JP2938592B2 - Flexible circuit board provided with terminals for mounting circuit components and method of manufacturing the same - Google Patents
Flexible circuit board provided with terminals for mounting circuit components and method of manufacturing the sameInfo
- Publication number
- JP2938592B2 JP2938592B2 JP3025250A JP2525091A JP2938592B2 JP 2938592 B2 JP2938592 B2 JP 2938592B2 JP 3025250 A JP3025250 A JP 3025250A JP 2525091 A JP2525091 A JP 2525091A JP 2938592 B2 JP2938592 B2 JP 2938592B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring pattern
- circuit
- circuit wiring
- insulating base
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Landscapes
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
- Magnetic Heads (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、絶縁べ−ス材上に所要
の回路配線パタ−ンを形成し、この回路配線パタ−ンに
電気的に接合すると共に絶縁べ−ス材を貫通して外部に
突出する回路部品の為の接続用パッド乃至はバンプを備
える端子部を個々に突出形成するように構成する為の可
撓性回路基板及びその製造法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention forms a required circuit wiring pattern on an insulating base material, and electrically connects to the circuit wiring pattern and penetrates the insulating base material. The present invention relates to a flexible circuit board and a method of manufacturing the same so as to individually form terminal portions having connection pads or bumps for circuit components projecting outside.
【０００２】[0002]
【従来の技術】ＩＣ等の回路部品を搭載する為のこの種
の可撓性回路基板としては、図３に示す構造のものがあ
る。これは、可撓性又は硬質の絶縁べ−ス材２１の一方
面に於ける所要の位置に必要な回路配線パタ−ン２２が
形成されており、また絶縁べ−ス材２１にはその上面側
から回路配線パタ−ン２２に達する導通用孔２９を形成
してある。この導通用孔２９には一端が回路配線パタ−
ン２２に電気的に接合すると共に他端が絶縁べ−ス材２
１の外部に突出するＩＣ等の回路部品の為の接続用パッ
ド乃至はバンプ３０を形成してある。一方、回路配線パ
タ−ン２２の表面側には接着剤２６によりポリイミドフ
ィルム等からなる保護フィルム２７を貼着して表面保護
層２８を構成している。2. Description of the Related Art A flexible circuit board of this type for mounting a circuit component such as an IC has a structure shown in FIG. This is because a required circuit wiring pattern 22 is formed at a required position on one surface of a flexible or hard insulating base material 21, and the insulating base material 21 has an upper surface. A conduction hole 29 reaching the circuit wiring pattern 22 from the side is formed. One end of the conduction hole 29 is a circuit wiring pattern.
Electrically connected to the housing 22 and the other end is made of an insulating base material 2
1, connection pads or bumps 30 for circuit components such as ICs protruding outside are formed. On the other hand, a protective film 27 made of a polyimide film or the like is stuck on the surface side of the circuit wiring pattern 22 with an adhesive 26 to form a surface protective layer 28.
