JP2899999B2 - Light emitting display plate and method of manufacturing the same - Google Patents

Light emitting display plate and method of manufacturing the same

Info

Publication number
JP2899999B2
JP2899999B2 JP3140881A JP14088191A JP2899999B2 JP 2899999 B2 JP2899999 B2 JP 2899999B2 JP 3140881 A JP3140881 A JP 3140881A JP 14088191 A JP14088191 A JP 14088191A JP 2899999 B2 JP2899999 B2 JP 2899999B2
Authority
JP
Japan
Prior art keywords
resin molded
display substrate
rubber elastic
molded body
convex lens
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP3140881A
Other languages
Japanese (ja)
Other versions
JPH04338795A (en
Inventor
正信 三浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Takiron Co Ltd
Original Assignee
Takiron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Takiron Co Ltd filed Critical Takiron Co Ltd
Priority to JP3140881A priority Critical patent/JP2899999B2/en
Publication of JPH04338795A publication Critical patent/JPH04338795A/en
Application granted granted Critical
Publication of JP2899999B2 publication Critical patent/JP2899999B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00—Illuminated signs; Luminous advertising
    • G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15192—Resurf arrangement of the internal vias

Landscapes

  • Led Device Packages (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【産業上の利用分野】本発明は、屋外等に配置する大型
表示装置における表示画素として好適に利用できるＬＥ
Ｄチップを用いた発光表示プレート及びその製造方法に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LE which can be suitably used as a display pixel in a large display device arranged outdoors or the like.
The present invention relates to a light emitting display plate using a D chip and a method for manufacturing the same.

【０００２】[0002]

【従来の技術】発光表示体のなかには、例えば、図８に
示すように、点発光するＬＥＤランプ１００を表示体基
板１０１の縦横に配列配線して表示プレートを構成し、
前面が開口したフード付きケース１０２に収容して、屋
外等の表示用ランプ等として使用するものがある。上記
ＬＥＤランプ１００としては、図９に示すように、発光
素子（ＬＥＤチップ）１０３を透明樹脂１０４で封止し
たもので、先端を球面状に形成することによって円形凸
レンズの役目を果たすようにしてあり、ＬＥＤチップ１
０３の光を収束して指向性を得るようになっている。2. Description of the Related Art In a light emitting display, for example, as shown in FIG. 8, LED lamps 100 that emit point light are arranged and wired vertically and horizontally on a display substrate 101 to constitute a display plate.
Some are housed in a hooded case 102 with an open front and are used as display lamps or the like for outdoor use. As shown in FIG. 9, the LED lamp 100 is formed by sealing a light emitting element (LED chip) 103 with a transparent resin 104 and forming a tip of the LED lamp 100 into a spherical shape so as to serve as a circular convex lens. Yes, LED chip 1
03 is converged to obtain directivity.

【０００３】[0003]

【発明が解決しようとする課題】しかしながら、上記発
光表示体における表示プレートは、ＬＥＤチップ１０３
を封止樹脂１０４でそれぞれ封止して各ＬＥＤランプ１
００を個々に製造してからそれぞれのＬＥＤランプ１０
０を表示体基板１０１に挿着して組立てるので、実質的
に部品点数が多くなってコスト的に高くなり、組立て自
体も面倒であるといった問題があった。However, the display plate in the above-mentioned light-emitting display is composed of the LED chip 103.
Are respectively sealed with a sealing resin 104 so that each LED lamp 1
00 individually manufactured and then each LED lamp 10
Since 0 is inserted into the display substrate 101 and assembled, there is a problem that the number of components is substantially increased, the cost is increased, and the assembly itself is troublesome.

【０００４】[0004]

【課題を解決するための手段】上記課題を解決するため
に本発明の第１の発光表示プレートは、多数のＬＥＤチ
ップを直接配設した表示体基板の表面をゴム弾性体層で
覆うと共に、該ゴム弾性体層を介して前記表示体基板の
各ＬＥＤチップと対応して凸レンズ体をそれぞれ多数突
設させた樹脂成形体を接合一体としたことを特徴とす
る。In order to solve the above problems, a first light emitting display plate of the present invention covers a surface of a display substrate on which a large number of LED chips are directly disposed, with a rubber elastic layer. The present invention is characterized in that a resin molded body in which a large number of convex lens bodies are provided so as to correspond to the respective LED chips of the display substrate via the rubber elastic body layer is integrally joined.

【０００５】第２の発光表示プレートは、多数のＬＥＤ
チップを縦横に配設した表示体基板の表面をゴム弾性体
層で覆うと共に、該ゴム弾性体層を介して前記表示体基
板の横列に配設される各ＬＥＤチップと対応して棒状凸
レンズ体をそれぞれ多数列突設させた樹脂成形体を接合
一体としたことを特徴とする。[0005] The second light emitting display plate includes a large number of LEDs.
The surface of the display substrate on which the chips are arranged vertically and horizontally is covered with a rubber elastic layer, and a bar-shaped convex lens body corresponding to each LED chip arranged in a row of the display substrate via the rubber elastic layer. Are formed by integrally joining resin molded bodies in which a large number of rows are protruded.

【０００６】また、本発明の第１の発光表示プレートの
製造方法は、表示体基板の表面に配設される多数のＬＥ
Ｄチップと対応するように凸レンズ体を多数突設させた
樹脂成形体の前記凸レンズ体の突設面側を下向きに配置
し、この樹脂成形体に未硬化のゴム弾性体樹脂液を供給
した上で、前記表示体基板の各ＬＥＤチップの配設面側
を下向きにしてそれぞれのＬＥＤチップと上記樹脂成形
体の各凸レンズ体とを対応させた状態で表示体基板と樹
脂成形体とを重ね合わせ、上記ゴム弾性体樹脂液を硬化
させてゴム弾性体層を形成し、該ゴム弾性体層を介して
表示体基板と樹脂成形体とを接合一体とすることを特徴
とする。Further, the first method for manufacturing a light emitting display plate of the present invention provides a method for manufacturing a large number of LEs provided on the surface of a display substrate.
The projecting surface side of the convex lens body of the resin molded body in which a large number of convex lens bodies are projected so as to correspond to the D chip is arranged downward, and an uncured rubber elastic resin liquid is supplied to the resin molded body. Then, the display substrate and the resin molded body are overlapped with each LED chip and each convex lens body of the resin molded body corresponding to each other with the LED chip mounting surface side of the display substrate facing downward. The rubber elastic body resin liquid is cured to form a rubber elastic body layer, and the display substrate and the resin molded body are integrally joined via the rubber elastic body layer.

