JP2930763B2 - Intermediate board for mounting circuit components and method of manufacturing the same - Google Patents
Intermediate board for mounting circuit components and method of manufacturing the sameInfo
- Publication number
- JP2930763B2 JP2930763B2 JP7740691A JP7740691A JP2930763B2 JP 2930763 B2 JP2930763 B2 JP 2930763B2 JP 7740691 A JP7740691 A JP 7740691A JP 7740691 A JP7740691 A JP 7740691A JP 2930763 B2 JP2930763 B2 JP 2930763B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating base
- circuit component
- base material
- copper foil
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Wire Bonding (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ＩＣ等の回路部品を半
田バンプ等を用いて回路配線基板にフリップチップ実装
する方式に於いて、バンプの接合信頼性を向上させる為
に回路部品と配線基板との間に配装する回路部品搭載用
中間基板及びその製造法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of flip-chip mounting a circuit component such as an IC on a circuit wiring board by using a solder bump or the like. The present invention relates to an intermediate substrate for mounting circuit components disposed between the substrate and a method of manufacturing the intermediate substrate.
【０００２】[0002]
【従来の技術】近年、ＩＣの高密度化、高速化に伴って
半田バンプによるフリップチップ実装方式が多用されつ
つある。しかし、このフリップチップ実装法では、ＩＣ
チップと回路配線基板との熱膨張係数の違いにより半田
バンプのクラックが発生し問題となっている。この問題
を解決する一つの方法は、回路配線基板とＩＣチップと
の熱膨張係数を極力近ずけることであるが、この手法で
も限界がある。他の方法としては、ＩＣチップと回路配
線基板との間に回路部品搭載用中間基板を配装してリフ
ロ−後の半田バンプの高さをできるだけ高くすることに
よって熱歪による応力を緩和する手法がある。2. Description of the Related Art In recent years, flip-chip mounting methods using solder bumps have been frequently used with the increase in density and speed of ICs. However, in this flip chip mounting method, IC
A difference in thermal expansion coefficient between the chip and the circuit wiring board causes cracks in the solder bumps, which is a problem. One method of solving this problem is to make the thermal expansion coefficients of the circuit wiring board and the IC chip as close as possible, but this method also has its limitations. Another method is to dispose a circuit component mounting intermediate board between the IC chip and the circuit wiring board and to increase the height of the solder bumps after reflow as much as possible, thereby alleviating the stress due to thermal strain. There is.
【０００３】このような回路部品接続用端子付き中間基
板の従来構造としては、種々提案されているが、例えば
特開昭６０−１２３０９３号公報に示されているような
絶縁材に直径０．１ｍｍ〜０．２ｍｍ程度の導電性ピン
をその絶縁材から突出するように埋め込んで形成するも
の、また、特開平１−７２５３７号公報の如く絶縁性フ
ィルムの所定の位置に穴を設け、この穴に一定量のペ−
スト状半田を印刷手段で保持させたものがある。更に、
特開昭６２−１８０４９号公報に示されているようにセ
ラミックグリ−ンシ−トに貫通孔を形成して焼成し、こ
の貫通孔に半田に対して濡れ性のある銅ペ−スト等を挿
入し焼成し、次にこの銅層の上に濡れ性のないタングス
テンペ−スト等を挿入し焼成した後、そのタングステン
層の上に濡れ性のある銅ペ−スト等を挿入し焼成し、最
後に上表面の銅の部分に半田ボ−ルを溶融接合する手法
などがある。Various conventional structures of such an intermediate board with terminals for connecting circuit parts have been proposed. For example, an insulating material as disclosed in Japanese Patent Application Laid-Open No. Sho 60-123093 has a diameter of 0.1 mm. A conductive pin of about 0.2 mm is embedded and formed so as to protrude from the insulating material, or a hole is provided at a predetermined position of an insulating film as disclosed in JP-A-1-72537. A certain amount of paper
There is a type in which a strike-shaped solder is held by printing means. Furthermore,
As disclosed in JP-A-62-18049, a through hole is formed in a ceramic green sheet and fired, and a copper paste or the like which is wettable with solder is inserted into the through hole. Then, a tungsten paste or the like having no wettability is inserted on the copper layer and fired. Then, a copper paste or the like having a wettability is inserted on the tungsten layer and fired. In addition, there is a method of melting and joining a solder ball to a copper portion on the upper surface.