【０００３】このような回路部品搭載用端子を備えた可
撓性回路基板を製作するには、図４の（１）の如く、先
ず絶縁べ−ス材２１の一方面に所要の回路配線パタ−ン
２２を形成すると共に、その絶縁べ−ス材２１の他方面
にエキシマレ−ザ遮光の為のメタルマスク２３を形成す
る。このメタルマスク２３には回路配線パタ−ン２２の
位置する該当部分に孔２４を形成し、また製品の外形分
離用溝孔２５をも形成するように処理される。そして、
回路配線パタ−ン２２の表面には接着剤２６を用いてポ
リイミドフィルム等の保護フィルム２７を貼着すること
により表面保護層２８を形成している。次に、図４の
（２）に示す如く、メタルマスク２３の側からエキシマ
レ−ザ光Ａを照射して回路配線パタ−ン２２に達する導
通用孔２９を形成すると共に、外形分離用溝２５Ａを形
成する。そこで、同図（３）のように不要なメタルマス
ク２３の層をエッチング等の手段で除去した後、同図
（４）の如く上記工程で形成した導通用孔２９に対して
一端が回路配線パタ−ン２２に電気的に接合すると共に
他端が絶縁べ−ス材２１から外部に突出するような形状
のＩＣ等の回路部品の為の接続用パッド乃至はバンプ３
０を半田等の導電性部材の充填処理で形成することによ
り製品を得ることができる。In order to manufacture a flexible circuit board having such circuit component mounting terminals, a required circuit wiring pattern is first formed on one surface of an insulating base material 21 as shown in FIG. And a metal mask 23 for excimer laser light shielding is formed on the other surface of the insulating base material 21. The metal mask 23 is processed so that a hole 24 is formed in a corresponding portion where the circuit wiring pattern 22 is located, and a groove 25 for separating the outer shape of the product is formed. And
A surface protective layer 28 is formed on the surface of the circuit wiring pattern 22 by sticking a protective film 27 such as a polyimide film using an adhesive 26. Next, as shown in FIG. 4 (2), an excimer laser beam A is irradiated from the side of the metal mask 23 to form a conduction hole 29 reaching the circuit wiring pattern 22, and an outer shape separation groove 25A. To form Therefore, after removing unnecessary layers of the metal mask 23 by means such as etching as shown in FIG. 3C, one end of the circuit hole is formed in the conduction hole 29 formed in the above step as shown in FIG. A connection pad or bump 3 for a circuit component such as an IC having a shape electrically connected to the pattern 22 and having the other end protruding outside from the insulating base material 21.
A product can be obtained by forming 0 in a filling process of a conductive member such as solder.
【０００４】[0004]
【発明が解決しようとする課題】上記のような構造の回
路部品搭載用端子を備えた可撓性回路基板では、例えば
ハ−ドディスクドライブ用ヘッドと外部回路を接続する
為の可撓性回路基板として使用する場合、その剛性と質
量の大きさにより磁気ヘッドの円滑な動きと磁気ディス
クへの追随性を阻害する等の問題を生ずる。また、搭載
される回路部品との間の線膨張係数の相違によって生ず
る剪断力によりパッド乃至はバンプ３０が破壊される場
合等がある。In a flexible circuit board having a circuit component mounting terminal having the above structure, for example, a flexible circuit for connecting a hard disk drive head to an external circuit is provided. When used as a substrate, problems such as impeding smooth movement of the magnetic head and the ability to follow the magnetic disk are caused by its rigidity and mass. Further, the pad or the bump 30 may be broken by a shearing force caused by a difference in linear expansion coefficient between the mounted circuit component and the like.
【０００５】[0005]
【課題を解決するための手段】本発明は、例えば磁気ヘ
ッドのような高速の動きを阻害させることなく、また搭
載部品との間の線膨張係数の相違によって生ずる接続用
パッド乃至はバンプの破壊などの虞のない高精度であっ
て高信頼性の回路部品搭載用端子を備えた可撓性回路基
板及びその製造法を提供するものである。SUMMARY OF THE INVENTION According to the present invention, there is provided a connection pad or bump breakage which does not hinder a high-speed movement of a magnetic head, for example, and which is caused by a difference in linear expansion coefficient between a mounted component and a component. An object of the present invention is to provide a flexible circuit board provided with a highly accurate and highly reliable circuit component mounting terminal which does not have a risk of causing the like, and a method of manufacturing the same.
【０００６】その為に本発明によれば、絶縁べ−ス材上
に所要の回路配線パタ−ンを有し、この回路配線パタ−
ンに一端が電気的に接合されると共に他端が上記絶縁べ
−ス材を貫通して外部に突出する回路部品の為の接続用
パッド乃至はバンプを備える可撓性回路基板に於いて、
上記接続用パッド乃至はバンプを含む回路部品搭載用端
子の位置する部分の回路配線パタ−ンはフィンガ−リ−
ド状に上記絶縁べ−ス材と共に個々に突出した構造に構
成され、上記接続用パッド乃至はバンプを含む突出形成
した上記回路部品搭載用端子部を構成する部分に相当す
る上記絶縁べ−ス材はその上面に位置する回路配線パタ
−ンと同一の形状に構成されて突出したこの回路部品搭
載用端子部分の低質量化と高自由度を確保している。Therefore, according to the present invention, a required circuit wiring pattern is provided on an insulating base material, and this circuit wiring pattern is provided.
