JP3052739B2 - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JP3052739B2 JP3052739B2 JP6178375A JP17837594A JP3052739B2 JP 3052739 B2 JP3052739 B2 JP 3052739B2 JP 6178375 A JP6178375 A JP 6178375A JP 17837594 A JP17837594 A JP 17837594A JP 3052739 B2 JP3052739 B2 JP 3052739B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- pattern
- solder
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、抵抗、コンデンサ、半
導体等の表面実装部品、ベアチップ実装部品をリフロー
により実装するプリント配線基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board on which surface mounted components such as resistors, capacitors, semiconductors, and bare chip mounted components are mounted by reflow.
【０００２】[0002]
【従来の技術】近年、電子機器は小型化、軽量化、高機
能化が進展し、これらの電子機器のプリント配線基板に
は、表面実装部品、ベアチップ実装部品が実装されてい
る。一般に、リフローにより表面実装部品、ベアチップ
実装部品を実装する方法は、プリント配線基板の端子上
のはんだ付け部分にあらかじめはんだペーストあるいは
クリームはんだをプリコートをしておき、外部からの熱
源、例えば赤外線加熱あるいはレーザ等の加熱によりは
んだ接続を行うようにしている。2. Description of the Related Art In recent years, electronic devices have been reduced in size, weight, and functionality, and printed circuit boards of these electronic devices have been mounted with surface mount components and bare chip mount components. In general, a method of mounting a surface mount component or a bare chip mount component by reflow is to pre-coat a solder paste or cream solder on a soldered portion on a terminal of a printed wiring board in advance, and to apply a heat source from the outside, for example, infrared heating or Solder connection is performed by heating with a laser or the like.
【０００３】このように表面実装部品、ベアチップ実装
部品が実装されるプリント配線基板では、クリームはん
だ印刷時におけるはんだのタレ、ニジミ、カスレ等が発
生すると、はんだ付け部分間のショートや表面実装部
品、ベアチップ実装部品の実装不良となるので、これを
検査する必要がある。In a printed wiring board on which surface-mounted components and bare chip-mounted components are mounted as described above, if solder dripping, bleeding, blurring, etc. occur during cream solder printing, a short circuit between soldered portions, surface-mounted components, It is necessary to inspect the bare chip mounting component because it is defective.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、これを
検査する時点では、表面実装部品、ベアチップ実装部品
が実装された状態となっているので、リフロー後のはん
だが部品になじんでいるかどうかのはんだのヌレ性を的
確に把握することができないといった欠点があった。ま
た、検査の対象とする表面実装部品、ベアチップ実装部
品には、特に目印を付けていないので、検査漏れが発生
したり、検査する作業者により選択する実装部品にばら
つきがあると、検査基準にばらつきが生じ正確な検査が
できないといった問題もあった。However, at the time of inspection, since the surface-mounted components and bare chip-mounted components are in a mounted state, it is necessary to check whether the solder after reflow has adjusted to the components. There was a drawback that the wetting property could not be accurately grasped. In addition, since surface mount components and bare chip mount components to be inspected are not marked in particular, inspection omissions may occur, or if there are variations in the mounting components selected by the inspecting operator, the inspection standards may not be met. There is also a problem that an accurate inspection cannot be performed due to variations.
【０００５】したがって、本発明は上記した従来の問題
に鑑みてなされたものであり、その目的とするところ
は、検査漏れを防止すると共に、正確な検査が行えるプ
リント配線基板を提供することにある。Accordingly, the present invention has been made in view of the above-mentioned conventional problems, and an object of the present invention is to provide a printed wiring board capable of preventing an omission of an inspection and performing an accurate inspection. .