【０００４】[0004]
【発明が解決しようとする課題】このような回路部品搭
載用中間基板に於いては、ＩＣチップの配線密度が更に
高くなり、半田バンプの直径もそれに応じて小さくなる
と、高精細な接続端子を有する回路部品搭載用中間基板
を製造することは困難となる。また、ＩＣチップの電極
と回路部品搭載用中間基板の接続端子との位置合わせも
困難性を増す。In such an intermediate board for mounting circuit components, when the wiring density of the IC chip is further increased and the diameter of the solder bump is correspondingly reduced, a high-definition connection terminal is formed. It becomes difficult to manufacture an intermediate board for mounting circuit components. In addition, the alignment of the electrodes of the IC chip with the connection terminals of the circuit component mounting intermediate substrate also increases the difficulty.
【０００５】[0005]
【課題を解決するための手段】本発明は上記の問題を解
決する為に、高精細なリベット状の接続端子を備え、ま
た、この接続端子がＩＣ等の回路部品の電極側の半田バ
ンプと位置整合を容易にする構造の回路部品搭載用中間
基板及びその製造法を提供するものである。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention includes a high-definition rivet-like connection terminal, and the connection terminal is connected to a solder bump on the electrode side of a circuit component such as an IC. An object of the present invention is to provide a circuit component mounting intermediate substrate having a structure that facilitates position alignment and a method of manufacturing the same.
【０００６】その為に本発明の回路部品搭載用中間基板
では、この中間基板の上記接続端子を、絶縁べ−ス材の
一方面に形成した島状電極と、この島状電極に電気的に
接合すると共に上記絶縁べ−ス材を貫通して該絶縁べ−
ス材の他方面に突出する回路部品搭載用端子とで構成し
たものである。そして、上記接続端子の回路部品搭載用
端子の外縁はリング状に***させるように構成すること
も出来る。Therefore, in the circuit component mounting intermediate substrate of the present invention, the connection terminals of the intermediate substrate are electrically connected to the island-shaped electrode formed on one surface of the insulating base material and the island-shaped electrode. Joining and penetrating the insulating base material
And a circuit component mounting terminal projecting from the other surface of the metal material. In addition, the outer edge of the circuit component mounting terminal of the connection terminal may be configured to protrude in a ring shape.
【０００７】また、このようなこの中間基板の上記接続
端子を、絶縁べ−ス材の一方面に形成した島状電極と、
この島状電極に電気的に接合すると共に上記絶縁べ−ス
材を貫通して該絶縁べ−ス材の他方面に突出する回路部
品搭載用端子とで構成したものである。そして、上記接
続端子の回路部品搭載用端子の外縁はリング状に***さ
せるように構成することも出来る。Further, the connection terminal of the intermediate substrate is provided with an island-shaped electrode formed on one surface of an insulating base material,
A circuit component mounting terminal electrically connected to the island-shaped electrode and penetrating the insulating base material and protruding from the other surface of the insulating base material. In addition, the outer edge of the circuit component mounting terminal of the connection terminal may be configured to protrude in a ring shape.