【０００７】そして、第２の発光表示プレートの製造方
法は、表示体基板の表面縦横に配設される横列の各ＬＥ
Ｄチップと対応するように棒状凸レンズ体をそれぞれ突
設させた樹脂成形体の前記棒状凸レンズ体の突設面側を
下向きに配置し、この樹脂成形体に未硬化のゴム弾性体
樹脂液を供給した上で、前記表示体基板の各ＬＥＤチッ
プの配設面側を下向きにして横列の各ＬＥＤチップと上
記樹脂成形体の各棒状凸レンズ体とを対応させた状態で
表示体基板と樹脂成形体とを重ね合わせ、上記ゴム弾性
体樹脂液を硬化させてゴム弾性体層を形成し、該ゴム弾
性体層を介して表示体基板と樹脂成形体とを接合一体と
することを特徴とする。The second method of manufacturing a light-emitting display plate is characterized in that each of the LEs in a row arranged on the display substrate is arranged vertically and horizontally.
The protruding surface side of the rod-shaped convex lens body of the resin molded body in which the bar-shaped convex lens body is protruded so as to correspond to the D chip is arranged downward, and an uncured rubber elastic resin liquid is supplied to the resin molded body. Then, the display substrate and the resin molded body are arranged in such a manner that the LED chips on the display substrate are arranged face down on the display substrate side so that the LED chips in the horizontal row correspond to the rod-shaped convex lens bodies of the resin molded body. Are superposed, the rubber elastic resin liquid is cured to form a rubber elastic layer, and the display substrate and the resin molded body are integrally joined via the rubber elastic layer.

【０００８】[0008]

【作用】上記構成の第１及び第２の発光表示プレート
は、何れも、表示体基板に多数のＬＥＤチップを配設し
てゴム弾性体層にて密封状態としているので、各ＬＥＤ
チップの点灯時などの発熱による温度変化によって生じ
る熱応力をこのゴム弾性体層が吸収緩和し、発光表示プ
レート自体の歪み、反り等を防止し、信頼性が向上す
る。さらに、表示体基板と樹脂成形体とをゴム弾性体層
を介して接合一体としているので、発光表示プレート全
体としての熱伝導性が良く放熱性も向上し、より信頼性
の高い発光表示プレートとなる。In each of the first and second light emitting display plates having the above structure, a large number of LED chips are arranged on the display substrate and are sealed by the rubber elastic material layer.
The rubber elastic layer absorbs and relaxes the thermal stress caused by the temperature change due to the heat generated at the time of lighting of the chip, so that the light emitting display plate itself is prevented from being distorted or warped, and the reliability is improved. Furthermore, since the display substrate and the resin molded body are joined and integrated via the rubber elastic layer, the heat conductivity of the entire light emitting display plate is improved, and the heat dissipation is improved. Become.

【０００９】また、第１の発光表示プレートの樹脂成形
体には、表示体基板に配設した各ＬＥＤチップと対応し
て凸レンズ体がそれぞれ一体で突設されているので、各
ＬＥＤチップから発せられた光は、それぞれ対応する凸
レンズ体によって集束されて挟視野角でほぼ直線状に発
せられ、指向性が良くなる。In addition, since the convex lens body is integrally provided on the resin molded body of the first light emitting display plate in correspondence with each LED chip disposed on the display substrate, the light is emitted from each LED chip. The emitted light is converged by the corresponding convex lens bodies and emitted almost linearly at a narrow viewing angle, and the directivity is improved.

【００１０】そして、第２の発光表示プレートの樹脂成
形体には、表示体基板の縦横に配設された横列の各ＬＥ
Ｄチップと対応して多数列の棒状凸レンズ体がそれぞれ
一体で突設されているので、横列の各ＬＥＤチップから
発せられる光は対応する棒状凸レンズ体により上下方向
にのみ絞られて左右方向には絞られ難くなり、実用上有
用な左右の視野角が充分に確保され、不要な上下方向の
光が絞られる分だけ明るい発光が得られ、指向性も向上
する。[0010] The resin molded body of the second light emitting display plate is provided with each of the LEs in the rows arranged vertically and horizontally on the display substrate.
Since a large number of rows of bar-shaped convex lens bodies are integrally provided so as to correspond to the D chip, light emitted from each row of LED chips is narrowed down only in the vertical direction by the corresponding bar-shaped convex lens body, and in the horizontal direction. It is difficult to stop down, and a practically useful left and right viewing angle is sufficiently ensured, and bright light emission is obtained as much as unnecessary vertical light is stopped down, and the directivity is also improved.

【００１１】さらに、本発明の第１の発光表示プレート
の製造方法では、予め表示体基板に直接配設される多数
のＬＥＤチップと対応して凸レンズ体を一体で突設させ
た樹脂成形体の凸レンズ体の突設面側を下向きに配置し
て未硬化のゴム弾性体樹脂液を供給した上で、表示体基
板の各ＬＥＤチップ配設面側を下向きにして重ね合わ
せ、未硬化のゴム弾性体樹脂液を硬化させて、各ＬＥＤ
チップと凸レンズ体とを対応させた状態で表示体基板と
樹脂成形体をゴム弾性体層を介して簡単に接合一体に製
造できる。従って、ＬＥＤチップを配設した表示体基板
と凸レンズ体を突設させた樹脂成形体と未硬化のゴム弾
性体樹脂液を準備するだけで簡単に発光表示プレートが
製造できるので、部品点数も少なく、熱応力を吸収緩和
し信頼性の高く、且つ放熱性も良く、指向性の良好な発
光表示プレートを効率良く製造することができる。Further, according to the first method of manufacturing a light emitting display plate of the present invention, a resin molded body in which a convex lens body is integrally projected in advance corresponding to a large number of LED chips directly disposed on a display substrate in advance. The uncured rubber elastic body resin liquid is supplied with the protruding surface side of the convex lens body facing downward, and the LED substrate mounting surface side of the display substrate is overlaid with the uncured rubber elastic body. After curing the body resin liquid, each LED
The display substrate and the resin molded body can be easily joined and manufactured integrally through the rubber elastic layer in a state where the chip and the convex lens body correspond to each other. Therefore, a light emitting display plate can be easily manufactured only by preparing a display substrate on which an LED chip is provided, a resin molded body having a convex lens body protruded, and an uncured rubber elastic resin liquid. In addition, a light emitting display plate having high reliability, good heat radiation, and good directivity by absorbing and relaxing thermal stress can be efficiently manufactured.