【０００６】[0006]
【課題を解決するための手段】この目的を達成するため
に、請求項１記載の発明は、はんだ付け部にあらかじめ
はんだをプリコートし電子部品をリフロー工程により実
装するプリント配線基板であって、このプリント配線基
板の少なくとも一方の対角線上の両隅部に一対のチェッ
ク用のパターン端子を設けると共に、このパターン端子
間のピッチを実装する電子部品間のピッチよりも狭め、
前記パターン端子の長手方向に目盛部を設けたものであ
る。また、請求項２記載の発明は、請求項１記載の発明
において、前記パターン端子の方向を電子部品が実装さ
れる実装パターンの方向に対応させたものである。 ま
た、請求項３記載の発明は、請求項１記載の発明におい
て、パターン端子を捨て基板部上に設けたものである。 In order to achieve this object, the invention according to claim 1 is a printed wiring board in which a soldering portion is pre-coated with solder in advance and electronic components are mounted by a reflow process. provided with a pattern terminal of a pair of check in both corners on at least one diagonal of the printed wiring board, narrower Me than the pitch between the electronic component to be mounted a pitch between the pattern terminal,
A scale portion is provided in a longitudinal direction of the pattern terminal . The invention described in claim 2 is the invention described in claim 1.
The electronic component is mounted in the direction of the pattern terminals.
This corresponds to the direction of the mounting pattern. Ma
The invention according to claim 3 is the same as the invention according to claim 1.
The pattern terminals are provided on the discarded substrate part.
【０００７】[0007]
【作用】請求項１記載の発明によれば、決まった位置で
の検査となるので、ばらつきがなく、しかもチェック用
のパターン端子には、表面実装部品、ベアチップ実装部
品を実装する必要がないので、リフロー後のはんだの状
態の確認の把握が的確となり、かつ対角線上の両隅部に
設けているので、基板全領域の実装パターン端子上のは
んだの状態を最小検査対象位置２箇所で行うことが可能
となり、さらに、パターン端子間のピッチを実装する電
子部品間のピッチよりも狭めたので、検査基準が厳しく
なる。また、目盛がはんだの状態の指標となる。また、
請求項２記載の発明によれば、パターン端子の方向を電
子部品が実装される実装パターンの方向に対応させたの
で、実装した電子部品と同じ状態の検査が行える。ま
た、請求項３記載の発明によれば、配線上およびスペー
ス上において、電子部品の実装に影響が発生しない。 According to the first aspect of the present invention, since inspection is performed at a fixed position, there is no variation, and there is no need to mount a surface mounting component or a bare chip mounting component on the check pattern terminal. Since the solder state after reflow can be checked accurately and provided at both corners on the diagonal line, the solder state on the mounting pattern terminals of the whole area of the board must be checked at two minimum inspection target positions. In addition, since the pitch between the pattern terminals is narrower than the pitch between the mounted electronic components, the inspection standard becomes strict. Also, eye Sheng is indicative of the solder of the state. Also,
According to the second aspect of the present invention, conductive direction of the pattern terminal
Since it is made to correspond to the direction of the mounting pattern on which the child component is mounted , the same state as the mounted electronic component can be inspected. Further , according to the third aspect of the invention, the mounting of the electronic component is not affected on the wiring and the space.
【０００８】[0008]
【実施例】以下、本発明の一実施例を図に基づいて説明
する。図１乃至図４は本発明に係るプリント配線基板を
示し、図１は平面図、図２はチェックパターン部の拡大
平面図、図３はリフロー工程前のはんだの状態を示す平
面図と側面図、図４はリフロー工程後のはんだの状態を
示す平面図と側面図である。これらの図において、符号
１で示すものは、プリント配線基板であって、全体にわ
たって従来周知のプリント配線と後述する表面実装部品
（以下、ＳＭＣと称する）を実装するはんだ付け部とし
ての実装パターン端子（共に図示を省略）とが印刷され
ていると共に、一方の対角線上の両隅部に一対のチェッ
クパターン部２、２が印刷されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. 1 to 4 show a printed wiring board according to the present invention, FIG. 1 is a plan view, FIG. 2 is an enlarged plan view of a check pattern portion, and FIG. 3 is a plan view and a side view showing a state of solder before a reflow process. FIG. 4 is a plan view and a side view showing the state of the solder after the reflow process. In these figures, reference numeral 1 denotes a printed wiring board, which is a mounting pattern terminal as a soldering portion on which a conventionally known printed wiring and a surface mounting component (hereinafter, referred to as SMC) to be described later are mounted. (Both not shown) are printed, and a pair of check pattern parts 2 and 2 are printed at both corners on one diagonal line.
