JP2892380B2 - Cleaning device and cleaning method - Google Patents
Cleaning device and cleaning methodInfo
- Publication number
- JP2892380B2 JP2892380B2 JP1190311A JP19031189A JP2892380B2 JP 2892380 B2 JP2892380 B2 JP 2892380B2 JP 1190311 A JP1190311 A JP 1190311A JP 19031189 A JP19031189 A JP 19031189A JP 2892380 B2 JP2892380 B2 JP 2892380B2
- Authority
- JP
- Japan
- Prior art keywords
- cleaning
- substrate
- cassette
- substrates
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004140 cleaning Methods 0.000 title claims description 111
- 238000000034 method Methods 0.000 title claims description 17
- 239000000758 substrate Substances 0.000 claims description 125
- 230000007246 mechanism Effects 0.000 claims description 20
- 238000005406 washing Methods 0.000 claims description 18
- 238000007599 discharging Methods 0.000 claims 1
- 238000012545 processing Methods 0.000 description 37
- 239000000126 substance Substances 0.000 description 19
- 238000001035 drying Methods 0.000 description 12
- 239000007788 liquid Substances 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 239000000243 solution Substances 0.000 description 5
- 210000000078 claw Anatomy 0.000 description 4
- 230000010354 integration Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
Description
【発明の詳細な説明】 〔発明の目的〕 （産業上の利用分野） 本発明は、基板の洗浄装置と洗浄方法に関する。The present invention relates to a substrate cleaning apparatus and a substrate cleaning method.
（従来の技術） 例えば半導体デバイスの製造プロセスにおいては、多
くの段階でウエハの洗浄が繰返し行われている。ウエハ
表面の汚染は半導体デバイスの性能に致命的な影響を及
ぼす為、ウエハの洗浄は半導体デバイスの製造プロセス
における重要な工程となる。(Prior Art) For example, in a semiconductor device manufacturing process, a wafer is repeatedly cleaned at many stages. Wafer cleaning is an important step in the semiconductor device manufacturing process because contamination of the wafer surface has a fatal effect on the performance of the semiconductor device.
従来より、半導体ウエハ等の被処理基板の洗浄を行う
装置としては、複数の基板を一度に洗浄するいわゆるバ
ッチ式洗浄装置が用いられていた。その一例は特開昭52
−95166に開示される。2. Description of the Related Art Conventionally, as an apparatus for cleaning a substrate to be processed such as a semiconductor wafer, a so-called batch type cleaning apparatus for cleaning a plurality of substrates at once has been used. An example is JP 52
-95166.
（発明が解決しようとする課題） しかしながら、近年の半導体デバイスのAM、16M等の
高集積化及び回路パターンの超微細化等にて高い歩留り
を得ることに対応する為、工程段階によっては洗浄処理
に対する要求も厳しくなって来ている。この厳しい要求
に対しては、上述のようなバッチ式基板洗浄装置では、
洗浄状態の均一性がとれない等の理由から十分に対応で
きない。(Problems to be Solved by the Invention) However, in order to cope with obtaining a high yield by recent high integration of semiconductor devices such as AM and 16M and ultra-miniaturization of a circuit pattern, a cleaning process is performed depending on a process step. Demands are becoming more stringent. To meet this strict requirement, the batch type substrate cleaning apparatus as described above,
It is not possible to sufficiently cope with the reason that the uniformity of the cleaning state cannot be obtained.
そこで被処理基板を１枚ずつ洗浄する枚葉式洗浄装置
が開発されて来ている。現在使用されている枚葉式洗浄
装置は、基板を搬送する為のキャリアの搬送方向に沿っ
て、複数の薄型処理室が１つずつ水平に順次並べられた
ものである。基板はキャリアの吸着アームにより保持さ
れ、処理室から処理室へと移動させる。基板は各処理室
内に水平状態に挿入され、水平状態で洗浄処理を受け
る。Accordingly, a single-wafer cleaning apparatus for cleaning substrates to be processed one by one has been developed. A single-wafer cleaning apparatus currently used has a plurality of thin processing chambers arranged one by one horizontally in the transport direction of a carrier for transporting a substrate. The substrate is held by a suction arm of the carrier and moved from the processing chamber to the processing chamber. The substrate is inserted into each processing chamber in a horizontal state, and undergoes a cleaning process in a horizontal state.
上記洗浄装置にあっては、装置の全長が少なくとも１
処理室の長さ×室数以上となる為、装置が大型化すると
いう問題がある。例えば８インチの基板を洗浄処理する
為の装置であれば、１処理室の長さは十数インチ程度と
なる。従って仮にこの大きさの処理室が３室あるとし、
且つまた基板のカセットのローダ及びアンローダの存在
を考慮すると、洗浄装置の全長は少なくとも５フィート
程度となってしまう。一般に当該洗浄装置が配置される
のは建設及び維持コストの高いクリーンルーム内である
為、本装置には占有スペースを小さくすることが当然要
求される。In the above cleaning device, the total length of the device is at least 1
Since the length is equal to or more than the length of the processing chamber × the number of chambers, there is a problem that the apparatus becomes large. For example, in the case of an apparatus for cleaning an 8-inch substrate, the length of one processing chamber is about ten and several inches. Therefore, if there are three processing chambers of this size,
Also, considering the presence of the loader and unloader of the substrate cassette, the overall length of the cleaning apparatus is at least about 5 feet. In general, the cleaning device is disposed in a clean room where construction and maintenance costs are high, so that the device is naturally required to reduce the occupied space.