【００１２】また、第２の発光表示プレートの製造方法
においても、第１の方法と同様に、縦横にＬＥＤチップ
を配設した表示体基板と、該表示体基板の横列の各ＬＥ
Ｄチップと対応して多数列の棒状凸レンズ体をそれぞれ
突設させた樹脂成形体とゴム弾性体樹脂液を準備するだ
けで簡単に発光表示プレートが製造できるので、部品点
数も少なく、熱応力を吸収緩和し信頼性が高く、且つ放
熱性も良く、実用上有用な左右の視野角が充分に確保さ
れて指向性の良好な発光表示プレートを製造することが
できる。Also, in the second method of manufacturing a light emitting display plate, similarly to the first method, a display substrate in which LED chips are arranged vertically and horizontally, and each LE in a row of the display substrate is provided.
A light emitting display plate can be easily manufactured simply by preparing a resin molded body having a plurality of rows of bar-shaped convex lens bodies projecting in correspondence with the D chip and a rubber elastic resin liquid, so that the number of parts is small and thermal stress is reduced. It is possible to manufacture a light emitting display plate having good directivity with sufficient practical and useful left and right viewing angles by absorbing and relaxing, having high reliability, good heat dissipation, and practically useful left and right viewing angles.

【００１３】[0013]

【実施例】以下、図面を参照して本発明の一実施例を説
明する。An embodiment of the present invention will be described below with reference to the drawings.

【００１４】図１は本発明の第一の実施例に係る発光表
示プレートの平面図であり、図２は図１のＡ−Ａ線に沿
って中央部分を省略した概略断面図である。FIG. 1 is a plan view of a light-emitting display plate according to a first embodiment of the present invention, and FIG. 2 is a schematic cross-sectional view along the line AA of FIG.

【００１５】この実施例の発光表示プレートは、円板状
の表示体基板１の縦横に多数のＬＥＤチップ２を配設
し、多数の凸レンズ体３が一体で突設された樹脂成形体
４でこの表示体基板１を覆い、前記凸レンズ体３と上記
各ＬＥＤチップ２とを対応させた状態で表示体基板１と
樹脂成形体４とをゴム弾性体層７を介して接合一体とし
たものである。The light emitting display plate of this embodiment is a resin molded body 4 in which a large number of LED chips 2 are arranged vertically and horizontally on a disk-shaped display substrate 1 and a large number of convex lens bodies 3 are integrally protruded. The display substrate 1 and the resin molded body 4 are joined together via a rubber elastic layer 7 in a state where the display substrate 1 is covered and the convex lens body 3 and the respective LED chips 2 correspond to each other. is there.

【００１６】上記表示体基板１は、ガラスエポキシや紙
フェノール等を基材とした銅張積層板の表面に例えば、
導電パターン５ａ（例えばカソード側）と導電パターン
５ｂ（例えばアノード側）をエッチング加工等の手段で
形成してある。そして、各導電パターン５ｂ上にＬＥＤ
チップ２を銀ペースト等の導電ペーストで固着し、ボン
ディングワイヤ６で基板表面の対応する導電パターン５
ａと接続し、例えば、同一発光色同士のＬＥＤチップを
それぞれ並列（又は直列）接続パターンとし、表示体基
板裏面側に外部接続用電極リードを設けて、発光色毎に
点灯・消灯できる点灯回路（不図示）を構成している。
そして、スルーホール８を適所に穿孔してある。該スル
ーホール８は後述する製造時に表示体基板１と樹脂成形
体４とをゴム弾性体層７を介して接合一体とするときの
空気抜きの役目をするものであり、この場合表示体基板
の表面と裏面との導電パターンの導通用スルーホールを
代用してもよい。The display substrate 1 is formed, for example, on the surface of a copper-clad laminate made of glass epoxy, paper phenol, or the like.
The conductive pattern 5a (for example, cathode side) and the conductive pattern 5b (for example, anode side) are formed by means such as etching. Then, an LED is provided on each conductive pattern 5b.
The chip 2 is fixed with a conductive paste such as a silver paste, and a corresponding conductive pattern 5 on the substrate surface is bonded with a bonding wire 6.
a lighting circuit that can be turned on / off for each emission color by connecting LED chips of the same emission color to each other in a parallel (or series) connection pattern, and providing external connection electrode leads on the back side of the display substrate. (Not shown).
Then, a through hole 8 is formed at an appropriate position. The through holes 8 serve to release air when the display substrate 1 and the resin molded body 4 are joined and integrated via the rubber elastic layer 7 at the time of manufacturing, which will be described later. A through hole for conduction between the conductive pattern and the back surface may be substituted.

【００１７】上記樹脂成形体４は、ＰＥＴ樹脂やポリカ
ーボネート樹脂等の透明で耐熱性を有する比較的硬質の
透光性樹脂により、円形のシート状本体４ａの一方に表
示体基板１に配設された各ＬＥＤチップ２に対応して略
半楕円形断面を有する上記凸レンズ体３を、他方に配設
基板１が収容される凹部４ｂと前記凸レンズ体３間に対
応して適宜該凹部４ｂ内に突設されるスペーサ４ｃと
を、また、シート状本体４ａの周囲に表示体基板１の周
囲を支持する段付枠４ｄをそれぞれ射出成形等により一
体成形したものとなっており、各ＬＥＤチップ２の中心
と対応する凸レンズ体３の中心とが略一致するようにな
っている。尚、この実施例では一つのＬＥＤチップ２に
対応して樹脂成形体４の各凸レンズ体３を位置させてい
るが、２乃至３個又はそれ以上のＬＥＤチップをそれぞ
れ近接させた状態で配置し、この複数個のＬＥＤチップ
に対応して樹脂成形体４にそれぞれ一つの凸レンズ体３
を成形一体としてもよい。The resin molded body 4 is disposed on one side of the circular sheet-shaped main body 4a on the display substrate 1 by using a transparent and heat-resistant relatively hard translucent resin such as PET resin or polycarbonate resin. The convex lens body 3 having a substantially semi-elliptical cross section corresponding to each of the LED chips 2 is placed in the concave part 4b corresponding to the space between the convex lens body 3 and the concave part 4b in which the mounting substrate 1 is housed. The protruding spacer 4c and the stepped frame 4d for supporting the periphery of the display substrate 1 around the sheet-shaped main body 4a are integrally formed by injection molding or the like. And the center of the corresponding convex lens body 3 substantially coincides. In this embodiment, each convex lens body 3 of the resin molded body 4 is located corresponding to one LED chip 2, but two or three or more LED chips are arranged in a state of being close to each other. One convex lens body 3 is formed on the resin molded body 4 corresponding to each of the plurality of LED chips.
May be integrally formed.

