JP2936597B2 - Method of manufacturing resin package for piezoelectric vibrator - Google Patents
Method of manufacturing resin package for piezoelectric vibratorInfo
- Publication number
- JP2936597B2 JP2936597B2 JP25821389A JP25821389A JP2936597B2 JP 2936597 B2 JP2936597 B2 JP 2936597B2 JP 25821389 A JP25821389 A JP 25821389A JP 25821389 A JP25821389 A JP 25821389A JP 2936597 B2 JP2936597 B2 JP 2936597B2
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric vibrator
- resin
- injection port
- molding die
- oscillator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Oscillators With Electromechanical Resonators (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明の構成は、樹脂パッケージングされて成る小型
薄型の圧電振動子及び圧電発振器に関する。The present invention relates to a small and thin piezoelectric vibrator and a piezoelectric oscillator packaged with a resin.
［従来の技術］ 従来の圧電振動子の実装構造を、水晶振動子を例とし
て第６図（ａ）の平面図，第６図（ｂ）の正面図に示
す。51は水晶振動子（本例ではシリンダー型）であり、
そのリード端子52,53がリードフレーム54,55に固着接続
され、水晶振動子51のケース56を、他のリードフレーム
の支持部57,58により支え、モールド樹脂59により樹脂
（パッケージング）されている。[Prior Art] A mounting structure of a conventional piezoelectric vibrator is shown in a plan view of FIG. 6A and a front view of FIG. 51 is a crystal oscillator (in this example, a cylinder type),
The lead terminals 52, 53 are fixedly connected to the lead frames 54, 55, the case 56 of the crystal unit 51 is supported by the supporting portions 57, 58 of the other lead frames, and is resin (packaged) by the mold resin 59. I have.
また、従来の圧電振動子を内蔵して樹脂成形した圧電
発振器を水晶振動子を用いなた晶発振器を例として第７
図（ａ），（ｂ）に示す。第７図（ａ）は平面図、第７
図（ｂ）は正面断面図であり、水晶振動子を発振させる
半導体素子と半導体素子から金属細線で接続された複数
の金属リード端子（以降、これらを総称して発振回路61
と言う。）発振回路61の金属リード端子の内の２本の金
属リード端子62,63に電気的に接続して装着した水晶振
動子64がトランスファーモールド樹脂68により、同時に
一体成形されている。この時水晶振動子64は、前記金属
リード端子62,63との接続部とリードフレームを曲げた
支持部65,66により水晶振動子64のケース67で保持され
ている。In addition, a conventional piezoelectric oscillator having a built-in piezoelectric vibrator and resin-molded is described as a crystal oscillator using a crystal vibrator.
These are shown in FIGS. FIG. 7A is a plan view, FIG.
FIG. 1B is a front sectional view showing a semiconductor element for oscillating the crystal unit and a plurality of metal lead terminals connected to the semiconductor element by thin metal wires (hereinafter, these are collectively referred to as an oscillation circuit 61).
Say The crystal oscillator 64 electrically connected to and mounted on the two metal lead terminals 62 and 63 of the metal lead terminals of the oscillation circuit 61 is simultaneously and integrally formed by the transfer molding resin 68. At this time, the crystal unit 64 is held by the case 67 of the crystal unit 64 by the connection portions with the metal lead terminals 62 and 63 and the support portions 65 and 66 obtained by bending the lead frame.
