JP2978390B2 - Method for manufacturing connection body between flexible printed board and wiring board - Google Patents
Method for manufacturing connection body between flexible printed board and wiring boardInfo
- Publication number
- JP2978390B2 JP2978390B2 JP5316292A JP31629293A JP2978390B2 JP 2978390 B2 JP2978390 B2 JP 2978390B2 JP 5316292 A JP5316292 A JP 5316292A JP 31629293 A JP31629293 A JP 31629293A JP 2978390 B2 JP2978390 B2 JP 2978390B2
- Authority
- JP
- Japan
- Prior art keywords
- flexible printed
- electrode
- board
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Description
【０００１】[0001]
【産業上の利用分野】本発明はフレキシブルプリント基
板と配線基板とを接続して構成する電子部品分野に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the field of electronic components formed by connecting a flexible printed board and a wiring board.
【０００２】[0002]
【従来の技術】従来の技術を図３によって説明する。2. Description of the Related Art A conventional technique will be described with reference to FIG.
【０００３】図３は、従来の異方性導電シートによる接
続を示した断面図である。異方性導電シートによる接続
方式は、フレキシブルプリント基板の電極１８と基板電
極１２とを異方性導電シートを介して電気的接続を得る
方法である。FIG. 3 is a cross-sectional view showing a connection using a conventional anisotropic conductive sheet. The connection method using an anisotropic conductive sheet is a method of obtaining an electrical connection between the electrode 18 of the flexible printed board and the substrate electrode 12 via the anisotropic conductive sheet.
【０００４】１１は基板、１２は基板電極、１３は金属
微粉末、１４は接着用樹脂、１５はフレキシブルプリン
ト基板のベースフィルム、１６はフレキシブルプリント
基板の配線、１７はフレキシブルプリント基板のカバー
フィルム、１８はフレキシブルプリント基板の電極であ
る。[0004] 11 is a substrate, 12 is a substrate electrode, 13 is a metal fine powder, 14 is an adhesive resin, 15 is a base film of a flexible printed board, 16 is a wiring of the flexible printed board, 17 is a cover film of the flexible printed board, Reference numeral 18 denotes an electrode of a flexible printed board.
【０００５】この方法は、接着用樹脂１４中に、金属微
粉末１３を分散させたシートを基板電極１２とフレキシ
ブルプリント基板の電極１８との間に介在させ、シート
を加熱加圧することにより、接着用樹脂１４を軟化せし
め、フレキシブルプリント基板の電極１８と基板電極１
２間を分散させた金属微粉末１３で電気的に接触させる
方法である。In this method, a sheet in which a metal fine powder 13 is dispersed in an adhesive resin 14 is interposed between a substrate electrode 12 and an electrode 18 of a flexible printed circuit board, and the sheet is heated and pressurized. The resin 14 is softened so that the electrode 18 of the flexible printed circuit board and the substrate electrode 1 are softened.
In this method, the metal fine powder 13 in which the two are dispersed is brought into electrical contact.
【０００６】金属微粉末１３は、ニッケル、半田ボー
ル、カーボンなどが用いられ、接着用樹脂１４は、熱硬
化型の樹脂が用いられる。フレキシブルプリント基板の
ベースフィルム１５とカバーフィルム１７は耐熱性に優
れたポリイミドが一般的に用いられる。The metal fine powder 13 is made of nickel, solder balls, carbon, or the like, and the bonding resin 14 is a thermosetting resin. As the base film 15 and the cover film 17 of the flexible printed board, polyimide having excellent heat resistance is generally used.
【０００７】しかし、この異方性導電シートを用いた方
法では、電極間にも金属微粉末が存在するため電極間の
絶縁抵抗が低下し、クロストークを発生させるなど微細
ピッチに向かない。However, the method using this anisotropic conductive sheet is not suitable for fine pitches, for example, because the metal fine powder is present between the electrodes, so that the insulation resistance between the electrodes is reduced and crosstalk is generated.