【０００９】３１、３２は前述した実装パターン端子に
クリームはんだ（図示せず）をプリコートし、リフロー
工程でプリント配線基板１に表面実装したＳＭＣであっ
て、ＳＭＣ３１はＢ方向、すなわち上下方向、ＳＭＣ３
２はＣ方向、すなわち水平方向に実装されており、それ
ぞれのＳＭＣ３１、３２の実装パターン端子（図示せ
ず）もＢ方向およびＣ方向に印刷されている。Reference numerals 31 and 32 denote SMCs in which cream solder (not shown) is pre-coated on the above-mentioned mounting pattern terminals and surface-mounted on the printed wiring board 1 in a reflow process.
2 is mounted in the C direction, that is, the horizontal direction, and the mounting pattern terminals (not shown) of the respective SMCs 31 and 32 are also printed in the B and C directions.
【００１０】チェックパターン部２は図２に詳細を示す
ように、Ｂ方向にαのピッチで３本印刷された第１のチ
ェックパターン端子２１と、Ｃ方向にαのピッチで３本
印刷された第２のチェックパターン端子２２とで構成さ
れており、それぞれのチェックパターン端子２１、２２
には、長手方向に沿って中央から左右に均等の間隔に配
分された目盛部２１１、２２１が印刷されている。ピッ
チαはＳＭＣ３１、３１間あるいはＳＭＣ３２、３２間
のピッチβよりも狭められて形成されており、本実施例
では、α＝０．５ｍｍ、β＝０．６５ｍｍに設定されて
いる。As shown in detail in FIG. 2, the check pattern section 2 has three first check pattern terminals 21 printed at a pitch α in the B direction and three check pattern terminals 21 printed at a pitch α in the C direction. And second check pattern terminals 22, and respective check pattern terminals 21, 22.
Are printed with scale portions 211 and 221 distributed at equal intervals from the center to the left and right along the longitudinal direction. The pitch α is formed to be narrower than the pitch β between the SMCs 31 and 31 or between the SMCs 32 and 32. In this embodiment, α = 0.5 mm and β = 0.65 mm.
【００１１】次に、このような構成のプリント配線基板
におけるはんだのリフロー後の検査方法を説明する。ま
ず、従来と同様にプリント配線基板１のはんだ付け部で
ある実装パターン端子（図示せず）とチェックパターン
部２にクリームはんだ４をプリコートする。図３はチェ
ックパターン部２上にプリコートされたクリームはんだ
４の状態を示すもので、中央から左右にほぼ１目盛づつ
の位置までプリコートされている。Next, an inspection method after reflow of solder in a printed wiring board having such a configuration will be described. First, a cream solder 4 is pre-coated on a mounting pattern terminal (not shown) which is a soldering portion of the printed wiring board 1 and a check pattern portion 2 as in the conventional case. FIG. 3 shows the state of the cream solder 4 pre-coated on the check pattern portion 2, which is pre-coated from the center to the left and right to a position of approximately one scale.
【００１２】しかるのち、実装パターン端子上にＳＭＣ
３１、３２を搭載して、外部からプリント配線基板１を
加熱してクリームはんだ４を溶融させて、ＳＭＣ３１、
３２を実装パターン端子上に表面実装する。表面実装
後、一対のチェックパターン端子部２の第１および第２
のチェックパターン端子２１、２２上のクリームはんだ
４の溶融状態を検査する。図４は第２のチェックパター
ン端子２２上のクリームはんだ４の溶融状態を示すもの
で、ここで図示されているように、溶融したクリームは
んだが、左右にほぼ均等に２目盛相当の位置まで溶融
し、かつチェックパターン端子２２間にクリームはんだ
が漏れずにチェックパターン端子２２間がショートして
いないことを確認することにより、はんだのタレ、ニジ
ミ、カスレ等がないと判定される。Thereafter, the SMC is placed on the mounting pattern terminals.
The printed wiring board 1 is externally heated to melt the cream solder 4 and mount the SMC 31,
32 is surface-mounted on the mounting pattern terminals. After the surface mounting, the first and second pair of check pattern terminals 2
Of the solder paste 4 on the check pattern terminals 21 and 22 is inspected. FIG. 4 shows the melting state of the cream solder 4 on the second check pattern terminal 22. As shown in FIG. 4, the melted cream solder is melted almost equally to the left and right to a position corresponding to two graduations. By checking that the cream solder does not leak between the check pattern terminals 22 and that there is no short circuit between the check pattern terminals 22, it is determined that there is no solder sagging, bleeding, or blurring.