【０００８】また、このような回路部品搭載用中間基板
を製造する為の手法としては、絶縁べ−ス材の両面に銅
箔層を形成した両面銅張積層板を用意し、上記一方の銅
箔層は上記絶縁べ−ス材の所要部位を貫通させる為に必
要な孔を有するメタルマスクに形成し、このメタルマス
クの上記孔の位置に対応する上記他方の銅箔層の外面部
位には島状の耐腐食性金属層を形成し、上記メタルマス
ク側からエキシマレ−ザ−を照射して上記孔の部分に位
置する上記絶縁べ−ス材部位を貫通除去して上記他方の
銅箔層を露出させ、次に上記メタルマスクを除去した
後、絶縁べ−ス材の上記貫通孔にメッキ処理を施して一
端が上記他方の銅箔層に電気的に接合すると共に他端が
上記絶縁べ−ス材の外部に突出する回路部品搭載用端子
を形成し、更に上記耐腐食性金属層の側からエッチング
処理を加えて上記他方の銅箔層側の不要部分を除去して
島状の電極を形成する各工程を採用できる。そして、上
記のような回路部品搭載用端子を形成する工程として
は、高電流密度でメッキ処理を施すことによってその端
子の外縁をリング状に***させる手法も採用できる。As a method for manufacturing such an intermediate board for mounting circuit parts, a double-sided copper-clad laminate having a copper foil layer formed on both sides of an insulating base material is prepared, The foil layer is formed on a metal mask having a hole necessary to penetrate a required portion of the insulating base material, and an outer surface portion of the other copper foil layer corresponding to the position of the hole of the metal mask is formed on the metal mask. Forming an island-shaped corrosion-resistant metal layer, irradiating an excimer laser from the metal mask side to penetrate and remove the insulating base material portion located at the hole, and forming the other copper foil layer; Then, after the metal mask is removed, the through hole of the insulating base material is plated to electrically connect one end to the other copper foil layer and the other end to the insulating base. -Forming circuit component mounting terminals protruding outside the From the side of the corrosive metal layer in addition to an etching process may be employed the steps of forming the removed and island-shaped electrodes unnecessary portions of the other of the copper foil layer side. As a process of forming the circuit component mounting terminal as described above, a method of performing plating at a high current density to raise the outer edge of the terminal in a ring shape can be adopted.
【０００９】[0009]
【実施例】以下、図示の実施例を参照して本発明を更に
説明すると、図１に於いて、１は本発明に従って構成さ
れた回路部品搭載用中間基板であって、この中間基板１
はリベット状に形成された多数の微細な接続端子２を備
えている。３及び４はその各接続端子２の表裏に電気的
に接続される半田バンプであって、その一方の半田バン
プ３はＩＣチップ等の回路部品５の電極６に接続され、
また他方の半田バンプ４は回路配線基板７に於ける配線
パタ−ン等の電極８に接続される。回路部品搭載用中間
基板１はこのような接続態様で回路部品５と配線基板７
との間に配装される。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be further described below with reference to the illustrated embodiment. In FIG. 1, reference numeral 1 denotes an intermediate board for mounting circuit components constructed according to the present invention.
Has a number of fine connection terminals 2 formed in a rivet shape. Solder bumps 3 and 4 are electrically connected to the front and back of each connection terminal 2, and one of the solder bumps 3 is connected to an electrode 6 of a circuit component 5 such as an IC chip.
The other solder bump 4 is connected to an electrode 8 such as a wiring pattern on a circuit wiring board 7. The circuit component mounting intermediate substrate 1 is connected to the circuit component 5 and the wiring substrate 7 in such a connection manner.
It is arranged between and.
【００１０】図２は回路部品搭載用中間基板１に於ける
各接続端子２の具体的構造を示すものであり、１０はポ
リイミドフィルム等の絶縁べ−ス材を示し、この絶縁べ
−ス材１０の一方の面には表面に金メッキ等の耐腐食性
金属層１２を形成したリベット状に突出する回路部品搭
載用端子１１を有する。この端子１１の一部は絶縁べ−
ス材１０を貫通して該べ−ス材１０の裏面に形成した島
状電極１３に電気的に接合している。島状電極１３はそ
の表面が平坦状に形成され、またその外面には金メッキ
等の耐腐食性金属層１４を有する。FIG. 2 shows a specific structure of each connection terminal 2 in the circuit component mounting intermediate substrate 1. Reference numeral 10 denotes an insulating base material such as a polyimide film. On one surface of 10, there is provided a circuit component mounting terminal 11 protruding like a rivet having a corrosion-resistant metal layer 12 such as gold plating formed on the surface. A part of the terminal 11 is an insulating base.
The base material 10 penetrates through the base material 10 and is electrically connected to the island-shaped electrodes 13 formed on the back surface of the base material 10. The island-shaped electrode 13 has a flat surface, and has on its outer surface a corrosion-resistant metal layer 14 such as gold plating.
【００１１】回路部品搭載用端子１１は図２のようなリ
ベット状の構造の他、図３の如く、外縁を適度に***さ
せたリング状の端子１１Ａに構成することも可能であっ
て、このようなリング状の回路部品搭載用端子１１Ａを
備える場合には、その中央部に陥部を有することとなる
ので、ＩＣチップ等の回路部品５の電極６側の半田バン
プ３との位置整合を確保することが容易となる。The circuit component mounting terminal 11 can be formed into a ring-shaped terminal 11A having an outer edge appropriately raised as shown in FIG. 3 in addition to a rivet-shaped structure as shown in FIG. In the case where such a ring-shaped circuit component mounting terminal 11A is provided, a concave portion is provided at the center of the terminal 11A. It becomes easy to secure.