【００１８】この表示体基板１とこれう覆う樹脂成形体
４とを接合一体とするゴム弾性体層７は、例えば、透光
性を有する透明なシリコーンゴム等が好適に使用され
る。このゴム弾性体層７は、各ＬＥＤチップ２の密封と
それぞれのＬＥＤチップ２の点灯時の発熱による熱応力
を吸収するものであり、温度変化によって生じる発光表
示プレート自体の反りや歪み等が防止され、また、ワイ
ヤ６の断線等も防げる。この場合、少なくとも各ＬＥＤ
チップ２とワイヤボンディングしたそれぞれのワイヤ６
が密封され、且つ、前記熱応力を吸収緩和できるだけの
厚みがあればよく、具体的には、約１ｍｍ程度以上あれ
ばよい。As the rubber elastic layer 7 integrally joining the display substrate 1 and the resin molding 4 covering the same, for example, a transparent silicone rubber having a light transmitting property is preferably used. The rubber elastic body layer 7 absorbs thermal stress caused by heat generated when the LED chips 2 are turned on when the LED chips 2 are sealed, and prevents the light emitting display plate itself from being warped or distorted due to a temperature change. In addition, disconnection of the wire 6 can be prevented. In this case, at least each LED
Each wire 6 wire-bonded to chip 2
It is sufficient if the thickness is sufficient to seal and absorb and relieve the thermal stress, and more specifically, about 1 mm or more.

【００１９】図３は本発明の第２の実施例に係る発光表
示プレートの平面図であり、図４は図３のＢ−Ｂ線に沿
って中間部分を省略した概略断面図である。この発光表
示プレートは、円板状の表示体基板１に多数のＬＥＤチ
ップ２を縦横に配設し、横列に配設される各ＬＥＤチッ
プ２に対応して前面側に多数列の棒状凸レンズ体３をそ
れぞれ突設させた樹脂成形体４１を重ね合わせてゴム弾
性体層７を介して接合一体としたものである。FIG. 3 is a plan view of a light emitting display plate according to a second embodiment of the present invention, and FIG. 4 is a schematic sectional view along line BB of FIG. 3 omitting an intermediate portion. This light-emitting display plate has a large number of LED chips 2 arranged vertically and horizontally on a disk-shaped display substrate 1 and a large number of bar-shaped convex lens bodies on the front side corresponding to the LED chips 2 arranged in a horizontal row. The resin molded bodies 41 each having the protrusions 3 protruded from each other are overlapped with each other to be integrally joined via the rubber elastic layer 7.

【００２０】即ち、表示体基板１は表面の縦横にＬＥＤ
チップ２が配設され、上記第１の発光表示プレートと同
様に、導電パターン５ａと導電パターン５ｂをエッチン
グ加工等の手段でそれぞれ形成し、各導電パターン５
ａ，５ｂとＬＥＤチップ２とをそれぞれ接続して、前記
実施例と同様に、表示体基板１の裏面側に外部接続用電
極リードを設けて上記同様の点灯回路（不図示）を構成
している。That is, the display substrate 1 has LEDs
The chip 2 is provided, and similarly to the first light emitting display plate, the conductive patterns 5a and 5b are formed by means of etching or the like, respectively.
a, 5b and the LED chip 2 are connected to each other, and an external connection electrode lead is provided on the back side of the display substrate 1 to form a lighting circuit (not shown) similar to the above, as in the above-described embodiment. I have.

【００２１】樹脂成形体４１は、シート状本体４ａの一
方に上記表示体基板１の横列の各ＬＥＤチップ２に対応
して略半楕円形断面を有する棒状凸レンズ体３１を複数
列その長さを異ならせて一体に成形して突設されてい
る。その他の構成は前記樹脂成形体４と実質的に同一で
あるため、同一部材に同一符号を付してここでは説明を
省略する。この樹脂成形体４１では、棒状凸レンズ体３
１の長手方向の中心線ＣＬに沿ってその略真後ろの位置
に表示体基板１の横列の各ＬＥＤチップ２が配列配線さ
れている。尚、各ＬＥＤチップ２を一定間隔で配列した
実施例を示したが、上記同様に発光色の異なる２乃至３
個又はそれ以上のＬＥＤチップをそれぞれ近接させて配
置するなど、これらを必要な指向性等が得られるように
配設したものでもよい。また、各列の棒状凸レンズ体３
１が複数に区分されたものであってもよいことは云うま
でもない。The resin molded body 41 includes a plurality of bar-shaped convex lens bodies 31 each having a substantially semi-elliptical cross section corresponding to each of the LED chips 2 arranged in a row on the display body substrate 1 on one side of the sheet-shaped main body 4a. They are formed integrally and project differently. Since other configurations are substantially the same as the resin molded body 4, the same reference numerals are given to the same members, and the description is omitted here. In this resin molded body 41, the rod-shaped convex lens body 3
Each LED chip 2 in a row of the display substrate 1 is arranged and wired at a position almost immediately behind the center line CL in the longitudinal direction of the display device 1. Although the embodiment in which the LED chips 2 are arranged at a constant interval has been described, the light emitting colors 2 to 3 having different emission colors are also similar to the above.
For example, one or more LED chips may be arranged close to each other, and may be arranged so as to obtain necessary directivity or the like. In addition, each row of the bar-shaped convex lens bodies 3
It goes without saying that 1 may be divided into a plurality.

