JP2956717B2 - Piano wire for wire saw and its manufacturing method - Google Patents

Piano wire for wire saw and its manufacturing method

Info

Publication number
JP2956717B2
JP2956717B2 JP19725091A JP19725091A JP2956717B2 JP 2956717 B2 JP2956717 B2 JP 2956717B2 JP 19725091 A JP19725091 A JP 19725091A JP 19725091 A JP19725091 A JP 19725091A JP 2956717 B2 JP2956717 B2 JP 2956717B2
Authority
JP
Japan
Prior art keywords
wire
piano wire
piano
saw
skin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP19725091A
Other languages
Japanese (ja)
Other versions
JPH0516066A (en
Inventor
勝彦 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP19725091A priority Critical patent/JP2956717B2/en
Publication of JPH0516066A publication Critical patent/JPH0516066A/en
Application granted granted Critical
Publication of JP2956717B2 publication Critical patent/JP2956717B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23DPLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/18Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
    • B23D61/185Saw wires; Saw cables; Twisted saw strips

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Metal Extraction Processes (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】本発明は、セラミックス、金属、半導体部
材等の切断に供されるワイヤー・ ソー用のピアノ線とそ
の製造方法に関するものである。
The present invention relates to a piano wire for wire saws used for cutting ceramics, metals, semiconductor members, and the like, and a method for manufacturing the same.

【0002】[0002]

【従来の技術】セラミックス、金属、半導体部材等を切
断するワイヤー・ ソーでは、その構成に高抗張力のピア
ノ線が使用されているが、ピアノ線使用によるワイヤー
・ ソーの態様を以下に説明する。 (1)通常のピアノ線を使用し、ダイヤモンド砥粒混入
液を滴下しつつ、ピアノ線をソーの一部として被加工部
材切断に作用させるもの。(図2a参照) (2)厚肉Cuメッキのピアノ線を使用し、その軟らかい
Cuメッキ層に滴下されたダイヤモンド砥粒混入液のダイ
ヤモンド砥粒を保持して被加工部材切断にソーの作用を
するもの。(図2b参照) (3)予めピアノ線の表皮部に金属を介してダイヤモン
ド砥粒を附着させ、ソーを構成し、切断性能を向上させ
るもの。(図2c参照) なお、図において1はピアノ線、2は厚Cuメッキピアノ
線、3は軟質金属層、4はダイヤモンド砥粒を示す。
2. Description of the Related Art In a wire saw for cutting ceramics, metal, semiconductor members, etc., a piano wire having a high tensile strength is used for its configuration. An embodiment of a wire saw using a piano wire will be described below. (1) A method in which a piano wire is used as a part of a saw to work on a workpiece to be cut while a normal piano wire is used and a diamond abrasive mixed solution is dropped. (See Fig. 2a) (2) Use thick Cu-plated piano wire and its softness
A tool that holds a diamond abrasive grain of a diamond abrasive grain mixed liquid dropped on a Cu plating layer and acts as a saw when cutting a workpiece. (See FIG. 2b) (3) A diamond wire is attached to the skin portion of the piano wire in advance via a metal to form a saw and improve cutting performance. (See FIG. 2c.) In the figure, 1 indicates a piano wire, 2 indicates a thick Cu-plated piano wire, 3 indicates a soft metal layer, and 4 indicates diamond abrasive grains.