【００１２】図４の（１）から（９）は上記の如き回路
部品搭載用中間基板１を製作する為の一製造工程図を示
す。この製作手法では同図（１）の如く、先ずポリイミ
ドフィルム等の絶縁べ−ス材１０の両面に銅箔層１５、
１６を形成した両面銅張積層板を用意し、これらの銅箔
層１５、１６の外面には同図（２）に示すように各々フ
ォトレジスト層１７、１８を各別に形成される。次に、
回路部品搭載用端子を設けるべき各位置に対応させて一
方のフォトレジスト層１７には露光・現像処理で後述の
貫通孔用の孔１９を形成すると共に、他方のフォトレジ
スト層１８側には上記孔１９の形成位置に対応する部位
にその孔１９よりも適宜大きくなるように同様な露光・
現像処理で島状電極を形成する為の孔２０を形成する。
そこで、同図（４）のように先ず孔１９を形成したフォ
トレジスト層１７の側に耐メッキレジスト層２１を形成
した段階で、他方のフォトレジスト層１８の孔２０に露
出する銅箔層１６の部位に金メッキ等の処理を施して耐
腐食性金属層２２を形成するものである。FIGS. 4 (1) to (9) show one manufacturing process diagram for manufacturing the above-described circuit component mounting intermediate substrate 1. FIG. In this manufacturing method, as shown in FIG. 1A, first, a copper foil layer 15 is formed on both surfaces of an insulating base material 10 such as a polyimide film.
A double-sided copper-clad laminate having 16 formed thereon is prepared, and photoresist layers 17 and 18 are separately formed on the outer surfaces of these copper foil layers 15 and 16 as shown in FIG. next,
A hole 19 for a through hole, which will be described later, is formed in one photoresist layer 17 by exposure / development processing in correspondence with each position where a circuit component mounting terminal is to be provided, and the other photoresist layer 18 is provided with A similar exposure / exposure process is performed on a portion corresponding to the formation position of the hole 19 so as to be appropriately larger than the hole 19.
A hole 20 for forming an island-shaped electrode in the developing process is formed.
Therefore, as shown in FIG. 4D, when the plating resist layer 21 is first formed on the side of the photoresist layer 17 where the holes 19 are formed, the copper foil layer 16 exposed to the holes 20 of the other photoresist layer 18 is formed. Is subjected to a treatment such as gold plating to form a corrosion-resistant metal layer 22.
【００１３】次いで、同図（５）の如く上記耐メッキレ
ジスト層２１を除去した状態でエッチング処理を加え、
且つフォトレジスト層１７を除去すると、一方の銅箔層
１５には上記の孔１９の大きさに合致した孔２３を形成
することができる。このような孔２３を形成した段階で
は銅箔層１５はメタルマスクとして機能するようにな
る。このような状態でメタルマスクとしての銅箔層１５
の側から同図（６）の如くエキシマレ−ザ−光Ａを照射
すると、上記孔２３の部位に位置する絶縁べ−ス材１０
の箇所には他方の銅箔層１６の一部を露出させる貫通孔
２４をアブレ−ション形成することができる。Next, as shown in FIG. 5 (5), an etching process is performed with the plating resist layer 21 removed,
When the photoresist layer 17 is removed, a hole 23 corresponding to the size of the hole 19 can be formed in one copper foil layer 15. At the stage when such holes 23 are formed, the copper foil layer 15 functions as a metal mask. In this state, the copper foil layer 15 as a metal mask is formed.
When the excimer laser light A is irradiated from the side of FIG.
A through-hole 24 for exposing a part of the other copper foil layer 16 can be formed in the above-mentioned position.