［発明が解決しようとする課題］ しかし前述した従来技術の構成では、水晶振動子及び
水晶発振器ともに、水晶振動子の保持が２本の金属リー
ド端子との接続部と支持部でなされているが、金属リー
ド端子への水晶振動子の装着時及び樹脂注入成形時に、
水晶振動子の位置（特に水晶振動子のケース先端部）が
平面方向にずれて、水晶振動子の周囲にある金属リード
端子と接触して異常発振を起こしたり、あるいは上下方
向（厚み方向）にずれて、樹脂成形したパッケージの外
部へ露出してしまう危険性が大きいため、ずれ量を含ん
で樹脂厚みを大きくしなくてはならずパッケージの厚み
が大きくなってしまう等の問題点を有していた。[Problems to be Solved by the Invention] However, in the above-described configuration of the related art, both the crystal unit and the crystal oscillator hold the crystal unit at the connection portion between the two metal lead terminals and the support portion. , When mounting the crystal unit to the metal lead terminals and during resin injection molding,
The position of the crystal unit (especially the tip of the case of the crystal unit) shifts in the plane direction, causing abnormal oscillation due to contact with the metal lead terminals around the crystal unit, or in the vertical direction (thickness direction). Since there is a high risk that the package will shift and be exposed to the outside of the resin molded package, there is a problem that the thickness of the package must be increased, including the amount of shift, and the thickness of the package will increase. I was
そこで本発明はこのような問題点を解決しようとする
もので、その目的とするところは、圧電振動子の保持方
法を改良して圧電振動子全体の装着位置を固定し、発振
回路に接続された他の金属リード端子と圧電振動子との
接触による異常発振の防止と、樹脂成形厚み（パッケー
ジ厚み）を薄くして小型化を図った圧電振動子及び圧電
発振器を提供することにある。Therefore, the present invention is intended to solve such a problem, and an object of the present invention is to improve the method of holding the piezoelectric vibrator, fix the mounting position of the entire piezoelectric vibrator, and connect the piezoelectric vibrator to the oscillation circuit. Another object of the present invention is to provide a piezoelectric vibrator and a piezoelectric oscillator that prevent abnormal oscillation due to contact between another metal lead terminal and the piezoelectric vibrator and that are reduced in size by reducing the resin molding thickness (package thickness).
［課題を解決するための手段］ 本発明の圧電振動子の樹脂パッケージ製造方法は、支
持部に支持され且つリードフレームに固着接続された圧
電振動子を成形金型に入れた後、前記成形金型の注入口
から樹脂を注入する工程を包含する。前記注入口は、前
記樹脂の流れが前記圧電振動子を前記支持部に押し付け
るように形成されている。[Means for Solving the Problems] In the method of manufacturing a resin package for a piezoelectric vibrator according to the present invention, the method includes: placing a piezoelectric vibrator supported by a support portion and fixedly connected to a lead frame into a molding die; A step of injecting a resin from an injection port of the mold. The inlet is formed so that the flow of the resin presses the piezoelectric vibrator against the support.
好ましくは、前記成形金型は上型と下型とを有し、前
記上型は前記圧電振動子のほぼ上半分を覆い、前記下型
は前記圧電振動子のほぼ下半分と前記支持部とを覆い、
前記注入口が前記上型に設けられている。Preferably, the molding die has an upper mold and a lower mold, the upper mold covers substantially the upper half of the piezoelectric vibrator, and the lower mold has a substantially lower half of the piezoelectric vibrator and the support portion. ,
The inlet is provided in the upper mold.
他の実施形態では、前記成形金型は上型と下型とを有
し、前記上型は前記圧電振動子のほぼ上半分を覆い、前
記下型は前記圧電振動子のほぼ下半分と前記支持部とを
覆い、前記成形金型の注入口は、前記圧電振動子と前記
上型との間に向けて樹脂を注入する傾斜部を有してい
る。In another embodiment, the molding die has an upper mold and a lower mold, the upper mold covers substantially the upper half of the piezoelectric vibrator, and the lower mold has substantially the lower half of the piezoelectric vibrator and the lower mold. The injection port of the molding die has an inclined portion that injects resin toward between the piezoelectric vibrator and the upper die.
本発明の圧電振動子の樹脂パッケージ製造方法は、支
持部に支持され且つリードフレームに固着接続された圧
電振動子を成形金型に入れた後、前記成形金型の注入口
から樹脂を注入する工程を包含する。前記注入口と前記
圧電振動子との間に、前記注入口から注入された樹脂の
流れを前記圧電振動子と前記上型との間に向ける流入方
向制御部が配置され、前記樹脂の流れが前記圧電振動子
を前記支持部に押し付ける。In the method of manufacturing a resin package for a piezoelectric vibrator according to the present invention, after a piezoelectric vibrator supported by a support portion and fixedly connected to a lead frame is put into a molding die, a resin is injected from an injection port of the molding die. Process. An inflow direction control unit that directs the flow of the resin injected from the injection port between the piezoelectric vibrator and the upper mold is disposed between the injection port and the piezoelectric vibrator, and the flow of the resin is The piezoelectric vibrator is pressed against the support.
