JP2995320B2 - Fine drilling method for ceramics - Google Patents
Fine drilling method for ceramicsInfo
- Publication number
- JP2995320B2 JP2995320B2 JP8249243A JP24924396A JP2995320B2 JP 2995320 B2 JP2995320 B2 JP 2995320B2 JP 8249243 A JP8249243 A JP 8249243A JP 24924396 A JP24924396 A JP 24924396A JP 2995320 B2 JP2995320 B2 JP 2995320B2
- Authority
- JP
- Japan
- Prior art keywords
- drilling
- processing
- drill
- grinding
- finishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ファイン・セラミック
ス、ガラス等の硬質材に対して微細径の穿孔加工を能率
的に行う方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for efficiently drilling a small diameter hole in hard materials such as fine ceramics and glass.
【０００２】難加工材であるファイン・セラミックスの
穿孔加工は、加工製品の精密化と共に穿孔径はますます
微細化し、製品当りの穿孔個数も多数化している。した
がって、従来の工具の直接接触よる加工方法では対応で
きず、新しい加工法としてレーザー加工、放電加工、Ａ
ＪＭ加工等の加工素材に対して工具が直接接触しない方
法が提案されている。しかし、これらの加工法は、いず
れも加工コスト、加工精度、特に加工能率の点で課題が
多く残っている。[0002] In the drilling of fine ceramics, which are difficult-to-machine materials, the drilling diameter is becoming finer and the number of drillings per product is increasing with the refinement of processed products. Therefore, conventional machining methods by direct contact of tools cannot be used, and new machining methods such as laser machining, electric discharge machining, and A
A method has been proposed in which a tool does not directly contact a processing material such as JM processing. However, these processing methods still have many problems in processing cost, processing accuracy, and particularly processing efficiency.
【０００３】一方、従来の加工法の内で、穿孔形状精度
の点で現在一番信頼のおける加工法は超音波研削加工で
ある。これは、砥粒ドリルの回転による研削加工に加え
て、超音波による縦振動の衝撃力を付与し、被加工材を
徐々に破砕しながら穿孔する加工法である。On the other hand, among conventional processing methods, ultrasonic grinding is the most reliable processing method at present in terms of perforation shape accuracy. This is a processing method in which, in addition to grinding by rotation of an abrasive drill, an impact force of longitudinal vibration by ultrasonic waves is applied, and a workpiece is gradually crushed and drilled.
【０００４】穿孔径が２ｍｍ以上の太径の場合、ドリル
による穿孔加工法は研削抵抗の低減と切削水の噴出を目
的とする筒状のコア・ドリルが使用できるので、工具コ
スト、加工能率は共に問題なく、現在もっとも多用され
る加工法である。[0004] When the drilling diameter is 2 mm or more, a drilling method using a drill can use a cylindrical core drill for the purpose of reducing grinding resistance and jetting cutting water. Therefore, tool cost and machining efficiency are reduced. Both are the most frequently used processing methods at present.
【０００５】しかし、穿孔径が１ｍｍ未満の微細径にな
ると、中空型のコア・ドリルが製作できなくなり、中実
型のドリルしか使用できなくなる。そして、ドリル径が
細くなるとともに、ドリルの座屈剛性は著しく低下す
る。したがって、この場合、超音波研削加工によるセラ
ミックスに対するの微細孔径の穿孔は、ドリルの強度保
持と研削切粉の排出を確保するために、「微小切込みの
多段繰り返し」の加工となり、加工時間は著しく長くな
り、加工能率は低下する。[0005] However, when the diameter of the perforation becomes smaller than 1 mm, a hollow core drill cannot be manufactured, and only a solid drill can be used. Then, as the drill diameter becomes smaller, the buckling rigidity of the drill is significantly reduced. Therefore, in this case, the drilling of the fine pore diameter to the ceramics by ultrasonic grinding is a process of “multi-stage repetition of minute cuts” in order to secure the strength of the drill and discharge the grinding chips, and the processing time is remarkable. It becomes longer and the processing efficiency decreases.
