JP3017752B2 - Printing metal mask and manufacturing method thereof - Google Patents
Printing metal mask and manufacturing method thereofInfo
- Publication number
- JP3017752B2 JP3017752B2 JP19348089A JP19348089A JP3017752B2 JP 3017752 B2 JP3017752 B2 JP 3017752B2 JP 19348089 A JP19348089 A JP 19348089A JP 19348089 A JP19348089 A JP 19348089A JP 3017752 B2 JP3017752 B2 JP 3017752B2
- Authority
- JP
- Japan
- Prior art keywords
- printing
- pattern
- photosensitive resin
- metal mask
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Landscapes
- Printing Plates And Materials Therefor (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Description
【発明の詳細な説明】 〔発明の背景〕 ＜産業上の利用分野＞ 本発明は微細な電子部品を実装するためのクリーム半
田の印刷など、精密な印刷精度が要求される印刷物を印
刷するのに適した印刷用メタルマスクおよびその製造方
法に関する。[Background of the Invention] <Industrial application field> The present invention is to print a printed material that requires precise printing accuracy, such as printing cream solder for mounting fine electronic components. The present invention relates to a metal mask for printing and a method of manufacturing the same suitable for printing.
＜従来技術＞ 従来、プリント配線板の製造工程において用いられて
いる、クリーム半田をプリント配線基板上に印刷するた
めのスクリーン印刷用のシルクスクリーンやメタルマス
クは、プリント配線板が高密度化、高集積度化されるの
に伴なって、実装される電気部品がより微細化された
り、チップ化されることによって、一層精密なスクリー
ン印刷技術が要求されるようになった。<Prior Art> Silk screens and metal masks for screen printing for printing cream solder on a printed wiring board, which are conventionally used in the manufacturing process of a printed wiring board, have a high density printed wiring board. As the degree of integration increases, the mounted electronic components become finer or chipped, and thus more precise screen printing techniques have been required.
例えば、プリント配線板の電子部品の微細化によっ
て、その脚部であるピンはプリント配線基板上に半田に
よって固着されるが、そのピンと隣接するピンとの間の
ピン間隔が高密度化の度合を決定することから、現在そ
のピン間隔が0.8mmより0.65mmに変わりつつある程度で
あるが、近い将来0.5mmにまでなることが予想される。For example, due to the miniaturization of electronic components on a printed wiring board, the pins that are the legs are fixed on the printed wiring board by soldering, but the pin interval between the pin and an adjacent pin determines the degree of high density. Therefore, the pin spacing is currently changing from 0.8mm to 0.65mm, but it is expected to reach 0.5mm in the near future.
それ故、このような微細な電子部品をプリント基板上
に実装するためには、プリント基板上にスクリーン印刷
されるクリーム半田を、伸縮しないで正確に位置決めし
て印刷する必要があることから、そのスクリーン印刷の
スクリーンに金属製のメタルマスクを使用している。Therefore, in order to mount such fine electronic components on a printed circuit board, the cream solder to be screen-printed on the printed circuit board needs to be accurately positioned and printed without expansion and contraction. A metal mask is used for the screen printing screen.
＜発明が解決しようとする課題＞ しかし、このようなスクリーン印刷用のメタルマスク
は、一般に金属板に図柄を描くためにエッチング処理を
していることから、該メタルマスクの孔部の肉厚の中間
部分では、孔部の両入口部よりも狭まったものが生じ
て、特に線幅の広狭によって正確な図柄が画き難く、著
るしく異なったものとなり易いことから目的とする図柄
の線幅や形状あるいはインキの量にバラツキが生じた
り、ラインエッヂににじみが生じたりした。<Problems to be Solved by the Invention> However, since such a metal mask for screen printing is generally subjected to an etching process for drawing a pattern on a metal plate, the thickness of the hole of the metal mask is reduced. In the middle part, the narrower than the two entrances of the hole occurs, and it is difficult to draw an accurate pattern especially due to the width of the line width, and it is likely to be significantly different, so the line width and The shape or the amount of ink varied, or the line edge was blurred.
