JP2890988B2 - Peeling composition and peeling method - Google Patents

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【産業上の利用分野】本発明は、接着剤による回路や電
極等にの接続部の補修に好適な、剥離用組成物及び剥離
方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a stripping composition and a stripping method suitable for repairing a connection portion of a circuit or an electrode with an adhesive.

【０００２】[0002]

【従来の技術】電子部品の小型薄型化に伴い、これらに
用いる回路や電極等は、高密度、高精細化している。こ
れら微細回路等の接続は、接着剤による方法が最近多用
されるようになってきた。この場合、接着剤中に導電性
粒子を配合し加圧により接着剤の厚み方向に電気的接続
を得るもの（例えば特開昭５５−１０４００７号公報）
と、導電性粒子を用いないで接続時の加圧により電極面
の微細凹凸により電気的接続を得るもの（例えば特開昭
６０−２６２４３０号公報）がある。これら接着剤によ
る接続において、電気的接続が不良であったり、接続後
に電子部品や回路が不良になった場合、接続部間を剥離
し、残った接着剤を溶剤や剥離液で除去した後、再度良
品を接着剤により接続する。この時、例えば液晶ディス
プレイパネルのような多数の回路を有する１つの電子部
品に、多数の例えばＩＣチップのような他の電子部品を
接続する場合、前記の接着剤除去法では、周辺部等の他
の接続部にまで影響し、接続不良や信頼性が低下する問
題があった。また、最近ではこの様な用途に使用される
接着剤は、接続信頼性に優れることから熱や紫外線等に
よる硬化型が多用されるが、その場合の適当な剥離液が
なく接続不良や信頼性が低下する問題を抱えながら使用
されていた。これらの対策として先に本発明者等は、補
修を要する接着剤面積とほぼ等しい所定形状の多孔質シ
ートに剥離液を含ませ、補修を要する接着剤と接触させ
て剥離させる試みについて提案した。2. Description of the Related Art As electronic components have become smaller and thinner, circuits, electrodes, and the like used therein have become denser and more precise. For connection of these fine circuits and the like, a method using an adhesive has recently been frequently used. In this case, conductive particles are blended in the adhesive, and electrical connection is obtained in the thickness direction of the adhesive by pressing (for example, Japanese Patent Application Laid-Open No. 55-104007).
Also, there is a method in which electrical connection is obtained by applying pressure during connection without using conductive particles by fine irregularities on the electrode surface (for example, JP-A-60-262430). In connection with these adhesives, if the electrical connection is poor, or if the electronic components and circuits become defective after the connection, peel off between the connection parts, remove the remaining adhesive with a solvent or a peeling liquid, The non-defective product is again connected with the adhesive. At this time, in the case where a large number of other electronic components such as an IC chip are connected to one electronic component having a large number of circuits such as a liquid crystal display panel, in the above-described method of removing the adhesive, a peripheral portion or the like is used. There is a problem that the influence is exerted on other connection parts, and that connection failure and reliability are reduced. In recent years, adhesives used for such applications are often used in the form of adhesives that are cured by heat or ultraviolet rays because of their excellent connection reliability. Had been used while having the problem of decreasing. As a countermeasure against these problems, the present inventors have previously proposed an attempt to include a stripping liquid in a porous sheet having a predetermined shape substantially equal to the area of the adhesive requiring repair and to bring the porous sheet into contact with the adhesive requiring repair to peel off the adhesive.

【０００３】[0003]

【発明が解決しようとする課題】この方法は、局所部分
の剥離には極めて有効な方法であるが、所定形状の多孔
質シートを補修が必要な部分のみに形成するため、シー
トの正確な断面や載置、剥離液の含有が必要であり、作
業性に劣る。また、剥離液中に酸やハロゲン系溶剤を含
む場合に、電食が発生し易く接続信頼性が不十分であっ
た。本発明は、上記欠点を解消すべくなされたものであ
り、補修が必要な部分のみの接着剤を効率良く剥離で
き、且つ接続信頼性に優れた剥離用組成物及び剥離方法
を提案するものである。Although this method is extremely effective for peeling off a local portion, since a porous sheet having a predetermined shape is formed only in a portion requiring repair, an accurate cross section of the sheet is required. , Mounting, and the inclusion of a stripping solution are required, resulting in poor workability. In addition, when an acid or a halogen-based solvent is contained in the stripping solution, electrolytic corrosion easily occurs, and connection reliability is insufficient. The present invention has been made in order to solve the above-mentioned disadvantages, and proposes a peeling composition and a peeling method which can efficiently peel off an adhesive only in a portion requiring repair and have excellent connection reliability. is there.