A flexible circuit board having connection pads or bumps for circuit components, one end of which is electrically connected to the other terminal and the other end of which penetrates through the insulating base material and protrudes to the outside.
The circuit wiring pattern at the portion where the connection pad or the circuit component mounting terminal including the bump is located is a finger wire.
The insulating base is formed in a structure protruding individually together with the insulating base material in the form of a pad, and corresponds to a portion constituting the protrudingly formed circuit component mounting terminal portion including the connection pad or bump. The material is configured in the same shape as the circuit wiring pattern located on the upper surface thereof, so that the protruding terminal parts for mounting circuit components have low mass and high degree of freedom.
【０００７】また、上記回路配線パタ−ンと共にその下
部に一体に形成した絶縁べ−ス材をフィンガ−リ−ド状
に突出させる手法としては、先ず絶縁べ−ス材の一方の
面に所要の回路配線パタ−ンを形成すると共にこの絶縁
べ−ス材の他方面にエキシマレ−ザ光を遮光する為のメ
タルマスクを形成し、このメタルマスクには回路配線パ
タ−ンの位置する該当部位に孔を形成すると共に製品外
形の為の分離用溝孔を形成する。次に、上記回路配線パ
タ−ンの表面には接着剤を用いてポリイミドフィルム等
の保護フィルムを貼着させるか又は絶縁性樹脂コ−ト等
の手段によって表面保護層を形成する。次いで上記メタ
ルマスク側からエキシマレ−ザ光を照射して半田による
接続用パッド乃至はバンプを形成する為の回路配線パタ
−ンに対する導通用孔を形成すると共に、製品外形の為
の分離処理を施した後、その導通用孔に半田による回路
部品接続用のバンプ乃至はパッドを形成する。更に、上
記回路配線パタ−ン側の表面保護層上に、フィンガ−リ
−ド状の突出部に対応する位置に透孔を形成した別体の
遮光用メタルマスクを載置した状態でエキシマレ−ザ光
を照射する。これによって上記フィンガ−リ−ド状の突
出部は、回路配線パタ−ンを遮光マスクとして用いたエ
キシマレ−ザ−アブレ−ションにより好適に形成され
る。As a method of projecting an insulating base material integrally formed below the circuit wiring pattern together with the above-mentioned circuit wiring pattern in a finger lead shape, first, a method is required in which one surface of the insulating base material is provided. And a metal mask for shielding the excimer laser light is formed on the other surface of the insulating base material. The metal mask has a corresponding portion where the circuit wiring pattern is located. And a separation slot for the outer shape of the product. Next, a protective film such as a polyimide film is adhered to the surface of the circuit wiring pattern using an adhesive, or a surface protective layer is formed by means such as an insulating resin coat. Next, an excimer laser beam is irradiated from the metal mask side to form a conductive hole for a circuit wiring pattern for forming a connection pad or bump by soldering, and to perform a separation process for a product outer shape. After that, bumps or pads for connecting circuit components are formed by soldering in the conduction holes. Further, an excimer laser is mounted on the surface protection layer on the circuit wiring pattern side, with a separate light-shielding metal mask having a through hole formed at a position corresponding to the finger-lead-shaped protrusion. Irradiate the light. Thus, the finger-lead-like projections are suitably formed by excimer laser abrasion using the circuit wiring pattern as a light-shielding mask.