またこの種の洗浄装置にあっては、多くの場合洗浄時
に超音波振動を加えながら処理を行う。しかし上記洗浄
装置にあっては、振動源が必然的に被処理基板の裏面側
一方にのみしか配置できず、基板上面に物理的に付着し
た汚染源に対する振動の効果は低くなる。Further, in this type of cleaning apparatus, in many cases, processing is performed while applying ultrasonic vibration during cleaning. However, in the above-described cleaning apparatus, the vibration source is inevitably disposed only on one side of the back surface of the substrate to be processed, and the effect of vibration on the contamination source physically attached to the upper surface of the substrate is reduced.
また上記洗浄装置にあっては、基板を洗浄液に浸漬す
る際に基板の断面方向に浮力が影響する為、薄い基板に
無理な負荷が掛からないように浸漬作業に注意を払わな
ければならない。Further, in the above-described cleaning apparatus, when the substrate is immersed in the cleaning liquid, the buoyancy affects the cross-sectional direction of the substrate. Therefore, it is necessary to pay attention to the immersion operation so that an unreasonable load is not applied to the thin substrate.
本発明は、かかる従来の事情に対処してなされたもの
で、高集積化に応じたクリーンな洗浄を行うことができ
るとともに、占有スペースが少なく、生産性の向上と生
産コストの低減を図ることのできる洗浄装置と洗浄方法
を提供しようとするものである。The present invention has been made in view of such a conventional situation, and can perform clean cleaning according to high integration, occupy less space, improve productivity and reduce production cost. It is an object of the present invention to provide a cleaning apparatus and a cleaning method which can be performed.
（課題を解決するための手段） 請求項１の発明は，カセットから基板を取り出す搬入
部および／またはカセットに基板を装填する搬出部と，
基板を洗浄する洗浄部とを直列に配置し，これら搬入部
および／または搬出部と洗浄部に沿って移動可能な複数
の移動機構と，これら複数の移動機構のそれぞれに基板
を一枚ずつ保持するアーム機構を設けた洗浄装置であっ
て，前記洗浄部が，基板を搬送方向に対して垂直の姿勢
にして洗浄することを特徴とする。(Means for Solving the Problems) The invention according to claim 1 includes a carry-in portion for taking out a substrate from a cassette and / or a carry-out portion for loading a substrate into the cassette.
A cleaning unit for cleaning a substrate is arranged in series, and a plurality of moving mechanisms movable along the loading / unloading unit and the cleaning unit, and one substrate is held in each of the plurality of moving mechanisms. A cleaning device provided with an arm mechanism for cleaning the substrate in a posture perpendicular to the transfer direction.
この請求項１の洗浄装置において，請求項２に記載し
たように，前記複数の移動機構は，前記搬入部および／
または搬出部と洗浄部に沿って配置されたレール上をそ
れぞれ移動可能であることが好ましい。また請求項３に
記載したように，前記カセットは基板を水平状態で収納
するものであり，前記アーム機構が基板を水平状態と垂
直状態に転換可能であることが好ましい。また請求項４
に記載したように，前記搬入部がローダであり，前記搬
出部がアンローダであり，これらローダおよび／または
アンローダと洗浄部が直線上に配置されていても良い。In the cleaning apparatus according to the first aspect, as described in the second aspect, the plurality of moving mechanisms include the loading unit and / or the moving mechanism.
Alternatively, it is preferable to be able to move on rails arranged along the carry-out section and the washing section, respectively. According to a third aspect of the present invention, it is preferable that the cassette stores the substrate in a horizontal state, and the arm mechanism can convert the substrate between a horizontal state and a vertical state. Claim 4
As described in the above, the loading section may be a loader and the unloading section may be an unloader, and the loader and / or the unloader and the cleaning section may be arranged on a straight line.
また，請求項５の発明は，基板を水平状態で収納する
カセットから一枚ずつ取り出した基板を洗浄部に搬送し
て洗浄した後，洗浄済みの基板を再びカセットに一枚ず
つ装填する洗浄方法において，前記カセットから取り出
した基板を水平状態から垂直状態に転換した後，前記洗
浄部での基板の洗浄を並行して行い，その後，洗浄済み
の基板を垂直状態から水平状態に転換した後，再びカセ
ットに一枚ずつ装填することを特徴とする。According to a fifth aspect of the present invention, there is provided a cleaning method in which substrates taken out one by one from a cassette for storing substrates in a horizontal state are transported to a cleaning unit for cleaning, and then the cleaned substrates are loaded again into the cassette one by one. In the method, after the substrate taken out of the cassette is changed from a horizontal state to a vertical state, washing of the substrate in the washing unit is performed in parallel, and then, after the washed substrate is changed from the vertical state to the horizontal state, It is characterized in that cassettes are loaded one by one again.