【００２２】上記構成の第１及び第２の発光表示プレー
トの製造は、何れも次のように行われる。まず、表示体
基板１に形成された一方の導電パターン５ａの所定位置
にＬＥＤチップ２を銀ペースト等の導電性接着剤にてダ
イボンディングすると共に、他方の導電パターン５ｂと
ＬＥＤチップ２の表面とをワイヤ６でワイヤボンディン
グする。と同時に、第１の発光表示プレートではシート
状本体４ａの一方に表示体基板１の各ＬＥＤチップ２と
対応する凸レンズ体３を、他方に表示体基板１を収容す
る凹部４ｂと該表示体基板１との間に適宜配置されるス
ペーサ４ｃを、シート状本体４ａの周囲には表示体基板
１の周縁を支持する段付枠４ｄと製造時のゴム弾性体樹
脂液７１の漏れを防止する囲い４ｅを予め一体成形した
樹脂成形体４を準備する。同じく、第２の発光表示プレ
ートではシート状本体４ａの一方に表示体基板１の横列
の各ＬＥＤチップ２と対応する複数の棒状凸レンズ体３
１を、他方にこの表示体基板１を収容する凹部４ｂと該
表示体基板１との間に適宜配置されるスペーサ４ｃを、
シート状本体４ａの周囲には表示体基板１の周縁を支持
する段付枠４ｄと製造時のゴム弾性体樹脂液７１の漏れ
を防止する囲い４ｅを予め一体成形した樹脂成形体４１
を準備する。尚、この段付枠４ｄとスペーサ４ｃは表示
体基板１との位置合わせとゴム弾性体層７の厚みを規制
する役目をするためのものである。The manufacture of the first and second light emitting display plates having the above-described structures is performed as follows. First, the LED chip 2 is die-bonded to a predetermined position of one conductive pattern 5a formed on the display substrate 1 with a conductive adhesive such as a silver paste, and the other conductive pattern 5b and the surface of the LED chip 2 are connected to each other. Is wire-bonded with a wire 6. At the same time, in the first light-emitting display plate, the convex lens body 3 corresponding to each LED chip 2 of the display substrate 1 is provided on one side of the sheet-shaped main body 4a, and the concave portion 4b for accommodating the display substrate 1 is provided on the other side. A spacer 4c appropriately disposed between the stepped frame 1 and a stepped frame 4d that supports the periphery of the display substrate 1 around the sheet-shaped main body 4a and an enclosure that prevents leakage of the rubber elastic resin liquid 71 during manufacture. A resin molded body 4 in which 4e is integrally molded in advance is prepared. Similarly, in the second light-emitting display plate, a plurality of rod-shaped convex lens bodies 3 corresponding to each LED chip 2 in a row of the display substrate 1 are provided on one of the sheet-shaped main bodies 4a.
1 and a spacer 4c appropriately disposed between the recess 4b for accommodating the display substrate 1 and the display substrate 1.
A resin molded body 41 integrally formed with a stepped frame 4d for supporting the peripheral edge of the display substrate 1 and an enclosure 4e for preventing leakage of the rubber elastic resin liquid 71 at the time of manufacture around the sheet-shaped main body 4a.
Prepare The stepped frame 4d and the spacer 4c serve for positioning the display substrate 1 and for controlling the thickness of the rubber elastic layer 7.

【００２３】そして、図５に示すように、それぞれの樹
脂成形体４又は樹脂成形体４１の各凸レンズ体３又は棒
状凸レンズ体３１の突設面側を下向きにして配置し、該
樹脂成形体４又は４１のそれぞれの凹部４ｂ内にシリコ
ーンゴム等の未硬化のゴム弾性体樹脂液７１を適量供給
する。As shown in FIG. 5, each of the resin moldings 4 or 41 is disposed with the projecting surface side of each convex lens body 3 or rod-shaped convex lens body 31 facing downward. Alternatively, an appropriate amount of uncured rubber elastic resin liquid 71 such as silicone rubber is supplied into each of the concave portions 4b of 41.

【００２４】それから、表示体基板１の各ＬＥＤチップ
２の配設面側を下向きにして樹脂成形体４内に収容し、
図６に示すように、段付枠４ｄにて表示体基板１の周縁
を支持すると共に、スペーサ４ｃにて表示体基板１との
間隔を規制した上で前記ゴム弾性体樹脂液７１に浸した
状態で表示体基板１と樹脂成形体４とを重ね合わせる。
このとき、表示体基板１に穿孔されたスルーホール８に
よってゴム弾性体樹脂液７１と表示体基板１との間に挟
まれた不要な空気が外部に逃げ、空気溜りを生じること
なく樹脂成形体４に収容できる。そして、樹脂成形体４
又は４１の各凸レンズ体３又は棒状レンズ体３１と表示
体基板１の各ＬＥＤチップ２とが対応して配置されるよ
うになる。Then, the display substrate 1 is housed in the resin molded body 4 with the surface on which the LED chips 2 are provided facing downward,
As shown in FIG. 6, the peripheral edge of the display substrate 1 is supported by the stepped frame 4d, and the distance from the display substrate 1 is regulated by the spacer 4c. In this state, the display substrate 1 and the resin molded body 4 are overlaid.
At this time, unnecessary air sandwiched between the rubber elastic resin liquid 71 and the display substrate 1 escapes to the outside by the through holes 8 perforated in the display substrate 1, and the resin molded body does not generate air pockets. 4 can be accommodated. And the resin molding 4
Alternatively, the respective convex lens bodies 3 or the rod-shaped lens bodies 31 of 41 and the respective LED chips 2 of the display substrate 1 are arranged correspondingly.

【００２５】しかる後、これを加熱炉等に載置してゴム
弾性体樹脂液７１を硬化させる。これにより形成された
ゴム弾性体層７によって各ＬＥＤチップ２が密封される
と共に、このゴム弾性体層７を介して表示体基板１と樹
脂成形体４又は４１とが接合一体となった発光表示プレ
ートが製造される。After that, this is placed in a heating furnace or the like to cure the rubber elastic resin liquid 71. Each LED chip 2 is hermetically sealed by the rubber elastic layer 7 thus formed, and the display substrate 1 and the resin molded body 4 or 41 are integrally joined through the rubber elastic layer 7 to form a light emitting display. A plate is manufactured.

【００２６】本発明の第１及び第２の発光表示プレート
では、何れも、表示体基板１に多数のＬＥＤチップ２を
直接配設し、ゴム弾性体層７を介して樹脂成形体４又は
４１で覆って接合一体としたため、従来のように、各Ｌ
ＥＤチップをそれぞれ樹脂封止して各ＬＥＤランプを製
造してから表示体基板に挿着配置するものと比べ、部品
点数の大幅な低減が図れ、簡単に製造でき、コスト的に
も極めて有利となる。そのため、広面積の発光表示プレ
ートにおいても、表示体基板１を広面積としてＬＥＤチ
ップ２を直接配設し、これに対応して凸レンズ体３又は
棒状凸レンズ体３１を突設させた樹脂成形体４又は４１
を一体成形してゴム弾性体層７を介して接合一体とする
だけで簡単に対応させることが可能となる。また、表示
体基板１と樹脂成形体４とをゴム弾性体層７を介して接
合一体とすると、表示体基板１の各ＬＥＤチップ２の点
灯時の発熱等による温度変化によって生じた熱応力を吸
収して発光表示プレート自体の反り、歪み等やワイヤ６
の断線等の発生を該ゴム弾性体層７が確実にこれを吸収
緩和して防止するようになる。その上、ゴム弾性体層７
により表示体基板１と樹脂成形体４とが密着状態で接合
一体となるので熱伝導性も良好となって放熱性も向上す
る。従って、ＬＥＤチップ２の点灯時の発熱による熱応
力の吸収と放熱性の向上が顕著となって、信頼性の高い
発光表示プレートが提供できる。In each of the first and second light emitting display plates of the present invention, a large number of LED chips 2 are directly disposed on the display substrate 1 and the resin molded body 4 or 41 is interposed via the rubber elastic layer 7. And then joined together, as in the past, each L
Compared to the LED lamps manufactured by sealing the ED chips with resin and manufacturing each LED lamp, the number of parts can be greatly reduced, the manufacturing is simple, and the cost is extremely advantageous. Become. Therefore, even in a light-emitting display plate having a large area, the LED chip 2 is directly provided with the display substrate 1 having a large area, and the resin molded body 4 having the convex lens body 3 or the rod-shaped convex lens body 31 protruding correspondingly. Or 41
Can be easily coped with simply by integrally molding and joining them together via the rubber elastic layer 7. Further, when the display substrate 1 and the resin molded body 4 are joined and integrated via the rubber elastic layer 7, thermal stress generated by a temperature change due to heat generation or the like at the time of lighting of each LED chip 2 of the display substrate 1 is reduced. It absorbs and warps and warps the light emitting display plate itself and the wire 6
The rubber elastic layer 7 reliably absorbs and relaxes the occurrence of disconnection and the like. In addition, the rubber elastic layer 7
As a result, the display substrate 1 and the resin molded body 4 are joined together in a close contact state, so that the thermal conductivity is improved and the heat dissipation is improved. Accordingly, the absorption of heat stress due to heat generated when the LED chip 2 is turned on and the improvement of heat dissipation are remarkable, and a highly reliable light emitting display plate can be provided.