それ故、ハンダリフロー後に、ブリッジによるショー
トが起ったり、未着部が発生して、不良品が生じ易くな
り、目的とする図柄を正確に画くためにはインキの量の
コントロールが行ない難かった。Therefore, after solder reflow, a short circuit due to a bridge or an unattached portion occurs, so that a defective product is easily generated, and it is difficult to control the amount of ink to accurately draw a desired pattern. .
＜要旨＞ 本発明者は、上記課題に鑑みて鋭意研究を重ねた結
果、エッチングにより形成した印刷用メタルマスクの被
印刷面と接する側に、図柄を印刷するための印刷画像形
成用感光樹脂硬化膜を積層すれば、エッチングによって
生じたメタルマスクの孔部に線幅のバラツキが生じて
も、印刷画像形成用感光樹脂硬化膜に形成した図柄を印
刷するための孔部によって正確な線幅を画くことができ
るとの知見を得て本発明を完成するに至った。<Summary> In view of the above problems, the present inventor has conducted intensive studies, and as a result, cured a photosensitive resin for forming a printed image for printing a pattern on a side of a metal mask for printing formed by etching in contact with a surface to be printed. By laminating the film, even if the line width of the hole of the metal mask caused by etching varies, the accurate line width can be reduced by the hole for printing the pattern formed on the cured photosensitive resin film for print image formation. The inventor has found that the present invention can be drawn and completed the present invention.
すなわち、本発明の印刷用メタルマスクは、印刷され
る図柄に類似する模様の孔部を形成したメタルマスク層
と、該メタルマスク層の被印刷面側に積層された図柄を
印刷するための孔部を形成した印刷画像形成用感光樹脂
硬化膜層とから構成され、前記メタルマスク層の孔部
が、印刷画像形成用感光樹脂硬化膜層の図柄を印刷する
ための孔部よりも広く開口されたものであることを特徴
とするものである。That is, the metal mask for printing of the present invention has a metal mask layer in which a hole having a pattern similar to a pattern to be printed is formed, and a hole for printing a pattern stacked on the printing surface side of the metal mask layer. And a hole formed in the metal mask layer, the opening of which is wider than a hole for printing a pattern of the printed image forming photosensitive resin cured film layer. It is characterized in that it is.
また、本発明の印刷用メタルマスクの製造方法は、金
属板の表面に感光性樹脂フィルムを積層し、この感光性
樹脂フィルムに印刷される図柄に類似する模様のマスク
を介して露光させて、該感光性樹脂フィルムの未露光部
分を溶剤で除去した後、この積層板をエッチング処理し
て、前記金属板面に後記印刷画像形成用感光樹脂硬化膜
層の図柄を印刷するための孔部よりも広く開口した孔部
を形成した印刷用メタルマスクを形成し、該メタルマス
クの被印刷面側に印刷画像形成用感光性樹脂フィルムを
積層して、この印刷画像形成用感光性樹脂フィルムに印
刷画像形成用図柄マスクを介して露光させて、印刷画像
形成用感光樹脂硬化膜層を形成し、該樹脂フィルムの未
露光部分を溶剤で除去して、この印刷画像形成用感光樹
脂硬化膜層に図柄を印刷するための孔部を形成したこと
を特徴とする印刷用メタルマスクの製造方法。Further, the manufacturing method of the metal mask for printing of the present invention, a photosensitive resin film is laminated on the surface of the metal plate, and exposed through a mask having a pattern similar to a pattern printed on the photosensitive resin film, After removing the unexposed portion of the photosensitive resin film with a solvent, the laminated plate is subjected to an etching process, and a hole for printing a pattern of a photosensitive resin cured film layer for printing image formation described later on the metal plate surface. Also, a printing metal mask having a wide opening is formed, a photosensitive resin film for forming a printing image is laminated on a printing surface side of the metal mask, and printing is performed on the photosensitive resin film for forming a printing image. Exposure is performed through a pattern mask for image formation to form a photosensitive resin cured film layer for print image formation, an unexposed portion of the resin film is removed with a solvent, and the photosensitive resin cured film layer for print image formation is removed. The pattern Method for producing a printing metal mask, characterized in that the formation of the hole for printing.