【００１３】同じ検査を第１のチェックパターン端子２
１でも行い、さらに他方のチェックパターン端子２でも
行う。このようにプリント配線基板１の対角線上の両隅
部ではんだの状態を検査するようにし、かつチェックパ
ターン部２のピッチαを実装ピッチβよりも狭くするこ
とで、その検査条件を厳しくすることができ、このため
両チェックパターン部２、２による検査精度が最も落ち
るプリント配線基板１の中央部での検査精度を実装ピッ
チβまで許容できるようにしたことにより、最小必要検
査箇所２箇所によりプリント配線基板１の全領域の実装
パターン端子上のはんだの状態を把握することができ、
検査精度を落とさずに短時間で行うことが可能となる。
さらに、チェックパターン部２上には、ＳＭＣを実装す
る必要がないので、はんだの状態をより正確に把握でき
るとともに、チェックの位置が決まっているので、検査
する位置によるばらつきもなく、かつチェック漏れも防
止できる。また、チェックパターン端子２１、２２の方
向Ｂ、Ｃを実装パターン端子と対応させたので、実装パ
ターン端子と同じ条件で検査することができるので、よ
り正確な検査をすることができる。The same check is performed on the first check pattern terminal 2
1 and the check pattern terminal 2 on the other side. As described above, the condition of the solder is inspected at the two diagonal corners of the printed wiring board 1 and the pitch α of the check pattern portion 2 is made narrower than the mounting pitch β, thereby making the inspection conditions strict. Therefore, the inspection accuracy at the center of the printed wiring board 1 at which the inspection accuracy by the two check pattern portions 2 and 2 is the lowest is allowed up to the mounting pitch β, so that the printing can be performed with the minimum required inspection portions at two locations. The state of the solder on the mounting pattern terminals in the entire area of the wiring board 1 can be grasped,
The inspection can be performed in a short time without lowering the inspection accuracy.
Further, since it is not necessary to mount the SMC on the check pattern portion 2, the state of the solder can be grasped more accurately, and since the check position is fixed, there is no variation due to the inspection position, and the check is omitted. Can also be prevented. In addition, since the directions B and C of the check pattern terminals 21 and 22 correspond to the mounting pattern terminals, the inspection can be performed under the same conditions as the mounting pattern terminals, so that a more accurate inspection can be performed.
【００１４】図５は本発明の第２の実施例を示す平面図
である。この第２の実施例では、プリント配線基板１に
捨て基板部１１が設けられている場合であって、チェッ
クパターン部２を捨て基板部１１に設けた点に特徴があ
る。こうすることにより、ＳＭＣ３１、３２の実装効率
が向上すると共に、チェックパターン部２を実装パター
ン端子の配線された部分から排除することにより、実装
パターン端子の配線が簡素化される。FIG. 5 is a plan view showing a second embodiment of the present invention. The second embodiment is a case in which the printed wiring board 1 is provided with the discarded substrate portion 11, and is characterized in that the check pattern portion 2 is provided on the discarded substrate portion 11. This improves the mounting efficiency of the SMCs 31 and 32, and simplifies the wiring of the mounting pattern terminals by eliminating the check pattern portion 2 from the portion where the mounting pattern terminals are wired.
【００１５】なお、本実施例では、チェックパターン部
２を一方の対角線上に設けたが、検査基準を厳しくする
ため等から必要に応じて他方の対角線上にも設けてもよ
いことは勿論である。また、目盛部２１１、２２１をチ
ェックパターン端子２１、２２の片側のみに設けたが、
両側に設けてもよいことはいうまでのないことである。
さらに、チェックパターン端子２１、２２の方向を上下
方向、水平方向としたが、ＳＭＣ３１、３２が斜め方向
に実装された場合には、これに対応させてチェックパタ
ーン端子２１、２２の方向も斜め方向としてもよい。In the present embodiment, the check pattern portion 2 is provided on one diagonal, but may be provided on the other diagonal as necessary, for example, in order to tighten the inspection standard. is there. Although the graduation portions 211 and 221 are provided only on one side of the check pattern terminals 21 and 22,
It goes without saying that it may be provided on both sides.
