JP2846028B2 - Method of manufacturing liquid crystal display panel substrate - Google Patents

Method of manufacturing liquid crystal display panel substrate

Info

Publication number
JP2846028B2
JP2846028B2 JP719890A JP719890A JP2846028B2 JP 2846028 B2 JP2846028 B2 JP 2846028B2 JP 719890 A JP719890 A JP 719890A JP 719890 A JP719890 A JP 719890A JP 2846028 B2 JP2846028 B2 JP 2846028B2
Authority
JP
Japan
Prior art keywords
liquid crystal
crystal panel
glass substrate
crystal display
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP719890A
Other languages
Japanese (ja)
Other versions
JPH03212619A (en
Inventor
金子  靖
崇雄 石田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHICHIZUN TOKEI KK
Original Assignee
SHICHIZUN TOKEI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHICHIZUN TOKEI KK filed Critical SHICHIZUN TOKEI KK
Priority to JP719890A priority Critical patent/JP2846028B2/en
Publication of JPH03212619A publication Critical patent/JPH03212619A/en
Application granted granted Critical
Publication of JP2846028B2 publication Critical patent/JP2846028B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は単純マトリクス液晶パネルおよび各画素に能
動素子を設けたアクティブマトリクス液晶パネルの内、
特に、ガラス基板に駆動ICを直接搭載した液晶パネル基
板の製造方法に関する。
The present invention relates to a simple matrix liquid crystal panel and an active matrix liquid crystal panel provided with an active element in each pixel.
In particular, the present invention relates to a method for manufacturing a liquid crystal panel substrate in which a driving IC is directly mounted on a glass substrate.

〔従来の技術〕[Conventional technology]

従来、液晶パネルへの駆動IC接続方法として、駆動IC
を搭載した回路基板と液晶パネルをフレキシブルプリン
ト基板(以後、FPCと略す)で接続する方法や、FPC上に
駆動ICを直接搭載する方法や、液晶パネル基板に駆動IC
を直接搭載する方法(チップオングラス方式、以後、CO
G方式と略す)がある。特に、高密度液晶パネルを作製
するためには、COG方式が有利であり、盛んに研究され
ている。
Conventionally, drive ICs have been used to connect drive ICs to liquid crystal panels.
To connect a liquid crystal panel to a circuit board equipped with a flexible printed circuit board (hereinafter abbreviated as FPC), to directly mount a drive IC on the FPC, or to mount a drive IC on the liquid crystal panel board
Direct mounting method (chip-on-glass method, CO
G method). In particular, the COG method is advantageous for producing a high-density liquid crystal panel, and has been actively studied.

しかし、COG方式では、ICへの入力端子も透明電極で
形成されるために、入力抵抗が高くなり、IC毎の動作電
圧がばらついたり、動作不良が生じる等の問題もある。
そのために、低抵抗透明電極を使用したり、ガラス基板
全面にクロム等の金属を蒸着後、パターンニング工程に
より不用部分を除去している。
However, in the COG method, since the input terminal to the IC is also formed of a transparent electrode, the input resistance is increased, and there is a problem that the operating voltage of each IC varies, and an operation failure occurs.
For this purpose, a low-resistance transparent electrode is used, or a metal such as chromium is deposited on the entire surface of the glass substrate, and then unnecessary portions are removed by a patterning process.

〔発明が解決しようとする課題〕[Problems to be solved by the invention]

しかしながら、低抵抗透明電極はコストが高く、しか
も、入力端子形状によっては、低抵抗透明電極を用いて
も充分な抵抗値以下にはすることができない場合もあっ
た。また、金属を蒸着する方法も、蒸着コストとパター
ンニングコストがかかり、あまり実用的ではなかった。
また、電解メッキによる手法も検討されたが、メッキ用
電極付近ばかりにメッキされ、入力端子にはほとんどメ
ッキされなかった。
However, the low-resistance transparent electrode is expensive, and depending on the shape of the input terminal, there is a case where the resistance value cannot be reduced to a sufficient value even if the low-resistance transparent electrode is used. Also, the method of depositing a metal requires a deposition cost and a patterning cost, and is not very practical.
In addition, although a method using electrolytic plating was also studied, plating was performed only near the plating electrode, and almost no plating was performed on the input terminal.