【０００４】[0004]

【課題を解決するための手段】本発明は、沸点の異なる
２種以上の溶剤と、少なくとも前記低沸点溶剤に可溶な
固定樹脂と、必要に応じて用いる揺変性付与剤とよりな
る剥離用組成物及び、剥離を要する接着剤部に前記組成
物を形成し暫時接触後にこれらを取り除き清浄化する剥
離方法に関する。本発明に用いる沸点の異なる２種以上
の溶剤について説明する。高沸点溶剤としては、接着剤
を分解または溶解する性質を持つ物であれば良い。沸点
は揮発性抑制の点から９０℃以上が好ましく、１００℃
以上がより好ましい。これらは特に硬化後の接着剤を分
解または溶解し易い点から、キシレン（沸点１４２℃、
ＳＰ値８．８）、トルエン（沸点１１１℃、ＳＰ値８．
９）等の炭化水素、ジオキサン（沸点１０１℃、ＳＰ値
９．９）等のエーテル類、メチルイソブチルケトン（沸
点１００℃、ＳＰ値８．６）等のケトン類、酢酸ブチル
（沸点１２６℃、ＳＰ値８．５）等のエステル類、ブチ
ルアルコール（沸点１１７℃、ＳＰ値１１．１）等のア
ルコール類及び、ホルムアミド（沸点２１０℃）、Ｎ，
Ｎ−ジメチルホルムアミド（沸点１５３℃、ＳＰ値１
２．１）、Ｎ，Ｎ−ジメチルアセトアミド（沸点１６６
℃、ＳＰ値１１．１）、Ｎ−メチルホルムアミド（沸点
１８０℃）、Ｎ−メチルピロドリン（沸点２０２℃、Ｓ
Ｐ値１１．３）等の窒素化合物類等がある。これらの中
では窒素化合物類等が接着剤を分解または溶解、膨潤す
る性質が大きく好ましい。また、これらは任意に混合し
て用いることもできる。SUMMARY OF THE INVENTION The present invention relates to a peeling agent comprising two or more solvents having different boiling points, a fixing resin soluble in at least the low boiling point solvent, and a thixotropic agent used as required. The present invention relates to a composition and a peeling method of forming the above-mentioned composition on an adhesive part which needs to be peeled off, removing them after temporary contact, and cleaning them. Two or more solvents having different boiling points used in the present invention will be described. Any high-boiling solvent may be used as long as it has the property of decomposing or dissolving the adhesive. The boiling point is preferably 90 ° C. or higher from the viewpoint of suppressing volatility,
The above is more preferable. These are particularly easy to decompose or dissolve the cured adhesive, so xylene (boiling point 142 ° C,
SP value 8.8), toluene (boiling point 111 ° C., SP value 8.8).
Hydrocarbons such as 9), ethers such as dioxane (boiling point 101 ° C, SP value 9.9), ketones such as methyl isobutyl ketone (boiling point 100 ° C, SP value 8.6), butyl acetate (boiling point 126 ° C, Esters such as SP value 8.5), alcohols such as butyl alcohol (boiling point 117 ° C., SP value 11.1), and formamide (boiling point 210 ° C.), N,
N-dimethylformamide (boiling point 153 ° C, SP value 1
2.1), N, N-dimethylacetamide (boiling point 166)
° C, SP value 11.1), N-methylformamide (boiling point 180 ° C), N-methylpyrroline (boiling point 202 ° C, S
And nitrogen compounds having a P value of 11.3). Among these, nitrogen compounds and the like are preferable because of their properties of decomposing, dissolving, and swelling the adhesive. Further, these can be arbitrarily mixed and used.

【０００５】低沸点溶剤としては、後述する固定樹脂を
溶解する性質を持つものであれば良く、加えて剥離すべ
き接着剤を分解または溶解、膨潤する性質を持つもので
あればさらに好ましい。沸点は揮発性増進の点から９０
℃未満が好ましく、８０℃以下がより好ましい。これら
を例示すると、ヘキサン、アセトン、メチルエチルケト
ン、エチルアルコール、メチルアルコール、酢酸エチ
ル、酢酸メチル、リグロイン、テトラヒドロフラン等が
ある。これらは任意に混合して用いることもできる。高
沸点溶剤と低沸点溶剤の比率は、高沸点溶剤が５０重量
％以上、好ましくは７５重量％以上であることが剥離性
を向上できるので好ましい。[0005] The low-boiling solvent may be any solvent having a property of dissolving a fixing resin described later, and more preferably one having a property of decomposing, dissolving, and swelling the adhesive to be peeled. Boiling point is 90 from the point of volatility enhancement
Is preferably less than ° C., more preferably 80 ° C. or less. Examples thereof include hexane, acetone, methyl ethyl ketone, ethyl alcohol, methyl alcohol, ethyl acetate, methyl acetate, ligroin, and tetrahydrofuran. These can be arbitrarily mixed and used. The ratio of the high-boiling solvent to the low-boiling solvent is preferably 50% by weight or more, more preferably 75% by weight or more , since the releasability can be improved.