好ましくは、前記流入方向制御部はリード端子を折り
曲げて設けてある。Preferably, the inflow direction control section is provided by bending a lead terminal.
［実施例］ 本発明の圧電振動子の一実施例を水晶振動子を例に第
１図（ａ）の平面図、第１図（ｂ）の側面断面図及び第
１図（ｃ）の正面断面図に示す。１は水晶振動子（本体
ではシリンダー型）であり、その端子2,3をリードフレ
ーム4,5に固定され水晶振動子１のケース６を、他のリ
ードフレームの支持部7,8により支え、水晶振動子１が
支持部7,8に押し付けられるように成形型の上型に設け
てある注入口９より溶融樹脂10を注入して樹脂封止を行
なっている。よって水晶振動子は確実に固定される。Embodiment An embodiment of the piezoelectric vibrator of the present invention will be described with reference to a plan view of FIG. 1A, a cross-sectional side view of FIG. 1B and a front view of FIG. It is shown in the sectional view. Reference numeral 1 denotes a crystal oscillator (a cylinder type in the main body) whose terminals 2 and 3 are fixed to lead frames 4 and 5 and a case 6 of the crystal oscillator 1 is supported by supporting portions 7 and 8 of other lead frames. A molten resin 10 is injected from an injection port 9 provided in the upper mold so that the crystal unit 1 is pressed against the supporting portions 7 and 8, and resin sealing is performed. Therefore, the crystal oscillator is securely fixed.
また注入口12の形状を第２図に示すように成形型の下
型11に設けても、樹脂の注入方向が上方になるように注
入口の下部に傾斜13を設けると同様な加圧ができ、水晶
振動子14を確実に固定することができる。In addition, even if the shape of the injection port 12 is provided in the lower mold 11 of the molding die as shown in FIG. As a result, the crystal resonator 14 can be fixed securely.
更に第３図に示すように、リードフレーム15に曲げ加
工を加えて水晶振動子16の固定位置を低くすると、より
樹脂封止時の水晶振動子16への加圧力が増して良い。Furthermore, as shown in FIG. 3, when the lead frame 15 is bent to lower the fixing position of the crystal unit 16, the pressure applied to the crystal unit 16 during resin sealing may be further increased.
また第４図（ａ）の平面図、第４図（ｂ）の正面断面
図に示すとうり樹脂注入口12の前方にリードフレーム13
を曲げて溶融樹脂の注入方向を変化させる方向変化部14
を設けることによって水晶振動子を支持部側に加圧する
ような樹脂の流れ100とする方法もとることができる。Also, as shown in the plan view of FIG. 4A and the front sectional view of FIG.
Direction changing unit 14 that changes the injection direction of the molten resin by bending
By providing the resin flow, it is possible to adopt a method in which the resin flow 100 is set such that the quartz oscillator is pressed toward the support portion.
また本発明の圧電振動子を内蔵して樹脂成形した圧電
発振器を水晶振動子を用いた水晶発振器を例として第５
図（ａ），（ｂ）に示し説明する。第５図（ａ）は平面
図、第５図（ｂ）は正面断面図であり、発振回路21と発
振回路21の内の２本の金属リード端子22,23に電気的に
接続して装着した水晶振動子24が金属リード端子22,23
及び発振回路21と接続されており、ケース30がリードフ
レームを構成するリード端子を曲げた支持部25,26に固
定され、成形型の上型の注入口27から溶融樹脂28を注入
して、水晶振動子24を支持部25,26に押し付けた状態で
樹脂封止29が行なわれる。Further, a piezoelectric oscillator which incorporates the piezoelectric vibrator of the present invention and is resin-molded is described as a fifth example using a crystal oscillator using a crystal vibrator.