【０００８】現在この方法で使用できる電極ピッチは１
５０〜２００μｍピッチである。また、フレキシブルプ
リント基板を基板１１に十分な接着固着するために、接
着長を約２ｍｍ程度以上必要とされる。At present, the electrode pitch that can be used in this method is 1
The pitch is 50 to 200 μm. Further, in order to sufficiently bond and fix the flexible printed board to the board 11, the bonding length is required to be about 2 mm or more.
【０００９】しかも、この接続方式は、異方性導電シー
トを介しているため高価となる。なお、図４に示したよ
うにフレキシブルプリント基板と基板との接続部に屈曲
性の応力が加わると、フレキシブルプリント基板の電極
部にクラックが発生しやすく、断線しやすい。In addition, this connection method is expensive because it uses an anisotropic conductive sheet. When a flexible stress is applied to the connection between the flexible printed board and the board as shown in FIG. 4, cracks are easily generated in the electrode portion of the flexible printed board, and the wire is easily broken.
【００１０】[0010]
【発明が解決しようとする課題】上記の異方性導電シー
トを用いたフレキシブルプリント基板と配線基板の接続
方法によれば、下記の課題がある。According to the method for connecting a flexible printed board and a wiring board using the anisotropic conductive sheet described above, there are the following problems.
【００１１】（１）接続ピッチが小さくとも約１５０μ
ｍピッチ程度以上必要であり、微細ピッチの電極接続に
向かない。(1) Even if the connection pitch is small, about 150 μm
It requires about m pitches or more, and is not suitable for fine pitch electrode connection.
【００１２】（２）フレキシブルプリント基板を基板に
固着させる、十分な接続強度を得るためには、長い接続
しろ（約２ｍｍ以上）を必要とするので、部品の微細化
に適さない。(2) In order to secure the flexible printed board to the board and obtain sufficient connection strength, a long connection margin (about 2 mm or more) is required, which is not suitable for miniaturization of components.
【００１３】（３）樹脂を熱硬化させる温度まで熱を加
えないといけないので、耐熱性の低い基板やフレキシブ
ルプリント基板には向かない。(3) Since heat must be applied to a temperature at which the resin is thermally cured, it is not suitable for a substrate having low heat resistance or a flexible printed circuit board.
【００１４】（４）接続に異方性導電シートを用いてい
る分、コストが高い。(4) The cost is high because the anisotropic conductive sheet is used for the connection.
【００１５】[0015]
【課題を解決するための手段】上記課題を解決するため
に、本発明のフレキシブルプリント基板と配線基板との
接続体の製造方法は、配線基板端部近傍に設けられた基
板電極上に紫外線硬化型もしくは熱硬化型の絶縁性樹脂
を塗布し、ベースフィルム上に配線が接着され前記基板
電極と合致する電極部分を除いて配線上にカバーフィル
ムが接着されたフレキシブルプリント基板の前記電極を
前記基板電極と一致させるように設置し、前記配線基板
端面からフレキシブルプリント基板の前記カバーフィル
ムの端までかかるように前記絶縁性樹脂によるフィレッ
トを形成し、前記配線基板端面よりも基板の内側の部分
に位置する前記フレキシブルプリント基板の前記電極部
分を前記ベースフィルム上から前記配線基板側に加圧
し、前記フレキシブルプリント基板の電極の表面の凹凸
の凸部と前記基板電極との電気的接触を得、前記ベース
フィルムと前記配線基板の間と前記フレキシブルプリン
ト基板の電極の表面の凹凸の凹部と前記基板電極との間
に前記絶縁性樹脂が介在したまま、前記絶縁性樹脂を硬
化させて、前記配線基板に前記フレキシブルプリント基
板を固着すると共に前記基板電極とフレキシブルプリン
ト基板の電極との電気的接触を維持するフレキシブルプ
リント基板と配線基板との接続体の製造方法である。In order to solve the above-mentioned problems, a flexible printed board and a wiring board according to the present invention are required .
