JP2970110B2 - Manufacturing method of multilayer ceramic capacitor - Google Patents
Manufacturing method of multilayer ceramic capacitorInfo
- Publication number
- JP2970110B2 JP2970110B2 JP23459291A JP23459291A JP2970110B2 JP 2970110 B2 JP2970110 B2 JP 2970110B2 JP 23459291 A JP23459291 A JP 23459291A JP 23459291 A JP23459291 A JP 23459291A JP 2970110 B2 JP2970110 B2 JP 2970110B2
- Authority
- JP
- Japan
- Prior art keywords
- green
- metal
- partial pressure
- oxygen partial
- multilayer ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Description
【０００１】[0001]
【産業上の利用分野】本発明は積層セラミックコンデン
サの製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer ceramic capacitor.
【０００２】[0002]
【従来の技術】昨今、電子機器の小型化，高周波化に伴
って積層セラミックコンデンサの需要がますます高まっ
ている。最近では、さらに低コスト化を図るために内部
電極にＮｉ等の卑金属を用いた積層チップコンデンサの
開発も活発に行われている。2. Description of the Related Art In recent years, demand for multilayer ceramic capacitors has been increasing with the miniaturization and higher frequency of electronic devices. Recently, a multilayer chip capacitor using a base metal such as Ni for an internal electrode has been actively developed in order to further reduce the cost.
【０００３】Ｎｉを内部電極に用いた積層セラミックコ
ンデンサの一般的な製造方法は次の通りである。まずチ
タン酸バリウム等の誘電体粉末と有機バインダ，可塑剤
及び有機溶剤からなるスラリーを用いて、ドクターブレ
ード法等によりグリーンシートを作製する。A general manufacturing method of a multilayer ceramic capacitor using Ni as an internal electrode is as follows. First, a green sheet is prepared by a doctor blade method or the like using a slurry composed of a dielectric powder such as barium titanate, an organic binder, a plasticizer and an organic solvent.
【０００４】次に、このシートの上に、Ｎｉを主成分と
する導電性ペーストを用いてスクリーン印刷法等で内部
電極を形成する。そして、シート上の内部電極が、セラ
ミック誘電体層を挟んで対向するようにグリーンシート
を配置して順次交互に積層する。所望の積層数まで積層
を繰り返した後、チップ形状に切断し、グリーンチップ
を作製する。Next, on this sheet, internal electrodes are formed by a screen printing method or the like using a conductive paste containing Ni as a main component. Then, the green sheets are arranged so that the internal electrodes on the sheets face each other with the ceramic dielectric layer interposed therebetween, and the green sheets are sequentially laminated alternately. After repeating the lamination up to a desired number of laminations, it is cut into a chip shape to produce a green chip.
【０００５】その後、このグリーンチップを耐火性のさ
やに並べた後、大気中で内部電極が酸化しないような温
度範囲で脱脂を行う。脱脂後、さらにグリーンガス中で
焼成を行い、焼結体を作製する。次に、焼結体の両端部
に露出する内部電極が電気的に接続されるように、焼結
体の両端部にＮｉ，Ｃｕペースト等を塗布し、焼き付け
ることによって外部電極を形成し、積層セラミックコン
デンサを製造している。After that, after arranging the green chips on a fire-resistant sheath, degreasing is performed in the air in a temperature range where the internal electrodes are not oxidized. After degreasing, firing is further performed in a green gas to produce a sintered body. Then, external electrodes are formed by applying and baking Ni and Cu pastes on both ends of the sintered body so that the internal electrodes exposed on both ends of the sintered body are electrically connected to each other. Manufactures ceramic capacitors.
【０００６】[0006]
【発明が解決しようとする課題】内部電極であるＮｉの
一部は、焼成過程において炉内に存在する酸素によって
酸化されＮｉＯとなり、酸化膨張が生じる。このため、
コンデンサの表面にクラックが発生する。また、ＮｉＯ
は、ＮｉＯが焼結体に拡散することによって、Ｎｉ内部
電極の表面積が減少し、コンデンサの静電容量の低下を
引き起こす。A part of Ni, which is an internal electrode, is oxidized into NiO by oxygen existing in the furnace during the firing process, and oxidative expansion occurs. For this reason,
Cracks occur on the surface of the capacitor. Also, NiO
In Ni, the surface area of the Ni internal electrode is reduced due to the diffusion of NiO into the sintered body, causing a decrease in the capacitance of the capacitor.