【０００８】上記の製造工程に於いて、予め回路配線パ
タ−ンの表面に金メッキ等の金属層を施すことによっ
て、エキシマレ−ザ光の照射で露出した回路配線パタ−
ン表面にはその金属層が現われることとなるので、回路
配線パタ−ンの耐環境性を好適に高めることができる。
また、回路配線パタ−ンに対するこのよううな耐環境性
を付与する他の方法としては、半田による接続用パッド
乃至はバンプを形成する前に、フィンガ−リ−ド状に突
出させる回路配線パタ−ン部分を遮光用マスクとして用
いたエキシマレ−ザ−アブレ−ションを加えた後、半田
の充填による接続用パッド乃至はバンプを形成すると同
時に回路部品搭載用端子を形成しているその回路配線パ
タ−ン表面部分に半田メッキを施すことも可能である。In the above manufacturing process, a metal layer such as gold plating is applied to the surface of the circuit wiring pattern in advance, so that the circuit wiring pattern exposed by the irradiation of excimer laser light.
Since the metal layer appears on the surface of the circuit, the environmental resistance of the circuit wiring pattern can be suitably improved.
As another method for imparting such environmental resistance to a circuit wiring pattern, a circuit wiring pattern which is projected in a finger lead shape before forming a connection pad or bump by soldering is used. After applying an excimer laser abrasion using the contact portion as a light-shielding mask, a connection pad or bump is formed by filling with solder, and at the same time a circuit wiring pattern for forming a circuit component mounting terminal is formed. It is also possible to apply solder plating to the surface of the solder.
【０００９】[0009]
【実施例】以下、図示の実施例を参照しながら本発明を
更に説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be further described below with reference to the illustrated embodiments.
【００１０】図１の（１）から（３）は本発明に従って
構成された回路部品搭載用端子を備えた可撓性回路基板
の要部を概念的に示す図面であり、図１の（１）はその
要部平面構成図、図１の（２）は図１（１）のＸ−Ｘ線
断面構成図であり、また図１の（３）は同じくＹ−Ｙ線
断面構成図である。図１の（１）〜（３）に於いて、可
撓性の絶縁べ−ス材１の一方面の所要位置には耐腐食性
が高く耐環境性に富む金メッキ等の金属層６で被覆され
た回路配線パタ−ン２が必要な本数で形成されており、
この絶縁べ−ス材１に於ける回路配線パタ−ン２の位置
する該当部分には孔１０が形成され、これらの孔１０に
は一端がその回路配線パタ−ン２に電気的に接合すると
共に他端が上記絶縁べ−ス材１の外部に向かって突出す
るＩＣ等の回路部品の為の接続用パッド乃至はバンプ１
１が形成されている。このような接続用パッド乃至はバ
ンプ１１が形成されている部分の回路配線パタ−ン２及
び絶縁べ−ス材１は、図の如く同一の形状に形成されて
フィンガ−リ−ド状に突出した構造の回路部品搭載用端
子を構成している。そして、フィンガ−リ−ド状に突出
した部分以外の所要の部位の回路配線パタ−ン２側には
接着剤７によりポリイミドフィルム等の保護フィルム８
が貼着されて表面保護層９を形成している。この表面保
護層９はワニス状ポリイミドの塗布等の手段で構成する
ことも可能である。FIGS. 1 (1) to 1 (3) are diagrams conceptually showing a main part of a flexible circuit board provided with circuit component mounting terminals constructed according to the present invention. ) Is a plan view of a main part thereof, FIG. 1 (2) is a sectional view taken along line XX of FIG. 1 (1), and FIG. 1 (3) is a sectional view taken along line YY of FIG. . In (1) to (3) of FIG. 1, a required position on one surface of the flexible insulating base material 1 is covered with a metal layer 6 of gold plating or the like which has high corrosion resistance and high environmental resistance. The required number of circuit wiring patterns 2 are formed,
Holes 10 are formed in corresponding portions of the insulating base material 1 where the circuit wiring pattern 2 is located, and one end of each of the holes 10 is electrically connected to the circuit wiring pattern 2. And a connection pad or bump 1 for a circuit component such as an IC, the other end of which protrudes toward the outside of the insulating base material 1.
