present invention is not particularly limited as long as it exhibits thermoplasticity when it becomes a polyimide. That is, it is usually obtained by reacting a diamine with an acid anhydride. Examples of the diamine include phenylenediamine, diaminodiphenylmethane, diaminodiphenylsulfone, diaminodiphenylether, 2,2-bis [4-
(4-aminophenoxy) phenyl] propane, 1,3-bis (3-aminophenoxy) benzene, 4,4'-diaminodiphenylmethane, 3,3'-dimethylbenzidine, 4,4'-diamino-P
-Terphenyl, 4,4'-diamino-P-quarterphenyl, 2,8-diaminodiphenylene oxide, etc. Dianhydrides, benzophenonetetracarboxylic dianhydrides, and the like can be used, and each can be used alone or in combination of two or more.
【０００９】離型フィルムとして用いることのできる材
料としては、ポリプロピレン、ポリエステル、ポリエ−
テルサルフォン、ポリイミド、ポリエチレン等のプラス
チックフィルムがあげられる。Materials that can be used as the release film include polypropylene, polyester, and polyester.
Plastic films such as tersulfone, polyimide, and polyethylene can be given.
【００１０】導体層として用いることのできる材料とし
ては、銅、アルミニウム、コンスタンタン、ニッケル等
の金属心線が挙げられる。Examples of the material that can be used for the conductor layer include metal cores such as copper, aluminum, constantan, and nickel.
【００１１】[0011]
【作用】本発明は、熱可塑性ポリイミドフィルムの易成
型性および機械的強度を生かし、心線外周に熱可塑性ポ
リイミドテープを巻き付け加熱・融着することにより、
容易に、生産性・収率よく、ポリイミドの本来持ってい
る耐アルカリ性、耐溶剤性、耐熱性、電気特性をそのま
ま生かした、接着剤層のないポリイミドテープ巻き絶縁
電線を得ることができる。The present invention takes advantage of the easy moldability and mechanical strength of a thermoplastic polyimide film, wraps a thermoplastic polyimide tape around the core wire, and heats and fuses it.
A polyimide tape-wound insulated wire without an adhesive layer can be obtained easily, with good productivity and high yield, making full use of the inherent alkali resistance, solvent resistance, heat resistance, and electrical characteristics of polyimide.
【００１２】[0012]
【実施例】温度計、撹拌装置、環流コンデンサーおよび
乾燥窒素ガス吹き込み口を備えた４つ口セパラブルフラ
スコに2,2-ビス[4-(4-アミノフェノキシ)フェニル]プロ
パン20.53ｇ（0.05mol）、1,3-ビス(3-アミノフェノキ
シ)ベンゼン14.62ｇ（0.05mol）をとり、これに無水のN
-メチル―2―ピロリドン90重量％とトルエン10重量％の
混合溶剤を、全仕込原料中の固形分割合が20重量％にな
るだけの量を加えて溶解した。乾燥窒素ガスは反応の準
備段階より生成物取り出しまでの全工程にわたり流して
おいた。次いで精製したビフェニルテトラカルボン酸二
無水物20.60ｇ（0.07mol）、ベンゾフェノンテトラカル
ボン酸二無水物9.76ｇ（0.03mol）を撹拌しながら少量
ずつ添加するが発熱反応であるため、外部水槽に約15℃
の冷水を循環させてこれを冷却した。添加後、内部温度
を20℃に設定し、５時間撹拌し反応を終了してポリアミ
ック酸溶液を得た。EXAMPLE A 20-53 g (0.05 mol) of 2,2-bis [4- (4-aminophenoxy) phenyl] propane was placed in a four-neck separable flask equipped with a thermometer, a stirrer, a reflux condenser, and a dry nitrogen gas inlet. ) And 14.62 g (0.05 mol) of 1,3-bis (3-aminophenoxy) benzene were added to anhydrous N
A mixed solvent of -methyl-2-pyrrolidone 90% by weight and toluene 10% by weight was added and dissolved in such an amount that a solid content ratio in all the charged materials became 20% by weight. Dry nitrogen gas was allowed to flow throughout the entire process from the preparation of the reaction to the removal of the product. Then, 20.60 g (0.07 mol) of the purified biphenyltetracarboxylic dianhydride and 9.76 g (0.03 mol) of benzophenonetetracarboxylic dianhydride are added little by little with stirring. ° C
Was cooled by circulating cold water. After the addition, the internal temperature was set to 20 ° C., and the mixture was stirred for 5 hours to complete the reaction, thereby obtaining a polyamic acid solution.
【００１３】このポリアミック酸溶液を用い、通常の方
法で厚みが50μｍのポリイミドフィルムを得た。本フィ
ルムをスリッターを用いて20mm幅にスリットし、熱ポリ
イミドテープとした。このテープを心線上に３重になる
ように巻き付けた後、380℃で１時間加熱乾燥・イミド
化して、ポリイミドテープ巻き絶縁電線を得た。得られ
たテープ巻き絶縁電線の特性は、ポリイミド本来の持つ
優れた耐熱性（半田耐熱、360℃・１分）、耐薬品性を
有していた。Using this polyamic acid solution, a polyimide film having a thickness of 50 μm was obtained by an ordinary method. This film was slit to a width of 20 mm using a slitter to obtain a thermal polyimide tape. After winding this tape three times on the core wire, it was heated and dried at 380 ° C. for 1 hour and imidized to obtain a polyimide tape wound insulated wire. The properties of the obtained tape wound insulated wire were excellent heat resistance (solder heat resistance, 360 ° C., 1 minute) and chemical resistance inherent to polyimide.
【００１４】[0014]
【発明の効果】本発明によれば、接着剤層を持たないポ
リイミド層のみからなるテープ巻き絶縁電線を得ること
ができ、さらに、通常のテープ巻き絶縁電線の製造装置
をそのまま用いた連続工程にも容易に適用できるなど、
工業的なテープ巻き絶縁電線の製造方法として好適なも
のである。According to the present invention, it is possible to obtain a tape-wound insulated wire consisting only of a polyimide layer having no adhesive layer, and further to a continuous process using a normal tape-wound insulated wire manufacturing apparatus as it is. Can also be easily applied,
It is suitable as an industrial method of manufacturing a tape wound insulated wire.
Claims (1)
巻き付け、加熱・融着することを特徴とするテープ巻き
絶縁電線の製造方法。1. A method for manufacturing a tape-wound insulated wire, comprising: wrapping a thermoplastic polyimide tape around the core wire, and heating and fusing the tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3236178A JP3059254B2 (en) | 1991-09-17 | 1991-09-17 | Manufacturing method of tape wound insulated wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3236178A JP3059254B2 (en) | 1991-09-17 | 1991-09-17 | Manufacturing method of tape wound insulated wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0574245A JPH0574245A (en) | 1993-03-26 |
| JP3059254B2 true JP3059254B2 (en) | 2000-07-04 |
Family
ID=16996928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3236178A Expired - Fee Related JP3059254B2 (en) | 1991-09-17 | 1991-09-17 | Manufacturing method of tape wound insulated wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3059254B2 (en) |
-
1991
- 1991-09-17 JP JP3236178A patent/JP3059254B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0574245A (en) | 1993-03-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |