JP2887408B2 - Wafer cleaning equipment - Google Patents
Wafer cleaning equipmentInfo
- Publication number
- JP2887408B2 JP2887408B2 JP21301190A JP21301190A JP2887408B2 JP 2887408 B2 JP2887408 B2 JP 2887408B2 JP 21301190 A JP21301190 A JP 21301190A JP 21301190 A JP21301190 A JP 21301190A JP 2887408 B2 JP2887408 B2 JP 2887408B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- rotating body
- magnetic
- rotating
- wafer cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体を製造するための基板、即ちウエハを
ジェット液流、ブラシ等により両面同時に洗浄するウエ
ハ洗浄装置に関するものである。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer cleaning apparatus for simultaneously cleaning both surfaces of a substrate for manufacturing a semiconductor, that is, a wafer, using a jet stream, a brush, or the like.
従来、ウエハの両面を同時に洗浄するウエハ洗浄装置
は、第２図に示すように構成されていた。第２図におい
て、被洗浄物であるウエハ21の外周部をチャック22によ
り保持し、電動機23を適当な回転数で回転させながらウ
エハ21の上下両面にジェット液流24a,25aをノズル24,25
で噴射させて洗浄するか又はブラシ26でウエハ21の表面
を洗浄している。このときウエハ21の裏面に関しては電
動機23の回転軸が妨げとなり、各種の洗浄方法が適用で
きず、チャック22の支柱22aの間隙よりジェット液流25a
をウエハ21の裏面に当る程度の洗浄しかおこなえなかっ
た。Conventionally, a wafer cleaning apparatus for simultaneously cleaning both sides of a wafer has been configured as shown in FIG. In FIG. 2, the outer peripheral portion of a wafer 21 to be cleaned is held by a chuck 22, and jet liquid flows 24a, 25a are applied to upper and lower surfaces of the wafer 21 by rotating a motor 23 at an appropriate number of rotations.
The surface of the wafer 21 is cleaned with a brush 26. At this time, the rotating shaft of the electric motor 23 hinders the back surface of the wafer 21, and various cleaning methods cannot be applied, and the jet liquid flow 25 a flows from the gap between the columns 22 a of the chuck 22.
Could only be washed to the extent that it hits the back surface of the wafer 21.
上述したように、従来の洗浄装置においては、電動機
23の回転軸がウエハ21の裏側に存在するため、ウエハ21
の裏面の洗浄を十分に行なうことが困難であった。As described above, in the conventional cleaning device, the electric motor
Since the rotation axis of 23 exists on the back side of the wafer 21, the wafer 21
It was difficult to sufficiently clean the back surface of.
本発明は上述の点に鑑みてなされたもので、ウエハの
裏面にも種々の洗浄手段が適用できるウエハ洗浄装置を
提供することを目的とする。The present invention has been made in view of the above points, and has as its object to provide a wafer cleaning apparatus in which various cleaning means can be applied to the back surface of a wafer.
上記課題を解決するため請求項（１）に記載の発明
は、ウエハ洗浄装置を、ウエハ洗浄手段を具備し、ウエ
ハの外周部を保持するチャックを円筒状の回転体上に設
置し、該回転体を磁気軸受により浮上保持し、さらに回
転体に設けられロータ磁性体と、該ロータ磁性体に対向
して配置されたステータコイルからなる電動機で前記回
転体に回転力を与える構成とした。According to a first aspect of the present invention, there is provided a wafer cleaning apparatus including a wafer cleaning unit, a chuck for holding an outer peripheral portion of a wafer being mounted on a cylindrical rotating body, and The body is levitated and held by a magnetic bearing, and a rotating force is applied to the rotating body by an electric motor including a rotor magnetic body provided on the rotating body and a stator coil arranged to face the rotor magnetic body.
また、請求項（２）に記載の発明は、ウエハ洗浄装置
を、ウエハ洗浄手段を具備し、ウエハの外周部を保持す
るチャックを円筒状の回転体上に設置し、該回転体を磁
気軸受により浮上保持し、さらに回転体に設けられロー
タ磁性体と、該ロータ磁性体に対向して配置されたステ
ータコイルからなる電動機で回転体に回転力を与える構
成とし、ウエハ洗浄手段はウエハの表面は回転体の外側
から裏面は回転体の内側から洗浄するように構成し、ウ
エハの表裏両面を同時洗浄できるようにする。According to a second aspect of the present invention, there is provided a wafer cleaning apparatus, comprising a wafer cleaning means, a chuck for holding an outer peripheral portion of a wafer installed on a cylindrical rotating body, and the rotating body being a magnetic bearing. And a rotating motor provided with a rotor magnetic body provided on the rotating body and a stator coil disposed opposite to the rotor magnetic body to apply a rotating force to the rotating body. Is designed so that the back surface is cleaned from the outside of the rotator and the back surface is cleaned from the inside of the rotator so that both the front and back surfaces of the wafer can be cleaned simultaneously.
また、請求項（３）に記載の発明は、請求項（２）に
記載のウエハ洗浄装置において、磁気軸受及び電動機を
金属板で覆い、キャンド構造とした。According to a third aspect of the present invention, in the wafer cleaning apparatus according to the second aspect, the magnetic bearing and the electric motor are covered with a metal plate to form a canned structure.
請求項（１）に記載の発明によれば、回転体を磁気軸
受により非接触で支承するから、通常の接触型軸受を用
いる場合に問題となる発塵による汚染がない。According to the invention described in claim (1), since the rotating body is supported by the magnetic bearing in a non-contact manner, there is no contamination due to dust generation which is a problem when a normal contact type bearing is used.
また、請求項（２）に記載の発明によれば、ウエハは
中心部に回転軸を持たない円筒状の回転体上に設置され
たチャックに支持されているため、ウエハの裏面両面、
特に裏面を回転体の内側から洗浄できるため、両面同時
に最適な洗浄手段を用いて洗浄することが可能となる。According to the invention described in claim (2), since the wafer is supported by the chuck installed on the cylindrical rotating body having no rotation axis at the center, the both sides of the back surface of the wafer are supported.
In particular, since the back surface can be cleaned from the inside of the rotating body, it is possible to clean both surfaces simultaneously using an optimum cleaning means.
また、請求項（３）に記載の発明によれば、磁気軸受
及び電動機を金属板で覆い、キャンド構造としたので、
防水、防錆効果が向上する。According to the invention described in claim (3), since the magnetic bearing and the electric motor are covered with the metal plate to have the canned structure,
Waterproofing and rustproofing effect are improved.
以下、本発明の一実施例を図面に基づいて説明する。 Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
第１図は本発明のウエハ洗浄装置の構成を示す図であ
る。ウエハ１は円筒状の回転体３の上に設置されたチャ
ック２により外周部を保持されるようになっている。回
転体３は同じく円筒状の固定体４に、ラジアル磁気軸受
5,6とスラスト磁気軸受7,8で浮上保持されるようになっ
ている。ラジアル磁気軸受5,6は、前記回転体３に外周
部に設けられた回転側の磁性体部材5b,6bと前記固定体
４の内周部に該磁性体部材5b,6bに対向して設けられた
固定側の電磁コイル5a,6aにより構成され、スラスト磁
気軸受7,8は前記回転体３の上下に設けられたリング状
の回転側の磁性体部材7b,8bと前記固定体４の上下に磁
性体部材7b,8bに対向して設けられた固定側の電磁コイ
ル7a,8aにより構成されている。ラジアル磁気軸受５と
ラジアル磁気軸受６の間には電動機12が配置されてい
る。該電動機12は回転体３の外周部に設けられたロータ
磁性体12bと固定体４の内周部に該ロータ磁性体12bに対
向した配置されたステータコイル12aからなる。FIG. 1 is a view showing a configuration of a wafer cleaning apparatus of the present invention. The outer periphery of the wafer 1 is held by a chuck 2 installed on a cylindrical rotating body 3. The rotating body 3 has a cylindrical magnetic body 4 and a radial magnetic bearing.
The floating bearings 5 and 6 and the thrust magnetic bearings 7 and 8 are used. Radial magnetic bearings 5 and 6 are provided on the rotating body 3 on the rotating side so as to be opposed to the rotating magnetic members 5b and 6b, and on the inner periphery of the fixed body 4 so as to face the magnetic members 5b and 6b. Thrust magnetic bearings 7, 8 are provided above and below the rotating body 3 and are provided with ring-shaped rotating-side magnetic members 7b, 8b provided above and below the rotating body 3, and vertically above and below the fixed body 4. And fixed magnetic coils 7a, 8a provided opposite the magnetic members 7b, 8b. An electric motor 12 is arranged between the radial magnetic bearing 5 and the radial magnetic bearing 6. The electric motor 12 includes a rotor magnetic body 12b provided on the outer periphery of the rotating body 3 and a stator coil 12a arranged on the inner periphery of the fixed body 4 so as to face the rotor magnetic body 12b.
スラスト磁気軸受７を構成する磁性体部材7bと電磁コ
イル7aの間隙及びスラスト磁気軸受８を構成する磁性体
部材8bと電磁コイル8aの間隙はスラスト方向間隙センサ
９により検出されるようになっている。また、ラジアル
磁気軸受５を構成する磁性体部材5bと電磁コイル5aの間
隙はラジアル方向間隙センサ10で検知され、ラジアル磁
気軸受６を構成する磁性体部材6bと電磁コイル6aの間隙
はラジアル方向間隙センサ11で検知されるようになって
いる。The gap between the magnetic member 7b constituting the thrust magnetic bearing 7 and the electromagnetic coil 7a and the gap between the magnetic member 8b constituting the thrust magnetic bearing 8 and the electromagnetic coil 8a are detected by a thrust direction gap sensor 9. . The gap between the magnetic member 5b forming the radial magnetic bearing 5 and the electromagnetic coil 5a is detected by the radial gap sensor 10, and the gap between the magnetic member 6b forming the radial magnetic bearing 6 and the electromagnetic coil 6a is defined as the radial gap. The detection is performed by the sensor 11.
外側にはノズル13と回転ブラシ14とが配置されてお
り、回転体３の内側にはノズル15と回転ブラシ16とが配
置されている。ウエハ１の表面にはノズル13からジェッ
ト液流13aが噴射されるようになっており、更に回転ブ
ラシ14が当接するようになっている。また、ウエハ１の
裏面にはノズル15からジェット液流15aが噴射されるよ
うになっており、更に回転ブラシ16が当接するようにな
っている。なお、前記固定体４は装置の枠体17内に固定
されている。また、18は汚れた洗浄液等を排出するため
の排出口である。A nozzle 13 and a rotating brush 14 are arranged outside, and a nozzle 15 and a rotating brush 16 are arranged inside the rotating body 3. A jet liquid flow 13a is jetted from a nozzle 13 onto the surface of the wafer 1, and a rotating brush 14 is further brought into contact therewith. Further, a jet liquid flow 15a is jetted from the nozzle 15 to the back surface of the wafer 1, and the rotating brush 16 is further brought into contact therewith. The fixed body 4 is fixed in a frame 17 of the apparatus. Reference numeral 18 denotes a discharge port for discharging dirty cleaning liquid and the like.
