JP2871774B2 - Electrical contact material - Google Patents

Electrical contact material

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Publication number
JP2871774B2
JP2871774B2 JP1343023A JP34302389A JP2871774B2 JP 2871774 B2 JP2871774 B2 JP 2871774B2 JP 1343023 A JP1343023 A JP 1343023A JP 34302389 A JP34302389 A JP 34302389A JP 2871774 B2 JP2871774 B2 JP 2871774B2
Authority
JP
Japan
Prior art keywords
contact
alloy
electrical contact
contact material
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1343023A
Other languages
Japanese (ja)
Other versions
JPH03202435A (en
Inventor
道彦 西島
喬 奈良
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokuriki Honten Co Ltd
Original Assignee
Tokuriki Honten Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokuriki Honten Co Ltd filed Critical Tokuriki Honten Co Ltd
Priority to JP1343023A priority Critical patent/JP2871774B2/en
Publication of JPH03202435A publication Critical patent/JPH03202435A/en
Application granted granted Critical
Publication of JP2871774B2 publication Critical patent/JP2871774B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、小型のスイッチやリレー等に用いられる軽
負荷用の電気接点材料に関する。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a light-load electrical contact material used for small switches and relays.

〔従来の技術〕[Conventional technology]

小型のスイッチやリレー等に用いられる軽負荷用の電
気接点材料には、従来よりAgもしくはAg合金が多く用い
られている。
Conventionally, Ag or Ag alloy has been widely used as a light load electrical contact material used for small switches and relays.

しかし、初期接触抵抗値もしくは初期接触信頼性を重
視する機種では、AgもしくはAg合金の耐硫化性、耐酸化
性を考慮してAgもしくはAg合金を基材とし、接点表面に
Auめっきを施すかまたはAuもしくはAu合金を接点表面に
複合被覆したものが用いられてきた。
However, for models that place importance on the initial contact resistance or initial contact reliability, Ag or Ag alloy is used as the base material in consideration of the sulfidation resistance and oxidation resistance of Ag or Ag alloy.
Au plating or a composite coating of the contact surface with Au or an Au alloy has been used.

〔発明が解決しようとする課題〕[Problems to be solved by the invention]

上記のような従来技術によると、Auめっきを被覆材と
した場合にはAuのピンホールを避けることができず、こ
のピンホールに起因する耐蝕性に問題がある。
According to the above-described prior art, when Au plating is used as the covering material, Au pinholes cannot be avoided, and there is a problem in corrosion resistance due to the pinholes.

また、Auを被覆材とした場合は、接点開閉時に疑似的
な溶着現象いわゆる粘着現象が生ずる問題があり、Au合
金の場合には添加元素の種類によって異なるが、一般に
は金属添加元素の影響による初期接触抵抗値のばらつき
および耐蝕性に問題がある。
In addition, when Au is used as a coating material, there is a problem that a pseudo welding phenomenon, so-called sticking phenomenon, occurs when a contact is opened and closed. There is a problem in the variation of the initial contact resistance value and the corrosion resistance.

〔課題を解決する為の手段〕[Means for solving the problem]

本発明は、AuにGe,Sb,Biのうち一種以上を0.001〜0.1
Wt%添加し、その材料を酸化雰囲気中で400℃以上に加
熱することを特徴とする。
The present invention, 0.00, 0.1 to 0.1 at least one of Ge, Sb, Bi in Au.
Wt% is added, and the material is heated to 400 ° C. or more in an oxidizing atmosphere.

〔実 施 例〕〔Example〕

第1実施例 Au 1000gとBi 10mgをアーク炉により溶解し、Au−0.0
01Wt%Mg合金を得た。この合金を鍛造・切削・圧延によ
り厚さ0.05mmまで加工し、厚さ10mmのAgに複合した。
First Example 1000 g of Au and 10 mg of Bi were melted in an arc furnace, and Au-0.0
A 01 Wt% Mg alloy was obtained. This alloy was processed to a thickness of 0.05 mm by forging, cutting, and rolling, and was combined into a 10 mm-thick Ag.

つぎに、圧延・裁断・ダイスにより厚さ0.5mm幅1mmの
条件をつくった。このときAu−Bi合金の厚さは約2μ、
Agの厚さは0.498mmであった。
Next, conditions of thickness 0.5 mm and width 1 mm were made by rolling, cutting, and dies. At this time, the thickness of the Au-Bi alloy is about 2μ,
The thickness of Ag was 0.498 mm.