【０００６】[0006]
【発明が解決しようとする課題】仕上り寸法精度のよい
超音波研削加工を利用しながら、セラミックスに対する
微細孔径の穿孔加工の能率を、飛躍的に向上させる方法
について研究開発を行った。超音波研削加工による極細
穿孔の加工能率の低下は、加工ドリルの細径化によるド
リルの剛性の低下が最大の理由である。そのため、ドリ
ルの剛性を高めるため、ドリル芯金の材質を従来の普通
鋼から、熱処理合金鋼、超硬合金またはファイン・セラ
ミックス製に変更することを試験し、その結果、加工時
間短縮の改善が得られた。SUMMARY OF THE INVENTION Research and development have been made on a method for dramatically improving the efficiency of drilling a fine hole in ceramics while utilizing ultrasonic grinding with good finished dimensional accuracy. The biggest reason for the reduction in the processing efficiency of ultra-fine drilling by ultrasonic grinding is that the rigidity of the drill is reduced due to the reduction in the diameter of the processing drill. Therefore, to increase the rigidity of the drill, we tested changing the material of the drill core from conventional plain steel to heat-treated alloy steel, cemented carbide, or fine ceramics. Obtained.
【０００７】さらに加工能率を向上させるために、穿孔
の工程を穿孔の作用に応じて２つに分割して実行するこ
とが有効であることを見出した。すなわち、超音波研削
加工による穿孔は仕上り加工のみにとどめ、加工負荷の
大きい貫通までの穿孔は、加工精度は低くても加工能率
の大きい穿孔法を採用することにした。すなわち「１次
穿孔：任意の加工法による粗穿孔」と「２次穿孔：超音
波研削による仕上り穿孔」の２段工程にすることであ
る。この発明が解決しようとする課題は、一連の穿孔加
工工程のなかで、加工精度の高い超音波研削加工を有効
に如何に適用するかにある。In order to further improve the processing efficiency, it has been found that it is effective to divide the drilling step into two in accordance with the function of the drilling. That is, the drilling by the ultrasonic grinding is limited to the finishing, and the drilling up to the penetration with a large processing load is performed by a drilling method with low processing accuracy but high processing efficiency. That is, it is to be a two-step process of “primary drilling: coarse drilling by an arbitrary processing method” and “secondary drilling: finished drilling by ultrasonic grinding”. The problem to be solved by the present invention is how to effectively apply ultrasonic grinding with high processing accuracy in a series of drilling steps.
【０００８】[0008]
【課題を解決するための手段】第１の手段は請求項１の
とうりである。「ファイン・セラミックスに対する穿孔
加工において、１次の粗加工として被加工材と工具が直
接接触をしない加工法を利用して貫通する穴を穿孔した
後、２次の仕上げ加工を、ダイヤモンドあるいはｃＢＮ
を電着して製造されたドリルを用いドリル加工を行うこ
とを特徴とする加工方法」The first means is as defined in claim 1. "In the drilling of fine ceramics, the workpiece and tool are directly
After drilling a hole to penetrate using a processing method that does not make contact , a second finishing process is performed using diamond or cBN.
A drilling method using a drill manufactured by electrodeposition of the
【０００９】第２の手段は請求項２のとおりである。
「ファイン・セラミックスに対する穿孔加工において、
１ｍｍ以下の微細口径の穴を多数個連続して加工する場
合、１次の粗加工として被加工材と工具が直接接触をし
ない加工法を利用して貫通する穴を穿孔した後、２次の
仕上げ加工を、ダイヤモンドあるいはｃＢＮを電着して
製造された円柱形の中実ドリルを用い、超音波振動付与
による研削加工を行うことを特徽とする加工方法であ
る」The second means is as defined in claim 2.
"In the drilling of fine ceramics,
When a large number of holes with a diameter of 1 mm or less are continuously processed, the workpiece and the tool come into direct contact as primary roughing.
After drilling a hole through utilizing free machining method, the secondary finishing, using actual drilling in a cylindrical produced by electrodepositing diamond or cBN, grinding by applying ultrasonic vibration It is a processing method that specializes in doing. ''
【００１０】請求項１および請求項２の１次の粗加工の
方法として「被加工材と工具が直接接触をしない加工
法」としたのは、２次に行われる「ドリル加工」あるい
は「超音波研削加工は」よりも穿孔加工精度は劣るが、
加工能率でははるかに優れている被加工材に加工工具が
接触しない加工法例えばレーザー加工、放電加工、サン
ドブラスト加工、ウォタージェット加工などが対象にな
る。[0010] In the first roughing method of the first and second aspects, a method of “working in which the workpiece and the tool do not directly contact with each other is performed.