上記構成のウエハ洗浄装置において、スラスト方向間
隙センサ９の出力信号によりスラスト磁気軸受７の電磁
コイル7a及びスラスト磁気軸受８の電磁コイル8aに流れ
る励磁電流を制御することにより、電磁コイル7aと磁性
体部材7bの間隙及び電磁コイル8aと磁性体部材8bの間隙
が所定の値に保持される。また、ラジアル方向間隙セン
サ10の出力信号によりラジアル磁気軸受５の電磁コイル
5aに流れる励磁電流を制御することにより、該電磁コイ
ル5aと磁性体部材5bの間隙が所定の値に保持され、ラジ
アル方向間隙センサ11の出力信号によりラジアル磁気軸
受６の電磁コイル6aに流れる励磁電流を制御することに
より、該電磁コイル6aと磁性体部材6bの間隙が所定の値
に保持される。そして、電動機12のステータコイル12a
に駆動電流を供給することにより、電動機12は駆動し、
回転体３が回転する。これにより、ウエハ１の表面はノ
ズル13からのジェット液流13aと回転ブラシ14により洗
浄されると共に、ウエハ１の裏面はノズル15からのジェ
ット液流15aと回転ブラシ16により洗浄される。即ち、
ウエハ１の表裏両面が同時に洗浄されることになる。洗
浄後は回転体３の回転速度を高めることによりウエハ１
の面の水分を遠心力で振り切って乾燥させることができ
る。In the wafer cleaning apparatus having the above-described configuration, the electromagnetic coil 7a of the thrust magnetic bearing 7 and the exciting current flowing through the electromagnetic coil 8a of the thrust magnetic bearing 8 are controlled by the output signal of the thrust direction gap sensor 9 so that the electromagnetic coil 7a The gap between the members 7b and the gap between the electromagnetic coil 8a and the magnetic member 8b are maintained at predetermined values. In addition, the electromagnetic coil of the radial magnetic bearing 5 is output by the output signal of the radial gap sensor
By controlling the exciting current flowing through the electromagnetic coil 5a, the gap between the electromagnetic coil 5a and the magnetic member 5b is maintained at a predetermined value, and the exciting signal flowing through the electromagnetic coil 6a of the radial magnetic bearing 6 is output by the output signal of the radial gap sensor 11. By controlling the current, the gap between the electromagnetic coil 6a and the magnetic member 6b is maintained at a predetermined value. And, the stator coil 12a of the electric motor 12
By supplying a drive current to the motor 12, the motor 12 is driven,
The rotating body 3 rotates. Thus, the front surface of the wafer 1 is cleaned by the jet liquid flow 13a from the nozzle 13 and the rotating brush 14, and the back surface of the wafer 1 is cleaned by the jet liquid flow 15a from the nozzle 15 and the rotating brush 16. That is,
Both the front and back surfaces of the wafer 1 are cleaned at the same time. After the cleaning, the rotation speed of the rotating body 3 is increased to increase the wafer 1
The water on the surface can be shaken off by centrifugal force and dried.
なお、上記実施例では、５軸制御型磁気軸受けを例と
して挙げており、ラジアル方向間隙センサ10,11とラジ
アル磁気軸受5,6、スラスト方向間隙センサ９とスラス
ト磁気軸受7,8及び電動機12を第１図に示すような配置
とすることにより構成しているが、磁気軸受及び電動機
の構成はこの他にも種々の形式が考えられ、この例に限
定されるものでないことは当然である。In the above embodiment, the five-axis control type magnetic bearing is taken as an example, and the radial gap sensors 10 and 11 and the radial magnetic bearings 5 and 6, the thrust gap sensor 9 and the thrust magnetic bearings 7 and 8, and the motor 12 Are arranged as shown in FIG. 1. However, it is natural that the magnetic bearing and the electric motor may have various other configurations, and are not limited to this example. .
また、必要に応じて回転体３、固定体４の表面を金属
の薄板で覆って所謂キャンド型とすることにより、防
水、防錆効果を向上させることができる。In addition, if necessary, the surfaces of the rotating body 3 and the fixed body 4 are covered with a thin metal plate to form a so-called can type, so that the waterproof and rustproof effects can be improved.
また、上記実施例では、洗浄手段としてノズルからジ
ェット液流を噴射される方法とブラシを当接される方法
を示したが、洗浄手段はこれに限定されるものではな
く、他の方法、例えばドライアイス噴流、超音波液流等
を適用することも可能である。Further, in the above-described embodiment, the method of jetting the jet liquid stream from the nozzle and the method of contacting the brush as the cleaning means have been described, but the cleaning means is not limited to this, and other methods, for example, It is also possible to apply a dry ice jet, an ultrasonic liquid flow, or the like.
以上、説明したように本発明によれば下記のような優
れた効果が得られる。As described above, according to the present invention, the following excellent effects can be obtained.