＜効 果＞ 本発明の印刷用メタルマスクは印刷される図柄に類似
する模様の孔部を形成したメタルマスクの被印刷面側に
図柄を印刷するための印刷画像形成用感光樹脂硬化膜層
を積層していることから、実際上ほとんど伸縮しないの
で、印刷された図柄の配置にはズレが生じたりせず、正
確な図柄を印刷することができる。また線幅にバラツキ
が生じることが無く、ラインエッジににじみが生じ難い
ので、ブリッジによるショートが起きたり、未着部の発
生による不良品の発生率を減少させることができる。ま
た、印刷画像形成用感光樹脂硬化膜層の肉厚を増減する
ことによってインキの量を微細に調節することができ
る。<Effects> The metal mask for printing of the present invention has a photosensitive resin cured film layer for forming a printed image for printing a pattern on a printing surface side of a metal mask having a hole having a pattern similar to a pattern to be printed. Since they are laminated, they hardly expand or contract in practice, so that the arrangement of the printed symbols does not shift and an accurate symbol can be printed. Further, there is no variation in line width, and bleeding does not easily occur at the line edge. Therefore, a short-circuit caused by a bridge or a defective product due to a non-attached portion can be reduced. Also, the amount of ink can be finely adjusted by increasing or decreasing the thickness of the photosensitive resin cured film layer for forming a printed image.
従って精密な印刷精度が要求されるクリーム半田の印
刷、スルホール基板の穴埋め、接着剤の印刷、液晶レジ
ストパターンの印刷、シールパターンの印刷などの工業
的な印刷に適している。Therefore, it is suitable for industrial printing such as printing of cream solder, filling of a through-hole substrate, printing of an adhesive, printing of a liquid crystal resist pattern, printing of a seal pattern, etc., which require precise printing accuracy.
〔Ｉ〕印刷用メタルマスク 本発明の印刷用メタルマスク１は第１〜２図に示すよ
うに、印刷される図柄に類似する模様の孔部２を形成し
たメタルマスク層３と、該メタルマスク層３の被印刷面
側3aに積層されている図柄を印刷するための孔部４を形
成した印刷画像形成用感光性樹脂硬化膜層５とから基本
的に構成されている。[I] Printing Metal Mask As shown in FIGS. 1 and 2, a printing metal mask 1 of the present invention comprises a metal mask layer 3 having a hole 2 having a pattern similar to a pattern to be printed, It is basically composed of a photosensitive resin cured film layer 5 for forming a printed image in which a hole 4 for printing a pattern is formed, which is laminated on the printing surface side 3a of the layer 3.
（１）メタルマスク層 （メタルマスク） 一般にスクリーン印刷において用いられているスクリ
ーン用の紗には、ポリエステルやナイロンなどの織布を
素材にしたものが用いられるが、本発明においてはこれ
らの織布では伸縮性が大きくて、正確な印刷を行ない難
いので、ステンレス、ニッケル、真鍮、燐青銅、銅、ア
ルミニウムなどの金属板、特に肉厚が５〜1200μｍ、好
ましくは20〜500μｍの金属箔や金属薄板に印刷される
図柄と類似する模様の孔部を設けたメタルマスクを用い
ることが重要である。(1) Metal Mask Layer (Metal Mask) In general, screen gauze used for screen printing is made of a woven fabric such as polyester or nylon. In the present invention, these woven fabrics are used. Since it is difficult to perform accurate printing because of its high elasticity, metal plates such as stainless steel, nickel, brass, phosphor bronze, copper, and aluminum, especially metal foils and metals with a thickness of 5 to 1200 μm, preferably 20 to 500 μm It is important to use a metal mask provided with holes having a pattern similar to a pattern printed on a thin plate.
（孔部） このようなメタルマスクは、上記金属板にインキを透
過させることができるよう通常10μｍ以上、好ましくは
20μｍ以上の幅の印刷される図柄と類似する模様の孔部
が開けられており、メタルマスク上のインキはこの印刷
される図柄と類似する模様の孔部および後記印刷画像形
成用感光樹脂硬化層の図柄を印刷するための孔部を透過
して被印刷面に付着することによって被印刷面に図柄が
形成される。(Hole) Such a metal mask is usually at least 10 μm, preferably at least 10 μm, so that the ink can pass through the metal plate.