【０００７】そこで、一般的には、Ｎｉを内部電極に用
いた積層セラミックコンデンサの焼成は、還元ガスを用
いて焼成炉内の酸素分圧をＮｉの平衡酸素分圧以下に制
御した雰囲気下で行われなければならない。しかしなが
ら、量産化する場合、グリーンチップを入れたさやを段
積みして焼成するため、還元ガスがさや全体に均一に炉
内に拡散されず、局所的にＮｉの平衡酸素分圧以上の雰
囲気になる箇所が生じる。Therefore, in general, firing of a multilayer ceramic capacitor using Ni as an internal electrode is performed in an atmosphere in which the oxygen partial pressure in the firing furnace is controlled to be equal to or lower than the equilibrium oxygen partial pressure of Ni using a reducing gas. Must be done. However, when mass-producing, since the pods containing the green chips are stacked and fired, the reducing gas is not uniformly diffused throughout the pods, and is locally exposed to an atmosphere at or above the equilibrium oxygen partial pressure of Ni. Occurs.
【０００８】その結果、Ｎｉの平衡酸素分圧以上の雰囲
気下で焼成されたチップについては、Ｎｉが酸化されて
膨張することにより、クラック等の外観不良が生じた
り、ＮｉＯが焼結体中に拡散するためにコンデンサの静
電容量の低下が発生するため、生産工程の歩留りが低下
するという問題が生じていた。As a result, with respect to a chip fired in an atmosphere at a pressure equal to or higher than the equilibrium oxygen partial pressure of Ni, Ni is oxidized and expanded to cause poor appearance such as cracks or NiO in the sintered body. Since the diffusion causes a decrease in the capacitance of the capacitor, there has been a problem that the yield in the production process is reduced.
【０００９】本発明は、これらの問題点に鑑み、焼成時
に酸素分圧を低下させ、均一化することにより、Ｎｉが
酸化され膨張することを抑制し、外観不良や静電容量の
低下を抑制し、生産工程の歩留りの向上を図ることがで
きる積層セラミックコンデンサの製造方法を提供するも
のである。In view of the above problems, the present invention reduces the oxygen partial pressure during firing and makes it uniform, thereby suppressing Ni from being oxidized and expanding, and suppressing poor appearance and a decrease in capacitance. It is another object of the present invention to provide a method for manufacturing a multilayer ceramic capacitor capable of improving the yield of a production process.
【００１０】[0010]
【課題を解決するための手段】上記課題を解決するため
に本発明は、炉内にグリーンチップと共にＮｉよりも平
衡酸素分圧が低い金属を前記グリーンチップの周辺部に
配置して還元雰囲気中で焼成するものである。In order to solve the above-mentioned problems, the present invention provides a method in which a green chip and a green chip are placed in a furnace.
Metal with low equilibrium oxygen partial pressure around the green chip
It is arranged and fired in a reducing atmosphere .
【００１１】[0011]
【作用】この方法によると、炉内に残存する酸素は、優
先的にＮｉよりも平衡酸素分圧が低い金属と結合し、金
属酸化物を形成することとなる。 According to this method, oxygen remaining in the furnace is excellent.
It first combines with a metal having a lower equilibrium oxygen partial pressure than Ni,
A metal oxide will be formed.
【００１２】このため、炉内の平衡酸素分圧をＮｉの平
衡酸素分圧よりも状態にすることができ、Ｎｉを内部電
極とする積層セラミックコンデンサを焼成する際に、Ｎ
ｉが酸化され膨張するのを抑制することができる。その
結果、クラック等の外観不良や静電容量の低下を解決す
ることが可能となる。Therefore, the equilibrium oxygen partial pressure in the furnace can be set to a state higher than the equilibrium oxygen partial pressure of Ni.