（作 用） 上記構成の本発明の洗浄装置では、枚葉式にすること
により、一枚一枚高集積化に応じたクリーンな洗浄が可
能となる。また、被洗浄基板を垂直に設けることによ
り、処理室の横幅を狭くし、装置全体の横幅を狭くする
ことができる。すなわち、被洗浄基板を垂直に保持した
状態で所定の処理を施すので処理室の横幅は、例えば洗
浄を行う半導体ウエハの径が大径であってもこの径に無
関係に狭く設定することができ、装置全体の横幅を狭く
することができる。したがって、占有スペースの削減あ
るいは同一占有スペースとした場合には処理能力を向上
させることができ、生産性の向上と生産コストの低減を
図ることができる。(Operation) In the cleaning apparatus of the present invention having the above-described configuration, by using a single-wafer method, clean cleaning can be performed one by one according to high integration. Further, by providing the substrate to be cleaned vertically, the width of the processing chamber can be reduced, and the width of the entire apparatus can be reduced. That is, since the predetermined processing is performed while the substrate to be cleaned is held vertically, the width of the processing chamber can be set narrow regardless of the diameter of the semiconductor wafer to be cleaned, even if the diameter is large. The width of the entire device can be reduced. Therefore, when the occupied space is reduced or the same occupied space is used, the processing capacity can be improved, and the productivity and the production cost can be reduced.
（実施例） 以下、本発明装置は洗浄装置に適用した実施例につい
て図を参照して説明する。(Embodiment) Hereinafter, an embodiment in which the present invention is applied to a cleaning apparatus will be described with reference to the drawings.
本発明に係る洗浄装置の筐体12の一端部には、多棚型
の基板カセット22が載置されるローダ16が配設され、ロ
ーダ16は筐体12内に内蔵された図示されない駆動機構に
より昇降可能となっている。ローダ16は筐体のテーブル
14を挟んで基板カセット22を上下させ、後述のキャリア
・アーム68が洗浄処理される基板24をカセットから抜出
す位置（ロードポジション）にカセット22の所定の棚が
順次来るようにする。また筐体12の他端部には多棚型の
基板カセット22が載置されるアンローダ18が配設され、
アンローダ18もまた筐体12内に内蔵された図示されない
駆動機構により昇降可能となっている。アンローダ18は
筐体のテーブル14を挟んで基板カセット22を上下させ、
後述のキャリア・アーム68が洗浄処理された基板24をカ
セットに挿入する位置（アンロードポジション）にカセ
ット22の所定の棚が順次来るようにする。At one end of the housing 12 of the cleaning apparatus according to the present invention, a loader 16 on which a multi-shelf-type substrate cassette 22 is mounted is disposed, and the loader 16 is a drive mechanism (not shown) built in the housing 12. Can be moved up and down. The loader 16 is a table of the housing
The substrate cassette 22 is moved up and down with the substrate 14 interposed therebetween so that a predetermined shelf of the cassette 22 sequentially comes to a position (load position) where a carrier arm 68 to be described later extracts the substrate 24 to be cleaned from the cassette. An unloader 18 on which a multi-shelf type substrate cassette 22 is placed is provided at the other end of the housing 12,
The unloader 18 can also be moved up and down by a drive mechanism (not shown) built in the housing 12. The unloader 18 raises and lowers the substrate cassette 22 across the table 14 of the housing,
A predetermined shelf of the cassette 22 is sequentially placed at a position (an unload position) at which a carrier arm 68 to be described later inserts the cleaned substrate 24 into the cassette (unload position).
ローダ16とアンローダ18との間には、３つの処理室3
2、34、36が配設され、各処理室はローダ16の側から順
に、薬液洗浄室32、水洗室34及び乾燥室36となってい
る。各処理室32、34、36は装置筐体のテーブル14から下
方に垂直に伸び、基板24を垂直な状態に収納するように
配置される。この為各処理室内には保持台38（第３図及
び第４図参照）が配置され、基板24の垂直被支持状態が
保証される。また各処理室32、34、36には、夫々薬液洗
浄処理、水洗処理及び乾燥処理を行う為の配管類が接続
されている。Between the loader 16 and the unloader 18, three processing chambers 3
2, 34, and 36 are provided, and the processing chambers are a chemical cleaning chamber 32, a water cleaning chamber 34, and a drying chamber 36 in order from the loader 16 side. Each of the processing chambers 32, 34, and 36 extends vertically downward from the table 14 of the apparatus housing, and is arranged so as to store the substrate 24 in a vertical state. For this reason, a holding table 38 (see FIGS. 3 and 4) is arranged in each processing chamber, and the vertically supported state of the substrate 24 is ensured. The processing chambers 32, 34, and 36 are connected to pipes for performing a chemical solution washing process, a water washing process, and a drying process, respectively.