【０００６】剥離液中の溶剤は酸やハロゲン系溶剤を含
有しない、非ハロゲン系の有機溶剤であることが、接続
信頼性を保持することから好ましい。また、その少なく
とも１種は窒素化合物であることが、前述の様に効率良
く剥離できるので好ましい。高沸点及び低沸点のこれら
の溶剤の粘度は、低い方が剥離すべき接着剤への浸透性
が良く好ましい。またＳＰ値は８以上、より好ましくは
１０以上が接着剤の浸触作用が大きく好ましい。さらに
非プロトン系であると自己解離しないので保存時の安定
性に優れる。The solvent in the stripping solution is preferably a non-halogen organic solvent which does not contain an acid or a halogen solvent in order to maintain connection reliability. In addition, it is preferable that at least one of them is a nitrogen compound because it can be efficiently peeled as described above. The lower the viscosity of these solvents having a high boiling point and a low boiling point, the better, because the permeability to the adhesive to be peeled is good. Further, the SP value is preferably 8 or more, more preferably 10 or more, because the contacting action of the adhesive is large. Furthermore, since it is not self-dissociated when it is an aprotic system, it is excellent in storage stability.

【０００７】本発明に用いる固定樹脂としては少なくと
も前記低沸点溶剤に可溶で、溶剤の揮発により皮膜形成
性を有すれば良い。例えばポリビニルアセタール、フェ
ノキシ、ポリエチレンテレフタレート、ポリウレタン、
ポリアミド、等のポリマー類や、ゴム等のエラストマ
類、パラフィン等のワックス類、及びフェノール樹脂や
エポキシ樹脂等の硬化前樹脂等がある。これらは、剥離
すべき接着剤に用いられている材料と同種もしくは同系
統であると、剥離後の再接続のさいに接着性を阻害しな
いので好ましい。本発明に用いる固形樹脂の溶液濃度
は、樹脂の分子量等により変動するが、好ましくは１０
％以下、より好ましくは５％以下である。濃度が高いと
剥離後の粘度が増大し剥離すべき接着剤への浸透性に劣
ることや、溶剤の絶対量の不足から剥離性が不足する。
また皮膜形成性を得る濃度の下限は０．１％程度であ
る。The fixing resin used in the present invention may be any resin which is soluble in at least the low boiling point solvent and has a film-forming property by volatilization of the solvent. For example, polyvinyl acetal, phenoxy, polyethylene terephthalate, polyurethane,
Examples include polymers such as polyamide, elastomers such as rubber, waxes such as paraffin, and resins before curing such as phenol resin and epoxy resin. It is preferable that these are the same type or the same type as the material used for the adhesive to be peeled off, since the adhesiveness is not hindered at the time of reconnection after peeling. The solution concentration of the solid resin used in the present invention varies depending on the molecular weight of the resin and the like.
%, More preferably 5% or less. If the concentration is high, the viscosity after peeling increases, and the permeability to the adhesive to be peeled is poor, and the peelability is insufficient due to the shortage of the absolute amount of the solvent.
The lower limit of the concentration for obtaining the film forming property is about 0.1%.

【０００８】必要に応じて用いる揺変性付与剤として
は、一般的な微小粒径の粒子類が適用できる。これらを
例示すると、炭酸カルシウムやマグネシウム等の炭酸
塩、水酸化アルミニウムやマグネシウム等の水酸化物、
酸化亜鉛やマグネシウム等の酸化物、シリカやスメクタ
イト、タルク等のケイ酸及びケイ酸塩、スチレンやエポ
キシ樹脂等のポリマ粒子類等がある。ポリマ粒子類の場
合、溶剤による変質防止のため架橋体が好ましい。これ
ら粒子は、添加量をは少なくしても揺変性を得られるこ
とから、粒径１０μｍ以下が好ましく、粒径１μｍ以下
がより好ましい。またこれら粒子は任意に混合して用い
ることもできる。[0008] As the thixotropic agent used as required, particles having a general fine particle size can be used. When these are exemplified, carbonates such as calcium carbonate and magnesium, hydroxides such as aluminum hydroxide and magnesium,
There are oxides such as zinc oxide and magnesium, silicic acids and silicates such as silica, smectite and talc, and polymer particles such as styrene and epoxy resin. In the case of polymer particles, a crosslinked product is preferable for preventing deterioration by a solvent. These particles have a particle size of preferably 10 μm or less, more preferably 1 μm or less, since thixotropic properties can be obtained even with a small amount of addition. Further, these particles can be arbitrarily mixed and used.