It can suppress that i is oxidized and expanded. As a result, it is possible to solve appearance defects such as cracks and a decrease in capacitance.
【００１３】[0013]
【実施例】（実施例１）以下、本発明の第１の実施例に
ついて図面を参照しながら説明する。図１は、脱脂処理
したグリーンチップをさやに並べ、Ｆｅ，Ｃｏ，Ｃｒの
中から選ばれた少なくとも１種の金属粉をグリーンチッ
プと接触しないように、そのさやに均一に配置した状態
を示す図である。図１において、１はさや、２はＦｅ，
Ｃｏ，Ｃｒのみが任意の割合で存在している金属粉、３
は誘電体層とＮｉからなる内部電極とを積層したグリー
ンチップである。(Embodiment 1) Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 shows a state where degreased green chips are arranged in a sheath, and at least one metal powder selected from Fe, Co, and Cr is uniformly arranged on the sheath so as not to contact the green chips. FIG. In FIG. 1, 1 is sheath, 2 is Fe,
Metal powder containing only Co and Cr at an arbitrary ratio, 3
Is a green chip in which a dielectric layer and an internal electrode made of Ni are laminated.
【００１４】まず、チタン酸バリウムを主成分とする誘
電体粉末，ビニルブチラール樹脂，酢酸ブチル，フタル
酸ジオクチルを配合し、ボールミルで混練して誘電体用
のスラリーを作製し、これを用いてベースフィルムの上
にターブレード法で誘電体層を形成し、グリーンシート
を作製した。First, a dielectric powder containing barium titanate as a main component, a vinyl butyral resin, butyl acetate, and dioctyl phthalate are blended and kneaded by a ball mill to prepare a slurry for a dielectric, and the slurry is used as a base. A dielectric layer was formed on the film by a tar blade method to produce a green sheet.
【００１５】次に、このグリーンシートをベースフィル
ムから剥離し、加圧プレスを用いて予め用意したパレッ
トのうえに順次積層し、静電容量に関与しない最下層の
支持層を所望の厚さで形成した。以後、市販の内部電極
用Ｎｉペーストを用いて上記グリーンシート上にスクリ
ーン印刷法により内部電極を形成する工程と上記ベース
フィルムから剥離したグリーンシートを積層する工程を
順次繰り返し、４０層の積層を行った。Next, the green sheet is peeled off from the base film, and is sequentially laminated on a pallet prepared in advance by using a pressure press, so that the lowermost support layer which does not contribute to the capacitance has a desired thickness. Formed. Thereafter, a step of forming an internal electrode on the green sheet by a screen printing method using a commercially available Ni paste for an internal electrode and a step of laminating a green sheet peeled from the base film are sequentially repeated, and 40 layers are laminated. Was.
【００１６】その後、最上層に上記の最下層と同様の厚
さを有する支持層を形成した後、所望の寸法のチップに
切断し、グリーンチップ３を得た。次に、グリーンチッ
プ３を焼成用さや１に並べた後、箱型電気炉中で、大気
中３５０℃で脱脂を行った。Thereafter, a support layer having the same thickness as that of the lowermost layer was formed on the uppermost layer, and then cut into chips having desired dimensions to obtain a green chip 3. Next, after arranging the green chips 3 on the baking sheath 1, degreasing was performed at 350 ° C. in the air in a box-type electric furnace.
【００１７】脱脂後、図１に示すようにさや１にＦｅ，
Ｃｏ，Ｃｒのみが任意の割合で存在している金属粉２を
グリーンチップ３に接触しないように均一に配置した。
その後、そのさや１をいくつか段積みし、箱型電気炉の
中央部に配置した。After degreasing, as shown in FIG.
The metal powder 2 containing only Co and Cr at an arbitrary ratio was uniformly arranged so as not to contact the green chip 3.
Thereafter, several of the pods were stacked and placed in the center of the box-type electric furnace.