各処理室32、34、36の寸法は、深さ及び奥行きは処理
される基板24の寸法に応じて大幅に変更されるであろう
が、装置の全長を決定するファクタとなる横幅は僅か数
インチとなる。例えば図示洗浄装置が８インチの基板24
を洗浄処理する為の装置であれば、装置の全長は３フィ
ート程度となり、処理室32、34、36を水平に並べた従来
装置に比べ、その全長は1/2乃至2/3程度で済む。従っ
て、この種洗浄装置に求められている占有スペースの削
減という条件を満たすことができる。The dimensions of each processing chamber 32, 34, 36 will vary greatly in depth and depth depending on the dimensions of the substrate 24 being processed, but only a few lateral widths will determine the overall length of the apparatus. Inches. For example, the illustrated cleaning device is an 8-inch substrate 24.
If it is a device for cleaning processing, the total length of the device is about 3 feet, and the total length can be about 1/2 to 2/3 as compared with the conventional apparatus in which the processing chambers 32, 34, 36 are arranged horizontally. . Therefore, it is possible to satisfy the condition of reducing the occupied space required for this type of cleaning apparatus.
各処理室32、34、36に対応してテーブル14にはスリッ
ト状の開口42、44、46が形成される。開口42、44、46の
奥行きもまた処理される基板24の寸法に応じて大幅に変
更されるであろう。各開口42、44、46の上部にはカバー
52、54、56が配設され、各カバーは奥側（第１図中上
方）の位置でテーブル14に旋回可能に軸支される。各カ
バー52、54、56は、開口42、44、46を通して基板24を挿
入若しくは抜取る際は自動的に旋回開放され、基板の洗
浄時は閉鎖されて処理空間を密閉する。Slit-shaped openings 42, 44, 46 are formed in the table 14 corresponding to the respective processing chambers 32, 34, 36. The depth of the openings 42, 44, 46 will also vary significantly depending on the dimensions of the substrate 24 being processed. Cover on top of each opening 42, 44, 46
52, 54, and 56 are provided, and each cover is pivotally supported by the table 14 at a position on the back side (upward in FIG. 1). Each of the covers 52, 54, and 56 is automatically opened when the substrate 24 is inserted or withdrawn through the openings 42, 44, and 46, and is closed when the substrate is washed to close the processing space.
ローダ16、３つの処理室32、34、36及びアンローダ18
に隣接して、テーブル14の状には軌道レール62が配設さ
れる。軌道レール62上には基板を搬送する為の第１及び
第２の２つのキャリア64、66が移動可能に配置され、各
キャリアには基板を保持する為の公知の構造のアーム機
構68（第３図及び第４図参照）が取付けられる。アーム
68の先端には基板24の裏面側を支持する２本のフィンガ
72が延設され、各フィンガの先端には基板24の周縁部に
係合する爪74が付設される。図示した実施例において
は、フィンガ72と爪74との協働により、基板が水平状態
から垂直状態まで確実に保持される。吸着ではうまくい
かないので再製作中、又吸着個所の汚れもある。アーム
68には、フィンガ72により基板を保持した状態で所期の
旋回動作等を行ない得るように、自在関節部（図示され
ず）が配備されている。この自在関節部の技術に関して
は既に公知である。Loader 16, three processing chambers 32, 34, 36 and unloader 18
A track rail 62 is disposed adjacent to the table 14 in the shape of the table 14. On the track rail 62, first and second two carriers 64, 66 for transporting the substrate are movably arranged, and each carrier has an arm mechanism 68 (known as a first member) having a known structure for holding the substrate. (See FIGS. 3 and 4). arm
At the tip of 68, two fingers supporting the back side of the substrate 24 are provided.
72 are extended, and each finger is provided with a claw 74 that engages with the peripheral edge of the substrate 24 at the tip of each finger. In the illustrated embodiment, the cooperation of the fingers 72 and the claws 74 ensures that the substrate is held from a horizontal state to a vertical state. Since it does not work well with suction, there is also dirt in the suction area during remanufacturing. arm
The 68 is provided with a universal joint (not shown) so that a desired turning operation or the like can be performed while the substrate is held by the finger 72. The art of this universal joint is already known.
上記洗浄装置の作動はコンピュータにより制御され、
上記カバー52、54、56の開閉、キャリア64、66及びアー
ム68の所期の動作、並びに各処理室32、34、36内での洗
浄或いは乾燥処理は、予め組まれた所定のプログラムに
従って自動的に行われる。The operation of the cleaning device is controlled by a computer,
The opening and closing of the covers 52, 54, 56, the intended operation of the carriers 64, 66 and the arm 68, and the cleaning or drying processing in each of the processing chambers 32, 34, 36 are automatically performed according to a predetermined program. It is done on a regular basis.
次に動作を説明する。 Next, the operation will be described.
