JP2869591B2 - Circuit wiring board with intermediate terminal for connecting circuit components and method of manufacturing the same - Google Patents
Circuit wiring board with intermediate terminal for connecting circuit components and method of manufacturing the sameInfo
- Publication number
- JP2869591B2 JP2869591B2 JP3089902A JP8990291A JP2869591B2 JP 2869591 B2 JP2869591 B2 JP 2869591B2 JP 3089902 A JP3089902 A JP 3089902A JP 8990291 A JP8990291 A JP 8990291A JP 2869591 B2 JP2869591 B2 JP 2869591B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- circuit component
- wiring board
- base material
- island
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ＩＣ等の回路部品を半
田バンプ等を用いて回路配線基板にフリップチップ実装
する方式に於いて、バンプの接合信頼性を向上させる為
に回路部品と回路基板との間に配装する回路部品接続用
中間端子を備えた回路配線基板及びその製造法に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of flip-chip mounting a circuit component such as an IC on a circuit wiring board using a solder bump or the like. The present invention relates to a circuit wiring board provided with a circuit component connecting intermediate terminal disposed between the circuit board and a method of manufacturing the circuit wiring board.
【０００２】[0002]
【従来の技術】近年のＩＣの大面積化と電極数の増加、
高密度化に伴い、ＩＣチップ等の回路部品と回路基板と
の熱膨張係数差により、バンプ部に歪が生じ甚だしい場
合には断線などを生じて接続信頼性に悪影響を及ぼす。
このような問題に対して、この種の回路部品搭載用中間
基板を回路部品と回路基板との間に配装する手段によっ
てバンプの高さを高くする手法が有効である。2. Description of the Related Art In recent years, the area of ICs has increased and the number of electrodes has increased.
With the increase in the density, a bump portion is distorted due to a difference in thermal expansion coefficient between a circuit component such as an IC chip and a circuit board.
In order to solve such a problem, it is effective to increase the height of the bumps by means of disposing such a circuit component mounting intermediate board between the circuit component and the circuit board.
【０００３】このような回路部品接続用端子付き中間基
板の従来構造としては、種々提案されているが、例えば
特開昭６０−１２３０９３号公報に示されているような
絶縁材に直径０．１ｍｍ〜０．２ｍｍ程度の導電性ピン
をその絶縁材から突出するように埋め込んで形成するも
の、また、特開平１−７２５３７号公報の如く絶縁性フ
ィルムの所定の位置に穴を設け、この穴に一定量のペ−
スト状半田を印刷手段で保持させたものがある。更に、
特開昭６２−１８０４９号公報に示されているようにセ
ラミックグリ−ンシ−トに貫通孔を形成して焼成し、こ
の貫通孔に半田に対して濡れ性のある銅ペ−スト等を挿
入し焼成し、次にこの銅層の上に濡れ性のないタングス
テンペ−スト等を挿入し焼成した後、そのタングステン
層の上に濡れ性のある銅ペ−スト等を挿入し焼成し、最
後に上表面の銅の部分に半田ボ−ルを溶融接合する手法
などがある。Various conventional structures of such an intermediate board with terminals for connecting circuit parts have been proposed. For example, an insulating material as disclosed in Japanese Patent Application Laid-Open No. Sho 60-123093 has a diameter of 0.1 mm. A conductive pin of about 0.2 mm is embedded and formed so as to protrude from the insulating material, or a hole is provided at a predetermined position of an insulating film as disclosed in JP-A-1-72537. A certain amount of paper
There is a type in which a strike-shaped solder is held by printing means. Furthermore,
As disclosed in JP-A-62-18049, a through hole is formed in a ceramic green sheet and fired, and a copper paste or the like which is wettable with solder is inserted into the through hole. Then, a tungsten paste or the like having no wettability is inserted on the copper layer and fired. Then, a copper paste or the like having a wettability is inserted on the tungsten layer and fired. In addition, there is a method of melting and joining a solder ball to a copper portion on the upper surface.