【０００９】以上よりなる剥離用組成物を用いた剥離方
法について説明する。まず補修を要する接続部の相互の
接合部を必要に応じて剥離させ、剥離を要する接着剤面
を露出させる。この時例えば接着剤のガラス転移点以上
に加熱しながら行うと剥離が容易である。補修面積が微
小の場合や、接合部に剥離用組成物が簡単に侵入出来る
場合には本工程は省略することもできる。次に、剥離を
要する接着剤露出面に剥離用組成物を形成し暫時接触さ
せる。形成手段としては、剥離用組成物が液状なので、
例えば刷毛、デイスペンサ、シルクスクリーン等、適宜
選択出来る。この時周辺部への悪影響を防止するためマ
スキングテープ等により、除去しない部分を保護しても
良い。接触時間は、接着剤を分解または溶解する時間で
決定する。この時高沸点溶剤の揮発を抑制出来る程度に
加熱しながら行うと、接着剤を分解または溶解すること
がさらに容易となり作業時間の短縮に有効である。この
後、剥離用組成物の形成面を布、紙、綿棒等で拭き取る
か、これらに溶剤を含浸させたもので拭き取る等によ
り、接着剤を取り除き清浄化する。A peeling method using the above-described peeling composition will be described. First, the mutual joints of the connection portions requiring repair are peeled off as necessary, and the adhesive surface requiring peeling is exposed. At this time, for example, if the heating is performed at a temperature higher than the glass transition point of the adhesive, the peeling is easy. This step can be omitted when the repair area is small or when the peeling composition can easily enter the joint. Next, a peeling composition is formed on the exposed surface of the adhesive which needs to be peeled off, and is brought into contact with the adhesive temporarily. As a forming means, since the peeling composition is liquid,
For example, a brush, a dispenser, a silk screen, or the like can be appropriately selected. At this time, a portion which is not removed may be protected by a masking tape or the like in order to prevent a bad influence on a peripheral portion. The contact time is determined by the time for dissolving or dissolving the adhesive. At this time, if the heating is performed to such an extent that the volatilization of the high boiling point solvent can be suppressed, the adhesive can be more easily decomposed or dissolved, which is effective in shortening the working time. Thereafter, the surface on which the release composition is formed is wiped off with a cloth, paper, a cotton swab, or the like, or wiped with a solvent impregnated with the composition to remove the adhesive and clean.

【００１０】[0010]

【作用】本発明によれば、剥離を要する接着剤部に剥離
用組成物を形成し暫時接触させる。この時、組成物中に
沸点の異なる２種以上の溶剤を含有しているので、低沸
点溶剤が先に揮発し、固形樹脂が前記低沸点溶剤に可溶
であるため溶剤の揮発により表面に皮膜を形成する。図
１に示すように、基板１上に剥離すべき接着剤２が存在
し、皮膜４内に残った高沸点溶剤３は、沸点が高いこと
に加えて皮膜４に保護されているので揮発し難く、剥離
を要する接着剤２と任意の時間接触することができ、接
着剤を分解または溶解あるいは膨潤等により剥離可能な
状態にする。必要に応じて用いる揺変性付与剤は、剥離
用組成物に揺変性を付与するので、剥離を要する接着剤
部に剥離用組成物を形成する時は低粘度のため形成が容
易であるが、形成した後増粘剤として作用し必要部外へ
の流出を防ぎ補修が必要な部分のみへの形成を容易にす
る。剥離用組成物中には接着剤を分解または溶解膨潤す
る性質が大きい窒素化合物類が含まれ、有機溶剤のみな
ので接続信頼性を保持することが可能であり、剥離液中
に酸やハロゲン系溶剤を含有しない場合には、特にこの
効果が顕著である。According to the present invention, a peeling composition is formed on the adhesive part which needs to be peeled off, and is brought into contact with the adhesive for a while. At this time, since the composition contains two or more solvents having different boiling points, the low-boiling solvent volatilizes first, and the solid resin is soluble in the low-boiling solvent. Form a film. As shown in FIG. 1, the adhesive 2 to be peeled off is present on the substrate 1, and the high-boiling solvent 3 remaining in the coating 4 is volatile because it is protected by the coating 4 in addition to having a high boiling point. It is difficult to make contact with the adhesive 2 that requires peeling for an arbitrary time, and the adhesive is decomposed, dissolved, or swelled to make it peelable. The thixotropic agent used as needed imparts thixotropic to the release composition, so when forming the release composition in the adhesive portion that needs to be released, it is easy to form because of low viscosity, After forming, it acts as a thickener to prevent it from flowing out of the required part and facilitates formation only in the part requiring repair. The stripping composition contains nitrogen compounds that have a large property of decomposing or dissolving and swelling the adhesive.Since only organic solvents are used, connection reliability can be maintained. This effect is particularly remarkable when no is contained.