この課題を解決するために、本発明の目的は、低コス
トで、COG方式の入力端子の抵抗値を低くして、駆動IC
の動作電圧むら等の少ない良好な表示を得られる、液晶
パネル基板の製造方法を提供することにある。
In order to solve this problem, an object of the present invention is to reduce the resistance value of the input terminal of the COG system at a low cost and to realize a drive IC.
It is an object of the present invention to provide a method for manufacturing a liquid crystal panel substrate, which can obtain a good display with less fluctuation in operating voltage.

〔課題を解決するための手段〕[Means for solving the problem]

上記目的を達成させるために、本発明は、液晶パネル
外形より外側のガラス基板上で駆動ICへの全入力端子の
結線と通電用の端子となるリードパターンを透明電極で
形成した後、前記リードパターン上を有機絶縁物でスク
リーン印刷等を用いて被覆してから電圧を印加して電解
メッキを行ない、その後、液晶パネル外形サイズでガラ
ス基板を切断することにより、透明電極入力端子のみを
メッキして入力端子抵抗を低下させ、低コストで、入力
端子を低抵抗化できる。
In order to achieve the above object, the present invention provides a method of forming a lead pattern on a glass substrate outside the outer shape of a liquid crystal panel, which is a connection pattern of all input terminals to a drive IC and a lead pattern serving as a terminal for energization, using a transparent electrode. After covering the pattern with an organic insulator using screen printing or the like, apply voltage and perform electrolytic plating, and then cut the glass substrate to the outer size of the liquid crystal panel to plate only the transparent electrode input terminals. As a result, the input terminal resistance can be reduced, and the resistance of the input terminal can be reduced at low cost.

〔作用〕[Action]

透明電極の抵抗値は、低抵抗電極のシート抵抗で約10
オーム、通常抵抗電極では100オーム以上もあり、従っ
て、通常幅1mm以下入力端子抵抗として50オームから数
百オームとなり、IC毎に電源電圧がばらつき、表示むら
が発生する。この、入力端子抵抗を下げるために、入力
端子に電解メッキすることが考えられるが、通常の方法
では透明電極の抵抗値が、金属の抵抗値より1桁以上高
いために、メッキ用電極付近に金属が析出すると、その
付近ばかりに電流が集中し、メッキ用電極から遠い部分
には、メッキされない。そこで、リード端子上を絶縁物
で被覆して、電流の集中を避けることで、透明電極上で
も電解メッキが可能となる。
The resistance value of the transparent electrode is about 10 with the sheet resistance of the low resistance electrode.
The resistance of a normal resistance electrode is 100 ohms or more. Therefore, the input terminal resistance is usually 50 ohms to several hundreds ohms with a width of 1 mm or less, and the power supply voltage varies from one IC to another, causing display unevenness. In order to reduce the input terminal resistance, it is conceivable to perform electrolytic plating on the input terminal. However, in a normal method, the resistance of the transparent electrode is one digit or more higher than the resistance of the metal. When the metal is deposited, the current is concentrated only in the vicinity thereof, and the portion far from the plating electrode is not plated. Thus, by covering the lead terminals with an insulator to avoid concentration of current, electrolytic plating can be performed even on the transparent electrodes.

〔実施例〕〔Example〕

以下、本発明による一実施例を図面を用いて説明す
る。第3図は、本発明を用いた液晶表示パネルの外形図
である。信号電極基板31と走査電極基板35の間に液晶が
挾まれている。信号電極基板の裏面に信号電極駆動IC32
が直接搭載され、そこから入力端子33が形成されてい
る。なお、34は信号電極(画素部分)である。また、同
様に、走査電極基板35の表面に走査電極駆動IC36が搭載
され、入力端子37が形成されている。なお、38は走査電
極(画素部分)である。本発明により、入力端子33及び
入力端子37の部分のみを電解メッキすることが可能とな
る。信号電極基板の製造方法を第1図と第2図を用いて
説明する。
An embodiment according to the present invention will be described below with reference to the drawings. FIG. 3 is an external view of a liquid crystal display panel using the present invention. Liquid crystal is sandwiched between the signal electrode substrate 31 and the scanning electrode substrate 35. Signal electrode drive IC 32 on the back of the signal electrode substrate
Are directly mounted, and the input terminal 33 is formed therefrom. 34 is a signal electrode (pixel portion). Similarly, scan electrode drive IC 36 is mounted on the surface of scan electrode substrate 35, and input terminal 37 is formed. Reference numeral 38 denotes a scanning electrode (pixel portion). According to the present invention, only the input terminal 33 and the input terminal 37 can be electrolytically plated. A method for manufacturing the signal electrode substrate will be described with reference to FIGS.