The manufacturing method of the connection body is such that an ultraviolet-curing or thermosetting insulating resin is provided on the substrate electrode provided near the end of the wiring substrate.
The wiring is adhered on the base film and the substrate is
Cover fill the wiring except for the electrode part that matches the electrode
The electrodes on the flexible printed circuit board to which the
The wiring board is installed so as to coincide with the board electrode.
The cover fill of the flexible printed circuit board from the end face
So that it extends to the end of the
A portion inside the board from the end face of the wiring board.
The electrode portion of the flexible printed circuit board located at
Pressure from the base film to the wiring board side
And irregularities on the surface of the electrode of the flexible printed circuit board.
Electrical contact between the projections of the substrate and the substrate electrode is obtained.
Between the film and the wiring board and the flexible printed circuit board.
Between the concave and convex portions on the surface of the substrate electrode and the substrate electrode
The insulating resin is hardened while the insulating resin is interposed in the
And the flexible printed circuit board is attached to the wiring board.
The board is fixed and the substrate electrode and the flexible printed
Flexible board that maintains electrical contact with
This is a method for manufacturing a connection body between a lint board and a wiring board .
【００１６】[0016]
【００１７】[0017]
【作用】本発明のフレキシブルプリント基板と配線基板
との接続体の構造と製造方法によれば、次に示す作用が
ある。According to the structure and the manufacturing method of the connection body between the flexible printed board and the wiring board of the present invention, the following actions are provided.
【００１８】（１）絶縁性樹脂を用いて、直接配線基板
とフレキシブルプリント基板の電極同士を接続させるた
めに、約１００μｍピッチ以下の微細ピッチの接続に対
応でき、且つ、一つの工程で電極同士の接続とフレキシ
ブルプリント基板の固着が行える。(1) Since the electrodes of the wiring board and the flexible printed board are directly connected to each other by using the insulating resin, it is possible to cope with the connection at a fine pitch of about 100 μm or less, and the electrodes can be connected in one process. Connection and fixation of the flexible printed circuit board.
【００１９】（２）配線基板端面よりも外側に前記フレ
キシブルプリント基板のカバーフィルムが位置するよう
フレキシブルプリント基板を設置し、絶縁性樹脂が配線
基板端面からカバーフィルムにかかるように配線基板端
面部分に前記絶縁製樹脂をフィレット状に設置している
ため、非常に短い接続長で接続が可能であるにもかかわ
らず、接着強度も十分つよく、絶縁性樹脂がフレキシブ
ルプリント基板の電極部分を覆っているため、接続部の
電極の断線も生じなく高信頼性である （３）基板上の接続長が非常に短くできるため、基板が
小さくできる。(2) A flexible printed board is installed so that the cover film of the flexible printed board is located outside the end face of the wiring board, and the insulating resin is applied to the end face of the wiring board such that the insulating resin extends from the end face of the wiring board to the cover film. Since the insulating resin is provided in a fillet shape, the connection is possible with a very short connection length, but the bonding strength is sufficiently high, and the insulating resin covers the electrode portion of the flexible printed circuit board. Therefore, there is no disconnection of the electrode of the connection portion and high reliability is achieved.
【００２０】（４）金属微粉末を含んだ導電性シートを
用いる必要がなく、低コストである。(4) There is no need to use a conductive sheet containing fine metal powder, and the cost is low.
【００２１】（５）接続に用いる絶縁性樹脂を紫外線硬
化型の樹脂とすれば、熱を印加することなく接続が可能
であり耐熱性の低い部品の接合にも適応可能であり、フ
レキシブルプリント基板の材質も高価なポリイミドを用
いないで良く低コストである。(5) If the insulating resin used for the connection is an ultraviolet-curing resin, the connection can be made without applying heat, and it can be applied to the joining of components having low heat resistance. The material can be low cost without using expensive polyimide.