【０００４】[0004]
【発明が解決しようとする課題】このような回路部品搭
載用中間基板に於いては、ＩＣチップの配線密度が更に
高くなり、半田バンプの直径もそれに応じて小さくなる
と、高精細な接続端子を有する回路部品搭載用中間基板
を製造することは困難となる。また、ＩＣチップの電極
と回路部品搭載用中間基板の接続端子との位置合わせも
困難性を増す。In such an intermediate board for mounting circuit components, when the wiring density of the IC chip is further increased and the diameter of the solder bump is correspondingly reduced, a high-definition connection terminal is formed. It becomes difficult to manufacture an intermediate board for mounting circuit components. In addition, the alignment of the electrodes of the IC chip with the connection terminals of the circuit component mounting intermediate substrate also increases the difficulty.
【０００５】一方、従来手法では各接続端子間に存在す
る絶縁ベ−ス材の熱膨張係数差により半田等からなる接
続端子に歪を発生させる為、今後更に高密度化、大型化
する回路部品に対しては信頼性の高い実装を困難にする
虞がある。On the other hand, in the conventional method, since a connection terminal made of solder or the like is distorted due to a difference in the thermal expansion coefficient of the insulating base material existing between the connection terminals, circuit components which will be further increased in density and size will be increased in the future. , There is a possibility that highly reliable mounting may be difficult.
【０００６】[0006]
【課題を解決するための手段】本発明は、ＩＣチップ等
の回路部品を回路基板上に実装する際、回路部品と回路
基板間の熱膨張係数差によって生ずる歪を好適に吸収し
て信頼性の高いフリップチップ実装を可能とする回路部
品接続用中間端子を備えた回路配線基板とその製造法を
提供するものである。SUMMARY OF THE INVENTION According to the present invention, when a circuit component such as an IC chip is mounted on a circuit board, distortion caused by a difference in thermal expansion coefficient between the circuit component and the circuit board is preferably absorbed to improve reliability. It is intended to provide a circuit wiring board provided with an intermediate terminal for connecting circuit components, which enables high flip-chip mounting, and a method of manufacturing the same.
【０００７】その為に本発明の回路部品接続用中間端子
を備えた回路配線基板では、島状電極の一方面に島状絶
縁べ−ス材を配設し、該島状電極に一端が電気的に接合
されると共に他端が上記島状絶縁べ−ス材を貫通して外
部に突出する接続用半田バンプを有するように構成した
回路部品接続用中間端子を備え、絶縁べ−ス材上に所要
の回路配線パタ−ンを有し、該回路配線パタ−ンに一端
が電気的に接合されると共に他端が上記絶縁べ−ス材を
貫通して外部に突出する接続用パッドを有するように構
成した回路配線基板を備え、該回路配線基板の上記回路
配線パタ−ンと上記回路部品接続用中間端子とが電気的
に導通するように上記回路配線基板上に該回路部品接続
用中間端子を少なくとも一段以上配装するように構成し
たものである。For this purpose, in the circuit wiring board provided with the intermediate terminal for connecting circuit components according to the present invention, an island-like insulating base material is provided on one surface of the island-like electrode, and one end of the island-like electrode is electrically connected. An intermediate terminal for connecting circuit components, which is configured to have a solder bump for connection protruding to the outside while penetrating the island-shaped insulating base material and having the other end penetrating the insulating base material. Have a required circuit wiring pattern, one end of which is electrically connected to the circuit wiring pattern, and the other end of which has a connection pad projecting outside through the insulating base material. A circuit wiring board configured as described above, and the circuit component connecting intermediate on the circuit wiring board so that the circuit wiring pattern of the circuit wiring board and the circuit component connecting intermediate terminal are electrically connected to each other. The terminal is configured to be arranged in at least one stage.