第1図と第2図は、信号電極基板を製造するガラス基
板の外形図で、1枚のガラス基板に4枚の信号電極基板
を形成した例である。第2図は、第1図の前の工程段階
を示している。ガラス基板26に形成される信号電極基板
21は、透明電極により、駆動IC用パッド部22と駆動IC入
力端子23および、画素部分にあたる信号電極24から形成
されている。本発明では、さらに、メッキ用リードパタ
ーン25を形成し、入力端子23を全て結線してある。次
に、第1図の様にメッキ用リードパターンに有機物等の
絶縁物17をスクリーン印刷を用いて塗布し、乾燥する。
この状態で、メッキ用リードパターンの両端に負電圧を
印加して電解メッキすると、入力端子13のみがメッキさ
れる。その後、信号電極基板外形11でガラス基板16を切
断すると、信号電極基板が完成する。なお、12は駆動IC
用パッド部、14は信号電極の画素部分、15はメッキ用リ
ードパターンである。本実施例では、透明電極のシート
抵抗値として20オーム品を使用し、メッキ用金属として
金を使用したところ、幅0.25mm、長さ3.0mmの入力端子
抵抗が約100オームから約10オームに低減し、むらのな
い良好な表示画面が得られた。
1 and 2 are external views of a glass substrate for manufacturing a signal electrode substrate, in which four signal electrode substrates are formed on one glass substrate. FIG. 2 shows the process step before FIG. Signal electrode substrate formed on glass substrate 26
Reference numeral 21 denotes a transparent electrode formed of a drive IC pad section 22, a drive IC input terminal 23, and a signal electrode 24 corresponding to a pixel portion. In the present invention, further, a lead pattern 25 for plating is formed, and all the input terminals 23 are connected. Next, as shown in FIG. 1, an insulator 17 such as an organic substance is applied to the plating lead pattern by using screen printing and dried.
In this state, when a negative voltage is applied to both ends of the plating lead pattern and electrolytic plating is performed, only the input terminal 13 is plated. Thereafter, when the glass substrate 16 is cut along the signal electrode substrate outer shape 11, the signal electrode substrate is completed. 12 is a drive IC
14 is a pixel portion of a signal electrode, and 15 is a lead pattern for plating. In the present embodiment, a sheet resistance value of the transparent electrode of 20 ohms was used, and gold was used as the metal for plating. A good display screen with reduced and evenness was obtained.

〔発明の効果〕〔The invention's effect〕

本発明により、液晶パネル基板に駆動ICを直接搭載す
るCOG方式の液晶パネルにおいて、低コストで駆動ICへ
の入力端子抵抗を小さくすることが可能となり、むらの
ない良好な表示を得られる液晶パネルの製造方法が提供
できる。
Advantageous Effects of Invention According to the present invention, in a COG type liquid crystal panel in which a drive IC is directly mounted on a liquid crystal panel substrate, it is possible to reduce input terminal resistance to the drive IC at low cost and obtain a uniform display with good display. Can be provided.