まず最下位置にあるローダ16上に処理すべき複数の基
板が収納された基板カセット22が載置される一方、最下
位置にあるアンローダ18上に空の基板カセット22が載置
される。ローダ16は基板カセット２を順次ステップ状に
上昇させ、上段から順にテーブル14上のロードポジショ
ンに配置する。これに対して第１図中左方の第１キャリ
ア64は軌道レール62上をローダ16の隣接位置まで移動さ
れ、この第１キャリア64のアーム68がカセット22の棚内
に挿入される。アーム68はそのフィンガ72先端の爪74に
より基板24の縁部と係合し、基板を棚から水平に引出
す。First, a substrate cassette 22 containing a plurality of substrates to be processed is placed on the lowermost loader 16, while an empty substrate cassette 22 is placed on the lowermost unloader 18. The loader 16 sequentially raises the substrate cassettes 2 in a step-like manner, and arranges the substrate cassettes 2 at the load positions on the table 14 in order from the top. On the other hand, the first carrier 64 on the left side in FIG. 1 is moved on the track rail 62 to a position adjacent to the loader 16, and the arm 68 of the first carrier 64 is inserted into the shelf of the cassette 22. The arm 68 is engaged with the edge of the substrate 24 by the claw 74 at the tip of the finger 72, and pulls the substrate horizontally from the shelf.
次に第１キャリア64は軌道レール62上に薬液洗浄室32
の隣接位置まで移動され、これと共にアーム68が関節部
分を介して旋回され、被保持基板24が水平状態から垂直
状態に転換される。またこれと並行して薬液洗浄室32の
カバー52が開放され、基板24がアームのフィンガ72に保
持されたままの状態で、対応の開口42を通して薬液洗浄
室32に挿入される。基板24は垂直状態で薬液洗浄室32内
の薬液中に浸漬され、保持台38上に載置される（第３図
参照）。基板24は浸漬時に液中に垂直に挿入される為、
液による基板の断面方向に対する浮力の悪影響は排除さ
れる。基板24が薬液洗浄室32内の保持第38に着座する
と、フィンガ先端の爪74が基板縁部から外され、基板24
を残してアーム68が薬液洗浄室32から引抜かれる。Next, the first carrier 64 is placed on the track rail 62 by the chemical cleaning chamber 32.
, The arm 68 is pivoted through the joint portion, and the held substrate 24 is changed from the horizontal state to the vertical state. At the same time, the cover 52 of the chemical cleaning chamber 32 is opened, and the substrate 24 is inserted into the chemical cleaning chamber 32 through the corresponding opening 42 while being held by the finger 72 of the arm. The substrate 24 is immersed in the chemical solution in the chemical solution cleaning chamber 32 in a vertical state, and is placed on the holding table 38 (see FIG. 3). Since the substrate 24 is inserted vertically into the liquid during immersion,
The adverse effect of buoyancy on the cross-sectional direction of the substrate due to the liquid is eliminated. When the substrate 24 is seated on the holding thirty-eighth in the chemical cleaning chamber 32, the claw 74 at the finger tip is disengaged from the substrate edge, and the substrate 24
The arm 68 is pulled out of the chemical solution cleaning chamber 32 while leaving.
そしてカバー52が閉鎖され、所定の洗浄処理が行われ
る。洗浄液は、例えば酸洗であれば硫酸若しくは塩酸と
過酸化水素水との混合液、フッ化水素酸等が選択され、
アルカリ洗であればアンモニアと過酸化水素との混合液
等が選択される。洗浄処理は、上記洗浄液内に基板24が
所定時間例えば数分間浸漬されることにより行われ、ま
たこれと共に図示されない機構により基板24の両面側或
いは主要面側のみから超音波振動が加えられる。少なく
とも振動源が基板24の主要面側に設けられ、且つ基板が
垂直状態に保持されることにより、基板24主要面に物理
的に付着した汚染源は超音波振動により該主要面から除
去されやすくなり、洗浄装置の洗浄機能が高まる。洗浄
液の温度を洗浄に好適な温度例えば80℃〜130℃にする
とよい。さらに洗浄液を流動させたりリバブリングさせ
るとさらに洗浄効果が高まる。Then, the cover 52 is closed, and a predetermined cleaning process is performed. For the washing liquid, for example, in the case of pickling, a mixed solution of sulfuric acid or hydrochloric acid and a hydrogen peroxide solution, hydrofluoric acid, or the like is selected,
In the case of alkali washing, a mixed solution of ammonia and hydrogen peroxide or the like is selected. The cleaning process is performed by immersing the substrate 24 in the cleaning liquid for a predetermined time, for example, several minutes, and at the same time, an ultrasonic vibration is applied only from both sides or the main surface of the substrate 24 by a mechanism (not shown). Since at least the vibration source is provided on the main surface side of the substrate 24 and the substrate is held in a vertical state, the contamination source physically attached to the main surface of the substrate 24 is easily removed from the main surface by ultrasonic vibration. The cleaning function of the cleaning device is enhanced. The temperature of the cleaning solution is preferably set to a temperature suitable for cleaning, for example, 80 ° C to 130 ° C. Further, when the washing liquid is made to flow or rebubble, the washing effect is further enhanced.