This will be described with reference to FIGS. FIG. 5 (a) is a plan view, and FIG. 5 (b) is a front sectional view, in which an oscillation circuit 21 and two metal lead terminals 22 and 23 of the oscillation circuit 21 are electrically connected and mounted. Crystal resonator 24
And the oscillation circuit 21 is connected, the case 30 is fixed to the support portions 25 and 26 in which the lead terminals constituting the lead frame are bent, and the molten resin 28 is injected from the injection port 27 of the upper mold of the molding die, Resin sealing 29 is performed in a state where the quartz oscillator 24 is pressed against the supporting portions 25 and 26.
支持部への水晶振動子を押し付ける方法は、圧電発振
器でも先の圧電振動子で示した他の方法が同様に用いら
れる。As for the method of pressing the crystal oscillator against the supporting portion, other methods shown in the above-described piezoelectric oscillator are similarly used for the piezoelectric oscillator.
尚、本発明の構成は実施例に示す水晶振動子を用いた
水晶発振器に限らず、タンタル酸リチウム振動子，モリ
ブデン酸リチウム振動子，セラミック振動子等の圧電振
動子、またはこれら圧電振動子の圧電振動子を発振させ
る電気回路を内蔵した圧電発振器でも良い。The configuration of the present invention is not limited to the quartz oscillator using the quartz oscillator described in the embodiment, but includes a piezoelectric oscillator such as a lithium tantalate oscillator, a lithium molybdate oscillator, a ceramic oscillator, or a piezoelectric oscillator of these piezoelectric oscillators. A piezoelectric oscillator having an electric circuit for oscillating the piezoelectric vibrator may be used.
さらに電気回路のGND又はVDDの金属リード端子を用い
れば、圧電振動子ケース体をアース固定できるため、圧
電振動子発振の安定化に一層の効果を有することができ
る。Furthermore, if the GND or VDD metal lead terminal of the electric circuit is used, the piezoelectric vibrator case body can be fixed to the ground, so that the effect of stabilizing the piezoelectric vibrator oscillation can be further improved.
［発明の効果］ 以上述べてきたように、本発明の圧電振動子及び圧電
発振器によれば、リードフレームの支持部にケースをモ
ールド時の樹脂の圧力で加圧して圧電振動子を位置決め
することにより、圧電振動子周囲にある他の金属リード
端子と圧電振動子との接触及び樹脂成形部（パッケー
ジ）外部への圧電振動子露出を防ぐことが可能となり、
圧電振動子を内蔵して樹脂成形された圧電発振器の発振
異常防止と薄型パッケージ化ができるという効果を有す
る。[Effect of the Invention] As described above, according to the piezoelectric vibrator and the piezoelectric oscillator of the present invention, the piezoelectric vibrator is positioned by pressing the case with the pressure of the resin at the time of molding on the supporting portion of the lead frame. As a result, it is possible to prevent contact between the piezoelectric vibrator and other metal lead terminals around the piezoelectric vibrator and to prevent the piezoelectric vibrator from being exposed to the outside of the resin molded part (package).
This has an effect that abnormal oscillation can be prevented and a thin package can be formed in a resin-molded piezoelectric oscillator having a built-in piezoelectric vibrator.