【０００８】ここで、上記回路部品接続用中間端子に
は、上記島状電極の他方面に他の島状絶縁べ−ス材を配
設し、上記島状電極に一端が電気的に接合されると共に
他端が上記他の島状絶縁べ−ス材を貫通して外部に突出
する他の接続用パッドを備えるように構成することもで
きる。そして、上記のような回路部品接続用中間端子の
上記接続用半田バンプの溶融温度は、ＩＣ等の回路部品
に形成された半田バンプの溶融温度より高くなるように
構成するのが好適である。なお、上記の如き接続用半田
バンプは、回路配線基板側に設けるか又は回路部品接続
用中間端子側に設けることができ、その際、このような
接続用半田バンプに接合される端子は、その外周部にリ
ング状の***部を有するパッド構造が端子アライメント
上好適である。Here, another intermediate insulating base material is provided on the other surface of the island electrode at the intermediate terminal for connecting circuit components, and one end is electrically connected to the island electrode. In addition, the other end may be provided with another connection pad that penetrates the other island-shaped insulating base material and protrudes to the outside. It is preferable that the melting temperature of the connection solder bump of the intermediate terminal for circuit component connection be higher than the melting temperature of the solder bump formed on the circuit component such as an IC. The connection solder bumps as described above can be provided on the circuit wiring board side or on the circuit component connection intermediate terminal side, and at this time, the terminals bonded to such connection solder bumps are A pad structure having a ring-shaped raised portion on the outer periphery is suitable for terminal alignment.
【０００９】また、上記のような回路部品接続用中間端
子を備えた回路配線基板を製造する為の手法としては、
ＩＣ等の回路部品の電極と該電極に対向して配置された
回路配線基板の回路配線パタ−ンとを電気的に接続する
ように上記回路部品と該回路配線基板との間に配装され
るものであって、絶縁べ−ス材の第一の面と第二の面と
を電気的に導通するように形成した回路部品接続用中間
端子を有する回路部品搭載用中間基板を製作し、上記回
路配線基板上に該回路部品搭載用中間基板を少なくとも
一段以上実装した後、この回路部品搭載用中間基板上に
エキシマレ−ザ−光を照射することにより該回路部品搭
載用中間基板に形成した上記各回路部品接続用中間端子
間の絶縁べ−ス材部分を除去する工程を採用できる。Further, as a method for manufacturing a circuit wiring board having an intermediate terminal for connecting circuit components as described above, there are the following methods.
An electrode of a circuit component such as an IC is disposed between the circuit component and the circuit wiring board so as to electrically connect an electrode of the circuit component and a circuit wiring pattern of a circuit wiring board disposed to face the electrode. Producing a circuit component mounting intermediate substrate having circuit component connection intermediate terminals formed so as to electrically connect the first surface and the second surface of the insulating base material, After mounting at least one stage of the circuit component mounting intermediate substrate on the circuit wiring board, the circuit component mounting intermediate substrate was formed on the circuit component mounting intermediate substrate by irradiating the circuit component mounting intermediate substrate with excimer laser light. The step of removing the insulating base material portion between the intermediate terminals for connecting each circuit component can be adopted.
【００１０】[0010]
【実施例】以下、図示の実施例を参照しながら本発明を
更に説明すると、図１は本発明の一実施例に従った回路
部品接続用中間端子を備えた回路配線基板の要部を概念
的に示す断面斜視図である。同図において、１はポリイ
ミド等の絶縁べ−ス材であって、その一方の面には所要
の回路配線パタ−ン２を有し、この回路配線パタ−ン２
に一端が電気的に接合されると共に他端が上記絶縁バ−
ス材１を貫通して外部に突出する接続用パッド３が形成
されている。この接続用パッド３には、以下に説明する
回路部品接続用中間端子４が上記回路配線パタ−ン２と
該接続用パッド３を介して電気的に導通するように接合
されている。このような接続用パッド３はその外周部が
図の如くリング状に***する構造に構成することができ
る。そして、回路配線パタ−ン２の表面には接着剤付き
ポリイミドフィルムの貼合わせ手段か又はポリイミドワ
ニスのコ−ティング手段等で表面保護層５を形成してあ
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be further described below with reference to the illustrated embodiment. FIG. 1 is a conceptual view of a main part of a circuit wiring board having an intermediate terminal for connecting circuit components according to an embodiment of the present invention. It is a sectional perspective view shown typically. In FIG. 1, reference numeral 1 denotes an insulating base material such as polyimide, which has a required circuit wiring pattern 2 on one surface thereof.