【００１１】[0011]

【実施例】以下、本発明を実施例により具体的に説明す
る。 実施例１〜３ （１）剥離用組成物の作製 エピコート１０１０（ビスフェノールＡ型固形エポキシ
樹脂、油化シェルエポキシ株式会社製商品名、ＥＰと
略）を、表１に示す配合比（重量比）によりメチルエチ
ルケトン（ＭＥＫと略）とＮ−メチルピロリドリン（Ｎ
ＭＰと略）の混合溶媒に溶解し５％溶液を得た。 （２）接続体 ＩＴＯ回路端子を有するガラス基板と、接続幅が１０ｍ
ｍＦＰＣ回路基板（いずれも回路幅５０μｍ、回路間隔
５０μｍ）３枚を間隔０．５ｍｍで、異方導電性接着フ
ィルム（エポキシ系接着剤が主成分、日立化成工業株式
会社製商品名、アニソルムＡＣ−７１０３、厚み２５μ
ｍ）を用いて、１７０℃−２０ｋｇ／ｃｍ² −２０秒で
導電接続した。本接続条件により接着剤は硬化し十分な
接続信頼性が得られたことを確認した。 （３）剥離 上記（２）の接続体の中央のＦＰＣ回路基板のみを、機
械的に静かに剥した。このガラス基板及びＦＰＣ回路基
板の剥離面には接続により硬化した接着剤が残存した。
この剥離面上に（１）の剥離用組成物をテフロン製のス
パチュラにより厚さ約２〜３ｍｍとなるように形成し
た。その状態で３０分放置した後、綿棒でこすり接着剤
及び剥離用組成物を除去し、さらにアセトンを含有した
綿棒で清浄化した。同様にＦＰＣ回路も清浄化した。両
者とも剥離用組成物の他部への浸透がなく必要部のみの
剥離が可能であった。 （４）再接続 前項で得た清浄化したガラス基板及びＦＰＣを用いて、
前記と同様にＡＣ−７１０３により再接続した。再接続
を行ったＦＰＣ回路部の接続抵抗及び、これと隣接する
ＦＰＣ回路の接続抵抗と、接着剤の除去を実施する前の
接続抵抗との差は、±０．５Ω以内で、各実施例とも接
続抵抗の上昇は見られなかった。The present invention will be described below in more detail with reference to examples. Examples 1 to 3 (1) Preparation of Peeling Composition Epicoat 1010 (Bisphenol A type solid epoxy resin, trade name, made by Yuka Shell Epoxy Co., Ltd., abbreviated as EP) was mixed at the compounding ratio (weight ratio) shown in Table 1. And methyl ethyl ketone (abbreviated as MEK) and N-methylpyrrolidrin (N
MP) to obtain a 5% solution. (2) Connection body A glass substrate having an ITO circuit terminal and a connection width of 10 m
Three mFPC circuit boards (each having a circuit width of 50 μm and a circuit interval of 50 μm) are spaced at 0.5 mm intervals, and an anisotropic conductive adhesive film (mainly composed of an epoxy-based adhesive, trade name, manufactured by Hitachi Chemical Co., Ltd., Anisolm AC- 7103, thickness 25μ
m) at 170 ° C.-20 kg / cm ² A conductive connection was made in -20 seconds. It was confirmed that the adhesive was cured under these connection conditions and sufficient connection reliability was obtained. (3) Peeling Only the FPC circuit board at the center of the connection body of (2) was mechanically gently peeled off. The adhesive cured by the connection remained on the peeled surfaces of the glass substrate and the FPC circuit board.
On the release surface, the release composition of (1) was formed to a thickness of about 2 to 3 mm using a Teflon spatula. After allowing to stand in that state for 30 minutes, the adhesive and the stripping composition were removed by rubbing with a cotton swab and further cleaned with a cotton swab containing acetone. Similarly, the FPC circuit was cleaned. In both cases, there was no permeation into the other part of the peeling composition, and only the necessary part was peelable. (4) Reconnection Using the cleaned glass substrate and FPC obtained in the previous section,
The connection was reconnected by AC-7103 as described above. The difference between the connection resistance of the reconnected FPC circuit part, the connection resistance of the FPC circuit adjacent to the FPC circuit part, and the connection resistance before the removal of the adhesive was within ± 0.5Ω. No increase in connection resistance was observed.