1 is formed. The circuit wiring pattern 2 and the insulating base material 1 at the portions where such connection pads or bumps 11 are formed are formed in the same shape as shown in the figure and project in the form of finger leads. This constitutes a circuit component mounting terminal having the above structure. A protective film 8 such as a polyimide film is applied to the circuit wiring pattern 2 side of a required portion other than the portion protruding in the form of a finger lead by an adhesive 7.
Are adhered to form the surface protective layer 9. The surface protection layer 9 can be formed by means such as application of varnish-like polyimide.
【００１１】図２の（１）〜（４）はその為の製造工程
図を示すものであり、図１の（２）に相当する断面構成
図で示してある。図２の（１）の如く、先ず例えば接着
層のあるもの又は無接着剤型の可撓性両面銅張積層板等
の材料を用意し、これにフォトエッチング処理を施して
絶縁べ−ス材１の一方面に対して所要の回路配線パタ−
ン２を形成し、またその他方面の導電層はメタルマスク
３として用いる。このメタルマスク３は図の如く回路配
線パタ−ン２の位置する該当箇所に孔４を有するように
形成されると共に、製品の外形に沿って形成した分離用
溝孔５を備えるように形成されている。この分離用溝孔
５は製品外形をエキシマレ−ザによって加工することな
く従来の金型等の手段で加工する場合は不要である。ま
た、上記回路配線パタ−ン２の表面には金等の耐腐食性
金属層６がメッキ等の手段で形成されており、更にその
表面には接着剤７を用いてポリイミドフィルム等の保護
フィルム８を貼着することによって表面保護層９を形成
してある。FIGS. 2 (1) to 2 (4) show a manufacturing process diagram for this purpose, which is shown in a sectional configuration view corresponding to FIG. 1 (2). As shown in FIG. 2A, for example, a material having an adhesive layer or a non-adhesive type flexible double-sided copper-clad laminate is first prepared and subjected to a photo-etching process to form an insulating base material. 1 required circuit wiring pattern for one side
The conductive layer on the other side is used as a metal mask 3. The metal mask 3 is formed so as to have a hole 4 at a corresponding position where the circuit wiring pattern 2 is located as shown in the figure, and to have a separation groove 5 formed along the outer shape of the product. ing. The separation slot 5 is unnecessary when the outer shape of the product is processed by means of a conventional mold or the like without being processed by an excimer laser. A corrosion resistant metal layer 6 such as gold is formed on the surface of the circuit wiring pattern 2 by plating or the like, and a protective film such as a polyimide film is further formed on the surface by using an adhesive 7. The surface protection layer 9 is formed by sticking the surface protection layer 8.
【００１２】次に、同図（２）の如く、メタルマスク３
側からエキシマレ−ザ光Ａ１を照射して後述の回路部品
搭載用端子を形成する為の導通用孔１０と製品形状の分
離用溝５Ａをアブレ−ション形成する。そこで同図
（３）のように、メタルマスク３の層をエッチング除去
した後、導通用孔１０に対して半田等の導電性部材の充
填処理を施すことによって、一端が回路配線パタ−ン２
に電気的に接合すると共に他端が絶縁べ−ス材１の外部
に突出するＩＣ等の回路部品のための接続用パッド乃至
はバンプ１１を形成する。次いで、同図（４）の如く回
路配線パタ−ン２、耐腐食性の金属層６及び表面保護層
９を配設した側からエキシマレ−ザ光Ａ２を照射し、回
路部品搭載用端子が形成されている部分の表面保護層９
及び絶縁べ−ス材１の回路配線パタ−ン２間に位置する
部分を、その回路配線パタ−ンをメタルマスクとして機
能させながら、アブレ−ション加工して端子部突出の為
の先端分離処理を施す。Next, as shown in FIG.
By irradiating excimer laser light A1 from the side, a conduction hole 10 for forming a circuit component mounting terminal described later and an isolation groove 5A of a product shape are formed by abrasion. Then, as shown in FIG. 3 (3), after the layer of the metal mask 3 is removed by etching, the conductive hole 10 is filled with a conductive material such as solder, so that one end of the circuit wiring pattern 2 is formed.