One end is electrically connected to the other end and the other end is the insulating bar.
The connection pad 3 is formed to penetrate through the metal material 1 and protrude to the outside. An intermediate terminal 4 for connecting circuit components, which will be described below, is joined to the connection pad 3 so as to be electrically connected to the circuit wiring pattern 2 via the connection pad 3. Such a connection pad 3 can be formed in a structure in which the outer peripheral portion protrudes in a ring shape as shown in the figure. A surface protective layer 5 is formed on the surface of the circuit wiring pattern 2 by means of laminating a polyimide film with an adhesive or coating means of a polyimide varnish.
【００１１】回路部品接続用中間端子４は、銅箔等の導
電性金属からなる島状電極６を有しており、この島状電
極６の第一の面にはポリイミド等からなる第一の島状絶
縁べ−ス材７を備え、その島状電極６の第一の面に一端
が電気的に接合されると共に他端が上記第一の島状絶縁
べ−ス材７を貫通して外部に突出する半田等の接続用半
田バンプ８を有し、この半田バンプ８は回路配線基板の
前記接続用パッド３に接続されている。更に、島状電極
６の第二の面にはポリイミド等からなる第二の島状絶縁
べ−ス材９を備えており、この島状電極６の第二の面に
一端が電気的に接合されると共に他端が上記第二の島状
絶縁べ−ス材９を貫通して外部に突出する第二の接続用
パッド１０を備え、この接続用パッド１０はその外周部
がリング状に***するように構成されている。The circuit component connecting intermediate terminal 4 has an island-like electrode 6 made of a conductive metal such as a copper foil, and a first surface of the island-like electrode 6 made of polyimide or the like is provided on a first surface thereof. An insulating base material 7 is provided, one end of which is electrically connected to the first surface of the island-shaped electrode 6 and the other end protrudes outside through the first island-shaped insulating base material 7. It has a solder bump 8 for connection such as solder, and the solder bump 8 is connected to the connection pad 3 of the circuit wiring board. Further, the second surface of the island-shaped electrode 6 is provided with a second island-shaped insulating base material 9 made of polyimide or the like, and one end is electrically connected to the second surface of the island-shaped electrode 6. A second connection pad 10 having the other end protruding to the outside through the second island-shaped insulating base material 9 and having an outer peripheral portion protruding in a ring shape. It is configured to be.
【００１２】図２は上記構成の回路部品接続用中間端子
を備えた回路配線基板と半田バンプ付きＩＣチップとの
接続構成図を示すものであり、図に於いて１１はＩＣチ
ップを示し、１２はＩＣチップ１１の電極に接続された
半田バンプであり、この半田バンプ１２は上記回路部品
接続用中間端子４の接続用パッド１０に接続されるもの
である。そして、ＩＣチップ１１側に設けた半田バンプ
１２の溶融温度は回路部品接続用中間端子４の接続用半
田バンプ８の溶融温度よりも低融点に構成されているの
で、回路部品としてのＩＣチップ１１を回路配線基板に
搭載する場合の温度によっても回路部品接続用中間端子
４の接続用半田バンプ８は溶融することなく安定に回路
部品を搭載することが可能となる。FIG. 2 is a diagram showing a connection between a circuit wiring board having the above-described circuit component connection intermediate terminals and an IC chip with solder bumps. In the figure, reference numeral 11 denotes an IC chip, and FIG. Are solder bumps connected to the electrodes of the IC chip 11, and the solder bumps 12 are connected to the connection pads 10 of the circuit component connection intermediate terminal 4. The melting temperature of the solder bumps 12 provided on the IC chip 11 side is lower than the melting temperature of the solder bumps 8 for connection of the intermediate terminals 4 for connection of circuit components. Can be stably mounted without melting the solder bumps 8 for connection of the intermediate terminals 4 for connecting circuit components depending on the temperature at which the circuit components are mounted on the circuit wiring board.