Furthermore, although the directions of the check pattern terminals 21 and 22 are set to the vertical direction and the horizontal direction, when the SMCs 31 and 32 are mounted in an oblique direction, the directions of the check pattern terminals 21 and 22 are also set in an oblique direction. It may be.
【００１６】[0016]
【発明の効果】以上説明したように、請求項１記載の発
明によれば、プリント配線基板の少なくとも一方の対角
線上の両隅部に一対のチェック用のパターン端子を設け
ると共に、このパターン端子間のピッチを実装する電子
部品間のピッチよりも狭めたことにより、プリント配線
基板の全領域の実装パターン端子上のはんだの状態を検
査精度を落とすことなく、必要最低限のチェックにより
検査できるので、短時間で把握することができる。ま
た、チェックの位置が決まっているので、検査する位置
によるばらつきもなく、かつチェック漏れも防止でき
る。さらに、チェックパターン部上には、電子部品を実
装する必要がないので、はんだの状態をより正確に把握
できる。また、パターン端子の長手方向に目盛部を設け
たので、はんだの溶融状態を正確に把握することができ
る。 As described above, according to the first aspect of the present invention,
According to Ming, a pair of check pattern terminals is provided at both corners on at least one diagonal line of the printed wiring board, and the pitch between the pattern terminals is made smaller than the pitch between electronic components to be mounted. In addition, since the state of the solder on the mounting pattern terminals in the entire area of the printed wiring board can be inspected by the minimum necessary check without lowering the inspection accuracy, it is possible to grasp in a short time. Further, since the position of the check is fixed, there is no variation depending on the position to be inspected, and omission of the check can be prevented. Further, since there is no need to mount electronic components on the check pattern portion, the state of the solder can be grasped more accurately. Also, a scale is provided in the longitudinal direction of the pattern terminal.
As a result, the molten state of the solder can be accurately grasped.
You.
【００１７】また、請求項２記載の発明によれば、パタ
ーン端子の方向を実装する電子部品の方向に対応させた
ので、実装パターン端子と同じ条件で検査することがで
きるので、より正確な検査をすることができる。 According to the second aspect of the present invention, the pattern
Terminal directions correspond to the direction of the mounted electronic components.
Therefore, it can be inspected under the same conditions as the mounting pattern terminals.
As a result, more accurate inspection can be performed.
【００１８】また、請求項３記載の発明によれば、パタ
ーン端子を捨て基板部上に設けたことにより、電子部品
の実装効率が向上すると共に、チェックパターン部を実
装パターン端子の配線された部分から排除することによ
り、実装パターン端子の配線が簡素化される。 According to the third aspect of the present invention, the pattern
The electronic component is provided by disposing the
Implementation efficiency is improved and the check pattern
By removing it from the wiring part of the
This simplifies wiring of the mounting pattern terminals.
【図１】 本発明に係るプリント配線基板の平面図であ
る。FIG. 1 is a plan view of a printed wiring board according to the present invention.
【図２】 本発明に係るプリント配線基板のチェックパ
ターン部の拡大平面図である。FIG. 2 is an enlarged plan view of a check pattern portion of the printed wiring board according to the present invention.
【図３】 本発明に係るプリント配線基板におけるリフ
ロー工程前の状態を示し、（ａ）はチェックパターン部
の拡大平面図、（ｂ）は同側面図である。3A and 3B show a state before a reflow process in a printed wiring board according to the present invention, wherein FIG. 3A is an enlarged plan view of a check pattern portion, and FIG.
【図４】 本発明に係るプリント配線基板におけるリフ
ロー工程後の状態を示し、（ａ）はチェックパターン部
の拡大平面図、（ｂ）は同側面図である。4A and 4B show a state after a reflow step in the printed wiring board according to the present invention, wherein FIG. 4A is an enlarged plan view of a check pattern portion, and FIG.
【図５】 本発明に係るプリント配線基板の第２実施例
の平面図である。FIG. 5 is a plan view of a second embodiment of the printed wiring board according to the present invention.