（１）請求項（１）に記載の発明によれば、回転体を磁
気軸受により非接触で支承するから、通常の接触型軸受
を用いる場合に問題となる発塵による汚染のないウエハ
洗浄ができるウエハ洗浄装置を提供できる。(1) According to the invention described in claim (1), since the rotating body is supported in a non-contact manner by the magnetic bearing, wafer cleaning free from dust generation which is a problem when a normal contact type bearing is used is achieved. The present invention can provide a wafer cleaning apparatus that can perform the cleaning.
（２）請求項（２）に記載の発明によれば、ウエハは中
心部に回転軸を持たない円筒状の回転体上に設置された
チャックに支持されているため、ウエハの表裏両面、特
に裏面を回転体の内側から洗浄できるため、上記効果に
加え両面同時に最適な洗浄手段を用いて洗浄することが
できるウエハ洗浄装置を提供できる。(2) According to the invention described in claim (2), since the wafer is supported by the chuck mounted on a cylindrical rotating body having no rotation axis at the center, both the front and back surfaces of the wafer, particularly, the wafer are supported. Since the back surface can be cleaned from the inside of the rotating body, it is possible to provide a wafer cleaning apparatus capable of cleaning both surfaces simultaneously by using an optimum cleaning means in addition to the above-described effects.
（３）請求項（３）に記載の発明によれば、磁気軸受及
び電動機を金属板で覆い、キャンド構造としたので、磁
気軸受及び電動機の防水、防錆効果が向上する。(3) According to the invention described in claim (3), since the magnetic bearing and the electric motor are covered with the metal plate and have a canned structure, the waterproof and rust-proof effects of the magnetic bearing and the electric motor are improved.
第１図は本発明のウエハ洗浄装置の構成を示す断面正面
図、第２図は従来のウエハ洗浄装置の構成を示す断面正
面図である。 図中、１……ウエハ、２……チャック、３……回転体、
４……固定体、５……ラジアル磁気軸受、６……ラジア
ル磁気軸受、７……スラスト磁気軸受、８……スラスト
磁気軸受、９……スラスト方向間隙センサ、10……ラジ
アル方向間隙センサ、11……ラジアル方向間隙センサ、
12……電動機、13……ノズル、14……回転ブラシ、15…
…ノズル、16……回転ブラシ。FIG. 1 is a cross-sectional front view showing a configuration of a wafer cleaning apparatus of the present invention, and FIG. 2 is a cross-sectional front view showing a configuration of a conventional wafer cleaning apparatus. In the figure, 1 ... wafer, 2 ... chuck, 3 ... rotary body,
4 ... fixed body, 5 ... radial magnetic bearing, 6 ... radial magnetic bearing, 7 ... thrust magnetic bearing, 8 ... thrust magnetic bearing, 9 ... thrust direction gap sensor, 10 ... radial direction gap sensor, 11 ... radial gap sensor,
12 ... electric motor, 13 ... nozzle, 14 ... rotating brush, 15 ...
... Nozzle, 16 ... Rotating brush.
Claims (3)
を保持するチャックを円筒状の回転体上に設置し、該回
転体を磁気軸受により浮上保持し、さらに回転体に設け
られたロータ磁性体と、該ロータ磁性体に対向して配置
されたステータコイルからなる電動機で前記回転体に回
転力を与える構成としたことを特徴とするウエハ洗浄装
置。1. A rotor provided with a wafer cleaning means, a chuck for holding an outer peripheral portion of a wafer is installed on a cylindrical rotary body, the rotary body is floated and held by a magnetic bearing, and a rotor provided on the rotary body is further provided. A wafer cleaning apparatus, wherein a rotating force is applied to the rotating body by an electric motor including a magnetic body and a stator coil disposed to face the rotor magnetic body.