第１図（ａ），第１図（ｂ），第１図（ｃ）は本発明の
実施例としての水晶振動子を示し、第１図（ａ）は平面
図、第１図（ｂ）は側面断面図、第１図（ｃ）は正面断
面図。 １……水晶振動子 2,3……水晶振動子の端子 4,5……リードフレーム ６……水晶振動子のケース 7,8……支持部 ９……樹脂の注入口 10……溶融樹脂 第２図は本発明の樹脂注入口の形状を示す図。 第３図は本発明の水晶振動子の応用例を示す図 第４図（ａ），第４図（ｂ）は本発明の水晶振動子の構
成を示し第４図（ａ）は平面図、第４図（ｂ）は正面断
面図。 12……樹脂注入口 13……リードフレーム 14……樹脂の流入方向変化部 第５図（ａ），第５図（ｂ）は本発明の圧電発振器の一
実施例としての水晶発振器を示し第５図（ａ）は平面
図、第５図（ｂ）は正面断面図。 21……発振回路 22,23……金属リード端子 24……水晶振動子 25,26……支持部 27……樹脂の注入口 28……溶融樹脂 29……樹脂封止部 30……水晶振動子のケース 第６図（ａ），第６図（ｂ）は従来の圧電振動子の実施
例としての水晶振動子を示し、第６図（ａ）は平面図、
第６図（ｂ）は正面断面図。 第７図（ａ），第７図（ｂ）は従来の圧電発振器の実施
例としての水晶発振器を示し、第７図（ａ）は平面図、
第７図（ｂ）は正面断面図。FIGS. 1 (a), 1 (b) and 1 (c) show a quartz oscillator as an embodiment of the present invention. FIG. 1 (a) is a plan view and FIG. 1 (b). Is a side sectional view, and FIG. 1 (c) is a front sectional view. 1 crystal oscillator 2,3 crystal oscillator terminal 4,5 lead frame 6 crystal oscillator case 7,8 support 9 resin injection port 10 molten resin FIG. 2 is a view showing a shape of a resin injection port of the present invention. FIG. 3 is a view showing an application example of the crystal unit of the present invention. FIGS. 4 (a) and 4 (b) show the configuration of the crystal unit of the present invention, and FIG. 4 (a) is a plan view. FIG. 4 (b) is a front sectional view. 12 Resin injection port 13 Lead frame 14 Resin inflow direction changing portion FIGS. 5A and 5B show a crystal oscillator as one embodiment of the piezoelectric oscillator of the present invention. 5A is a plan view, and FIG. 5B is a front sectional view. 21 ... Oscillation circuit 22,23 ... Metal lead terminal 24 ... Crystal resonator 25,26 ... Support 27 ... Resin injection port 28 ... Molten resin 29 ... Resin sealing section 30 ... Crystal oscillation 6 (a) and 6 (b) show a crystal unit as an example of a conventional piezoelectric unit, FIG. 6 (a) is a plan view,
FIG. 6 (b) is a front sectional view. 7 (a) and 7 (b) show a crystal oscillator as an embodiment of a conventional piezoelectric oscillator. FIG. 7 (a) is a plan view,
FIG. 7 (b) is a front sectional view.
Claims (5)
着接続された圧電振動子を成形金型に入れた後、前記成
形金型の注入口から樹脂を注入する工程を包含した圧電
振動子の樹脂パッケージ製造方法であって、 前記注入口は、前記樹脂の流れが前記圧電振動子を前記
支持部に押し付けるように形成されている、圧電振動子
の樹脂パッケージ製造方法。1. A piezoelectric vibrator comprising: a step of inserting a piezoelectric vibrator supported by a support portion and fixedly connected to a lead frame into a molding die, and injecting a resin through an injection port of the molding die. A method of manufacturing a resin package for a piezoelectric vibrator, wherein the injection port is formed so that a flow of the resin presses the piezoelectric vibrator against the support portion.
上型は前記圧電振動子のほぼ上半分を覆い、前記下型は
前記圧電振動子のほぼ下半分と前記支持部とを覆い、前
記注入口が前記上型に設けられている、請求項１記載の
圧電振動子の樹脂パッケージ製造方法。2. The molding die has an upper mold and a lower mold. The upper mold covers substantially the upper half of the piezoelectric vibrator, and the lower mold has substantially the lower half of the piezoelectric vibrator and the support. The method for manufacturing a resin package for a piezoelectric vibrator according to claim 1, wherein the injection port is provided in the upper mold so as to cover the upper mold.
上型は前記圧電振動子のほぼ上半分を覆い、前記下型は
前記圧電振動子のほぼ下半分と前記支持部とを覆い、前
記成形金型の注入口は、前記圧電振動子と前記上型との
間に向けて樹脂を注入する傾斜部を有している、請求項
１記載の圧電振動子の樹脂パッケージ製造方法。3. The molding die has an upper die and a lower die, wherein the upper die covers substantially the upper half of the piezoelectric vibrator, and the lower die substantially covers the lower half of the piezoelectric vibrator and the support. 2. The resin of the piezoelectric vibrator according to claim 1, wherein the injection port of the molding die has an inclined portion that injects resin toward between the piezoelectric vibrator and the upper mold. 3. Package manufacturing method.