A hole having a pattern similar to the pattern to be printed having a width of 20 μm or more is formed, and the ink on the metal mask has a hole having a pattern similar to the pattern to be printed and a cured resin layer for forming a printed image to be described later. The pattern is formed on the surface to be printed by passing through the hole for printing the symbol and attaching to the surface to be printed.
このような孔部は図柄の線幅を通常10μｍ〜1cm、好
ましくは20μｍ〜5mmに、またその線間隔を通常10μｍ
以上、好ましくは20μｍ以上とすることができる。Such a hole usually has a pattern line width of 10 μm to 1 cm, preferably 20 μm to 5 mm, and a line interval of 10 μm.
Above, preferably 20 μm or more.
特に上記メタルマスクの孔部２の被印刷面側には、後
記印刷画像形成用感光樹脂硬化膜５を積層してその印刷
画像形成用感光樹脂硬化膜５の図柄の孔部４よりインキ
を正確に被印刷面に転写させているので、第１図および
第２図にて示すように印刷画像形成用感光樹脂硬化膜５
の孔部４よりも若干幅広く開口させた方がインキの通過
量にバラツキが生じ難いので好適である。In particular, a photosensitive resin cured film 5 for printing image formation described below is laminated on the printing surface side of the hole 2 of the metal mask, and ink is accurately applied from the hole 4 of the pattern of the photosensitive resin cured film 5 for printing image formation. 1 and 2, the photosensitive resin cured film 5 for printed image formation is transferred as shown in FIGS.
It is preferable to make the opening slightly wider than the hole 4 because the variation in the amount of the ink passing hardly occurs.
また、メタルマスクの孔部２の一部にインキを流れ易
くするため、該孔部２の一部にリング状突状部5aを形成
することが好ましい。In addition, it is preferable to form a ring-shaped protrusion 5a in a part of the hole 2 in order to make it easier for ink to flow into a part of the hole 2 of the metal mask.
このようなメタルマスクは前記金属板を感光性樹脂で
被覆した後、印刷される図柄に類似する模様のマスクを
積層し露光させて、エッチング処理によって孔部を開け
て製造したり、または、前記金属板にレーザー光線によ
って孔部を穿設して製造したり、あるいは直接電気鋳造
によって製造したものであっても良い。これらメタルマ
スクの中では、エッチング処理によって製造したものあ
るいはレーザーによって製造したものが最適である。Such a metal mask is manufactured by coating the metal plate with a photosensitive resin, then laminating and exposing a mask having a pattern similar to a design to be printed, and opening a hole by an etching process, or It may be manufactured by forming a hole in a metal plate by a laser beam, or may be manufactured by direct electroforming. Among these metal masks, those manufactured by an etching process or those manufactured by a laser are optimal.
（２）印刷画像形成用感光樹脂硬化膜層 前記メタルマスク層の被印刷面側3aには、第１〜２図
に示すように図柄を印刷するための孔部４が形成された
印刷画像形成用感光樹脂硬化膜層５が積層されている。(2) Printed image forming photosensitive resin cured film layer Printed image formation in which a hole 4 for printing a pattern is formed on the printing surface side 3a of the metal mask layer as shown in FIGS. The photosensitive resin cured film layer 5 is laminated.
（感光性樹脂） 上記印刷画像形成用感光樹脂硬化膜層５を形成する印
刷画像形成用感光性樹脂９としては、ポジティブ型の感
光性樹脂あるいはネガティブ型の感光性樹脂とがある
が、ネガティブ型の感光性樹脂を使用することが好まし
い。(Photosensitive Resin) As the photosensitive resin 9 for forming a printed image, which forms the photosensitive resin cured film layer 5 for forming a printed image, there is a positive photosensitive resin or a negative photosensitive resin. It is preferable to use the photosensitive resin of the above.
このような印刷画像形成用感光性樹脂９を印刷画像形
成用図柄マスク10を介して露光させて、該樹脂を部分的
に硬化または分解させた後、未露光の未硬化の部分9aま
たは露光により分解した部分を溶媒により溶解除去し
て、孔部４を形成する。The photosensitive resin 9 for forming a print image is exposed through a design mask 10 for forming a print image, and the resin is partially cured or decomposed. The decomposed portion is dissolved and removed with a solvent to form the hole 4.