【図面の簡単な説明】[Brief description of the drawings]

第1図と第2図は、本発明による信号電極基板製造用ガ
ラス基板の外形図で、第3図は、本発明による液晶表示
パネルの外形図である。 11、21、31……信号電極基板、12、22、32……信号電極
駆動IC(パッド部)、13、23、33……信号電極駆動IC用
入力端子、14、24、34……信号電極(画素部分)、15、
25……メッキ用リードパターン、16、26……ガラス基
板、17……絶縁物、35……走査電極基板、36……走査電
極駆動IC(パッド部)、37……走査電極駆動IC用入力端
子、38……走査電極(画素部分)。
1 and 2 are external views of a glass substrate for manufacturing a signal electrode substrate according to the present invention, and FIG. 3 is an external view of a liquid crystal display panel according to the present invention. 11, 21, 31 ... signal electrode board, 12, 22, 32 ... signal electrode drive IC (pad part), 13, 23, 33 ... input terminal for signal electrode drive IC, 14, 24, 34 ... signal Electrode (pixel part), 15,
25: Lead pattern for plating, 16, 26: Glass substrate, 17: Insulator, 35: Scan electrode substrate, 36: Scan electrode drive IC (pad part), 37: Input for scan electrode drive IC Terminals 38: Scanning electrodes (pixels).

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6,DB名) G02F 1/1345──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. 6 , DB name) G02F 1/1345

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】2枚の透明電極付きガラス基板に液晶を挟
持してなる液晶パネルの内、ガラス基板に直接、駆動IC
を搭載した液晶パネルのガラス基板製造法において、液
晶パネル外形より外側のガラス基板上で駆動ICへの全入
力端子の結線と通電用の端子となるリードパターンを透
明電極で形成した後、前記リードパターン上を有機絶縁
物で被覆してから電圧を印加して電解メッキを行ない、
その後、液晶パネル外形サイズでガラス基板を切断する
ことにより、透明電極入力端子のみをメッキすることを
特徴とする液晶表示パネル基板の製造方法。
1. A liquid crystal display device comprising a liquid crystal panel sandwiched between two glass substrates with transparent electrodes, and a driving IC directly mounted on the glass substrate.
In a method of manufacturing a glass substrate of a liquid crystal panel equipped with a liquid crystal panel, a lead pattern serving as a connection terminal for all input terminals to a drive IC and a terminal for conducting electricity is formed on a glass substrate outside the outer shape of the liquid crystal panel with a transparent electrode, and then the lead is formed. After covering the pattern with an organic insulator, apply voltage and perform electrolytic plating,
Thereafter, only the transparent electrode input terminal is plated by cutting the glass substrate to the outer size of the liquid crystal panel, thereby manufacturing a liquid crystal display panel substrate.
JP719890A 1990-01-18 1990-01-18 Method of manufacturing liquid crystal display panel substrate Expired - Fee Related JP2846028B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP719890A JP2846028B2 (en) 1990-01-18 1990-01-18 Method of manufacturing liquid crystal display panel substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP719890A JP2846028B2 (en) 1990-01-18 1990-01-18 Method of manufacturing liquid crystal display panel substrate

Publications (2)

Publication Number Publication Date
JPH03212619A JPH03212619A (en) 1991-09-18
JP2846028B2 true JP2846028B2 (en) 1999-01-13

Family

ID=11659336

Family Applications (1)

Application Number Title Priority Date Filing Date
JP719890A Expired - Fee Related JP2846028B2 (en) 1990-01-18 1990-01-18 Method of manufacturing liquid crystal display panel substrate

Country Status (1)

Country Link
JP (1) JP2846028B2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002008823A1 (en) * 2000-07-20 2002-01-31 Tecdis S.P.A. A process for the fabrication of a liquid crystal display device
JP4112168B2 (en) * 2000-12-11 2008-07-02 株式会社半導体エネルギー研究所 Semiconductor device and manufacturing method thereof
TW525216B (en) 2000-12-11 2003-03-21 Semiconductor Energy Lab Semiconductor device, and manufacturing method thereof
SG111923A1 (en) 2000-12-21 2005-06-29 Semiconductor Energy Lab Light emitting device and method of manufacturing the same
JP4741569B2 (en) * 2000-12-21 2011-08-03 株式会社半導体エネルギー研究所 Light emitting device
JP4067819B2 (en) * 2000-12-21 2008-03-26 株式会社半導体エネルギー研究所 Light emitting device

Also Published As

Publication number Publication date
JPH03212619A (en) 1991-09-18

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