【００１８】焼成は、グリーンガス中１２５０℃で行
い、焼成後のチップについて外観不良率及び静電容量の
測定を行った。尚、サンプル数は各条件ごとに１０００
個である。比較のために従来法、すなわち脱脂したグリ
ーンチップのみをさや上に並べ、グリーンガス中で焼成
を行い、同様の測定を行った。その測定結果を（表１）
に示す。The firing was performed at 1250 ° C. in a green gas, and the appearance defect ratio and the capacitance were measured for the fired chips. The number of samples is 1000 for each condition.
Individual. For comparison, only the conventional method, that is, only the degreased green chips were arranged on the sheath, baked in green gas, and the same measurement was performed. Table 1 shows the measurement results.
Shown in
【００１９】[0019]
【表１】 [Table 1]
【００２０】この（表１）より明らかなように、従来法
すなわちグリーンガスのみで焼成を行った場合には、外
観不良が多数発生し、また静電容量は小さく、ばらつき
が大きい。一方、本発明による製造法すなわち金属粉を
配置した場合には、外観不良は少なく、静電容量はグリ
ーンガスのみの場合に比べて大きく、ばらつきが少な
い。As is clear from Table 1, when the conventional method, that is, when firing is performed using only green gas, many appearance defects occur, and the capacitance is small and the variation is large. On the other hand, when the manufacturing method according to the present invention, that is, when the metal powder is arranged, the appearance defect is small, and the capacitance is larger and the variation is smaller than when only the green gas is used.
【００２１】以上のように本発明によれば、焼成の際に
さやにＦｅ，Ｃｏ，Ｃｒのみが任意の割合で存在してい
る金属粉をグリーンチップ近傍に配置し、チップ近傍を
Ｎｉの平衡酸素分圧以下の酸素分圧に制御することによ
って、Ｎｉの酸化に起因する外観不良や容量不良といっ
た問題を大幅に改善する効果が得られる。As described above, according to the present invention, the metal powder containing only Fe, Co, and Cr at an arbitrary ratio during firing is arranged near the green chip, and the vicinity of the chip is equilibrated with Ni. By controlling the oxygen partial pressure to be equal to or lower than the oxygen partial pressure, it is possible to obtain an effect of remarkably improving problems such as poor appearance and poor capacity caused by oxidation of Ni.
【００２２】（実施例２）以下、本発明の第２の実施例
について図面を参照しながら説明する。図２は、脱脂処
理したグリーンチップをさやに並べ、グリーンチップと
接触しないように、そのさやをＦｅ，Ｃｏ，Ｃｒの中か
ら選ばれた少なくとも１種の金属により形成した金属板
で覆った状態を示す図である。図２において、４はさ
や、５はＦｅ，Ｃｏ，Ｃｒのみを任意の割合で用いて形
成した金属板、６はグリーンチップである。(Embodiment 2) Hereinafter, a second embodiment of the present invention will be described with reference to the drawings. FIG. 2 shows a state in which degreased green chips are arranged in pods, and the pods are covered with a metal plate formed of at least one metal selected from Fe, Co, and Cr so as not to contact the green chips. FIG. In FIG. 2, 4 is a sheath, 5 is a metal plate formed using only Fe, Co, and Cr at an arbitrary ratio, and 6 is a green chip.
【００２３】実施例１と同様の条件でグリーンチップ６
を作製してさや４に並べ、脱脂した後、図２に示すよう
にさや４の上部開口部をグリーンチップ６と接触しない
ようにＦｅ，Ｃｏ，Ｃｒのみを任意の割合で用いて形成
した金属板５で覆い、その後このさや４を段積みし、箱
型電気炉の中央部に配置した。Under the same conditions as in Example 1, the green chip 6
After arranging on the sheath 4 and degreased, a metal formed by using only Fe, Co, and Cr at an arbitrary ratio so that the upper opening of the sheath 4 does not contact the green chip 6 as shown in FIG. After covering with a plate 5, the pods 4 were stacked and placed in the center of a box-type electric furnace.