【００２７】さらに、第１の発光表示プレートでは、各
ＬＥＤチップ２から発せられる光が対応する各凸レンズ
体３内を屈折収束して上下左右方向に絞られ、視野角が
狭められてほぼ中心Ｃに沿って放出されるようになり明
るさが大幅に増し、且つ全体で一定した指向性が得られ
るようになる。また、第２の発光表示プレートでは、横
列の各ＬＥＤチップ２から発せられる光が対応する各棒
状凸レンズ体３１内を屈折収束して上下方向の光が絞ら
れ、左右方向の光は絞られないため、実用上有用な左右
の視野角だけが充分に確保され、不要な上下の視野角が
狭められる分だけ実質的な明るさが増し、全体的に視認
性が向上する。しかも、横列の各ＬＥＤチップ２は何れ
も棒状凸レンズ体３１の長手方向中心線ＣＬの略真後ろ
に配置されるため、どのＬＥＤチップ２が点灯されても
指向性が上下に変化することなく一定し、見る方向によ
って明度が低下することがなくなる。Further, in the first light-emitting display plate, the light emitted from each LED chip 2 is refracted and converged in the corresponding convex lens body 3 and is narrowed down in the vertical and horizontal directions. And the brightness is greatly increased, and a uniform directivity can be obtained as a whole. In the second light emitting display plate, the light emitted from each LED chip 2 in the horizontal row is refracted and converged in the corresponding rod-shaped convex lens body 31, and the light in the vertical direction is reduced, and the light in the horizontal direction is not reduced. Therefore, only the practically useful left and right viewing angles are sufficiently secured, and the substantial brightness is increased by the amount of the unnecessary upper and lower viewing angles being narrowed, so that the visibility is improved as a whole. In addition, since each of the LED chips 2 in the horizontal row is disposed substantially directly behind the longitudinal center line CL of the bar-shaped convex lens body 31, the directivity is constant without changing vertically regardless of which LED chip 2 is turned on. In addition, the brightness does not decrease depending on the viewing direction.

【００２８】図７は更に他の実施例の変形例に係る発光
表示プレートの中央部分を省略した概略断面図である。
この発光表示プレートは、例えば、シート状本体４１
ａ，凹部４１ｂ，スペーサ４１ｃ，段付枠４１ｄ及び凸
レンズ体又は棒状凸レンズ体の外形となるレンズ面４１
ｅを薄肉フィルム状に一体成型した樹脂成形体４２とＬ
ＥＤチップ２を配設した表示体基板１とをゴム弾性体層
７を介して接合一体としたものであり、製造方法は第
１、第２の実施例と同様である。このような発光表示プ
レートでは、ブロー成形等により樹脂成形体４２の成形
が簡単に行えるので上記実施例の樹脂成形体４又は４１
と比べて材料コストが低下する利点があり、ゴム弾性体
層７の体積が大きくなるので各ＬＥＤチップ２の発熱に
よる熱応力の吸収がより良好となり、信頼性も向上す
る。尚、前記したそれぞれの実施例の樹脂成形体４，４
１，４２は何れも硬質の合成樹脂成形体とするのが好ま
しい。このことにより、発光表示プレートの組付け、取
扱い時の保護の役目も果たすものである。FIG. 7 is a schematic sectional view of a light emitting display plate according to a modified example of still another embodiment, in which a central portion is omitted.
This light-emitting display plate is, for example, a sheet-shaped main body 41.
a, concave portion 41b, spacer 41c, stepped frame 41d, and lens surface 41 which is the outer shape of the convex lens body or the rod-shaped convex lens body
e and a resin molded body 42 integrally molded into a thin film
The display substrate 1 on which the ED chip 2 is disposed is joined and integrated via a rubber elastic layer 7, and the manufacturing method is the same as in the first and second embodiments. In such a light emitting display plate, since the molding of the resin molded body 42 can be easily performed by blow molding or the like, the resin molded body 4 or 41 of the above embodiment is used.
There is an advantage that the material cost is reduced as compared with that of the first embodiment, and since the volume of the rubber elastic layer 7 is large, the absorption of the thermal stress due to the heat generated by each LED chip 2 becomes better, and the reliability is improved. It should be noted that the resin molded articles 4 and 4 of the respective embodiments described above were used.
It is preferable that both 1 and 42 be hard synthetic resin molded articles. In this way, the light emitting display plate also plays a role of protection during assembly and handling.

【００２９】ここで、上記した発光表示プレートは、何
れも前方が開口した円筒状のフードカバー付きのケース
枠体（不図示）等に収容配置して、例えば、一つの発光
表示体として利用するものであり、多数個の発光表示体
を屋外のビル壁面等に縦横に配列して大型の発光表示装
置を構成し、各発光表示体を表示画素として所望の文
字、記号、図形等を点灯表示する。この場合、それぞれ
の発光表示体を構成する本発明の各発光表示プレート
は、明るくて充分な指向性を有し、実用視野位置での視
認性が向上した屋外用途の実用に充分耐え得ることがで
き、各ＬＥＤチップ２の発熱に対する信頼性も高くな
る。Here, each of the above-mentioned light emitting display plates is housed and arranged in a case frame (not shown) having a cylindrical hood cover having an open front, and is used as, for example, one light emitting display. A large-sized light-emitting display device is formed by arranging a large number of light-emitting display elements vertically and horizontally on a building wall or the like outdoors, and each light-emitting display element is used as a display pixel to display desired characters, symbols, figures, and the like. I do. In this case, each light-emitting display plate of the present invention constituting each light-emitting display body is bright and has sufficient directivity, and can sufficiently withstand practical use for outdoor use with improved visibility at a practical visual field position. As a result, the reliability of each LED chip 2 against heat generation is improved.