A connection pad or bump 11 for a circuit component such as an IC, which is electrically bonded to the other and protrudes the other end to the outside of the insulating base material 1, is formed. Next, as shown in FIG. 4D, an excimer laser beam A2 is irradiated from the side on which the circuit wiring pattern 2, the corrosion-resistant metal layer 6 and the surface protection layer 9 are provided, thereby forming a terminal for mounting a circuit component. Of the surface protection layer 9
The portion located between the circuit wiring patterns 2 of the insulating base material 1 is subjected to abrasion processing while using the circuit wiring pattern as a metal mask, and a tip separation process for projecting the terminal portion. Is applied.
【００１３】この端子突出形成処理の場合、表面保護層
９の上にはエキシマレ−ザ光を照射したい部分に透孔状
スリットを有する別体のメタルマスクを配置してアブレ
−ション加工を行うか、或いは所望の加工パタ−ンの２
倍から１０倍の大きさに形成したスリット又は孔を形成
した別体のメタルマスクに矩形のエキシマレ−ザ光を照
射し、そのスリット又は孔を介して照射されるエキシマ
レ−ザ光をレンズを用いて集光し上記所望部分に対する
アブレ−ション加工を行うこともできる。そして、これ
らの端子突出形成の先端分離の為のアブレ−ション処理
加工を施す部分には、表面保護層９を予め貼合わせない
ことによってそのアブレ−ション時間を短縮することも
可能である。In the case of the terminal protrusion forming process, a separate metal mask having a through-hole slit is arranged on the surface protective layer 9 at a portion to be irradiated with excimer laser light, and is subjected to abrasion processing. Or 2 of the desired processing pattern
A rectangular excimer laser beam is irradiated on a separate metal mask having a slit or a hole formed in a size of 2 to 10 times, and the excimer laser beam irradiated through the slit or the hole is irradiated with a lens. Then, the desired portion can be subjected to abrasion processing. Then, it is possible to shorten the abrasion time by not pasting the surface protection layer 9 on the portions to be subjected to the abrasion processing for separating the front ends of the terminal protrusions.
【００１４】[0014]
【発明の効果】本発明に従った回路部品搭載用端子を備
えた可撓性回路基板及びその製造法によれば、接続用パ
ッド乃至はバンプを有する回路部品搭載用端子を形成し
た部分の回路配線パタ−ン間に位置する絶縁べ−ス材を
除去することにより、それぞれの端子部をフィンガ−リ
−ド状に独立して突出形成したので、ＩＣ等の回路部品
との間に線膨張係数差を生じてもその差をフィンガ−リ
−ド状の端子部が吸収する為、接続用パッド乃至はバン
プを含む回路部品搭載用端子に歪が生じ接続信頼性に悪
影響を及ぼして甚だしい場合には断線するというような
問題を好適に解消することが可能である。従って、接続
信頼性の極めて高い回路部品搭載用端子を備えた可撓性
回路基板を安定的に提供することができる。According to the flexible circuit board having the circuit component mounting terminals according to the present invention and the method of manufacturing the same, the circuit of the portion where the circuit component mounting terminals having connection pads or bumps are formed is formed. By removing the insulating base material located between the wiring patterns, the respective terminal portions are independently formed to protrude in the form of finger leads, so that linear expansion occurs between circuit components such as ICs. Even if a coefficient difference occurs, the difference is absorbed by the finger-lead-shaped terminals, causing distortion in the connection pads or circuit component mounting terminals including bumps, which adversely affects connection reliability and is severe. , It is possible to preferably solve the problem of disconnection. Therefore, it is possible to stably provide a flexible circuit board having circuit component mounting terminals with extremely high connection reliability.