【００２４】焼成は、グリーンガス中１２５０℃で行
い、焼成後のチップについて外観不良率及び静電容量の
測定を行った。尚、サンプル数は、各条件ごとに１００
０個である。比較のために従来法、すなわち金属板で覆
わない場合についても、グリーンガス中で焼成を行い、
同様の測定を行った。その測定結果を（表２）に示す。The firing was carried out at 1250 ° C. in a green gas, and the appearance defect ratio and the capacitance were measured for the fired chips. The number of samples is 100 for each condition.
There are zero. For comparison, the conventional method, that is, even when not covered with a metal plate, fired in green gas,
Similar measurements were made. The measurement results are shown in (Table 2).
【００２５】[0025]
【表２】 [Table 2]
【００２６】この（表２）より明らかなように、従来
法、すなわち金属板で覆わないで焼成を行った場合に
は、外観不良が多数発生し、また静電容量は小さく、ば
らつきが大きい。一方、本発明による製造法、すなわち
金属板を配置した場合には、外観不良は少なく、また静
電容量は金属板で覆われない場合に比べて大きく、ばら
つきも少ない。As is evident from Table 2, when the conventional method is used, that is, when sintering is performed without covering with a metal plate, many appearance defects occur, and the capacitance is small and the variation is large. On the other hand, when the manufacturing method according to the present invention, that is, when the metal plate is arranged, the appearance defect is small, and the capacitance is large and the variation is small as compared with the case where the metal plate is not covered.
【００２７】このように本発明によれば、焼成の際に、
Ｆｅ，Ｃｏ，Ｃｒのみを任意の割合で用いて形成した金
属板によって、グリーンチップを並べたさやを覆うこと
により、グリーンチップ近傍をＮｉの平衡酸素分圧以下
の酸素分圧に制御することが可能となり、Ｎｉの酸化に
起因する外観不良や静電容量不良といった問題を大幅に
改善する効果が得られる。As described above, according to the present invention, when firing,
By covering the pods in which the green chips are arranged with a metal plate formed using only Fe, Co, and Cr at an arbitrary ratio, the vicinity of the green chips can be controlled to an oxygen partial pressure equal to or lower than the equilibrium oxygen partial pressure of Ni. It is possible to obtain an effect of greatly improving problems such as poor appearance and poor capacitance caused by oxidation of Ni.
【００２８】（実施例３）以下本発明の第３の実施例に
ついて、図面を参照しながら説明する。図３は、脱脂処
理したグリーンチップをＦｅ，Ｃｏ，Ｃｒの中から選ば
れた少なくとも１種の金属により形成した金属さやに並
べた状態を示す図である。図３において、７はグリーン
チップ、８はＦｅ，Ｃｏ，Ｃｒのみを任意の割合で用い
て形成した金属さやである。Embodiment 3 Hereinafter, a third embodiment of the present invention will be described with reference to the drawings. FIG. 3 is a diagram showing a state in which the degreased green chips are arranged on a metal sheath formed of at least one metal selected from Fe, Co, and Cr. In FIG. 3, reference numeral 7 denotes a green chip, and reference numeral 8 denotes a metal sheath formed using only Fe, Co, and Cr at an arbitrary ratio.
【００２９】上記実施例１及び実施例２と同様の条件で
グリーンチップを作製し、脱脂した後、図３に示すよう
にＦｅ，Ｃｏ，Ｃｒのみを任意の割合で用いて形成した
金属さや８上にグリーンチップ７を配置し、この金属さ
や８をいくつか段積みし、箱型電気炉の中央部に配置し
た。Green chips were prepared under the same conditions as in Examples 1 and 2 above, degreased, and then, as shown in FIG. 3, a metal sheath 8 formed using only Fe, Co, and Cr at an arbitrary ratio. A green chip 7 was placed on the top, several of the metal sheaths 8 were stacked, and placed in the center of a box-type electric furnace.