【００１４】そこで、同図（７）のように、メタルマス
クとしての銅箔層１５をエッチング除去した段階で、同
図（８）の如く貫通孔２４に対して銅メッキ処理等を施
すことにより、一端が銅箔層１６に電気的に接合すると
共に他端が絶縁べ−ス材１０の外部にリベット状に突出
する回路部品搭載用の端子２５を形成することができ
る。そして、このリベット状に形成された端子２５の表
面に金メッキ等の耐腐食性金属層２６を形成し、次いで
不要なフォトレジスト層１８を除去することにより銅箔
層１６を露出させる。このような処理を行った後、最後
に島状に形成した耐腐食性金属層２２をエッチングレジ
スト層の如く機能させながら銅箔層１６の側にエッチン
グ処理を加えることにより、同図（９）の如く耐腐食性
金属層２２を表面に形成した島状電極２７を得ることが
でき、これは図２のリベット状端子を有する回路部品搭
載用中間基板１の構造となる。Therefore, as shown in FIG. 7 (7), when the copper foil layer 15 as the metal mask is removed by etching, the through hole 24 is subjected to copper plating or the like as shown in FIG. 8 (8). A terminal 25 for mounting circuit components can be formed, one end of which is electrically connected to the copper foil layer 16 and the other end of which is projected out of the insulating base material 10 in the form of a rivet. Then, a corrosion-resistant metal layer 26 such as gold plating is formed on the surface of the rivet-shaped terminal 25, and then the unnecessary photoresist layer 18 is removed to expose the copper foil layer 16. After performing such a process, an etching process is performed on the copper foil layer 16 side while the corrosion-resistant metal layer 22 finally formed in the shape of an island functions as an etching resist layer. As a result, an island-like electrode 27 having a corrosion-resistant metal layer 22 formed on the surface can be obtained, which has the structure of the circuit component mounting intermediate substrate 1 having the rivet-like terminals shown in FIG.
【００１５】ここで、図４の（８）のリベット状端子２
５を形成する銅メッキ工程の際に、高電流密度のメッキ
処理を施すことによってリベット状端子の外縁をリング
状に***させた図３の如きリング状の端子１１Ａを形成
することができるので、上記と同様にその表面に耐腐食
性金属層２６のメッキ工程と島状電極２７の形成工程と
を順次施すことにより、図３に示す構造のリング状に形
成された接続端子を備えた回路部品搭載用中間基板１を
得ることが可能となる。Here, the rivet-shaped terminal 2 shown in FIG.
In the copper plating step of forming the step No. 5, a ring-shaped terminal 11A as shown in FIG. 3 in which the outer edge of the rivet-shaped terminal is raised in a ring shape by performing a plating treatment with a high current density can be formed. A circuit component having connection terminals formed in a ring shape as shown in FIG. 3 by sequentially performing a plating step of the corrosion-resistant metal layer 26 and a step of forming the island-shaped electrodes 27 on the surface thereof in the same manner as described above. The mounting intermediate substrate 1 can be obtained.
【００１６】[0016]
【発明の効果】本発明は以上のような構成を採用したの
で、極めて高精細なリベット状の接続端子を有する回路
部品搭載用中間基板を提供でき、これにより高密度で大
型ＩＣチップ等の回路部品のフリップチップ方式の実装
に於ける半田バンプのクラック発生の問題を防止でき
る。Since the present invention employs the above-described structure, it is possible to provide an intermediate substrate for mounting circuit components having extremely high-definition rivet-like connection terminals, thereby providing a high-density circuit for a large-sized IC chip or the like. The problem of cracking of solder bumps in flip-chip mounting of components can be prevented.
【００１７】また、この回路部品搭載用中間基板に於け
る各接続端子はその外縁をリング状に***した構造にも
構成できるので、ＩＣチップ等の回路部品の自重で半田
バンプが各接続端子の中央部に滑り込むような一種のセ
ルフアライメント効果を発揮し、従って回路部品の位置
合わせ精度を向上させることができる。Also, since each connection terminal of the circuit component mounting intermediate substrate can be configured to have a structure in which the outer edge thereof is raised in a ring shape, the solder bumps are formed on each connection terminal by the weight of the circuit component such as an IC chip. It exerts a kind of self-alignment effect such as sliding into the center part, and thus can improve the positioning accuracy of the circuit components.
【図１】ＩＣチップ等の回路部品の電極と回路配線基板
の電極とを接続する為に本発明の回路部品搭載用中間基
板を用いた場合の使用態様説明図FIG. 1 is an explanatory view of a use mode when an intermediate board for mounting a circuit component of the present invention is used to connect electrodes of a circuit component such as an IC chip and electrodes of a circuit wiring board.