薬液洗浄室32での処理が終了した後、カバー52が開放
され、第１キャリア64のアーム68により基板24が薬液洗
浄室32から取出される。取出された基板24は第１キャリ
ア64により次続の水洗室34まで搬送され、上記薬液洗浄
室32に関して説明されたのと同じ態様で、対応の開口44
を通して水洗室34に挿入される。この際水洗室34のカバ
ー54は、基板24の搬送にタイミングを合わせて開放さ
れ、キャリアのアーム68が水洗室34内に基板を残して引
抜かれた後、閉鎖される。基板24は水洗室34内の保持台
38に垂直状態で支持され、水洗処理を受ける。After the processing in the chemical cleaning chamber 32 is completed, the cover 52 is opened and the substrate 24 is taken out of the chemical cleaning chamber 32 by the arm 68 of the first carrier 64. The unloaded substrate 24 is transported by the first carrier 64 to the next washing chamber 34, where the corresponding opening 44 is provided in the same manner as described for the chemical cleaning chamber 32.
Through the washing room 34. At this time, the cover 54 of the rinsing chamber 34 is opened in synchronization with the transfer of the substrate 24, and the arm 68 of the carrier is pulled out while leaving the substrate in the rinsing chamber 34, and then closed. The substrate 24 is a holding table in the washing room 34
It is supported vertically by 38 and undergoes a water-washing process.
水洗処理は、温度例えば80℃〜130℃のリンス液内に
基板24が所定時間例えば数分間浸漬されることにより行
われ、またこれと共に図示されない機構により基板24の
両面側或いは主要面側のみから超音波振動が加えられ
る。The water washing process is performed by immersing the substrate 24 in a rinsing liquid at a temperature of, for example, 80 ° C. to 130 ° C. for a predetermined time, for example, several minutes, and together with a mechanism (not shown) from both sides or only the main surface of the substrate 24. Ultrasonic vibration is applied.
水洗室34での処理が終了した後、カバー54が開放さ
れ、今度は第１図中右方の第２キャリア66のアーム68に
より基板24が水洗室34から取出される。取出された基板
24は第２キャリア66により次続の乾燥室36まで搬送さ
れ、上記薬液洗浄室32に関して説明されたのと同じ態様
で、対応の開口46を通して乾燥室36に挿入される。この
際乾燥室のカバー56は、基板24の搬送にタイミングを合
わせて開放され、キャリアのアーム72が乾燥室36内に基
板を残して引抜かれた後、閉鎖される。基板24は乾燥室
36内の保持台38に温度例えば80℃〜130度の温度気流中
に時間例えば３分間垂直状態で支持され、乾燥処理を受
ける。After the processing in the washing chamber 34 is completed, the cover 54 is opened, and the substrate 24 is taken out of the washing chamber 34 by the arm 68 of the second carrier 66 on the right side in FIG. Board taken out
The 24 is transported by the second carrier 66 to the subsequent drying chamber 36 and is inserted into the drying chamber 36 through the corresponding opening 46 in the same manner as described for the chemical cleaning chamber 32. At this time, the cover 56 of the drying chamber is opened in synchronization with the transfer of the substrate 24, and is closed after the arm 72 of the carrier is pulled out leaving the substrate in the drying chamber 36. Substrate 24 is drying room
The holding table 38 in the inside 36 is vertically supported in a temperature airflow at a temperature of, for example, 80 ° C. to 130 ° C. for a time of, for example, 3 minutes, and undergoes a drying process.
乾燥室36での処理が終了した後、カバー56が開放さ
れ、第２キャリア66のアーム68により基板24が乾燥室36
から取出される。読出された基板24は第２キャリア66に
より右端のアンローダ18まで搬送され、これと共にアー
ム68が関節部を介して旋回され、被保持基板24が垂直状
態から水平状態に転換される。アンローダ18は基板カセ
ット22を順次ステップ状に上昇させ、上段から順にテー
ブル14上のアンロードポジションに配置する。基板24
は、第２キャリアのアーム68により水平状態で、アンロ
ードポジションにある基板カセット22の棚内に挿入され
る。After the processing in the drying chamber 36 is completed, the cover 56 is opened and the substrate 24 is moved by the arm 68 of the second carrier 66 to the drying chamber 36.
Taken out of The read substrate 24 is transported by the second carrier 66 to the unloader 18 at the right end. At the same time, the arm 68 is turned through the joint, and the held substrate 24 is changed from the vertical state to the horizontal state. The unloader 18 sequentially raises the substrate cassettes 22 in a step-like manner, and arranges them at the unload position on the table 14 in order from the upper stage. Board 24
Is inserted horizontally into the shelf of the substrate cassette 22 at the unload position by the arm 68 of the second carrier.
他方、上述の如く基板24が第１図中左方の第１キャリ
ア64により薬液洗浄室32から水洗室34に移送された後、
該第１キャリア64は直ぐにローダ16の隣接位置まで戻さ
れ、次の棚から次の基板24が引出される。そしてこの基
板24が薬液洗浄室32に搬送され、薬液洗浄処理がなされ
る。同様に先行する基板24が第１図中右方の第２キャリ
ア66により水洗室34から乾燥室36に移送された後、第１
図中左方の第１キャリア64により次の基板24が薬液洗浄
室32から水洗室34に直ぐに移送され、水洗処理がなされ
る。このように、各作業工程が複数の基板24に関して並
行して行われ、基板24が次々と、ロード、洗浄及び乾燥
処理並びにアンロードされ、第１図中左方の基板カセッ
ト22から右方のカセット22に移送されていく。On the other hand, as described above, after the substrate 24 is transferred from the chemical cleaning chamber 32 to the water cleaning chamber 34 by the first carrier 64 on the left side in FIG.