【００１２】 比較例１〜２ 実施例１〜３と同様であるが、剥離用組成物の配合比を
表１のように変更した。比較例１の場合低沸点溶剤を含
まないので、比較例２の場合固形樹脂を含まないので、
それぞれ剥離用組成物を形成放置した際に皮膜が形成さ
れにくく、隣接するＦＰＣ回路部にまで流れてしまい接
続抵抗が上昇した。また、剥離を要する接着剤の剥離液
量が流出により減少し接着剤の除去も困難であった。Comparative Examples 1 and 2 Same as Examples 1 to 3, except that the mixing ratio of the release composition was changed as shown in Table 1. Comparative Example 1 does not contain a low boiling point solvent, and Comparative Example 2 does not contain a solid resin.
When each of the peeling compositions was formed and allowed to stand, a film was not easily formed, and the composition flowed to the adjacent FPC circuit portion, and the connection resistance increased. In addition, the amount of the stripping solution of the adhesive that needs to be stripped decreases due to the outflow, and it is difficult to remove the adhesive.

【表１】 [Table 1]

【００１３】 実施例４〜６ 実施例１と同様であるが、剥離用組成物中にアエロジル
３８０（無水シリカ、粒径約０．０７μｍ、ＢＥＴ法比
面積３８０ｍ²／ｇ、ＡＥＲと略）を乳鉢で練り添加し
た。配合比は表１のように変更した。各実施例とも剥離
用組成物が揺変性を有しているので形成が容易であり、
形成後の静置により増粘して必要部外への流出を防ぎ補
修が必要な部分のみへの形成が、実施例１〜３に比べ容
易であった。実施例４〜６においては以上の様に、剥離
用組成物の他部への浸透がなく、必要部のみ剥離が可能
であった。また再接続部の接続抵抗の上昇は見られず良
好な再接続が可能であった。Examples 4 to 6 Same as Example 1, except that Aerosil 380 (anhydrous silica, particle size of about 0.07 μm, BET specific area 380 m ² / g, abbreviated as AER) is contained in the release composition. The mixture was kneaded in a mortar and added. The mixing ratio was changed as shown in Table 1. Since the peeling composition has thixotropic properties in each example, it is easy to form,
It was easy to form only the portion that needed to be repaired by increasing the viscosity by standing still after the formation and preventing it from flowing out of the required portion as compared with Examples 1 to 3. As described above, in Examples 4 to 6, there was no permeation into other parts of the stripping composition, and only necessary parts could be stripped. Also, no increase in the connection resistance of the reconnection portion was observed, and good reconnection was possible.

【００１４】実施例７〜１３ 実施例５と同様であるが、剥離用組成物の種類と組成を
かえた。すなわち固形樹脂としてパラプレンＰ２５Ｍ
（ポリウレタン樹脂、日本エラストラン株式会社商品
名、ＰＵと略）を用い、溶剤の低沸点成分として以下を
用いた。テトラヒドロフラン（沸点６６℃、ＳＰ値９．
２、実施例７、ＴＨＦと略）、リグロイン（沸点７５〜
１２０℃、ＳＰ値８．２、実施例８、ＲＩＧと略）、メ
チルアルコール（沸点６５、ＳＰ値１４．８、実施例
９、ＭＯＨと略）、アセトン（沸点５６、ＳＰ値９．
８、実施例１０、ＡＣＥと略）である。また溶剤の高低
沸点成分として新しく以下も用いた。Ｎ，Ｎ−ジメチル
ホルムアミド（実施例１１、ＤＭＦと略）、Ｎ，Ｎ−ジ
メチルアセトアミド（実施例１２、ＤＭＡと略）、Ｎ−
メチルホルムアミド（実施例１３，ＭＦＡと略）であ
る。さらに揺変剤としてスメクタイトＳＡＮ（合成スメ
クタイト、実施例１１〜１３、ＳＡＮと略）を、アエロ
ジル３８０に変えて用いた。各実施例とも剥離用組成物
の他部への浸透がなく、必要部のみ剥離が可能であっ
た。また再接続部の接続抵抗の上昇は見られず良好な再
接続が可能であった。Examples 7 to 13 The same as Example 5, except that the type and composition of the peeling composition were changed. That is, as a solid resin, Paraprene P25M
(Polyurethane resin, trade name of Nippon Elastran Co., Ltd., abbreviated as PU), and the following were used as low boiling components of the solvent. Tetrahydrofuran (boiling point 66 ° C., SP value 9.
2, Example 7, abbreviated as THF), ligroin (boiling point: 75 to
120 ° C., SP value 8.2, Example 8, abbreviated as RIG), methyl alcohol (boiling point 65, SP value 14.8, Example 9, abbreviated as MOH), acetone (boiling point 56, SP value 9.
8, Example 10, abbreviated as ACE). The following were also newly used as high and low boiling components of the solvent. N, N-dimethylformamide (Example 11, abbreviated as DMF), N, N-dimethylacetamide (Example 12, abbreviated as DMA), N-
This is methylformamide (Example 13, abbreviated as MFA). Further, as a thixotropic agent, smectite SAN (synthetic smectite, Examples 11 to 13, abbreviated as SAN) was used instead of Aerosil 380. In each of the examples, there was no permeation into the other part of the peeling composition, and only the necessary part was peelable. Also, no increase in the connection resistance of the reconnection portion was observed, and good reconnection was possible.