【００３０】尚、上記実施例では、何れも円形状の表示
体基板１を用いた発光表示プレートを示したが、矩形状
や長方形等の他の形状の表示体基板としてもよい。ま
た、本発明の発光表示プレートの外径サイズは、直径が
１５ｍｍ以上（矩形状であっては一片が１５ｍｍ以上）
実用上は５０ｍｍ以上（矩形状であっては一片が４０ｍ
ｍ以上）の大型のものに好適である。In each of the above embodiments, the light emitting display plate using the circular display substrate 1 has been described. However, the display substrate may have another shape such as a rectangular shape or a rectangular shape. The outer diameter of the light emitting display plate of the present invention is 15 mm or more in diameter (one piece is 15 mm or more in the case of a rectangular shape).
50 mm or more in practical use (a rectangular piece is 40 m
m or more).

【００３１】[0031]

【発明の効果】以上の説明から明らかなように、本発明
の発光表示プレートは、何れも樹脂成形体とＬＥＤチッ
プを配設した表示体基板とをゴム弾性体層を介して簡単
に接合一体に製造されるため、部品点数も少なく、製造
コストの大幅な低減が図れる。また、各ＬＥＤチップの
点灯時の発熱等による温度変化によって生じる熱応力を
吸収緩和し、これにより発光表示プレートの反りや歪み
やワイヤの断線等をこのゴム弾性体層によって充分に吸
収防止でき、さらに、ゴム弾性体層を介して表示体基板
と樹脂成形体とが接合一体となるので熱伝導性も良好と
なって放熱性が向上し、信頼性の高い発光表示プレート
となる。そして、各ＬＥＤチップに対応して突設された
樹脂成形体の凸レンズ体又は棒状凸レンズ体により実用
上有用な視野角を充分に確保することができ、明るく指
向性の良い発光表示プレートが提供できるといった効果
を奏する。As is apparent from the above description, in the light emitting display plate of the present invention, the resin molded body and the display substrate on which the LED chips are disposed are simply joined together via the rubber elastic layer. , The number of parts is small, and the manufacturing cost can be significantly reduced. In addition, the thermal stress caused by the temperature change due to the heat generated at the time of lighting of each LED chip is absorbed and relaxed, so that the rubber elastic layer can sufficiently prevent the warpage and distortion of the light emitting display plate and the disconnection of the wire by this rubber elastic layer. Further, since the display substrate and the resin molded body are joined and integrated via the rubber elastic layer, the heat conductivity is also improved, the heat dissipation is improved, and a highly reliable light emitting display plate is obtained. Further, a practically useful viewing angle can be sufficiently secured by a convex lens body or a rod-shaped convex lens body of a resin molded body protrudingly provided corresponding to each LED chip, and a bright and highly directional light emitting display plate can be provided. This has the effect.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の第１の実施例に係る発光表示プレート
の平面図。FIG. 1 is a plan view of a light emitting display plate according to a first embodiment of the present invention.

【図２】図１のＡ−Ａ線に沿った中央部分を省略した概
略断面図。FIG. 2 is a schematic cross-sectional view in which a central portion along the line AA in FIG. 1 is omitted.

【図３】本説明の第２の実施例に係る発光表示プレート
の平面図。FIG. 3 is a plan view of a light emitting display plate according to a second embodiment of the present description.

【図４】図３のＢ−Ｂ線に沿った中央部分を省略した概
略断面図。FIG. 4 is a schematic cross-sectional view in which a central portion along the line BB in FIG. 3 is omitted.

【図５】本発明の発光表示プレートの製造方法における
最初の段階を示す中央部分の省略概略断面図。FIG. 5 is an abbreviated schematic sectional view of a central portion showing a first step in the method for manufacturing a light emitting display plate of the present invention.

【図６】本発明の発光表示プレートの製造方法における
終了段階を示す中央部分の省略概略断面図。FIG. 6 is an abbreviated schematic cross-sectional view of a central portion showing an end stage in the method of manufacturing a light emitting display plate of the present invention.

【図７】本説明の他の実施例の変形例に係る発光表示プ
レートの中央部分を省略した概略断面図。FIG. 7 is a schematic cross-sectional view of a light-emitting display plate according to a modified example of another embodiment of the present description, in which a central portion is omitted.

【図８】従来の発光表示プレートを使用したランプ例の
縦断面図。FIG. 8 is a longitudinal sectional view of an example of a lamp using a conventional light emitting display plate.

【図９】従来のＬＥＤランプの断面図。FIG. 9 is a sectional view of a conventional LED lamp.

【符号の説明】[Explanation of symbols]

１ 表示体基板 ２ ＬＥＤチップ ３ 凸レンズ体 ３１ 棒状凸レンズ体 ４，４１，４２ 樹脂成形体 ７ ゴム弾性体層 ７１ 未硬化のゴム弾性体樹脂液 DESCRIPTION OF SYMBOLS 1 Display body board 2 LED chip 3 Convex lens body 31 Bar-shaped convex lens body 4, 41, 42 Resin molding 7 Rubber elastic body layer 71 Uncured rubber elastic resin liquid