The first carrier 64 is immediately returned to the position adjacent to the loader 16, and the next substrate 24 is pulled out from the next shelf. Then, the substrate 24 is transported to the chemical cleaning chamber 32, where the chemical cleaning processing is performed. Similarly, after the preceding substrate 24 is transferred from the washing chamber 34 to the drying chamber 36 by the second carrier 66 on the right side in FIG.
The next substrate 24 is immediately transferred from the chemical liquid cleaning chamber 32 to the water cleaning chamber 34 by the first carrier 64 on the left side in the figure, and is subjected to water cleaning processing. As described above, each operation process is performed in parallel with respect to the plurality of substrates 24, and the substrates 24 are successively loaded, washed, dried, and unloaded, and from the substrate cassette 22 on the left in FIG. It is transferred to the cassette 22.
以上本発明の詳細は、添付の図面に示される望ましい
実施例に従って説明されてきたが、これら実施例に対し
ては、本発明の範囲を逸脱することなく種々の変更、改
良が可能となることは明白である。例えば洗浄処理後の
基板をもとのカセットの棚に戻すようにすれば、アンロ
ーダは不要となる。この場合ロードポジションとアンロ
ードポジションとは実質的に同じか、或いは概ね同じと
なる。各処理室における処理タイプは任意であり、浸漬
洗浄処理ではなくスプレイ洗浄処理とすることもできる
し、同一処理室で薬液洗浄及び水洗を行うように構成す
ることも可能である。また処理室の数も当然任意のもの
である。Although the details of the present invention have been described with reference to the preferred embodiments shown in the accompanying drawings, various modifications and improvements can be made to these embodiments without departing from the scope of the present invention. Is obvious. For example, if the substrate after the cleaning process is returned to the original cassette shelf, the unloader becomes unnecessary. In this case, the load position and the unload position are substantially the same or substantially the same. The processing type in each processing chamber is arbitrary, and a spray cleaning processing instead of an immersion cleaning processing can be used. Alternatively, a chemical liquid cleaning and a water cleaning can be performed in the same processing chamber. The number of processing chambers is also arbitrary.
第５図のように一平面内に複数枚配列しても上記実施
例と同様な効果を得ることができる。Even if a plurality of sheets are arranged in one plane as shown in FIG. 5, the same effect as in the above embodiment can be obtained.
本発明の洗浄装置は，基板をカセットから取り出す搬
入部や基板をカセットに装填する搬出部と基板を洗浄す
る洗浄部との間で移動可能な移動機構を複数設け，これ
ら複数の移動機構のそれぞれに基板を一枚ずつ保持する
アーム機構を設けているため，カセットからの基板の取
り出し，洗浄部に対する基板の搬入，搬出，カセットへ
の基板の装填といった作業を複数の移動機構に設けたア
ーム機構によって別個のタイミングで行うことが可能と
なる。このため，例えば基板の洗浄中にカセットに対し
て基板を搬入出したり，複数の洗浄部を備えているよう
な場合には，各洗浄部での洗浄時間なども自由に異なら
せて設定するようなこともできるため，処理の自由度が
著しく高まるといった特徴がある。特に本発明によれ
ば，基板を一枚ずつ洗浄することにより，高集積化に対
応した高い洗浄度の洗浄を行うことが可能となる。ま
た，基板を水平状態で収納しているカセットから取り出
した基板を水平状態から垂直状態に転換して洗浄するこ
とにより，洗浄部の幅を狭くすることができ，従って，
装置全体をコンパクトにすることができるようになる。
また，ローダと洗浄部とアンローダを直接に配置してい
るので，カセットからの基板を取り出し，基板の洗浄，
カセットへの基板の装填といった工程を一連の動作とし
て行うことができるので，基板の搬送が容易かつ効率的
であり，スループットの向上を図ることができる。そし
て，複数の洗浄部において基板の洗浄を並行して行うよ
うにすれば，更にスループットを向上できるようにな
る。The cleaning apparatus of the present invention is provided with a plurality of moving mechanisms that can move between a carry-in section for taking out a substrate from a cassette or a carry-out section for loading a substrate into a cassette and a cleaning section for cleaning a substrate, and each of the plurality of moving mechanisms is provided. Arm mechanism for holding substrates one by one, a plurality of moving mechanisms provide operations such as taking out substrates from the cassette, loading and unloading substrates to and from the cleaning unit, and loading substrates into the cassette. Thus, it can be performed at different timings. For this reason, for example, when a substrate is carried in and out of the cassette during the cleaning of the substrate, or when a plurality of cleaning units are provided, the cleaning time in each cleaning unit may be set to be different. Because of this, there is a feature that the degree of freedom in processing is significantly increased. In particular, according to the present invention, by cleaning the substrates one by one, it becomes possible to perform a high degree of cleaning corresponding to high integration. In addition, the width of the cleaning section can be reduced by changing the substrate taken out of the cassette storing the substrates in the horizontal state from the horizontal state to the vertical state and performing cleaning.