The method of “ drilling” or “ultrasonic grinding is less effective” than the “drilling” performed in the second stage,
Processing methods that do not allow a processing tool to come into contact with a work material, which is far superior in processing efficiency, such as laser processing, electric discharge processing, sand blast processing, and water jet processing, are targets.
【００１１】請求項２の手段において、穿孔する微細孔
の径を１ｍｍ以下としたのは、これより太径の穿孔では
コア・ドリルが使用でき、加工能率の点で必ずしも本発
明を適用する必要がないからである。According to the second aspect of the present invention, the diameter of the fine holes to be drilled is set to 1 mm or less because a core drill can be used for drilling holes having a diameter larger than this, and the present invention is not necessarily applied in terms of processing efficiency. Because there is no.
【００１２】また、２次の仕上げ加工に使用するドリル
を、ダイヤモンドあるいはＣＢＮを電着して製造された
円柱形の中実ドリル刃としたのは、ドリルの口径が１ｍ
ｍ以下になると実用上のドリルは電着ドリルしかなく、
同時にコア状のドリルは製造できず、ドリルの形状はソ
リッド状の中実型になるからである。The drill used for the secondary finishing is a cylindrical solid drill blade manufactured by electrodepositing diamond or CBN, because the diameter of the drill is 1 m.
m or less, the only practical drill is an electrodeposition drill,
At the same time, a core-shaped drill cannot be manufactured, and the shape of the drill becomes a solid solid type.
【００１３】[0013]
【作用】請求の範囲に示すように、本発明の特徴である
「穿孔工程を粗加工と仕上り加工に分けたこと」がどう
作用するかについて説明する。貫通までの粗加工の時間
は、当然のことながら従来実施されていたドリル加工あ
るいは超音波研削加工による場合よりも著しい時間短縮
が可能となる。The following describes how the feature of the present invention, "separating the drilling step into roughing and finishing", which is a feature of the present invention, works. As a matter of course, the time required for the rough processing until the penetration can be significantly reduced as compared with the conventional drilling or ultrasonic grinding.
【００１４】２次穿孔は、粗加工により貫通している穴
に対して、穴径の仕上げ加工のみとなることから研削量
は少なく、研削抵抗は格段に小さい。このため、剛性強
度の小さい極細ドリルでも、従来よりも研削速度大きく
することが出来、１回の研削量も増やすことが出来るか
ら穿孔のための繰り返し回数も減らすことが可能とな
る。これには、仕上り加工が貫通孔にそう穿孔であるこ
とから、研削切屑は冷却水の流れによって直接排出でき
ることも寄与している。In the secondary drilling, only the finishing process of the hole diameter is performed for the hole penetrated by the roughing, so that the grinding amount is small and the grinding resistance is remarkably small. For this reason, even with an ultrafine drill having a small rigidity, the grinding speed can be made higher than in the past, and the amount of one grinding can be increased, so that the number of repetitions for drilling can be reduced. This also contributes to the fact that the grinding chips can be directly discharged by the flow of the cooling water, since the finishing process is a perforation in the through hole.
【００１５】[0015]
【実施例】穿孔加工を「１次：粗加工」、「２次：仕上
り加工」に分割し、粗加工として加工能率のよいＡＪＭ
法を採用し、仕上り加工法として超音波研削加工法を組
み合せ実施する試験を行った。ＡＪＭ法とは、微細な砥
粒粉末を高圧気体により加工物に対して噴射して穿孔加
工するものであり、加工物の脆性破壊の集積で加工が進
行していくため、多数個の穿孔を短時間に行うことがで
き硬脆材料の加工に適している。[Example] Drilling is divided into "primary: roughing" and "secondary: finishing", and AJM with high processing efficiency as roughing
A test was conducted in which the method was adopted and an ultrasonic grinding method was used in combination as a finishing method. The AJM method is a method in which fine abrasive powder is injected into a workpiece by high-pressure gas to perform drilling. Since the processing progresses due to the accumulation of brittle fracture of the workpiece, a large number of holes are formed. It can be performed in a short time and is suitable for processing hard and brittle materials.