また、この印刷画像形成用感光樹脂硬化膜層５の肉厚
は、通常１〜1200μｍ、好ましくは２〜500μｍである
が、この肉厚は予め積層する印刷画像形成用感光性樹脂
９の肉厚によって決まり、その肉厚を増減することによ
ってインキの量を微細に調節することができる。The thickness of the photosensitive resin cured film layer 5 for forming a printed image is usually from 1 to 1200 μm, preferably from 2 to 500 μm. The amount of ink can be finely adjusted by increasing or decreasing the thickness.
（孔部） このようにして形成された図柄を印刷するための孔部
４は、印刷画像形成用感光性樹脂９を用いて印刷画像形
成用図柄マスク10を介して露光させて形成したものであ
るから、エッチングによって形成したメタルマスク層３
の孔部２よりも著しく正確な図柄を画くことができるの
で、前記メタルマスク層３の被印刷面側3aに印刷画像形
成用感光樹脂硬化膜層５を設けることによって、被印刷
面にインキを正確に印刷することができる。(Hole) The hole 4 for printing the pattern formed in this manner is formed by exposing the photosensitive resin 9 for printing image formation through a pattern mask 10 for printing image formation. Therefore, the metal mask layer 3 formed by etching
Since it is possible to draw a pattern that is significantly more accurate than the hole 2 of the above, by providing the photosensitive resin cured film layer 5 for forming a printed image on the printing surface side 3a of the metal mask layer 3, ink can be applied to the printing surface. It can be printed accurately.
〔II〕印刷用メタルマスクの製造方法 上記印刷用メタルマスクは、使用する感光性樹脂のポ
ジ型またはネガ型の種類によって若干変更があるが、特
に次の方法によって製造したものが最適である。[II] Manufacturing method of metal mask for printing The metal mask for printing described above is slightly changed depending on the type of photosensitive resin used, ie, positive type or negative type, but the one manufactured by the following method is most suitable.
すなわち、金属板の表面に感光性樹脂フィルムを積層
し、この感光性樹脂フィルムに印刷される図柄マスクを
介して露光させて、該感光性樹脂フィルムの未露光部分
を溶剤で除去した後、この積層板をエッチング処理し
て、前記金属板面に図柄に類似する模様の孔部を形成し
た印刷用メタルマスクを形成し、該メタルマスクの被印
刷面側に印刷画像形成用感光性樹脂フィルムを積層し
て、この印刷画像形成用感光性樹脂フィルムを印刷画像
形成用図柄マスクを介して露光させて、印刷画像形成用
感光樹脂硬化膜層を形成し、該樹脂フィルムの未露光部
分を水や有機溶剤などで除去して、この印刷画像形成用
感光樹脂硬化膜層に図柄を印刷するための孔部を形成す
ることによって印刷用メタルマスクが製造される。That is, a photosensitive resin film is laminated on the surface of a metal plate, exposed through a pattern mask printed on the photosensitive resin film, and the unexposed portion of the photosensitive resin film is removed with a solvent. The laminated plate is subjected to an etching process to form a printing metal mask in which holes having a pattern similar to a pattern are formed on the surface of the metal plate, and a photosensitive resin film for forming a printed image is formed on the printing surface side of the metal mask. Laminate and expose the photosensitive resin film for print image formation through a pattern mask for print image formation to form a cured photosensitive resin layer for print image formation. A metal mask for printing is manufactured by forming a hole for printing a design on the cured photosensitive resin layer for forming a printed image by removing it with an organic solvent or the like.
本発明の印刷用メタルマスクの製造方法について、以
下にその一実施例を挙げて具体的に説明する。The manufacturing method of the metal mask for printing of the present invention will be specifically described below with reference to an embodiment.
第３図の（イ）〜（ト）は印刷用メタルマスクの製造
工程の概略図である、その（イ）にて金属板６の両表面
に感光性樹脂フィルム７を積層し、次いで、第３図の
（ロ）で示すようにその外側に印刷される図柄に類似す
る模様のマスク８を積層して、その外側より光を照射さ
せて、該樹脂７の印刷される図柄に類似する模様のマス
ク８によって光が遮蔽されない部分7aを硬化させる。3 (a) to 3 (g) are schematic views of a manufacturing process of a printing metal mask. In FIG. 3 (a), a photosensitive resin film 7 is laminated on both surfaces of a metal plate 6, and As shown in FIG. 3 (b), a mask 8 having a pattern similar to the pattern printed on the outside thereof is laminated, and light is irradiated from the outside thereof, and a pattern similar to the pattern printed on the resin 7 is formed. The portion 7a where light is not blocked by the mask 8 is hardened.