【0003】ここで、前記(1)、(2)、(3)のピ
アノ線を用いたものをソーとして評価してみると、 (1)のピアノ線を、即使用するものは、製造コストは
高くないが、切断性能が低く、ダイヤモンド砥粒が被加
工物切断中に離脱しやすく、且つダイヤモンド砥粒によ
ってピアノ線表面にきずがつき、断線しやすい。 (2)の厚肉Cuメッキのピアノ線を用いるものは、切断
性能は良好であるが、切断中Cuメッキ層でダイヤモンド
砥粒をよく保持して、かつCuメッキ層によりピアノ線本
体部分にダイヤンド砥粒できずが生じるのを防止するよ
うにするため、Cuメッキとしては砥粒保持のため約10μ
は必要で、ピアノ線素線上には結局20〜50μのCuメッキ
が必要となり、この厚さのメッキ層を得るには、通常10
回程度のメッキが必要となり、コストは極めて高い。 (3)予めピアノ線の表皮部にダイヤモンド砥粒を付着
させ、Niメッキ等を施してダイヤモンド砥粒を埋め込ん
だものでは、切断性能は良好であるが、コストは著しく
高いものとなる。
[0003] Here, when the piano wire of (1), (2), and (3) is evaluated as a saw, the one that immediately uses the piano wire of (1) is the manufacturing cost. Although not high, the cutting performance is low, the diamond abrasive grains are easily detached during cutting of the workpiece, and the diamond abrasive grains scratch the piano wire surface and are liable to break. (2) The one using thick Cu-plated piano wire has good cutting performance, but the diamond plating is well held by the Cu plating layer during cutting, and the piano wire body is dyaded by the Cu plating layer. Approximately 10μ as Cu plating to keep the abrasive grains in order to prevent the inability to form the abrasive grains
Is necessary, and ultimately 20 to 50μ Cu plating is required on the piano wire, and to obtain a plating layer of this thickness, usually 10
The plating is required about once, and the cost is extremely high. (3) In the case where diamond abrasive grains are previously adhered to the skin portion of a piano wire and the diamond abrasive grains are embedded by Ni plating or the like, the cutting performance is good, but the cost is extremely high.

【0004】[0004]

【発明が解決しようとする課題】本発明は前記ピアノ線
使用によるワイヤ・ ソーのうち、(2)の態様に着目
し、通常のピアノ線に近いコストでピアノ線の外皮部
に、前記(2)における軟質Cu層と同等な層を具えるピ
アノ線ならびにその製造方法を得ることにある。
The present invention focuses on the aspect (2) of the wire saw using the piano wire, and attaches the (2) to the outer surface of the piano wire at a cost close to that of a normal piano wire. It is another object of the present invention to provide a piano wire having a layer equivalent to the soft Cu layer in (1) and a method for manufacturing the same.

【0005】[0005]

【発明の構成】上記、厚肉Cuメッキピアノ線と同等の切
断性能を得るため、本発明ではCuに替る軟質表面皮とし
て、ほぼ純鉄で、かつ、その組織を最も軟かいフェライ
トとし、その肉厚を10〜30μとしたワイヤー・ ソー用ピ
アノ線を提供し、またこのようなピアノ線を高炭素鋼素
線から製造する方法を提供するものである。
According to the present invention, in order to obtain a cutting performance equivalent to that of a thick Cu-plated piano wire, in the present invention, as a soft surface skin in place of Cu, almost pure iron and its structure are made into the softest ferrite. An object of the present invention is to provide a piano wire for a wire / saw having a thickness of 10 to 30 .mu. And a method for producing such a piano wire from a high carbon steel wire.

【0006】[0006]