Claims (4)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】多数のＬＥＤチップを配設した表示体基板
の表面をゴム弾性体層で覆うと共に、該ゴム弾性体層を
介して前記表示体基板のＬＥＤチップと対応して凸レン
ズ体をそれぞれ多数突設させた樹脂成形体を接合一体と
したことを特徴とする発光表示プレート。1. A surface of a display substrate on which a large number of LED chips are provided is covered with a rubber elastic layer, and a convex lens body is formed via the rubber elastic layer in correspondence with the LED chip of the display substrate. A light-emitting display plate comprising a large number of projecting resin molded bodies joined together. 【請求項２】多数のＬＥＤチップを縦横に配設した表示
体基板の表面をゴム弾性体層で覆うと共に、該ゴム弾性
体層を介して前記表示体基板の横列に配設されるＬＥＤ
チップと対応して棒状凸レンズ体をそれぞれ多数列突設
させた樹脂成形体を接合一体としたことを特徴とする発
光表示プレート。2. A display device substrate comprising a plurality of LED chips arranged vertically and horizontally, the surface of which is covered by a rubber elastic layer, and the LEDs arranged in a row of the display substrate via the rubber elastic layer.
A light-emitting display plate, wherein a resin molded body in which a plurality of bar-shaped convex lens bodies are respectively provided in a protruding manner corresponding to a chip is integrally joined. 【請求項３】表示体基板の表面に配設される多数のＬＥ
Ｄチップと対応するように凸レンズ体を多数突設させた
樹脂成形体の前記凸レンズ体の突設面側を下向きに配置
し、この樹脂成形体に未硬化のゴム弾性体樹脂液を供給
した上で、前記表示体基板の各ＬＥＤチップの配設面側
を下向きにしてそれぞれのＬＥＤチップと上記樹脂成形
体の各凸レンズ体とを対応させた状態で表示体基板と樹
脂成形体とを重ね合わせ、上記ゴム弾性体樹脂液を硬化
させてゴム弾性体層を形成し、該ゴム弾性体層を介して
表示体基板と樹脂成形体とを接合一体とすることを特徴
とする発光表示プレートの製造方法。3. A plurality of LEs provided on a surface of a display substrate.
The projecting surface side of the convex lens body of the resin molded body in which a large number of convex lens bodies are projected so as to correspond to the D chip is arranged downward, and an uncured rubber elastic resin liquid is supplied to the resin molded body. Then, the display substrate and the resin molded body are overlapped with each LED chip and each convex lens body of the resin molded body corresponding to each other with the LED chip mounting surface side of the display substrate facing downward. Producing a light-emitting display plate, wherein the rubber elastic resin liquid is cured to form a rubber elastic layer, and the display substrate and the resin molded body are integrally joined through the rubber elastic layer. Method. 【請求項４】表示体基板の表面縦横に配設される横列の
各ＬＥＤチップと対応するように棒状凸レンズ体をそれ
ぞれ突設させた樹脂成形体の前記棒状凸レンズ体の突設
面側を下向きに配置し、この樹脂成形体に未硬化のゴム
弾性体樹脂液を供給した上で、前記表示体基板の各ＬＥ
Ｄチップの配設面側を下向きにして横列の各ＬＥＤチッ
プと上記樹脂成形体の各棒状凸レンズ体とを対応させた
状態で表示体基板と樹脂成形体とを重ね合わせ、上記ゴ
ム弾性体樹脂液を硬化させてゴム弾性体層を形成し、該
ゴム弾性体層を介して表示体基板と樹脂成形体とを接合
一体とすることを特徴とする発光表示プレートの製造方
法。4. A protruding surface side of the bar-shaped convex lens body of a resin molded body in which bar-shaped convex lens bodies are respectively protruded so as to correspond to the respective rows of LED chips arranged on the surface of the display substrate vertically and horizontally. The uncured rubber elastic resin liquid is supplied to the resin molded body, and then each LE of the display substrate is set.
The display substrate and the resin molded body are superimposed on each other in a state where the LED chips arranged in a row are directed downward and the respective bar-shaped convex lens bodies of the resin molded body correspond to each other. A method for manufacturing a light-emitting display plate, comprising: forming a rubber elastic layer by curing a liquid; and joining the display substrate and the resin molded body together through the rubber elastic layer.
JP3140881A 1991-05-15 1991-05-15 Light emitting display plate and method of manufacturing the same Expired - Lifetime JP2899999B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3140881A JP2899999B2 (en) 1991-05-15 1991-05-15 Light emitting display plate and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3140881A JP2899999B2 (en) 1991-05-15 1991-05-15 Light emitting display plate and method of manufacturing the same

Publications (2)

Publication Number Publication Date
JPH04338795A JPH04338795A (en) 1992-11-26
JP2899999B2 true JP2899999B2 (en) 1999-06-02

Family

ID=15278941

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3140881A Expired - Lifetime JP2899999B2 (en) 1991-05-15 1991-05-15 Light emitting display plate and method of manufacturing the same

Country Status (1)

Country Link
JP (1) JP2899999B2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0632511A3 (en) * 1993-06-29 1996-11-27 Mitsubishi Cable Ind Ltd A light emitting diode aggregate module and a method for manufacturing a light emitting diode aggregate module.
WO2002077689A1 (en) * 2001-03-23 2002-10-03 Mueller Thomas Light emitting diode, method for production and use thereof
JP2004342781A (en) * 2003-05-14 2004-12-02 Nichia Chem Ind Ltd Light emitting device and display unit
JP2006171256A (en) * 2004-12-15 2006-06-29 Sekisui Jushi Co Ltd Light guide plate type display device, sign, and road sign
JP2008034473A (en) * 2006-07-26 2008-02-14 Toyoda Gosei Co Ltd Surface light source
JP5103831B2 (en) * 2006-08-29 2012-12-19 日亜化学工業株式会社 Semiconductor manufacturing method
JP2008172140A (en) * 2007-01-15 2008-07-24 Stanley Electric Co Ltd Light-emitting device having buffering material between housing and upside rigid protecting material
CN103855259B (en) * 2014-01-26 2017-09-08 上海瑞丰光电子有限公司 LED encapsulation method

Also Published As

Publication number Publication date
JPH04338795A (en) 1992-11-26

Similar Documents

Publication Publication Date Title
US10679973B2 (en) Multiple pixel surface mount device package
US10833054B2 (en) Smart pixel surface mount device package
KR101398358B1 (en) A surface emitting unit and method for manufacturing the same
JP3639428B2 (en) Light source device
US7915061B2 (en) Environmentally robust lighting devices and methods of manufacturing same
JP6703312B2 (en) Light emitting module and surface emitting light source
JPH08185130A (en) Dot matrix light emitting display with light shielding louver
JPH0416468Y2 (en)
JP5815859B2 (en) Light source device and lighting device
JP2011254008A (en) Display device and method of manufacturing the same
JP2899999B2 (en) Light emitting display plate and method of manufacturing the same
JP2011124327A (en) Light emitting module, light emitting unit and lighting device
JPH11163410A (en) Led lighting device
JP4200146B2 (en) Method of packaging a matrix type light emitting diode module
JP2001196640A (en) Side light emitting led device and its manufacturing method
JPH0519705A (en) Light emission display body and manufacture thereof
JPH08234684A (en) Dot matrix light emitting display with light shielding louver
KR100575431B1 (en) Light-emitting diode display device and method thereof
US10074779B2 (en) LED module, method for manufacturing the same, and LED channel letter including the same
JP4678389B2 (en) Light emitting device
JP2002118290A (en) Light source device and manufacturing method thereof
JPH0511714A (en) Dot matrix light emitting display body and manufacture thereof
KR101781425B1 (en) Led module and its manufacturing method
CN112786576A (en) LED with built-in digital chip and packaging process thereof
JPH0328467Y2 (en)

Legal Events

Date Code Title Description
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 19990202