【００２２】[0022]
【実施例】本発明の実施例について図１を用いて説明す
る。図１は、本発明のフレキシブルプリント基板と配線
基板の接続体の製造方法を示す断面図である。１は基
板、２は基板電極、３はフレキシブルプリント基板のカ
バーフィルム、４はフレキシブルプリント基板の電極、
５はフレキシブルプリント基板のベースフィルム、６は
フレキシブルプリント基板の配線、７は絶縁性樹脂、８
は加圧ツールである。An embodiment of the present invention will be described with reference to FIG. FIG. 1 is a cross-sectional view illustrating a method for manufacturing a connection body between a flexible printed board and a wiring board according to the present invention. 1 is a board, 2 is a board electrode, 3 is a cover film of a flexible printed board, 4 is an electrode of a flexible printed board,
5 is a base film of the flexible printed board, 6 is a wiring of the flexible printed board, 7 is an insulating resin, 8
Is a pressure tool.
【００２３】まず、図１（ａ）に示すように基板電極２
を有した基板１上の接続部に紫外線硬化型もしくは熱硬
化型の絶縁性樹脂７を塗布する。この絶縁性樹脂には、
一般的にアクリル系やエポキシ系などの樹脂がある。First, as shown in FIG.
A UV-curable or thermosetting insulating resin 7 is applied to the connection portion on the substrate 1 having the above. In this insulating resin,
Generally, there is an acrylic or epoxy resin.
【００２４】次に、フレキシブルプリント基板を、基板
電極２とフレキシブルプリント基板の電極４を一致する
ように設置する。このとき絶縁性樹脂は、基板端面から
フレキシブルプリント基板のカバーフィルム３の端まで
にかかるようにフィレットを形成させる。Next, the flexible printed circuit board is set so that the substrate electrode 2 and the electrode 4 of the flexible printed circuit board coincide with each other. At this time, the insulating resin forms a fillet so as to extend from the end face of the board to the end of the cover film 3 of the flexible printed board.
【００２５】従って、基板端面からカバーフィルム３ま
での距離は、１ｍｍ以下の短い距離とする。基板の厚み
が１ｍｍよりも薄いときは、更に短く約０．５ｍｍ程度
が望ましい。フレキシブルプリント基板のカバーフィル
ム３とベースフィルム５はポリイミドなどの材質が一般
的である。フレキシブルプリント基板の配線８は、導電
性が良く屈曲性にも優れた銅などである。Therefore, the distance from the substrate end face to the cover film 3 is a short distance of 1 mm or less. When the thickness of the substrate is smaller than 1 mm, it is desirably shorter and about 0.5 mm. The cover film 3 and the base film 5 of the flexible printed board are generally made of a material such as polyimide. The wiring 8 of the flexible printed board is made of copper or the like having good conductivity and excellent flexibility.
【００２６】また、フレキシブルプリント基板の電極４
は、銅の表面に酸化防止のためにＡｕめっき処理が施さ
れた方が望ましいが、Ｓｎめっきでも良い。The electrode 4 of the flexible printed circuit board
It is preferable that the surface of copper is subjected to Au plating for preventing oxidation, but Sn plating may be used.
【００２７】次に図１（ｂ）に示すように、加圧ツール
８をフレキシブルプリント基板の電極４のベースフィル
ム側から、基板１に加圧する。このとき、加圧ツール８
は基板端面よりも基板１の内側を加圧する。Next, as shown in FIG. 1B, a pressing tool 8 is pressed against the substrate 1 from the base film side of the electrodes 4 of the flexible printed circuit board. At this time, the pressing tool 8
Presses the inside of the substrate 1 more than the end face of the substrate.
【００２８】これは、基板端部の断差部をフレキシブル
プリント基板を介して加圧すると、フレキシブルプリン
ト基板の電極４がその基板端部の局所的な応力によって
断線する可能性があるからである。This is because, when the gap between the ends of the substrate is pressurized through the flexible printed circuit board, the electrodes 4 of the flexible printed circuit board may be disconnected due to local stress at the end of the substrate. .