【製造方法】以下本発明のピアノ線製造方法を図1に示
す設備により説明する。加熱炉6、保持炉8、鉛浴炉
9、捲取部10がタンデムに配置され、前記加熱炉6、保
持炉8には雰囲気ガス供給部7よりガスが供給される。
加熱炉6の入口側に高炭素鋼素線5を巻いたリールが設
置され、素線5は後記の処理を受け捲取部10で捲取られ
る。高炭素鋼素線5は加熱炉6において、H2+H2O 雰囲
気で 850〜950 ℃に1〜10分間加熱される。このとき鋼
は殆んど酸化せず、脱炭だけが進行する。温度と時間の
選定により、表皮より所定の脱炭深さとすることができ
る。加熱炉6を出た素線5は保持炉8中において、 700
〜750 ℃にて10〜20秒保持されるので、脱炭部はオース
テナイトからもっとも軟らかいフェライトに容易に変態
させることができる。その後、通常の約 550℃の鉛浴炉
8における鉛浴焼入れにより、恒温変態させ、パテンチ
ングは終り、表皮20〜50μは純鉄フェライト組織、その
内部は高炭素鋼の微細パーライト組織からなる素線が得
られる。
[Manufacturing method] A method for manufacturing a piano wire according to the present invention will be described below with reference to the equipment shown in FIG. The heating furnace 6, the holding furnace 8, the lead bath furnace 9, and the winding unit 10 are arranged in tandem, and gas is supplied to the heating furnace 6 and the holding furnace 8 from the atmosphere gas supply unit 7.
A reel around which the high-carbon steel wire 5 is wound is installed on the inlet side of the heating furnace 6, and the wire 5 is wound by the winding unit 10 after undergoing the processing described below. The high carbon steel wire 5 is heated in a heating furnace 6 at 850 to 950 ° C. for 1 to 10 minutes in an H 2 + H 2 O atmosphere. At this time, the steel hardly oxidizes, and only decarburization proceeds. By selecting the temperature and time, a predetermined decarburization depth from the skin can be obtained. The wire 5 leaving the heating furnace 6 is placed in
Since it is maintained at 750 ° C. for 10 to 20 seconds, the decarburized portion can be easily transformed from austenite to the softest ferrite. Thereafter, the lead wire is quenched at a constant temperature of about 550 ° C. in a lead bath furnace 8 at a constant temperature of about 550 ° C., and the patenting is completed. Is obtained.

【0007】前記組織を有する素線を別途伸線して、高
抗張力のピアノ線とする。表皮が純鉄フェライトである
から伸線加工性が大きく、高速伸線に耐え、通常のピア
ノ線より低コストで製造できる。伸線により脱炭層(フ
ェライト組織)はうすくなり、10〜30μの所定の厚さの
フェライト軟質層が形成される。
A wire having the above structure is separately drawn to obtain a high tensile strength piano wire. Since the skin is pure iron ferrite, the wire drawing processability is high, it can withstand high-speed wire drawing, and can be manufactured at lower cost than ordinary piano wire. The decarburized layer (ferrite structure) becomes thinner by drawing, and a soft ferrite layer having a predetermined thickness of 10 to 30 μm is formed.

【0008】[0008]

【発明の効果】このように表皮10〜30μの鉄からなり、
その表皮金属組織がフェライトであるピアノ線によれ
ば、前記厚肉Cuメッキのピアノ線を用いたソーと同様
に、ダイヤモンド砥粒を被加工物切断中良好に保持し、
かつ、ダイヤモンド砥粒でピアノ線本体がきずつくこと
もなく、セラミックス、金属等の部材にミクロ的に切断
作業を行うことができる。また、本発明における脱炭処
理は従来から一般に使用されているピアノ線のパテンチ
ング処理設備で、容易、確実に実施することができ、低
コストで製造することができる。
[Effect of the Invention] As described above, the skin is made of iron of 10 to 30 μm,
According to the piano wire whose skin metal structure is ferrite, similarly to the saw using the thick-walled Cu-plated piano wire, the diamond abrasive grains are favorably held during the cutting of the workpiece,
In addition, it is possible to micro-cut a member such as ceramics or metal without breaking the piano wire body with diamond abrasive grains. In addition, the decarburization treatment in the present invention can be easily and reliably performed by a conventionally used apparatus for patenting a piano wire, and can be manufactured at low cost.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明を実施する装置を示す。FIG. 1 shows an apparatus for implementing the present invention.

【図2】(a)は通常のピアノ線を示す。 (b)は厚肉Cuメッキピアノ線を示す。 (c)は金属層によるダイヤモンド砥粒附着のピアノ線
を示す。
FIG. 2 (a) shows a normal piano wire. (B) shows a thick Cu-plated piano wire. (C) shows a piano wire with diamond abrasive grains attached to a metal layer.