【００１３】図３の（１）及び（２）は上記実施例の回
路部品接続用中間端子４を具備する回路配線基板の一製
造工程図を示す。同図（１）の如く、先ず絶縁べ−ス材
１、回路配線パタ−ン２、接続用パッド３及び表面保護
層５を備えるように回路配線基板２１を製作し、また、
上記回路部品接続用中間端子４の第一の島状絶縁べ−ス
材７が一様に連続する所要寸法の絶縁べ−ス材７Ａを形
成した回路部品搭載用中間基板２２を製作し、次に回路
配線基板２１の接続用パッド３に回路部品搭載用中間基
板２２の半田バンプ８が接続されるような態様で回路配
線基板２１上に回路部品搭載用中間基板２２を通常の手
法で実装する。そこで、同図（２）の如く、回路部品搭
載用中間基板２２の上方部位にメタルマスク２３を配置
した状態でこのメタルマスク２３の上方からエキシマレ
−ザ−光Ａを照射すると、既述の中間端子４の間に存在
する絶縁べ−ス材をアブレ−ション除去できるので、そ
の回路部品接続用中間端子４に島状の絶縁べ−ス材７を
形成することができることとなり、最終的に別体のメタ
ルマスク２３及び不要な絶縁べ−ス材のバリ２４を取り
除くことにより図１の如き回路部品接続用中間端子４を
備えた回路配線基板を製作することが出来る。FIGS. 3A and 3B show one manufacturing process diagram of a circuit wiring board provided with the circuit component connecting intermediate terminals 4 of the above embodiment. As shown in FIG. 1A, a circuit wiring board 21 is first manufactured so as to include an insulating base material 1, a circuit wiring pattern 2, a connection pad 3, and a surface protection layer 5.
A circuit component mounting intermediate substrate 22 having an insulating base material 7A of a required size in which the first island-shaped insulating base material 7 of the circuit component connecting intermediate terminal 4 is uniformly continuous is manufactured. The circuit component mounting intermediate substrate 22 is mounted on the circuit wiring substrate 21 in a normal manner such that the solder bumps 8 of the circuit component mounting intermediate substrate 22 are connected to the connection pads 3 of the wiring substrate 21. Therefore, as shown in FIG. 2B, when the excimer laser light A is irradiated from above the metal mask 23 in a state where the metal mask 23 is disposed above the circuit component mounting intermediate substrate 22, the above-described intermediate Since the insulating base material existing between the terminals 4 can be removed by abrasion, the island-shaped insulating base material 7 can be formed on the intermediate terminal 4 for connecting circuit components. By removing the metal mask 23 of the body and the unnecessary burrs 24 of the insulating base material, a circuit wiring board having the intermediate terminals 4 for connecting circuit components as shown in FIG. 1 can be manufactured.
【００１４】上記の如く絶縁べ−ス材７Ａの不要部分を
アブレ−ション除去する際に、別体のメタルマスク２３
を使用する手法の他、その不要部分のみをアブレ−ショ
ンするようなエキシマレ−ザ−光の集光・投影法や矩形
のエキシマレ−ザ−光を回路部品搭載用中間基板２２の
上方から全面に亘って照射する手法も採用できる。When removing unnecessary portions of the insulating base material 7A as described above, a separate metal mask 23 is used.
In addition to the above-described method, a method of condensing and projecting excimer laser light such that only unnecessary portions are abraded, or a method of applying a rectangular excimer laser light to the entire surface of the circuit component mounting intermediate substrate 22 from above. A method of irradiating over the entire surface can also be adopted.
【００１５】[0015]
【発明の効果】本発明による回路部品接続用中間端子を
備えた回路配線基板は、回路部品接続用中間端子の周辺
に絶縁べ−ス材を存在させないように構成できるので、
ＩＣ等の回路部品と回路配線基板との間の熱膨張係数差
によって生ずる歪を好適に吸収することができ、これに
より大面積の回路部品との信頼性の高い接続を達成する
ことが可能である。The circuit wiring board provided with the intermediate terminals for connecting circuit components according to the present invention can be constructed so that the insulating base material does not exist around the intermediate terminals for connecting circuit components.
Distortion caused by a difference in thermal expansion coefficient between a circuit component such as an IC and a circuit wiring board can be suitably absorbed, thereby achieving a highly reliable connection with a large-area circuit component. is there.