【図２】本発明の一実施例による回路部品搭載用中間基
板の概念的な要部断面斜視図FIG. 2 is a conceptual cross-sectional perspective view of a principal part of an intermediate board for mounting circuit components according to an embodiment of the present invention.
【図３】本発明の他の実施例に従ってリング状の接続端
子を有する回路部品搭載用中間基板の同様な要部断面斜
視図FIG. 3 is a cross-sectional perspective view of a similar principal part of an intermediate board for mounting circuit components having ring-shaped connection terminals according to another embodiment of the present invention.
【図４】図４の（１）から（９）は本発明の一例による
回路部品搭載用中間基板の製造工程図FIGS. 4 (1) to (9) are manufacturing process diagrams of a circuit component mounting intermediate substrate according to an example of the present invention.
１ 回路部品搭載用中間基板 ２ リベット状の接続端子 ５ ＩＣチップ等の回路部品 ７ 回路配線基板 １０ 絶縁べ−ス材 １１ 回路部品搭載用端子 １１Ａ リング状の端子 １２ 耐腐食性金属層 １３ 島状電極 １４ 耐腐食性金属層 DESCRIPTION OF SYMBOLS 1 Intermediate board for mounting circuit parts 2 Riveted connection terminal 5 Circuit parts such as IC chip 7 Circuit wiring board 10 Insulating base material 11 Terminal for mounting circuit parts 11A Ring-shaped terminal 12 Corrosion-resistant metal layer 13 Island shape Electrode 14 Corrosion resistant metal layer
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) H01L 21/60 311 H01L 23/12 H05K 1/18 ──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int. Cl. 6 , DB name) H01L 21/60 311 H01L 23/12 H05K 1/18
Claims (3)
極に対向して配置された回路配線基板上の電極とを電気
的に接続する為の接続端子を備え、且つ上記回路部品と
回路配線基板との間に配装される回路部品搭載用中間基
板に於いて、この中間基板の上記接続端子は、絶縁ベー
ス材の一方面に形成した島状電極と、この島状電極に電
気的に接合すると共に上記絶縁ベース材を貫通して該絶
縁ベース材の他方面に突出する回路部品搭載用端子とで
構成され、前記回路部品搭載用端子は、その外縁をリン
グ状に***させるように構成したことを特徴とする回路
部品搭載用中間基板。A connection terminal for electrically connecting an electrode on a surface of a circuit component such as an IC and an electrode on a circuit wiring board arranged to face the electrode. In the circuit component mounting intermediate substrate disposed between the circuit substrate and the circuit wiring substrate, the connection terminals of the intermediate substrate are connected to the island-shaped electrode formed on one surface of the insulating base material and the island-shaped electrode. the insulating base material a penetrating is composed of a circuit component mounting pin projecting on the other surface of the insulating base member, the circuit component mounting terminal, phosphorus its outer edge as well as joined
An intermediate substrate for mounting circuit components, wherein the intermediate substrate is configured to be protruded in a ridge shape .
両面銅張積層板を用意し、上記一方の銅箔層は上記絶縁
ベース材の所要部位を貫通させる為に必要な孔を有する
メタルマスクに形成し、このメタルマスクの上記孔の位
置に対応する上記他方の銅箔層の外面部位には島状の耐
腐食性金属層を形成し、上記メタルマスク側からエキシ
マレーザーを照射して上記孔の部分に位置する上記絶縁
ベース材部位を貫通除去して上記他方の銅箔層を露出さ
せ、次いで上記メタルマスクを除去した後、絶縁ベース
材の上記貫通孔にメッキ処理を施して一端が上記他方の
銅箔層に電気的に接合すると共に他端が上記絶縁ベース
材の外部に突出する回路部品搭載用端子を形成し、更に
上記耐腐食性金属層の側からエッチング処理を加えて上
記他方の銅箔層の不要部分を除去して島状の電極を形成
する各工程を備える回路部品搭載用中間基板の製造法。2. A double-sided copper-clad laminate in which copper foil layers are formed on both sides of an insulating base material is prepared, and the one copper foil layer has holes necessary for penetrating a required portion of the insulating base material. Formed on a metal mask, an island-shaped corrosion-resistant metal layer is formed on the outer surface of the other copper foil layer corresponding to the position of the hole in the metal mask, and an excimer laser is irradiated from the metal mask side. Through the insulating base material portion located at the hole portion to expose the other copper foil layer, and then, after removing the metal mask, plating the through hole of the insulating base material. One end is electrically connected to the other copper foil layer and the other end forms a circuit component mounting terminal projecting outside the insulating base material, and is further subjected to etching from the side of the corrosion-resistant metal layer. Of the other copper foil layer A method of manufacturing an intermediate board for mounting circuit components, comprising a step of forming an island-shaped electrode by removing a main part.