この条材を長さ5mmに切断し、台材に互いに交差する
ように取り付けた小型接点試験装置により粘着試験を、
接触力10g、解離力10gで無通電状態で5万回開閉テスト
を行った。接触安定性試験は同条件でDC24V,0.5Aの負荷
条件で10万回開閉し、接触抵抗のバラツキ測定をした。
以上の試験結果を表に示す。
This strip was cut to a length of 5 mm, and an adhesion test was performed using a small contact tester attached to the base so as to intersect each other.
An open / close test was performed 50,000 times in a non-energized state with a contact force of 10 g and a dissociation force of 10 g. In the contact stability test, switching was performed 100,000 times under the same load conditions of 24 VDC and 0.5 A, and the variation of the contact resistance was measured.
The test results are shown in the table.

第2実施例 Au 1000g,Ge 50mg,Sb 50mgをアーク炉により溶解し、
Au−0.005Wt% Ge−0.005Wt%Sb合金を得た。この合金
を鍛造・切削・圧延により厚さ0.5mmまで加工した。こ
の合金板を酸素気流中で500℃で2時間処理した後、厚
さ0.05mmまで圧延加工した。
Second Example 1000 g of Au, 50 mg of Ge, and 50 mg of Sb were melted by an arc furnace,
An Au-0.005 Wt% Ge-0.005 Wt% Sb alloy was obtained. This alloy was processed to a thickness of 0.5 mm by forging, cutting, and rolling. This alloy plate was treated in an oxygen stream at 500 ° C. for 2 hours, and then rolled to a thickness of 0.05 mm.

つぎに、厚さ10mmのAgに複合し、圧延・裁断・ダイス
により厚さ0.5mm幅1mmの条材をつくった。
Next, it was composited with Ag having a thickness of 10 mm, and a strip having a thickness of 0.5 mm and a width of 1 mm was formed by rolling, cutting, and die.

この条材を長さ5mmに切断し、台材に互いに交差する
ように取り付けた小型接点試験装置により粘着試験を、
接触力10g、解離力10gで無通電状態で5万回開閉テスト
を行った。接触安定性試験は同条件でDC24V,0.5Aの負荷
条件で10万回開閉し、接触抵抗のバラツキ測定をした。
以上の試験結果を表に示す。
This strip was cut to a length of 5 mm, and an adhesion test was performed using a small contact tester attached to the base so as to intersect each other.
An open / close test was performed 50,000 times in a non-energized state with a contact force of 10 g and a dissociation force of 10 g. In the contact stability test, switching was performed 100,000 times under the same load conditions of 24 VDC and 0.5 A, and the variation of the contact resistance was measured.
The test results are shown in the table.

なお、上記各実施例と比較のための従来例を以下の示
す。
The conventional examples for comparison with the above embodiments are shown below.

第1従来例 Agからなる接点材料表面に2μの厚さのAuめっきを施
し、上記と同様の接点形状とした。
First Conventional Example A 2 μm thick Au plating was applied to the surface of a contact material made of Ag to obtain a contact shape similar to that described above.

第2従来例 Agからなる接点材料表面に2μの厚さのAuを複合被覆
し、上記と同様の接点形状とした。
Second Conventional Example A contact material made of Ag was coated with a 2 μm-thick Au composite to form the same contact shape as described above.

第3従来例 Agからなる接点材料表面に2μの厚さに80Wt% Au−2
0Wt%Ag合金を複合被覆し、上記と同様の接点形状とし
た。
Third conventional example 2 W thickness of 80 Wt% Au-2 on contact surface made of Ag
A composite coating of 0 Wt% Ag alloy was applied to form the same contact shape as above.

以上の各従来例を上記実施例と同様に小型接点試験装
置により粘着試験を、接触力10g、解離力10gで無通電状
態で5万回開閉テストを行った。接触抵抗のバラツキお
よび表面状態についてはDC24V,0.5Aの負荷条件で10万回
開閉させて測定した。これらの試験結果を表に示す。
Each of the above conventional examples was subjected to an adhesion test using a small contact testing device in the same manner as in the above embodiment, and an open / close test was performed 50,000 times in a non-energized state with a contact force of 10 g and a dissociation force of 10 g. The variation of the contact resistance and the surface condition were measured by opening and closing 100,000 times under a load condition of DC24V, 0.5A. The results of these tests are shown in the table.