【００１６】また、本発明の製造法によれば、多数の回
路部品接続用中間端子を一度に回路配線基板に接合でき
るので、このような回路部品接続用中間端子を具備する
回路配線基板を能率よく安定に製作することができる。Further, according to the manufacturing method of the present invention, since a large number of intermediate terminals for connecting circuit components can be joined to the circuit wiring board at one time, the circuit wiring board having such intermediate terminals for connecting circuit components can be efficiently used. It can be manufactured well and stably.
【図１】本発明の一実施例に従って構成した回路部品接
続用中間端子を備えた回路配線基板の概念的な要部拡大
断面斜視図FIG. 1 is a conceptual enlarged cross-sectional perspective view of a principal part of a circuit wiring board having a circuit component connecting intermediate terminal configured according to an embodiment of the present invention.
【図２】本発明の回路部品接続用中間端子を備えた回路
配線基板とＩＣチップとの接続実装例を示す概念的な要
部拡大断面斜視図FIG. 2 is a conceptual enlarged cross-sectional perspective view of a principal part showing an example of connection and mounting of a circuit wiring board having an intermediate terminal for circuit component connection of the present invention and an IC chip.
【図３】図３の（１）及び（２）は本発明の一実施例に
従った回路部品接続用中間端子を備えた回路配線基板の
製造工程図FIGS. 3A and 3B are manufacturing process diagrams of a circuit wiring board provided with circuit component connecting intermediate terminals according to an embodiment of the present invention;
１ 絶縁べ−ス材 ２ 回路配線パタ−ン ３ 接続用パッド ４ 回路部品接続用中間端子 ５ 表面保護層 ６ 島状電極 ７ 第一の島状絶縁べ−ス材 ８ 接続用半田バンプ ９ 第二の島状絶縁べ−ス材 １０ 他の接続用パッド １１ ＩＣチップ １２ 半田バンプ ２１ 回路配線基板 ２２ 回路部品搭載用中間基板 ２３ 別体のメタルマスク ２４ バリ DESCRIPTION OF SYMBOLS 1 Insulation base material 2 Circuit wiring pattern 3 Connection pad 4 Intermediate terminal for connection of circuit parts 5 Surface protection layer 6 Island electrode 7 First island insulation base material 8 Connection solder bump 9 Second island Insulating base material 10 Other connection pads 11 IC chip 12 Solder bump 21 Circuit wiring board 22 Intermediate board for mounting circuit components 23 Separate metal mask 24 Burr
フロントページの続き (56)参考文献 特開 昭62−293730（ＪＰ，Ａ) 特開 平１−243534（ＪＰ，Ａ) 特開 平２−252250（ＪＰ，Ａ) 特開 平４−29336（ＪＰ，Ａ) 特開 平４−269475（ＪＰ，Ａ) (58)調査した分野(Int.Cl.6，ＤＢ名) H01L 21/60 311 H05K 1/18 Continuation of the front page (56) References JP-A-62-293730 (JP, A) JP-A-1-243534 (JP, A) JP-A-2-252250 (JP, A) JP-A-4-29336 (JP) , A) JP-A-4-269475 (JP, A) (58) Fields investigated (Int. Cl. 6 , DB name) H01L 21/60 311 H05K 1/18
Claims (4)
配設し、該島状電極に一端が電気的に接合されると共に
他端が上記島状絶縁べ−ス材を貫通して外部に突出する
接続用半田バンプを有するように構成した回路部品接続
用中間端子を備え、絶縁べ−ス材上に所要の回路配線パ
タ−ンを有し、該回路配線パタ−ンに一端が電気的に接
合されると共に他端が上記絶縁べ−ス材を貫通して外部
に突出する接続用パッドを有するように構成した回路配
線基板を備え、該回路配線基板の上記回路配線パタ−ン
と上記回路部品接続用中間端子とが電気的に導通するよ
うに上記回路配線基板上に該回路部品接続用中間端子を
少なくとも一段以上配装するように構成した回路部品接
続用中間端子を備えた回路配線基板。1. An island-shaped insulating base material is provided on one surface of an island-shaped electrode, one end of which is electrically connected to the island-shaped electrode and the other end of which is formed of the island-shaped insulating base material. A circuit component connection intermediate terminal configured to have a connection solder bump penetrating therethrough and protruding to the outside, a required circuit wiring pattern on an insulating base material, and the circuit wiring pattern A circuit wiring board, one end of which is electrically connected and the other end of which has a connection pad penetrating through the insulating base material and protruding to the outside. Circuit component connecting intermediate terminals arranged at least one stage on the circuit wiring board so that the pattern and the circuit component connecting intermediate terminals are electrically connected to each other. A circuit wiring board provided with.