が、高電流密度でメッキ処理を施すことによってその端
子の外縁をリング状に***させることを含む請求項２の
回路部品搭載用中間基板の製造法。3. The circuit component mounting intermediate substrate according to claim 2, wherein the step of forming the circuit component mounting terminal includes raising the outer edge of the terminal in a ring shape by plating at a high current density. Manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7740691A JP2930763B2 (en) | 1991-02-26 | 1991-02-26 | Intermediate board for mounting circuit components and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7740691A JP2930763B2 (en) | 1991-02-26 | 1991-02-26 | Intermediate board for mounting circuit components and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06140465A JPH06140465A (en) | 1994-05-20 |
| JP2930763B2 true JP2930763B2 (en) | 1999-08-03 |
Family
ID=13633032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7740691A Expired - Fee Related JP2930763B2 (en) | 1991-02-26 | 1991-02-26 | Intermediate board for mounting circuit components and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2930763B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6786381B2 (en) * | 2002-05-24 | 2004-09-07 | Illinois Tool Works Inc. | Anti-oxidant battery contacts for fastener-driving tool |
| JP4938346B2 (en) | 2006-04-26 | 2012-05-23 | ルネサスエレクトロニクス株式会社 | Semiconductor device and manufacturing method thereof |
-
1991
- 1991-02-26 JP JP7740691A patent/JP2930763B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06140465A (en) | 1994-05-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6251766B1 (en) | Method for improving attachment reliability of semiconductor chips and modules | |
| JP3210881B2 (en) | BGA package board | |
| JP2001223293A (en) | Semiconductor device and its manufacturing method | |
| JP4477213B2 (en) | Circuit board and circuit board manufacturing method | |
| JP2930763B2 (en) | Intermediate board for mounting circuit components and method of manufacturing the same | |
| JPH05175275A (en) | Method of mounting semiconductor chip and mounting structure | |
| JP3246959B2 (en) | Circuit board with bump and method of manufacturing the same | |
| JP3263875B2 (en) | Method for manufacturing surface-mounted electronic component and surface-mounted electronic component | |
| JP2869587B2 (en) | Intermediate board for mounting circuit components and method of manufacturing the same | |
| JP3800298B2 (en) | Bump forming method and semiconductor device manufacturing method | |
| JP2760360B2 (en) | Solder bump and its manufacturing method | |
| JP2980402B2 (en) | Manufacturing method of intermediate board for mounting circuit parts | |
| JP2005032931A (en) | Substrate, manufacturing method thereof, and electronic circuit device | |
| JP2000174410A (en) | Structure and method for mounting electronic component | |
| JP2869590B2 (en) | Intermediate board for mounting circuit components and method of manufacturing the same | |
| JPH07326853A (en) | Ball bump forming method for printed wiring board | |
| JP2004072043A (en) | Semiconductor wafer, semiconductor chip, and semiconductor device and its manufacturing method | |
| JP3207266B2 (en) | Manufacturing method of circuit wiring board with circuit component mounting terminals | |
| JPH07304Y2 (en) | Mask for solder paste printing | |
| JP3077182B2 (en) | Manufacturing method of printed wiring board | |
| JP2869586B2 (en) | Intermediate board for mounting circuit components and method of manufacturing the same | |
| JP2009087793A (en) | Convex spiral contactor and its manufacturing method | |
| JPH0510365Y2 (en) | ||
| JP3497774B2 (en) | Wiring board and its manufacturing method | |
| JP3224056B2 (en) | Flexible circuit board with bumps and method of manufacturing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 9 Free format text: PAYMENT UNTIL: 20080521 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090521 Year of fee payment: 10 |
|
| LAPS | Cancellation because of no payment of annual fees |