【００２９】そして、絶縁性樹脂が紫外線硬化型の樹脂
であれば、図１（ｃ）に示すように紫外線を照射して絶
縁性樹脂を硬化させる。If the insulating resin is an ultraviolet-curing resin, the insulating resin is cured by irradiating ultraviolet rays as shown in FIG.
【００３０】もし基板１がガラスなどの紫外線を透過す
る基材であれば、基板１の下方から紫外線を照射し、不
透明基板であれば基板上方から斜めにも紫外線を照射し
て絶縁性樹脂を硬化させる。絶縁性樹脂が熱硬化型であ
れば、加圧ツール８もしくは基板１を加熱するかして絶
縁性樹脂を硬化させる。If the substrate 1 is a substrate such as glass that transmits ultraviolet light, ultraviolet light is irradiated from below the substrate 1. If the substrate 1 is opaque, ultraviolet light is irradiated obliquely from above the substrate to remove the insulating resin. Let it cure. If the insulating resin is a thermosetting resin, the insulating resin is cured by heating the pressing tool 8 or the substrate 1.
【００３１】しかし、熱硬化の場合は耐熱性が低いフレ
キシブルプリント基板や基板１や接続部近傍に配置され
ている部品が、絶縁性樹脂の硬化温度までの温度に対し
て耐熱性が無ければならない。However, in the case of thermosetting, the flexible printed circuit board having low heat resistance, the board 1 and the components disposed in the vicinity of the connecting portion must have heat resistance up to the curing temperature of the insulating resin. .
【００３２】次に図１（ｄ）に示すように加圧を解除し
てフレキシブルプリント基板の接続を終了する。Next, as shown in FIG. 1D, the pressure is released and the connection of the flexible printed circuit board is completed.
【００３３】基板端部からベースフィルム３の端部にか
かるように絶縁性樹脂のフィレットを設けたのは、フレ
キシブルプリント基板が何度も屈曲される場合、フレキ
シブルプリント基板の電極４は、その繰り返し応力が絶
縁性樹脂が基板電極にかかっている境界に局所的にかか
るため、その境界で切断され易い。The reason why the insulating resin fillet is provided so as to extend from the end of the substrate to the end of the base film 3 is that when the flexible printed board is bent many times, the electrode 4 of the flexible printed board is repeatedly used. Since the stress is locally applied to the boundary where the insulating resin is applied to the substrate electrode, it is easily cut at the boundary.
【００３４】そのため、絶縁性樹脂をフレキシブルプリ
ント基板のカバーフィルム３の端部まで覆うようにフィ
レットを形成し、応力の集中を避けて、耐屈曲性を増し
ている。For this reason, a fillet is formed so as to cover the insulating resin up to the end of the cover film 3 of the flexible printed circuit board, thereby avoiding concentration of stress and increasing bending resistance.
【００３５】またフレキシブルプリント基板の電極と基
板電極２との接続長が短くてもフレキシブルプリント基
板と基板１との接着強度を十分得るためである。加圧し
ているフレキシブルプリント基板の電極４の長さは、約
０．２ｍｍ以上あれば電気的接続が維持される。Further, even if the connection length between the electrode of the flexible printed board and the board electrode 2 is short, the adhesive strength between the flexible printed board and the board 1 can be sufficiently obtained. If the length of the electrode 4 of the pressurized flexible printed circuit board is about 0.2 mm or more, the electrical connection is maintained.
【００３６】なお、フレキシブルプリント基板の各電極
４の厚さのバラツキは、加圧ツール８の加圧時に１つ当
りの加重が均一になるように、なるべく均一な方がよ
く、約±２μｍ以下のバラツキにした方が望ましい。The variation in the thickness of each electrode 4 of the flexible printed board is preferably as uniform as possible so that the weight per electrode 4 is uniform when the pressing tool 8 is pressed, and is about ± 2 μm or less. It is desirable to make the variation.