【００１５】実施例１４〜１５ 実施例１及び実施例１１の剥離用組成物を用いて、接続
体の構成を変えた。すなわち、ガラス基板としてガラス
板上に半導体チップ（３×１０ｍｍ、高さ０．５ｍｍ、
主面の４辺周囲にバンプと呼ばれる５０μｍ角、高さ２
０μｍの突起した金電極が形成）のバンプ配置と対応し
た接続端子を有するＩＴＯ回路を形成した基板と半導体
チップを用意した。実施例１と同様にアニソルムＡＣ−
７１０３、厚み２５μｍ）を用いて、１７０℃−５０ｇ
／バンプ−２０秒で導電接続した。本接続条件により接
着剤は硬化し十分な接続信頼性が得られることを確認し
た。接続体を熱板上で約１５０℃に加熱しながら、剪断
力を加えて機械的に静かに剥した。この剥離面上に実施
例１と同様に剥離用組成物を形成し、放置、除去、清浄
化、再接続した。両者とも剥離用組成物の他部への浸透
がなく、必要部のみの剥離が可能であった。また再接続
後の接続抵抗の上昇は見られなかった。Examples 14 and 15 The composition of the connector was changed using the stripping compositions of Examples 1 and 11. That is, a semiconductor chip (3 × 10 mm, height 0.5 mm,
50 μm square, height 2 called bumps around four sides of the main surface
A substrate and a semiconductor chip on which an ITO circuit having connection terminals corresponding to the bump arrangement (forming a protruding gold electrode of 0 μm) were prepared. Anisorm AC-
7103, thickness 25 μm), 170 ° C.-50 g
/ Bump-Conductive connection in 20 seconds. It was confirmed that the adhesive was cured under these connection conditions and sufficient connection reliability was obtained. While the connection body was heated to about 150 ° C. on a hot plate, a shearing force was applied to mechanically and gently peeled off. A release composition was formed on the release surface in the same manner as in Example 1, and left, removed, cleaned, and reconnected. In both cases, there was no permeation into other parts of the stripping composition, and only the necessary parts could be stripped. No increase in connection resistance after reconnection was observed.

【００１６】実施例１６〜１７ 実施例１４〜１５と同様であるが、接続体を剥離せず図
２に示すように、基板１と半導体チップ５のバンプ６と
の接続体周囲の接着剤２のはみ出し部に、剥離用組成物
を形成し、剥離すべき接着剤２の表面を、皮膜４で覆わ
れた溶剤３を接触させ、２４時間放置後に剥離したとこ
ろ、簡単に剥離できた。以下実施例１４〜１５と同様な
評価を行ったが、再接続後の接続抵抗の上昇は見られな
かった。Embodiments 16 and 17 The same as in Embodiments 14 and 15, but without peeling off the connection body, as shown in FIG. 2, the adhesive 2 around the connection body between the substrate 1 and the bumps 6 of the semiconductor chip 5 is used. A peeling composition was formed on the protruding portion, and the surface of the adhesive 2 to be peeled was brought into contact with the solvent 3 covered with the film 4 and peeled off after standing for 24 hours. Thereafter, the same evaluation as in Examples 14 and 15 was performed, but no increase in connection resistance after reconnection was observed.