を保持するチャックを円筒状の回転体上に設置し、該回
転体を磁気軸受により浮上保持し、さらに回転体に設け
られたロータ磁性体と、該ロータ磁性体に対向して配置
されたステータコイルからなる電動機で前記回転体に回
転力を与える構成とし、前記ウエハ洗浄手段はウエハの
表面は前記回転体の外側から裏面は前記回転体の内側か
ら洗浄するように構成し、前記ウエハの表裏両面を同時
洗浄することを特徴とするウエハ洗浄装置。A chuck provided with wafer cleaning means for holding an outer peripheral portion of the wafer on a cylindrical rotating body, which is floated and held by a magnetic bearing; and a rotor provided on the rotating body. The rotating body is configured to apply a rotating force to the rotating body by a motor including a magnetic body and a stator coil disposed opposite to the rotor magnetic body, and the wafer cleaning unit is configured such that a front surface of the wafer is formed from the outside of the rotating body to a back surface. A wafer cleaning apparatus configured to clean from the inside of a rotating body and simultaneously cleaning both front and back surfaces of the wafer.
キャンド構造としたことを特徴とする請求項（２）記載
のウエハ洗浄装置。3. The magnetic bearing and the electric motor are covered with a metal plate.
3. The wafer cleaning apparatus according to claim 2, wherein the apparatus has a canned structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21301190A JP2887408B2 (en) | 1990-08-10 | 1990-08-10 | Wafer cleaning equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21301190A JP2887408B2 (en) | 1990-08-10 | 1990-08-10 | Wafer cleaning equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0494537A JPH0494537A (en) | 1992-03-26 |
| JP2887408B2 true JP2887408B2 (en) | 1999-04-26 |
Family
ID=16632021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21301190A Expired - Fee Related JP2887408B2 (en) | 1990-08-10 | 1990-08-10 | Wafer cleaning equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2887408B2 (en) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6264752B1 (en) | 1998-03-13 | 2001-07-24 | Gary L. Curtis | Reactor for processing a microelectronic workpiece |
| US6350319B1 (en) | 1998-03-13 | 2002-02-26 | Semitool, Inc. | Micro-environment reactor for processing a workpiece |
| US6413436B1 (en) | 1999-01-27 | 2002-07-02 | Semitool, Inc. | Selective treatment of the surface of a microelectronic workpiece |
| US6423642B1 (en) | 1998-03-13 | 2002-07-23 | Semitool, Inc. | Reactor for processing a semiconductor wafer |
| US6632292B1 (en) | 1998-03-13 | 2003-10-14 | Semitool, Inc. | Selective treatment of microelectronic workpiece surfaces |
| US6318385B1 (en) | 1998-03-13 | 2001-11-20 | Semitool, Inc. | Micro-environment chamber and system for rinsing and drying a semiconductor workpiece |
| JP4040162B2 (en) | 1998-04-07 | 2008-01-30 | 沖電気工業株式会社 | Semiconductor wafer cleaning equipment |
| US7217325B2 (en) | 1999-01-22 | 2007-05-15 | Semitool, Inc. | System for processing a workpiece |
| US6511914B2 (en) | 1999-01-22 | 2003-01-28 | Semitool, Inc. | Reactor for processing a workpiece using sonic energy |
| US6492284B2 (en) | 1999-01-22 | 2002-12-10 | Semitool, Inc. | Reactor for processing a workpiece using sonic energy |
| US6548411B2 (en) | 1999-01-22 | 2003-04-15 | Semitool, Inc. | Apparatus and methods for processing a workpiece |
| US6680253B2 (en) | 1999-01-22 | 2004-01-20 | Semitool, Inc. | Apparatus for processing a workpiece |
| US6711775B2 (en) * | 1999-06-10 | 2004-03-30 | Lam Research Corporation | System for cleaning a semiconductor wafer |
| US6286231B1 (en) | 2000-01-12 | 2001-09-11 | Semitool, Inc. | Method and apparatus for high-pressure wafer processing and drying |
| JP7055720B2 (en) | 2018-08-10 | 2022-04-18 | 株式会社荏原製作所 | Control method for board rotating device, board cleaning device, board processing device, and board rotating device |
-
1990
- 1990-08-10 JP JP21301190A patent/JP2887408B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0494537A (en) | 1992-03-26 |
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| LAPS | Cancellation because of no payment of annual fees |