１…プリント配線基板、２…チェックパターン部、４…
クリームはんだ、１１…捨て基板部、２１，２２…チェ
ックパターン端子、３１，３２…ＳＭＣ、２１１，２２
１…目盛部。1 ... printed wiring board, 2 ... check pattern part, 4 ...
Cream solder, 11: discarded substrate part, 21, 22, check pattern terminal, 31, 32, SMC, 211, 22
1: Scale part.
Claims (3)
コートし電子部品をリフロー工程により実装するプリン
ト配線基板であって、このプリント配線基板の少なくと
も一方の対角線上の両隅部に一対のチェック用のパター
ン端子を設けると共に、このパターン端子間のピッチを
実装する電子部品間のピッチよりも狭め、前記パターン
端子の長手方向に目盛部を設けたことを特徴とするプリ
ント配線基板。1. A printed wiring board in which a soldering portion is pre-coated with solder in advance and an electronic component is mounted by a reflow process, and a pair of check patterns are provided at both corners on at least one diagonal line of the printed wiring board. provided with a pin, narrow-Me than the pitch between the electronic component to be mounted a pitch between the pattern terminal, the pattern
A printed wiring board having a scale portion provided in a longitudinal direction of a terminal .
て、前記パターン端子の方向を電子部品が実装される実
装パターンの方向に対応させたことを特徴とするプリン
ト配線基板。 2. The printed wiring board according to claim 1, wherein the direction of the pattern terminal is determined by the actual size of the component on which the electronic component is mounted.
Pudding characterized by the orientation of the mounting pattern
Wiring board.
て、前記パターン端子を捨て基板部上に設けたことを特
徴とするプリント配線基板。 3. The printed wiring board according to claim 1, wherein said pattern terminal is provided on a discarded substrate portion.
Printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6178375A JP3052739B2 (en) | 1994-07-29 | 1994-07-29 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6178375A JP3052739B2 (en) | 1994-07-29 | 1994-07-29 | Printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0846307A JPH0846307A (en) | 1996-02-16 |
| JP3052739B2 true JP3052739B2 (en) | 2000-06-19 |
Family
ID=16047398
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6178375A Expired - Fee Related JP3052739B2 (en) | 1994-07-29 | 1994-07-29 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3052739B2 (en) |
-
1994
- 1994-07-29 JP JP6178375A patent/JP3052739B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0846307A (en) | 1996-02-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0653905A1 (en) | Direct chip attach module | |
| JPH11145578A (en) | Mounting structure of electronic component, mounting board, and mounting method of the electronic component | |
| JP3128891B2 (en) | Component mounting method and component mounting device | |
| JPH09186444A (en) | Method for monitoring solder paste printing process | |
| JP4372719B2 (en) | Component mounting system | |
| US6054720A (en) | Apparatus and method for evaluating the surface insulation resistance of electronic assembly manufacture | |
| JP3052739B2 (en) | Printed wiring board | |
| US7057293B2 (en) | Structure comprising a printed circuit board with electronic components mounted thereon and a method for manufacturing the same | |
| JP2002043737A (en) | Printed circuit board | |
| KR100801899B1 (en) | Testing method for printed circuit board | |
| JP3174536B2 (en) | How to check the soldering condition | |
| JPH1012992A (en) | Mounting method and electronic component housing pallet | |
| JPH05107212A (en) | Inspecting method of external appearance of printed circuit board having parts mounted thereon | |
| JP2000174161A (en) | Flexible substrate and method for mounting semiconductor device using the same | |
| JPH06232543A (en) | Mounting method for component of printed board | |
| KR0141229B1 (en) | Local hardening method for package soldering | |
| JP2605497Y2 (en) | Printed wiring board for surface mounting | |
| JPH07307559A (en) | Soldering structure and method of electronic component | |
| JP2000077835A (en) | Land on printed wiring board | |
| JPH03101297A (en) | Printed board with pattern for checking soldering, and soldering inspection using same | |
| JPH11204934A (en) | Mounting method of electronic component | |
| JP2000151056A (en) | Package | |
| JPH0521683A (en) | Semiconductor element | |
| JPH02214192A (en) | Semiconductor device | |
| JPH0918104A (en) | Printed board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080407 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090407 Year of fee payment: 9 |
|
| LAPS | Cancellation because of no payment of annual fees |