次いで、第３図の（ハ）で示すようにこの未露光で感
光性樹脂フィルム７の未だ硬化されていない部分7bに溶
剤を吹きつけて溶剤除去する。Next, as shown in FIG. 3C, a solvent is sprayed on the unexposed and uncured portion 7b of the photosensitive resin film 7 to remove the solvent.
さらに、第３図の（ニ）で示すように、エッチング液
を吹きつけて金属板６の露出部分6aを腐食させて金属板
６にエッチングによる孔部２を開けてメタルマスク層３
を形成する。Further, as shown in FIG. 3 (d), the exposed portion 6a of the metal plate 6 is corroded by spraying an etching solution to form a hole 2 by etching in the metal plate 6, thereby forming a metal mask layer 3
To form
そして、前記感光樹脂硬化層７を剥離した後、第３図
の（ホ）で示すようにこのメタルマスク層３の被印刷面
側3aに、印刷画像形成用感光性樹脂フィルム９を積層
し、その外側に更に、正確な印刷画像形成用図柄マスク
10を積層して、再び光を照射させ、該樹脂フィルム９の
印刷画像形成用図柄マスク10により遮蔽されない部分9a
を硬化させる。After the photosensitive resin cured layer 7 is peeled off, a photosensitive resin film 9 for forming a printed image is laminated on the printing surface side 3a of the metal mask layer 3 as shown in FIG. On the outside, a pattern mask for accurate printed image formation
10 is laminated and irradiated again with light, and a portion 9a of the resin film 9 which is not shielded by the printed image forming pattern mask 10
To cure.
次いで、未露光の感光性樹脂が未硬化部分9bを、第３
図の（へ）にて示すように再び溶剤を吹きつけて溶解除
去して孔部４を形成して、感光樹脂硬化膜層５を形成す
る。Next, the unexposed photosensitive resin removes the uncured portion 9b from the third resin.
As shown by (f) in the figure, the solvent is again sprayed to dissolve and remove the solvent, thereby forming the hole portion 4 and the photosensitive resin cured film layer 5 is formed.
これによって本発明の印刷用メタルマスク１が形成さ
れる。Thereby, the printing metal mask 1 of the present invention is formed.
〔III〕印 刷 このような印刷用メタルマスク１は、スクリーン枠に
張設して第４図（イ）および（ロ）に示すような弾性被
膜11によって伸縮自在に支持したメタルマスク用印刷機
12などを用いて、スキージ13を摺動させることによりイ
ンキ14を、第３図の（ト）に示すように、被印刷板15上
に転移させて図柄16を形成させる。[III] Printing Such a metal mask for printing 1 is stretched on a screen frame and supported in a stretchable manner by an elastic coating 11 as shown in FIGS.
By sliding the squeegee 13 using 12 or the like, the ink 14 is transferred onto the printing plate 15 as shown in FIG.
〔IV〕印刷物 このようにして印刷された印刷物は、通常のスクリー
ン印刷と異なりメタルマスクが実際上ほとんど伸縮しな
いので、画かれた図柄の配置にはズレが生じないし、印
刷画像形成用図柄マスクの図柄を正確に印刷することが
できる。[IV] Printed matter Printed matter printed in this manner is different from normal screen printing in that the metal mask does not substantially expand or contract, so the arrangement of the drawn pattern does not shift, and the printed image forming pattern mask Designs can be printed accurately.
従って、通常の紙への印刷よりも工業的な印刷、例え
ばプリント配線板などに電子部品を実装するために接着
するクリーム半田の印刷や、スルホール基板の穴埋め印
刷、接着剤の印刷、液晶レジストパターンの印刷、シー
ルパターンの印刷などに最適である。Therefore, it is more industrial printing than printing on normal paper, for example, printing of cream solder that is bonded to mount electronic components on printed wiring boards, fill-in printing of through-hole boards, printing of adhesive, liquid crystal resist pattern It is most suitable for printing of seals and printing of seal patterns.