さらに、未試験接点材料表面をNO2ガス濃度10ppm,湿
度90%,温度40℃の環境にて100時間曝気後、接触荷重5
gにて接触抵抗を測定し、その大小をもって耐蝕性とし
た。
Furthermore, the contact surface of the untested contact material was aerated for 100 hours in an environment of NO 2 gas concentration of 10 ppm, humidity of 90%, and temperature of 40 ° C.
The contact resistance was measured in g, and the magnitude was defined as the corrosion resistance.

〔発明の効果〕 以上に説明した本発明によると、AuにGa,Ge,Sb,Biの
うち一種以上を0.001〜0.1Wt%添加し、その材料を酸化
雰囲気中で400℃以上に加熱したことにより、Auと同等
の初期接触抵抗の安定性が得られ、しかも接触抵抗のバ
ラツキが少なく、粘着現象も起きない効果を有する。
According to the present invention described above, at least one of Ga, Ge, Sb, and Bi is added to Au in an amount of 0.001 to 0.1 Wt%, and the material is heated to 400 ° C. or more in an oxidizing atmosphere. Thereby, the same stability of the initial contact resistance as that of Au can be obtained, and the variation of the contact resistance is small, and there is an effect that the sticking phenomenon does not occur.

また、過酷な試験環境においてもAuめっきや80Au−Ag
合金を接点表面に被覆した場合に比べ、優れた耐蝕性を
示す効果を有する。
Also, even in severe test environments, Au plating or 80Au-Ag
It has an effect of exhibiting excellent corrosion resistance as compared with the case where the contact surface is coated with an alloy.

さらに、Auより高い軟化温度を有するため、微弱電圧
電流条件および低接触繰り返し荷重における接点開閉状
態においてはAuより優れた特性を示すすばらしい効果を
有する。
Further, since it has a higher softening temperature than Au, it has an excellent effect of exhibiting characteristics superior to Au in a contact opening / closing state under a weak voltage / current condition and a low contact repetitive load.

フロントページの続き (58)調査した分野(Int.Cl.6,DB名) C22C 5/02 H01H 1/02 C22C 1/10 Continuation of front page (58) Field surveyed (Int. Cl. 6 , DB name) C22C 5/02 H01H 1/02 C22C 1/10

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】AuにGe、Sb、Biのうち一種以上を0.001〜
0.1Wt%添加し、その材料を酸化雰囲気中で400℃以上に
加熱することを特徴とする電気接点材料。
(1) Au contains at least one of Ge, Sb, and Bi in an amount of 0.001 to 0.001.
An electrical contact material characterized by adding 0.1 Wt% and heating the material to 400 ° C. or more in an oxidizing atmosphere.
【請求項2】AuにGe、Sb、Biのうち一種以上を0.001〜
0.1Wt%添加し、その材料を酸化雰囲気中で400℃以上に
加熱した材料をAgもしくはAg合金に複合したことを特徴
とする電気接点材料。
2. The method according to claim 1, wherein one or more of Ge, Sb, and Bi are contained in Au at 0.001 to 0.001.
An electrical contact material comprising 0.1 Wt% added, and a material obtained by heating the material to 400 ° C. or more in an oxidizing atmosphere and combining it with Ag or an Ag alloy.
JP1343023A 1989-12-29 1989-12-29 Electrical contact material Expired - Lifetime JP2871774B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1343023A JP2871774B2 (en) 1989-12-29 1989-12-29 Electrical contact material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1343023A JP2871774B2 (en) 1989-12-29 1989-12-29 Electrical contact material

Publications (2)

Publication Number Publication Date
JPH03202435A JPH03202435A (en) 1991-09-04
JP2871774B2 true JP2871774B2 (en) 1999-03-17

Family

ID=18358345

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1343023A Expired - Lifetime JP2871774B2 (en) 1989-12-29 1989-12-29 Electrical contact material

Country Status (1)

Country Link
JP (1) JP2871774B2 (en)

Also Published As

Publication number Publication date
JPH03202435A (en) 1991-09-04

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