【００３７】図２に、図１に示したＡ−Ａ’の断面図を
示す。図２を用いて本発明の接続方式のメカニズムを説
明する。FIG. 2 is a sectional view taken along the line AA ′ shown in FIG. The mechanism of the connection method of the present invention will be described with reference to FIG.
【００３８】フレキシブルプリント基板の電極４の表面
は細かな凹凸を有しており、加圧ツール８を加圧時にこ
の電極４の凸部が基板電極２と接している状態となる。
また、電極４の凹部には薄く微量の絶縁性樹脂７があ
り、絶縁性樹脂７の硬化後の加圧除去時には、この微量
の樹脂の収縮力がフレキシブルプリント基板の電極４と
基板電極２との機械的接触と電気的接続を維持すること
になる。The surface of the electrode 4 of the flexible printed board has fine irregularities, and when the pressing tool 8 is pressed, the convex portion of the electrode 4 comes into contact with the substrate electrode 2.
Also, there is a thin and minute amount of insulating resin 7 in the concave portion of the electrode 4, and when the insulating resin 7 is removed under pressure after curing, the contraction force of this minute amount of resin causes the electrode 4 and the substrate electrode 2 of the flexible printed circuit board to be in contact with each other. Will maintain the mechanical contact and electrical connection.
【００３９】また、フレキシブルプリント基板の各電極
４の間にも絶縁性樹脂７が介在し、絶縁性樹脂７の硬化
時に、この各電極４間にある樹脂の収縮力もベースフィ
ルムを押え込む形で応力が伝わり、電気的接触を維持す
るために寄与する。An insulating resin 7 is also interposed between the electrodes 4 of the flexible printed circuit board, and when the insulating resin 7 is cured, the shrinking force of the resin between the electrodes 4 is reduced by pressing the base film. Stress is transmitted and contributes to maintaining electrical contact.
【００４０】[0040]
【発明の効果】上記本発明によるフレキシブルプリント
基板と配線基板の接続体の構造と製造方法によれば、次
に述べる効果がある。According to the structure and manufacturing method of the connection body between the flexible printed board and the wiring board according to the present invention, the following effects can be obtained.
【００４１】（１）配線基板端面よりも外側に前記フレ
キシブルプリント基板のカバーフィルムが位置するよう
フレキシブルプリント基板を設置し、絶縁性樹脂が配線
基板端面からカバーフィルムにかかるように配線基板端
面部分に前記絶縁製樹脂をフィレット状に設置している
ため、非常に短い接続長で接続が可能であるにもかかわ
らず、接着強度も十分つよく、絶縁性樹脂がフレキシブ
ルプリント基板の電極部分を覆っているため、接続部の
電極の断線が生じなく高信頼性である。(1) A flexible printed board is installed so that the cover film of the flexible printed board is located outside the end face of the wiring board, and the insulating resin is applied to the end face of the wiring board so that the insulating resin covers the cover film from the end face of the wiring board. Since the insulating resin is provided in a fillet shape, the connection is possible with a very short connection length, but the bonding strength is sufficient and the insulating resin covers the electrode portion of the flexible printed circuit board. Therefore, high reliability is obtained without disconnection of the electrode of the connection portion.
【００４２】（２）絶縁性樹脂を用いて、直接配線基板
とフレキシブルプリント基板の電極同士を接続させるた
めに、約１００μｍピッチまでの微細ピッチの接続に対
応でき、且つ、一つの工程で電極同士の接続とフレキシ
ブルプリント基板の固着が行えるために、非常に簡単か
つ効率的に接続ができる。(2) Since the electrodes of the wiring board and the flexible printed board are directly connected to each other by using the insulating resin, it is possible to cope with the connection at a fine pitch of up to about 100 μm. Connection and the fixation of the flexible printed circuit board can be performed very easily and efficiently.