【００３０】焼成は、グリーンガス中１２５０℃で行
い、焼成後のチップについてそれぞれの外観不良率及び
静電容量の測定を行った。尚、サンプル数は各条件ごと
に１０００個である。比較のために従来法、すなわち耐
火性のさやにグリーンチップを並べ、脱脂後グリーンガ
ス中で焼成を行い、同様の測定を行った。その測定結果
を（表３）に示す。The firing was performed at 1250 ° C. in a green gas, and the appearance defect ratio and the capacitance of each of the fired chips were measured. The number of samples is 1000 for each condition. For comparison, green chips were arranged in a conventional method, that is, a fire-resistant sheath, baked in green gas after degreasing, and the same measurement was performed. The measurement results are shown in (Table 3).
【００３１】[0031]
【表３】 [Table 3]
【００３２】この（表３）より明らかなように、従来
法、すなわち耐火性のさやを用いた場合には、外観不良
が多数発生し、また静電容量は小さくばらつきが大き
い。一方、本発明による製造法、すなわち金属さやを用
いた場合には、外観不良は少なく、静電容量は金属さや
を用いた場合に比べて大きく、ばらつきも少ない。As is clear from Table 3, when the conventional method, that is, when using the fire-resistant sheath, a large number of poor appearances occur, and the capacitance is small and the variation is large. On the other hand, when the manufacturing method according to the present invention, that is, when the metal sheath is used, the appearance defect is small, and the capacitance is large and the variation is small as compared with the case where the metal sheath is used.
【００３３】以上のように本発明によれば、焼成時のさ
やとしてＦｅ，Ｃｏ，Ｃｒのみを任意の割合で用いて形
成した金属板さやを用いることで、チップ近傍をＮｉの
平衡酸素分圧以下の酸素分圧に制御することが可能とな
り、Ｎｉの酸化に起因する外観不良や静電容量不良とい
った問題を大幅に改善する効果が得られる。As described above, according to the present invention, by using a metal plate sheath formed by using only Fe, Co, and Cr at an arbitrary ratio as the sheath during firing, the equilibrium oxygen partial pressure of Ni is obtained near the chip. It is possible to control the oxygen partial pressure to the following value, and it is possible to obtain an effect of remarkably improving problems such as poor appearance and poor capacitance due to oxidation of Ni.
【００３４】[0034]
【発明の効果】以上のように本発明は、Ｎｉよりも平衡
酸素分圧が低い金属をグリーンチップの周辺部に配置し
て還元雰囲気中で焼成することにより、焼結後の外観不
良や静電容量の低下といった問題を大幅に改善し、積層
セラミックコンデンサの生産性向上に大きな効果をもた
らすことができる。As described above, the present invention is more balanced than Ni.
Place a metal with low oxygen partial pressure around the green chip
By firing in a reducing atmosphere, problems such as poor appearance after sintering and a decrease in capacitance can be greatly improved, and a great effect can be brought about in improving the productivity of the multilayer ceramic capacitor.
【図１】本発明の一実施例による積層セラミックコンデ
ンサの製造方法において、焼成時のさや詰め状態を説明
する斜視図FIG. 1 is a perspective view for explaining a pod filling state during firing in a method for manufacturing a multilayer ceramic capacitor according to an embodiment of the present invention.
【図２】本発明の一実施例による積層セラミックコンデ
ンサの製造方法において、焼成時のさや詰め状態を説明
する斜視図FIG. 2 is a perspective view illustrating a pod filling state during firing in the method for manufacturing a multilayer ceramic capacitor according to one embodiment of the present invention.
【図３】本発明の一実施例による積層セラミックコンデ
ンサの製造方法において、焼成時のさや詰め状態を説明
する斜視図FIG. 3 is a perspective view illustrating a pod filling state during firing in the method for manufacturing a multilayer ceramic capacitor according to one embodiment of the present invention.