着接続された圧電振動子を成形金型に入れた後、前記成
形金型の注入口から樹脂を注入する工程を包含した圧電
振動子の樹脂パッケージ製造方法であって、 前記注入口と前記圧電振動子との間に、前記注入口から
注入された樹脂の流れを前記圧電振動子と前記上型との
間に向ける流入方向制御部が配置され、前記樹脂の流れ
が前記圧電振動子を前記支持部に押し付ける、圧電振動
子の樹脂パッケージ製造方法。4. A piezoelectric vibrator comprising a step of inserting a piezoelectric vibrator supported by a support portion and fixedly connected to a lead frame into a molding die, and injecting a resin through an injection port of the molding die. A resin package manufacturing method, wherein an inflow direction control unit that directs a flow of resin injected from the injection port between the piezoelectric vibrator and the upper mold is provided between the injection port and the piezoelectric vibrator. A method of manufacturing a resin package for a piezoelectric vibrator, wherein the flow of the resin is arranged to press the piezoelectric vibrator against the support portion.
げて設けてある、請求項４記載の圧電振動子の樹脂パッ
ケージ製造方法。5. The method for manufacturing a resin package for a piezoelectric vibrator according to claim 4, wherein said inflow direction control section is provided by bending a lead terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25821389A JP2936597B2 (en) | 1989-10-03 | 1989-10-03 | Method of manufacturing resin package for piezoelectric vibrator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25821389A JP2936597B2 (en) | 1989-10-03 | 1989-10-03 | Method of manufacturing resin package for piezoelectric vibrator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03119810A JPH03119810A (en) | 1991-05-22 |
| JP2936597B2 true JP2936597B2 (en) | 1999-08-23 |
Family
ID=17317091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25821389A Expired - Fee Related JP2936597B2 (en) | 1989-10-03 | 1989-10-03 | Method of manufacturing resin package for piezoelectric vibrator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2936597B2 (en) |
-
1989
- 1989-10-03 JP JP25821389A patent/JP2936597B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03119810A (en) | 1991-05-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100254891B1 (en) | Electronic parts having 3 terminal parts for piezoelectric device | |
| US4916413A (en) | Package for piezo-oscillator | |
| JP2936597B2 (en) | Method of manufacturing resin package for piezoelectric vibrator | |
| KR950025963A (en) | Manufacturing Method of Semiconductor Device | |
| JPH01158756A (en) | Manufacture of resin sealed semiconductor device | |
| JP2605756B2 (en) | Piezoelectric oscillator | |
| JP3128906B2 (en) | Piezoelectric oscillator | |
| JPH0691168B2 (en) | Hybrid IC mounting structure with built-in piezoelectric vibrator and resin molding | |
| JP2543874Y2 (en) | Resin mold type piezoelectric oscillator and resin mold type piezoelectric vibrator | |
| JPS63305604A (en) | Piezoelectric oscillator | |
| JPH0516724Y2 (en) | ||
| JPS6354222B2 (en) | ||
| JP3072632B2 (en) | Piezoelectric oscillator | |
| JP2001298032A (en) | Semiconductor package and its manufacturing method | |
| JP2611693B2 (en) | Mounting structure of piezoelectric oscillator | |
| JP2570653B2 (en) | Mounting structure of piezoelectric vibrator | |
| JP3000917B2 (en) | Piezoelectric oscillator | |
| KR940008559B1 (en) | Manufacturing method and apparatus of sensor deivce | |
| JPS63244905A (en) | Piezo-oscillator | |
| JPS63263902A (en) | Piezoelectric oscillator | |
| JPH043501Y2 (en) | ||
| JPS62139347A (en) | Metal lead frame for packaging resin-sealed type semiconductor | |
| JPH01135213A (en) | Piezo-oscillator | |
| JPS5978537A (en) | Manufacture of resin-sealed semiconductor device | |
| JP2001196401A (en) | Resin package forming method for semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 10 Free format text: PAYMENT UNTIL: 20090611 |
|
| LAPS | Cancellation because of no payment of annual fees |