【００１６】ＡＪＭ法による１次の粗穿孔の加工条件を
下記に示した。 「ＡＪＭ法による粗加工の加工条件」 被加工材 ：グラッシーカーボン 板厚：４ｍｍ 砥 粒 ：ＳｉＣ 粒径：５８μ 搬送ガス ：窒素 圧力：２ＭＰａ 使用ノズル：０．６８ｍｍ 目標穿孔径：１．５ｍｍThe processing conditions for the primary coarse perforation by the AJM method are shown below. "Processing conditions for rough processing by AJM method" Workpiece material: glassy carbon Plate thickness: 4 mm Abrasive particles: SiC Particle size: 58 μ Carrier gas: nitrogen Pressure: 2 MPa Nozzle used: 0.68 mm Target drilling diameter: 1.5 mm
【００１７】超音波研削加工による仕上り加工条件を下
記に示す。 「超音波研削による仕上り加工条件」 仕上り加工用ドリル ：ダイヤモンド電着ドリル（中実型） 外径：１．８５ｍｍ 仕上り加工の穿孔モード：Ｇ７２（高速深穴開けサイクル） Ｇ８２（深穴開けサイクル） 図１に仕上り加工において試験した穿孔モードを示し
た。The finishing conditions of the ultrasonic grinding are shown below. "Finishing conditions by ultrasonic grinding" Finishing drill: Electrodeposited diamond drill (solid type) Outer diameter: 1.85mm Finishing drilling mode: G72 (high-speed deep drilling cycle) G82 (deep drilling cycle) FIG. 1 shows the drilling mode tested in the finishing process.
【００１８】試験によって得られた穿孔加工時間、穿孔
時の研削抵抗の測定結果を表１に示した。Table 1 shows the measurement results of the drilling time and the grinding resistance during drilling obtained by the test.
【表１】 [Table 1]
【００１９】このように、従来の超音波研削１段のみの
加工法に比較して、本発明法による２段の穿孔は、穿孔
加工時間は従来より通常使用の「穿孔モードＧ８３」に
おいても２／３に、さらに「穿孔モードＧ７３」の場合
は１／５と著しい時間の短縮が達成されている。そし
て、研削抵抗は「穿孔モードＧ８３、Ｇ７３」共に従来
法の４０％までに減少している。このように穿孔工程を
加工当初より「粗加工と仕上げ加工」の２段とする本発
明は、加工時間の短縮と工具寿命の延長の両面における
メリットが確認できた。As described above, in comparison with the conventional method using only one step of ultrasonic grinding, the two-step drilling according to the method of the present invention requires a longer drilling time even in the “drilling mode G83” which has been conventionally used. In the case of "perforation mode G73", a remarkable time reduction of 1/5 has been achieved. Then, the grinding resistance is reduced to 40% of that of the conventional method in both the “perforation modes G83 and G73”. As described above, according to the present invention in which the drilling step is performed in two steps of “rough processing and finish processing” from the beginning of the processing, advantages in both reduction of the processing time and extension of the tool life were confirmed.
【００２０】[0020]
【発明の効果】本発明において仕上り加工の研削抵抗が
著しく減少することから、穿孔モードは図１に示すよう
にドリルの繰り返し切込み回数の少ないモードが採用で
きるようになり、穿孔加工の時間は大幅に短縮させるこ
とができる。すなわち、本発明による効果は、第１に従
来法に比べて「加工能率が著しく向上する」ことであ
る。例えば、プラズマ・エッチャー用電極のように穴径
０．８ｍｍ、深さ３ｍｍ、穴個数１７３３個の多数孔の
加工製品の場合、従来の９０秒／個の加工時間が本発明
法によって加工時間が約１／５になるとすると、製品１
個の加工時間は従来の５２時間から１２時間と大幅な短
縮が達成できる。最近、微細で多数個の穿孔製品が増え
ており、本発明は加工生産能率の向上に有効である。According to the present invention, since the grinding resistance in the finishing process is remarkably reduced, a mode in which the number of repetitive cuttings of the drill is small as shown in FIG. Can be shortened. That is, the effect of the present invention is that, first, the processing efficiency is remarkably improved as compared with the conventional method. For example, in the case of a multi-hole processed product having a hole diameter of 0.8 mm, a depth of 3 mm, and a number of holes of 1733, such as a plasma etcher electrode, the conventional processing time of 90 seconds / piece is obtained by the method of the present invention. If it becomes about 1/5, product 1
The individual machining time can be greatly reduced from the conventional 52 hours to 12 hours. Recently, a large number of fine and perforated products are increasing, and the present invention is effective for improving the processing productivity.