第１図は本発明実施例の印刷用メタルマスクの部分拡大
断面図であり、第２図は他の実施例の印刷用メタルマス
クの部分拡大断面図であり、第３図（イ）〜（ト）は本
発明実施例の印刷用メタルマスクの製造工程の概略図で
あり、第４図は本発明の印刷用メタルマスクを用いたメ
タルマスク用印刷機の正面図である。 １……印刷用メタルマスクの正面図、２……印刷される
図柄に類似する模様の孔部、３……メタルマスク層、3a
……被印刷面側、４……図柄を印刷するための孔部、５
……印刷画像形成用感光樹脂硬化膜層、5a……リング状
突状部、６……金属板、6a……露出部分、７……感光性
樹脂、7a……遮蔽されない部分、7b……未だ硬化されて
いない部分、８……印刷される図柄に類似する模様のマ
スク、９……印刷画像形成用感光性樹脂、9a……遮蔽さ
れない部分、9b……未硬化部分、10……印刷画像形成用
図柄マスク、11……弾性被膜、12……メタルマスク用印
刷機、13……スキージ、14……インキ、15……被印刷
板、16……図柄。FIG. 1 is a partially enlarged sectional view of a printing metal mask according to an embodiment of the present invention, and FIG. 2 is a partially enlarged sectional view of a printing metal mask of another embodiment. (G) is a schematic view of a manufacturing process of the metal mask for printing of the embodiment of the present invention, and FIG. 4 is a front view of a printing machine for metal mask using the metal mask for printing of the present invention. 1... Front view of a printing metal mask 2... Holes having a pattern similar to the pattern to be printed 3... Metal mask layer 3 a
…… the printing surface side, 4 …… a hole for printing a design, 5
…………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………… Looking. Uncured portion, 8: Mask having a pattern similar to the pattern to be printed, 9: Photosensitive resin for forming a printed image, 9a: Unshielded portion, 9b: Uncured portion, 10: Printing Design mask for image formation, 11 ... Elastic coating, 12 ... Printing machine for metal mask, 13 ... Squeegee, 14 ... Ink, 15 ... Plate to be printed, 16 ... Design.
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) B41N 1/24 B41C 1/14 G03F 7/12 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 7 , DB name) B41N 1/24 B41C 1/14 G03F 7/12
Claims (3)
成したメタルマスク層と、該メタルマスク層の被印刷面
側に積層された図柄を印刷するための孔部を形成した印
刷画像形成用感光樹脂硬化膜層とから構成され、前記メ
タルマスク層の孔部が、印刷画像形成用感光樹脂硬化膜
層の図柄を印刷するための孔部よりも広く開口されたも
のであることを特徴とする印刷用メタルマスク。1. A metal mask layer in which holes having a pattern similar to a pattern to be printed are formed, and a printed image in which holes for printing a pattern laminated on the printing surface side of the metal mask layer are formed. A photosensitive resin cured film layer for formation, wherein the holes of the metal mask layer are wider than the holes for printing the pattern of the photosensitive resin cured film layer for print image formation. Characteristic metal mask for printing.
ッチングによって形成されたものである、請求項１に記
載の印刷用メタルマスク。2. The printing metal mask according to claim 1, wherein holes having a pattern similar to a pattern to be printed are formed by etching.