The whole device can be made compact.
Also, since the loader, cleaning section and unloader are directly arranged, the substrate is taken out of the cassette,
Since the process of loading substrates into the cassette can be performed as a series of operations, the substrate can be easily and efficiently transported, and the throughput can be improved. If the cleaning of the substrate is performed in a plurality of cleaning sections in parallel, the throughput can be further improved.
第１図は本発明装置を洗浄装置に適用した一実施例を示
す上面説明図、第２図は第１図の２−２線に沿った縦断
にして装置を説明するための側面説明図、第３図及び第
４図は第１図の薬液洗浄室内の洗浄液中に被処理基板が
浸漬された状態を示す説明図、第５図は本発明装置の他
の実施例を説明する説明図である。FIG. 1 is an explanatory top view showing one embodiment in which the apparatus of the present invention is applied to a cleaning apparatus, FIG. 2 is an explanatory side view for explaining the apparatus in a longitudinal section along line 2-2 in FIG. 1, 3 and 4 are explanatory views showing a state in which the substrate to be processed is immersed in the cleaning liquid in the chemical liquid cleaning chamber of FIG. 1, and FIG. 5 is an explanatory view showing another embodiment of the apparatus of the present invention. is there.
Claims (5)
／またはカセットに基板を装填する搬出部と，基板を洗
浄する洗浄部とを直列に配置し， これら搬入部および／または搬出部と洗浄部に沿って移
動可能な複数の移動機構と，これら複数の移動機構のそ
れぞれに基板を一枚ずつ保持するアーム機構を設けた洗
浄装置であって， 前記洗浄部が，基板を搬送方向に対して垂直の姿勢にし
て洗浄することを特徴とする洗浄装置。A loading section for taking out a substrate from a cassette and / or an unloading section for loading a substrate into the cassette and a cleaning section for cleaning the substrate are arranged in series, and the loading section and / or the unloading section and the cleaning section are arranged in series. A cleaning apparatus, comprising: a plurality of moving mechanisms movable along the arm; and an arm mechanism for holding the substrates one by one in each of the plurality of moving mechanisms. A cleaning device characterized in that the cleaning is performed in the posture of the cleaning.
／または搬出部と洗浄部に沿って配置されたレール上を
それぞれ移動可能であることを特徴とする，請求項１に
記載の洗浄装置。2. The cleaning device according to claim 1, wherein the plurality of moving mechanisms are respectively movable on rails arranged along the loading portion and / or the discharging portion and the cleaning portion. apparatus.
ものであり，前記アーム機構が基板を水平状態と垂直状
態に転換可能であることを特徴とする，請求項１又は２
に記載の洗浄装置。3. The cassette according to claim 1, wherein the cassette stores the substrates in a horizontal state, and the arm mechanism can convert the substrates into a horizontal state and a vertical state.
The cleaning device according to item 1.
アンローダであり，これらローダおよび／またはアンロ
ーダと洗浄部が直線上に配置されている請求項1,2又は
３のいずれかに記載の洗浄装置。4. The apparatus according to claim 1, wherein said loading section is a loader, said unloading section is an unloader, and said loader and / or unloader and the washing section are arranged on a straight line. Cleaning equipment.
枚ずつ取り出した基板を洗浄部に搬送して洗浄した後，
洗浄済みの基板を再びカセットに一枚ずつ装填する洗浄
方法において， 前記カセットから取り出した基板を水平状態から垂直状
態に転換した後，前記洗浄部での基板の洗浄を行い，そ
の後，洗浄済みの基板を垂直状態から水平状態に転換し
た後，再びカセットに一枚ずつ装填することを特徴とす
る，洗浄方法。5. The method according to claim 1, wherein the substrates taken out one by one from a cassette for storing the substrates in a horizontal state are transported to a cleaning section for cleaning.
In the cleaning method of loading the cleaned substrates again into the cassette one by one, the substrates taken out of the cassette are changed from a horizontal state to a vertical state, and then the substrates are cleaned in the cleaning section. A cleaning method, wherein a substrate is changed from a vertical state to a horizontal state, and then loaded into a cassette one by one again.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18306288 | 1988-07-22 | ||
| JP63-183062 | 1988-07-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02125429A JPH02125429A (en) | 1990-05-14 |
| JP2892380B2 true JP2892380B2 (en) | 1999-05-17 |
Family
ID=16129078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1190311A Expired - Lifetime JP2892380B2 (en) | 1988-07-22 | 1989-07-21 | Cleaning device and cleaning method |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2892380B2 (en) |
| KR (1) | KR0148357B1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100696726B1 (en) * | 2005-12-28 | 2007-03-20 | 주식회사 케이씨텍 | Dip Type system for cleaning substrate and cleaning method of the same |
-
1989
- 1989-07-05 KR KR1019890009551A patent/KR0148357B1/en not_active IP Right Cessation
- 1989-07-21 JP JP1190311A patent/JP2892380B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| KR900002413A (en) | 1990-02-28 |
| KR0148357B1 (en) | 1998-12-01 |
| JPH02125429A (en) | 1990-05-14 |
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