【符号の説明】[Explanation of symbols]

1 ピアノ線 2 厚Cuメッキピアノ線 3 軟質金属 4 ダイヤモンド砥粒 5 高炭素鋼素線 6 加熱炉 7 雰囲気ガス供給部 8 保持炉 9 鉛浴炉 10 巻取部 DESCRIPTION OF SYMBOLS 1 Piano wire 2 Thick Cu plating piano wire 3 Soft metal 4 Diamond abrasive grain 5 High carbon steel wire 6 Heating furnace 7 Atmospheric gas supply unit 8 Holding furnace 9 Lead bath furnace 10 Winding unit

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6,DB名) B24B 27/06 B21C 9/00 C21D 3/04 C21D 6/00 ──────────────────────────────────────────────────続 き Continued on the front page (58) Fields surveyed (Int. Cl. 6 , DB name) B24B 27/06 B21C 9/00 C21D 3/04 C21D 6/00

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 セラミックス、金属、半導体等部材の切
断用ワイヤ・ ソーに供されるピアノ線であって、表皮10
〜30μが鉄よりなり、その組織がフェライトであること
を特徴とするワイヤー・ ソー用ピアノ線。
1. A piano wire for use in a wire saw for cutting members such as ceramics, metal, semiconductors, etc.
A piano wire for wire saws, characterized in that ~ 30μ is made of iron and its structure is ferrite.
【請求項2】 高炭素鋼素線をH+HO の雰囲気で
850〜950 ℃に1〜10分間加熱して表皮20〜50μを脱炭
させ、その後 700〜750 ℃にて10〜20秒保持して脱炭部
をフェライト組織となし、約 550℃の鉛浴炉によりパテ
ンチングを行い、パテンチングの終った素線を伸線して
表皮10〜30μが鉄よりなり、その表皮部組織がフェライ
トであることを特徴とするワイヤー・ ソー用ピアノ線の
製造方法。
2. A high-carbon steel wire in an atmosphere of H 2 + H 2 O.
Decarburize 20 to 50μ of skin by heating to 850 to 950 ° C for 1 to 10 minutes, then hold at 700 to 750 ° C for 10 to 20 seconds to make the decarburized part a ferrite structure, and lead bath at about 550 ° C A method for producing a piano wire for a wire saw, characterized in that a patenting is performed in a furnace, and a wire after the patenting is drawn, and a skin of 10 to 30 μm is made of iron, and a structure of the skin is ferrite.
JP19725091A 1991-07-10 1991-07-10 Piano wire for wire saw and its manufacturing method Expired - Fee Related JP2956717B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19725091A JP2956717B2 (en) 1991-07-10 1991-07-10 Piano wire for wire saw and its manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19725091A JP2956717B2 (en) 1991-07-10 1991-07-10 Piano wire for wire saw and its manufacturing method

Publications (2)

Publication Number Publication Date
JPH0516066A JPH0516066A (en) 1993-01-26
JP2956717B2 true JP2956717B2 (en) 1999-10-04

Family

ID=16371345

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19725091A Expired - Fee Related JP2956717B2 (en) 1991-07-10 1991-07-10 Piano wire for wire saw and its manufacturing method

Country Status (1)

Country Link
JP (1) JP2956717B2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3244426B2 (en) * 1996-03-26 2002-01-07 信越半導体株式会社 Method for manufacturing wire for wire saw and wire for wire saw
TW201043367A (en) * 2009-02-13 2010-12-16 Bekaert Sa Nv Fixed abrasive sawing wire
SG175811A1 (en) 2009-04-29 2011-12-29 Bekaert Sa Nv A sawing wire with abrasive particles partly embedded in a metal wire and partly held by an organic binder
WO2011020105A2 (en) 2009-08-14 2011-02-17 Saint-Gobain Abrasives, Inc. Abrasive articles including abrasive particles bonded to an elongated body
CN102555088A (en) * 2012-01-04 2012-07-11 青岛高校测控技术有限公司 Cutting line solidified with mixed grinding materials of diamond and cubic boron nitride and method for manufacturing cutting line
TW201402274A (en) 2012-06-29 2014-01-16 Saint Gobain Abrasives Inc Abrasive article and method of forming
TWI474889B (en) 2012-06-29 2015-03-01 Saint Gobain Abrasives Inc Abrasive article and method of forming

Also Published As

Publication number Publication date
JPH0516066A (en) 1993-01-26

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