記島状電極の他方面に他の島状絶縁べ−ス材を配設し、
上記島状電極に一端が電気的に接合されると共に他端が
上記他の島状絶縁べ−ス材を貫通して外部に突出する他
の接続用パッドを備える請求項１の回路部品接続用中間
端子を備えた回路配線基板。2. An island-like insulating base material is provided on the other surface of said island-like electrode in said circuit component connecting intermediate terminal,
2. The circuit component connection circuit according to claim 1, further comprising another connection pad having one end electrically connected to said island-shaped electrode and the other end penetrating through said another island-shaped insulating base material and projecting outside. Circuit wiring board with intermediate terminals.
用半田バンプの溶融温度は、ＩＣ等の回路部品に形成さ
れた半田バンプの溶融温度より高くなるように構成した
請求項１又は２の回路部品接続用中間端子を備えた回路
配線基板。3. The method according to claim 1, wherein the melting temperature of the connection solder bump of the circuit component connection intermediate terminal is higher than the melting temperature of the solder bump formed on the circuit component such as an IC. Circuit wiring board with intermediate terminals for connecting circuit components.
して配置された回路配線基板の回路配線パタ−ンとを電
気的に接続するように上記回路部品と該回路配線基板と
の間に配装されるものであって、絶縁べ−ス材の第一の
面と第二の面とを電気的に導通するように形成した回路
部品接続用中間端子を有する回路部品搭載用中間基板を
製作し、上記回路配線基板上に該回路部品搭載用中間基
板を少なくとも一段以上実装した後、この回路部品搭載
用中間基板上にエキシマレ−ザ−光を照射することによ
り該回路部品搭載用中間基板に形成した上記各回路部品
接続用中間端子間の絶縁べ−ス材部分を除去することを
特徴とする回路部品接続用中間端子を備えた回路配線基
板の製造法。4. The circuit component such as an IC is electrically connected to a circuit wiring pattern of a circuit wiring board disposed opposite to the electrode so that the circuit component and the circuit wiring board are electrically connected to each other. A circuit component mounting intermediate having a circuit component connecting intermediate terminal formed between the first surface and the second surface of the insulating base material so as to be electrically conductive. A substrate is manufactured, and at least one or more stages of the circuit component mounting intermediate substrate are mounted on the circuit wiring substrate, and then the circuit component mounting intermediate substrate is irradiated by excimer laser light on the circuit component mounting intermediate substrate. A method for manufacturing a circuit wiring board having circuit component connecting intermediate terminals, wherein an insulating base material portion between the circuit component connecting intermediate terminals formed on the intermediate substrate is removed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3089902A JP2869591B2 (en) | 1991-03-28 | 1991-03-28 | Circuit wiring board with intermediate terminal for connecting circuit components and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3089902A JP2869591B2 (en) | 1991-03-28 | 1991-03-28 | Circuit wiring board with intermediate terminal for connecting circuit components and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04299839A JPH04299839A (en) | 1992-10-23 |
| JP2869591B2 true JP2869591B2 (en) | 1999-03-10 |
Family
ID=13983661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3089902A Expired - Fee Related JP2869591B2 (en) | 1991-03-28 | 1991-03-28 | Circuit wiring board with intermediate terminal for connecting circuit components and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2869591B2 (en) |
-
1991
- 1991-03-28 JP JP3089902A patent/JP2869591B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04299839A (en) | 1992-10-23 |
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