し、この感光性樹脂フィルムに印刷される図柄に類似す
る模様のマスクを介して露光させて、該感光性樹脂フィ
ルムの未露光部分を溶剤で除去した後、この積層板をエ
ッチング処理して、前記金属板面に後記印刷画像形成用
感光樹脂硬化膜層の図柄を印刷するための孔部よりも広
く開口した孔部を形成した印刷用メタルマスクを形成
し、該メタルマスクの被印刷面側に印刷画像形成用感光
性樹脂フィルムを積層して、この印刷画像形成用感光性
樹脂フィルムに印刷画像形成用図柄マスクを介して露光
させて、印刷画像形成用感光樹脂硬化膜層を形成し、該
樹脂フィルムの未露光部分を溶剤で除去して、この印刷
画像形成用感光樹脂硬化膜層に図柄を印刷するための孔
部を形成したことを特徴とする印刷用メタルマスクの製
造方法。3. A photosensitive resin film is laminated on the surface of a metal plate, and is exposed through a mask having a pattern similar to a pattern printed on the photosensitive resin film, and an unexposed portion of the photosensitive resin film is exposed. After removing with a solvent, the laminated plate was subjected to an etching treatment to form a hole which was wider than a hole for printing a pattern of a photosensitive resin cured film layer for printing image formation described later on the metal plate surface. A metal mask for printing is formed, a photosensitive resin film for forming a print image is laminated on the printing surface side of the metal mask, and the photosensitive resin film for forming a print image is exposed through a pattern mask for forming a print image. To form a photosensitive resin cured film layer for print image formation, remove the unexposed portion of the resin film with a solvent, and form a hole for printing a pattern on the photosensitive resin cured film layer for print image formation. That it formed Manufacturing method of printing metal mask to butterflies.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19348089A JP3017752B2 (en) | 1989-07-26 | 1989-07-26 | Printing metal mask and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19348089A JP3017752B2 (en) | 1989-07-26 | 1989-07-26 | Printing metal mask and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0357697A JPH0357697A (en) | 1991-03-13 |
| JP3017752B2 true JP3017752B2 (en) | 2000-03-13 |
Family
ID=16308728
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19348089A Expired - Lifetime JP3017752B2 (en) | 1989-07-26 | 1989-07-26 | Printing metal mask and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3017752B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102844190A (en) * | 2009-10-23 | 2012-12-26 | 斯托克印刷品奥地利有限公司 | Method for producing perforated or partially perforated templates with reliefs |
| KR20190027941A (en) * | 2012-01-12 | 2019-03-15 | 다이니폰 인사츠 가부시키가이샤 | Method for producing step-and-repeat vapor deposition mask, step-and-repeat vapor deposition mask obtained therefrom, and method for producing organic semiconductor element |
| US10894267B2 (en) | 2012-01-12 | 2021-01-19 | Dai Nippon Printing Co., Ltd. | Vapor deposition mask with metal plate |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI458648B (en) * | 2006-04-07 | 2014-11-01 | Mitsubishi Paper Mills Ltd | A method for manufacturing a photographic mask for printing a resin, and a screen printing mask for resin |
| CN101435992B (en) * | 2007-11-15 | 2012-05-30 | 北京京东方光电科技有限公司 | Photoresist pattern forming method |
| JP2014013783A (en) * | 2010-10-27 | 2014-01-23 | Sanyo Electric Co Ltd | Method of manufacturing solar cell |
| CN106274028A (en) * | 2016-08-17 | 2017-01-04 | 村上精密制版（昆山）有限公司 | A kind of manufacture method of steel form composite wire printing screen plate |
-
1989
- 1989-07-26 JP JP19348089A patent/JP3017752B2/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102844190A (en) * | 2009-10-23 | 2012-12-26 | 斯托克印刷品奥地利有限公司 | Method for producing perforated or partially perforated templates with reliefs |
| CN102844190B (en) * | 2009-10-23 | 2015-03-25 | Spg印刷奥地利有限公司 | Method for producing perforated or partially perforated templates with reliefs |
| KR20190027941A (en) * | 2012-01-12 | 2019-03-15 | 다이니폰 인사츠 가부시키가이샤 | Method for producing step-and-repeat vapor deposition mask, step-and-repeat vapor deposition mask obtained therefrom, and method for producing organic semiconductor element |
| KR102122864B1 (en) * | 2012-01-12 | 2020-06-15 | 다이니폰 인사츠 가부시키가이샤 | Method for producing step-and-repeat vapor deposition mask, step-and-repeat vapor deposition mask obtained therefrom, and method for producing organic semiconductor element |
| US10894267B2 (en) | 2012-01-12 | 2021-01-19 | Dai Nippon Printing Co., Ltd. | Vapor deposition mask with metal plate |
| US11511301B2 (en) | 2012-01-12 | 2022-11-29 | Dai Nippon Printing Co., Ltd. | Vapor deposition mask with metal plate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0357697A (en) | 1991-03-13 |
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