【００４３】（３）基板上の接続長が非常に短くできる
ため、基板が小さくできる。 （４）金属微粉末を含んだ導電性シートを用いる必要が
なく、低コストである。(3) Since the connection length on the substrate can be made very short, the substrate can be made small. (4) There is no need to use a conductive sheet containing fine metal powder, and the cost is low.
【００４４】（５）接続に用いる絶縁性樹脂を紫外線硬
化型の樹脂とすれば、熱を印加することなく接続が可能
であり耐熱性の低い部品の接合にも適応可能であり、フ
レキシブルプリント基板の材質も高価なポリイミドを用
いないで良く低コストである。などの効果もある。(5) If the insulating resin used for the connection is an ultraviolet-curing resin, the connection can be made without applying heat, and it can be applied to the joining of components having low heat resistance. The material can be low cost without using expensive polyimide. There are other effects as well.
【図１】本発明の一実施例における工程を示す断面図FIG. 1 is a cross-sectional view showing a process in one embodiment of the present invention.
【図２】図１のＡ−Ａ’ラインで示した断面図FIG. 2 is a sectional view taken along line A-A ′ in FIG. 1;
【図３】ワイヤーボンディング方式を用いた従来の接続
体の構成を示した断面図FIG. 3 is a cross-sectional view showing a configuration of a conventional connector using a wire bonding method.
【図４】図３の従来例の上面図FIG. 4 is a top view of the conventional example of FIG. 3;
１ 基板 ２ 基板電極 ３ フレキシブルプリント基板のカバーフィルム ４ フレキシブルプリント基板の電極 ５ フレキシブルプリント基板のベースフィルム ６ フレキシブルプリント基板の配線 ７ 絶縁性樹脂 ８ 加圧ツール DESCRIPTION OF SYMBOLS 1 Substrate 2 Board electrode 3 Flexible printed circuit board cover film 4 Flexible printed circuit board electrode 5 Flexible printed circuit board base film 6 Flexible printed circuit board wiring 7 Insulating resin 8 Pressure tool
フロントページの続き (56)参考文献 特開 昭60−121789（ＪＰ，Ａ) 特開 昭60−140896（ＪＰ，Ａ) 特開 昭62−27786（ＪＰ，Ａ) 特開 昭55−13974（ＪＰ，Ａ) (58)調査した分野(Int.Cl.6，ＤＢ名) H05K 3/36 H05K 1/14 Continuation of front page (56) References JP-A-60-121789 (JP, A) JP-A-60-140896 (JP, A) JP-A-62-27786 (JP, A) JP-A-55-13974 (JP) , A) (58) Field surveyed (Int. Cl. 6 , DB name) H05K 3/36 H05K 1/14
Claims (1)
上に紫外線硬化型もしくは熱硬化型の絶縁性樹脂を塗布
し、ベースフィルム上に配線が接着され前記基板電極と
合致する電極部分を除いて配線上にカバーフィルムが接
着されたフレキシブルプリント基板の前記電極を前記基
板電極と一致させるように設置し、前記配線基板端面か
らフレキシブルプリント基板の前記カバーフィルムの端
までかかるように前記絶縁性樹脂によるフィレットを形
成し、前記配線基板端面よりも基板の内側の部分に位置
する前記フレキシブルプリント基板の前記電極部分を前
記ベースフィルム上から前記配線基板側に加圧し、前記
フレキシブルプリント基板の電極の表面の凹凸の凸部と
前記基板電極との電気的接触を得、前記ベースフィルム
と前記配線基板の間と前記フレキシブルプリント基板の
電極の表面の凹凸の凹部と前記基板電極との間に前記絶
縁性樹脂が介在したまま、前記絶縁性樹脂を硬化させ
て、前記配線基板に前記フレキシブルプリント基板を固
着すると共に前記基板電極とフレキシブルプリント基板
の電極との電気的接触を維持することを特徴とするフレ
キシブルプリント基板と配線基板との接続体の製造方
法。 1. A substrate electrode provided near an end surface of a wiring substrate.