【００１５】また、回路部品搭載用端子を形成した部分
の回路配線パタ−ンを保持している絶縁べ−ス材は、こ
の回路配線パタ−ンを遮光マスクとして機能させながら
エキシマレ−ザアブレ−ションで分離形成されるので、
その回路配線パタ−ンと同一形状寸法の必要最小限寸法
に構成してこの部分の質量と剛性を軽減できるため、例
えば磁気記録装置のヘッド素子を搭載する可撓性回路基
板のように高速で円滑な動きと磁気ディスクへの良好な
追随性が要求される場合にその動きを阻害することなく
高性能且つ高信頼性の磁気ディスク用の可撓性回路基板
を提供できる。The insulating base material holding the circuit wiring pattern in the portion where the circuit component mounting terminal is formed is an excimer laser abrasion while using this circuit wiring pattern as a light shielding mask. Is formed separately.
Since it is possible to reduce the mass and rigidity of this portion by configuring the circuit wiring pattern to have the same shape and dimensions as the required minimum size, for example, at high speed like a flexible circuit board on which a head element of a magnetic recording apparatus is mounted. When smooth movement and good followability to a magnetic disk are required, a flexible circuit board for a magnetic disk with high performance and high reliability can be provided without hindering the movement.
【図１】図１の（１）から（３）は本発明に従って構成
された回路部品搭載用端子を備えた可撓性回路基板の要
部を概念的に示す図面であり、図１の（１）はその要部
平面構成図、図１の（２）は図１（１）のＸ−Ｘ線断面
構成図であり、また図１の（３）は同じくＹ−Ｙ線断面
構成図であるFIGS. 1 (1) to 1 (3) are diagrams conceptually showing a main part of a flexible circuit board provided with circuit component mounting terminals configured according to the present invention. 1) is a plan view of a main part thereof, FIG. 1 (2) is a sectional view taken along line XX of FIG. 1 (1), and FIG. 1 (3) is a sectional view taken along line YY of FIG. is there
【図２】図２の（１）から（４）は本発明による製造工
程図2 (1) to 2 (4) are manufacturing process diagrams according to the present invention.
【図３】従来構造による回路部品搭載用端子を備えた可
撓性回路基板の概念的な要部の拡大断面構成図FIG. 3 is an enlarged cross-sectional configuration diagram of a conceptual main part of a flexible circuit board having circuit component mounting terminals according to a conventional structure.
【図４】図４の（１）から（４）は従来例による製造工
程図4 (1) to 4 (4) are manufacturing process diagrams according to a conventional example.
１ 可撓性絶縁べ−ス材 ２ 回路配線パタ−ン ３ メタルマスク ４ 孔 ５ 外形分離用溝孔 ５Ａ 分離用溝 ６ 耐腐食性の金属層 ７ 接着剤 ８ 保護フィルム ９ 表面保護層 １０ 導通用孔 １１ 接続用パッド乃至はバンプ Ａ１ エキシマレ−ザ光 Ａ２ エキシマレ−ザ光 DESCRIPTION OF SYMBOLS 1 Flexible insulating base material 2 Circuit wiring pattern 3 Metal mask 4 Hole 5 Outer shape separation groove 5A Separation groove 6 Corrosion resistant metal layer 7 Adhesive 8 Protective film 9 Surface protective layer 10 For conduction Hole 11 Connecting pad or bump A1 Excimer laser light A2 Excimer laser light
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) H05K 1/11 H05K 1/18 H05K 3/40 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 6 , DB name) H05K 1/11 H05K 1/18 H05K 3/40
Claims (2)
ンを有し、この回路配線パタ−ンに一端が電気的に接合
されると共に他端が上記絶縁べ−ス材を貫通して外部に
突出する回路部品の為の接続用パッド乃至はバンプを具
備する可撓性回路基板に於いて、上記接続用パッド乃至
はバンプを形成した部位の回路配線パタ−ンはその下面
に位置する上記絶縁べ−ス材と共にフィンガ−リ−ド状
に突出するように構成され、上記接続用パッド乃至はバ
ンプを含む突出形成した上記回路部品搭載用端子部を構
成する部分に相当する上記絶縁べ−ス材はその上面に位
置する回路配線パタ−ンと同一の形状に構成された回路
部品搭載用端子を備えた可撓性回路基板。1. A required circuit wiring pattern on an insulating base material.