【００２１】また本発明法によって研削抵抗は大幅に低
下するから、工具寿命もこれに比例して減少するとする
と、約２倍以上になることが推定できる。Further, since the grinding resistance is greatly reduced by the method of the present invention, it can be estimated that if the tool life is reduced in proportion to this, it will be about twice or more.
【００２２】そして、１ｍｍ以下の穿孔の場合、小口径
の中実ドリルがコア・ドリルに替えて、問題なく使用で
きることは、本発明の最大の効用である。In the case of drilling of 1 mm or less, it is the greatest utility of the present invention that a solid drill having a small diameter can be used without problem in place of a core drill.
【図１】仕上り加工に用いられる穿孔モードとドリルの
上下切込み移動のパターンを示す模式図である。FIG. 1 is a schematic diagram showing a drilling mode used for finishing and a pattern of a vertical cutting movement of a drill.
Claims (2)
において、１次の粗加工として被加工材と工具が直接接
触しない加工法を利用して貫通する穴を穿孔した後２次
の仕上げ加工を、ダイヤモンドあるいはｃＢＮを電着し
て製造されたドリルを用いドリル加工を行うことを特徴
とする加工方法。In the drilling of fine ceramics, a workpiece and a tool are directly contacted as a primary roughing.
A drilling method characterized by drilling a through-hole using a drilling method that does not touch, and then performing secondary finishing using a drill manufactured by electrodepositing diamond or cBN.
において、１ｍｍ以下の微細口径の穴を多数個連続して
加工する場合、１次の粗加工として被加工材と工具が直
接接触をしない加工法を利用して貫通する穴を穿孔した
後、２次の仕上げ加工を、ダイヤモンドあるいはｃＢＮ
を電着して製造された円柱形の中実ドリルを用い、超音
波振動付与による研削加工を行うことを特徴とする加工
方法。2. In the drilling of fine ceramics, when a large number of holes having a fine diameter of 1 mm or less are continuously formed, a workpiece and a tool are directly processed as a primary roughing.
After drilling a hole to penetrate using a processing method that does not make contact , a second finishing process is performed using diamond or cBN.
A grinding method by applying ultrasonic vibration using a cylindrical solid drill manufactured by electrodeposition of a material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8249243A JP2995320B2 (en) | 1996-08-29 | 1996-08-29 | Fine drilling method for ceramics |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8249243A JP2995320B2 (en) | 1996-08-29 | 1996-08-29 | Fine drilling method for ceramics |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1071612A JPH1071612A (en) | 1998-03-17 |
| JP2995320B2 true JP2995320B2 (en) | 1999-12-27 |
Family
ID=17190062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8249243A Expired - Lifetime JP2995320B2 (en) | 1996-08-29 | 1996-08-29 | Fine drilling method for ceramics |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2995320B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009155159A (en) * | 2007-12-26 | 2009-07-16 | Tosoh Quartz Corp | High precision pore working with fine size to quartz glass plate |
| CN105345613B (en) * | 2015-10-19 | 2017-11-07 | 上海现代先进超精密制造中心有限公司 | One kind is used for the precision machined method of angle mirror deep hole |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04122607A (en) * | 1990-09-14 | 1992-04-23 | Hitachi Seiko Ltd | Method of boring fragile body |
-
1996
- 1996-08-29 JP JP8249243A patent/JP2995320B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH1071612A (en) | 1998-03-17 |
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