Apply UV-curable or thermosetting insulating resin on top
Then, the wiring is adhered on the base film and the substrate electrode is
Except for the matching electrode part, the cover film
The electrode of the attached flexible printed circuit board is
Install it so that it matches the plate electrode, and
End of the cover film of the flexible printed circuit board
Fillet made of the insulating resin
And located at a portion inside the substrate relative to the end surface of the wiring substrate.
The electrode part of the flexible printed circuit board
Pressing on the wiring board side from above the base film,
The convex and concave portions of the electrode surface of the flexible printed circuit board
Obtaining electrical contact with the substrate electrode, the base film
And between the wiring board and the flexible printed circuit board.
The gap between the substrate electrode and the concave portion of the electrode surface.
The insulating resin is cured while the edge resin is interposed.
And fix the flexible printed circuit board to the wiring board.
The substrate electrode and the flexible printed circuit board
Characterized by maintaining electrical contact with other electrodes
How to manufacture a connection body between a kibble printed circuit board and a wiring board
Law.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5316292A JP2978390B2 (en) | 1993-12-16 | 1993-12-16 | Method for manufacturing connection body between flexible printed board and wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5316292A JP2978390B2 (en) | 1993-12-16 | 1993-12-16 | Method for manufacturing connection body between flexible printed board and wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07170047A JPH07170047A (en) | 1995-07-04 |
| JP2978390B2 true JP2978390B2 (en) | 1999-11-15 |
Family
ID=18075492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5316292A Expired - Fee Related JP2978390B2 (en) | 1993-12-16 | 1993-12-16 | Method for manufacturing connection body between flexible printed board and wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2978390B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102026479A (en) * | 2009-09-17 | 2011-04-20 | 日东电工株式会社 | Wired circuit board, connection structure thereof, and connection method therefor |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3804269B2 (en) * | 1998-03-31 | 2006-08-02 | カシオ計算機株式会社 | Flexible wiring board bonding structure |
| JP2000036647A (en) * | 1998-07-21 | 2000-02-02 | Hitachi Chem Co Ltd | Printed wiring board, its manufacture and manufacture of assembled body using the same |
| JP2006024751A (en) * | 2004-07-08 | 2006-01-26 | Three M Innovative Properties Co | Method of connecting flat surface multiple conductor and electric electronic part including part connected by method of connection |
| CN101194540B (en) * | 2005-04-11 | 2010-06-16 | 3M创新有限公司 | Connection method of conductive articles, and electric or electronic component with parts connected by the connection method |
| JP2008171959A (en) * | 2007-01-10 | 2008-07-24 | Naraenaotech Corp | Pattern electrode jointing structure using ultraviolet ray, and method of jointing pattern electrode using the same |
| JP2008235594A (en) * | 2007-03-20 | 2008-10-02 | Sumitomo Electric Printed Circuit Inc | Bonded body of wiring boards and method of manufacturing the same |
| JP5376653B2 (en) * | 2009-06-09 | 2013-12-25 | 株式会社フジクラ | Flexible printed circuit board and manufacturing method thereof |
| CN102550135B (en) * | 2009-07-24 | 2015-06-17 | 汉高知识产权控股有限责任公司 | Method for connecting electrodes and connection composition used therefor |
| WO2018203481A1 (en) * | 2017-05-01 | 2018-11-08 | 三菱電機株式会社 | Flexible printed circuit board and joined body |
-
1993
- 1993-12-16 JP JP5316292A patent/JP2978390B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102026479A (en) * | 2009-09-17 | 2011-04-20 | 日东电工株式会社 | Wired circuit board, connection structure thereof, and connection method therefor |
| CN102026479B (en) * | 2009-09-17 | 2014-07-16 | 日东电工株式会社 | Wired circuit board, connection structure thereof, and connection method therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07170047A (en) | 1995-07-04 |
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