１，４ さや ２ 金属粉 ３，６，７ グリーンチップ ５ 金属板 ８ 金属さや 1,4 pod 2 metal powder 3,6,7 green chip 5 metal plate 8 metal pod
───────────────────────────────────────────────────── フロントページの続き (72)発明者 鎌田 雄樹 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (72)発明者 棚橋 正和 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (72)発明者 西村 勉 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (56)参考文献 特開 昭61−144813（ＪＰ，Ａ) (58)調査した分野(Int.Cl.6，ＤＢ名) H01G 4/12 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Yuki Kamada 1006 Kadoma Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. (72) Inventor Tsutomu Nishimura 1006 Kazuma, Kadoma, Osaka Pref. Matsushita Electric Industrial Co., Ltd. (56) References JP-A-61-144813 (JP, A) (58) Fields investigated (Int. 6 , DB name) H01G 4/12
Claims (6)
グリーンチップを作製する第１工程と、次に炉内に前記
グリーンチップと共にＮｉよりも平衡酸素分圧が低い金
属を前記グリーンチップの周辺部に配置し、還元雰囲気
中で焼成する第２工程とを備えた積層セラミックコンデ
ンサの製造方法。1. A dielectric layer and an internal electrode of Ni are laminated.
A first step of producing a green chip, and then placing the green chip in a furnace
Gold with equilibrium oxygen partial pressure lower than Ni with green chip
Metal at the periphery of the green chip, reducing atmosphere
And a second step of firing in a multilayer ceramic capacitor.
て、Ｆｅ，Ｃｏ及びＣｒのうち少なくとも１つを使用す
ることを特徴とする請求項１に記載の積層セラミックコ
ンデンサの製造方法。2. The method according to claim 1, wherein at least one of Fe, Co and Cr is used as the metal having a lower equilibrium oxygen partial pressure than Ni.
粉末状であることを特徴とする請求項１あるいは請求項
２に記載の積層セラミックコンデンサの製造方法。3. A metal having a lower equilibrium oxygen partial pressure than Ni is
2. The method according to claim 1, wherein the powder is in the form of a powder.
3. The method for manufacturing a multilayer ceramic capacitor according to item 2 .
板状であることを特徴とする請求項１あるいは請求項２
に記載の積層セラミックコンデンサの製造方法。4. A metal having a lower equilibrium oxygen partial pressure than Ni,
3. A plate shape according to claim 1, wherein
3. The method for manufacturing a multilayer ceramic capacitor according to item 1.
グリーンチップを作製する第１工程と、次に前記グリー
ンチップをＮｉよりも平行酸素分圧が低い金属からなる
サヤ上に配置して還元雰囲気中で焼成する第２工程とを
備えた積層セラミックコンデンサの製造方法。5. A laminate comprising a dielectric layer and an internal electrode of Ni.
A first step of producing a green chip, and then the green
The tip is made of metal whose parallel oxygen partial pressure is lower than Ni
A second step of arranging on a sheath and firing in a reducing atmosphere.
Manufacturing method of a provided multilayer ceramic capacitor.
て、Ｆｅ，Ｃｏ及びＣｒのうち少なくとも１つを使用す
ることを特徴とする請求項５に記載の積層セラミックコ
ンデンサ。 6. A metal having a lower equilibrium oxygen partial pressure than Ni.
And at least one of Fe, Co and Cr is used.
The multilayer ceramic core according to claim 5, wherein
Ndenza.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23459291A JP2970110B2 (en) | 1991-09-13 | 1991-09-13 | Manufacturing method of multilayer ceramic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23459291A JP2970110B2 (en) | 1991-09-13 | 1991-09-13 | Manufacturing method of multilayer ceramic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0574649A JPH0574649A (en) | 1993-03-26 |
| JP2970110B2 true JP2970110B2 (en) | 1999-11-02 |
Family
ID=16973447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23459291A Expired - Fee Related JP2970110B2 (en) | 1991-09-13 | 1991-09-13 | Manufacturing method of multilayer ceramic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2970110B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3067698B2 (en) * | 1997-06-27 | 2000-07-17 | 松下電器産業株式会社 | Manufacturing method of multilayer ceramic electronic component |
| JP2002198243A (en) * | 2000-12-26 | 2002-07-12 | Murata Mfg Co Ltd | Method for manufacturing laminated ceramic electronic component |
| JP4581584B2 (en) * | 2004-09-17 | 2010-11-17 | 株式会社村田製作所 | Multilayer ceramic capacitor and manufacturing method thereof |
-
1991
- 1991-09-13 JP JP23459291A patent/JP2970110B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0574649A (en) | 1993-03-26 |
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