A connection pad or bump for a circuit component having one end electrically connected to the circuit wiring pattern and the other end penetrating through the insulating base material and projecting to the outside is provided. In the flexible circuit board provided, the circuit wiring pattern at the portion where the connection pads or bumps are formed protrudes in the form of finger leads together with the insulating base material located on the lower surface thereof. The insulating base material corresponding to a portion constituting the protrudingly formed circuit component mounting terminal portion including the connection pad or the bump is the same as the circuit wiring pattern located on the upper surface thereof. A flexible circuit board provided with circuit component mounting terminals configured in the shape of.
し、これにフォトエッチング処理を施して絶縁べ−ス材
の一方面に対して所要の回路配線パタ−ンを形成すると
共にその絶縁べ−ス材の他方面にはメタルマスクを形成
し、このメタルマスクに対しては上記回路配線パタ−ン
の位置する所要の該当箇所に孔を形成すると共に製品の
外形に沿って形成した分離用溝孔を有するように形成
し、次いで上記メタルマスク側からエキシマレ−ザ光を
照射して回路部品搭載用端子を形成する為の導通用孔と
製品分離用溝とを形成し、次に上記メタルマスクを除去
し、更に上記導通用孔に対して導電性部材の充填処理を
施すことにより一端が上記回路配線パタ−ンに電気的に
接合すると共に他端が上記絶縁べ−ス材の外部に突出す
る回路部品の為の接続用パッド乃至はバンプを形成した
後、上記回路配線パタ−ン側からエキシマレ−ザ光を照
射してこの回路配線パタ−ンを遮光マスクとして機能さ
せながら上記回路配線パタ−ン間の上記絶縁べ−ス材を
アブレ−ション加工して回路部品搭載用端子部をフィン
ガ−リ−ド状に突出形成する各工程を含む回路部品搭載
用端子を備えた可撓性回路基板の製造法。2. A material such as a flexible double-sided copper-clad laminate is prepared and subjected to a photo-etching process to form a required circuit wiring pattern on one surface of an insulating base material. A metal mask is formed on the other surface of the insulating base material, a hole is formed in a required portion where the circuit wiring pattern is located, and the metal mask is formed along the outer shape of the product. Then, an excimer laser beam is irradiated from the metal mask side to form a conduction hole for forming a circuit component mounting terminal and a product separation groove. Then, the metal mask is removed, and the conductive hole is filled with a conductive member to electrically connect one end to the circuit wiring pattern and the other end to the insulating base material. For connection of circuit parts protruding outside After the pads or bumps are formed, the circuit wiring pattern is irradiated with excimer laser light from the side of the circuit wiring pattern, and the insulating base between the circuit wiring patterns is formed while the circuit wiring pattern functions as a light shielding mask. A method for manufacturing a flexible circuit board having circuit component mounting terminals, comprising the steps of forming a circuit component mounting terminal portion in the form of a finger lead by abrasion processing a substrate material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3025250A JP2938592B2 (en) | 1991-01-26 | 1991-01-26 | Flexible circuit board provided with terminals for mounting circuit components and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3025250A JP2938592B2 (en) | 1991-01-26 | 1991-01-26 | Flexible circuit board provided with terminals for mounting circuit components and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04250684A JPH04250684A (en) | 1992-09-07 |
| JP2938592B2 true JP2938592B2 (en) | 1999-08-23 |
Family
ID=12160749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3025250A Expired - Fee Related JP2938592B2 (en) | 1991-01-26 | 1991-01-26 | Flexible circuit board provided with terminals for mounting circuit components and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2938592B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5593322A (en) * | 1995-01-17 | 1997-01-14 | Dell Usa, L.P. | Leadless high density connector |
-
1991
- 1991-01-26 JP JP3025250A patent/JP2938592B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04250684A (en) | 1992-09-07 |
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