【００１７】[0017]

【発明の効果】本発明によれば、必要部のみに剥離用組
成物を液状のまま形成できるので、接着剤を効率良く剥
離でき作業性に優れる。また剥離液中の溶剤は、有機溶
剤のみなので接続信頼性を保持することが可能である。According to the present invention, since the peeling composition can be formed in a liquid state only on the necessary parts, the adhesive can be peeled efficiently and the workability is excellent. Further, since the solvent in the stripping solution is only an organic solvent, it is possible to maintain connection reliability.

【図面の簡単な説明】[Brief description of the drawings]

【図１】接着部に本願剥離用組成物を形成した状況を示
す模式断面図である。FIG. 1 is a schematic cross-sectional view showing a state in which a peeling composition of the present invention is formed on an adhesive portion.

【図２】接着部に本願剥離用組成物を形成した状況を示
す他の模式断面図である。FIG. 2 is another schematic cross-sectional view showing a state in which the composition for peeling of the present application is formed on an adhesive portion.

【符号の説明】[Explanation of symbols]

１ 基板 ２ 接着剤 ３ 溶剤 ４ 皮膜 ５ 半導体チップ ６ バンプ DESCRIPTION OF SYMBOLS 1 Substrate 2 Adhesive 3 Solvent 4 Film 5 Semiconductor chip 6 Bump

───────────────────────────────────────────────────── フロントページの続き (72)発明者 太田 共久 茨城県下館市大字小川1500番地 日立化 成工業株式会社 下館研究所内 (72)発明者 山口 豊 茨城県下館市大字小川1500番地 日立化 成工業株式会社 下館研究所内 (56)参考文献 特開 昭60−20982（ＪＰ，Ａ) (58)調査した分野(Int.Cl.⁶，ＤＢ名) C09J 5/00 C09K 13/00 H01R 43/00 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor, Kyohisa Ota, 1500, Oji, Oji, Shimodate-shi, Ibaraki Hitachi Chemical Co., Ltd. (56) References JP-A-60-20982 (JP, A) (58) Fields investigated (Int. Cl. ⁶ , DB name) C09J 5/00 C09K 13/00 H01R 43/00

Claims (4)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】 沸点の異なる２種以上の溶剤と、少なく
とも前記低沸点溶剤に可溶な固形樹脂とよりなり、前記
沸点の異なる溶剤は沸点が９０℃以上の溶剤７５重量％
以上と沸点が９０℃未満の残余の溶剤とよりなる回路接
続用接着剤の剥離用組成物。And 1. A two or more solvents having different boiling points, and more become soluble solid resin at least in the low-boiling solvent, the
Solvents with different boiling points are solvents with a boiling point of 90 ° C or more 75% by weight
A circuit connection comprising the above and a residual solvent having a boiling point of less than 90 ° C.
A composition for stripping a continuous adhesive . 【請求項２】 沸点の異なる２種以上の溶剤と、少なく
とも前記低沸点溶剤に可溶な固形樹脂と、揺変性付与剤
とよりなり、前記沸点の異なる溶剤は沸点が９０℃以上
の溶剤７５重量％以上と沸点が９０℃未満の残余の溶剤
とよりなる回路接続用接着剤の剥離用組成物。2. A solvent comprising at least two solvents having different boiling points, a solid resin soluble in at least the low boiling point solvent, and a thixotropic agent, wherein the solvent having a different boiling point has a boiling point of 90 ° C. or higher.
Solvent of 75% by weight or more and residual solvent having a boiling point of less than 90 ° C.
A composition for stripping an adhesive for circuit connection comprising: 【請求項３】 沸点の異なる２種以上の溶剤は非ハロゲ
ン系の有機溶剤であり、その少なくとも１種は窒素化合
物であり、回路接続用接着剤が熱もしくは紫外線硬化型
の接着剤である請求項１または２記載の剥離用組成物3. The method of claim 2, wherein the two or more solvents having different boiling points are non-halogen organic solvents, at least one of which is a nitrogen compound, and the adhesive for circuit connection is a heat or ultraviolet curing adhesive. Item | item 1. The stripping composition of 1 or 2 . 【請求項４】 剥離を要する回路接続用接着剤の接着剤
部に請求項１乃至３のいずれかに記載の組成物を形成
し、暫時接触後にこれを取り除き清浄化する工程を含む
剥離方法。4. A peeling method comprising a step of forming the composition according to claim 1 on an adhesive portion of a circuit connection adhesive requiring peeling, removing the composition after temporary contact, and cleaning the composition.