JP2832651B2 - Manufacturing method of multilayer solid electrolytic capacitor - Google Patents
Manufacturing method of multilayer solid electrolytic capacitorInfo
- Publication number
- JP2832651B2 JP2832651B2 JP14954291A JP14954291A JP2832651B2 JP 2832651 B2 JP2832651 B2 JP 2832651B2 JP 14954291 A JP14954291 A JP 14954291A JP 14954291 A JP14954291 A JP 14954291A JP 2832651 B2 JP2832651 B2 JP 2832651B2
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- JP
- Japan
- Prior art keywords
- film
- conductive polymer
- forming
- polymer film
- teeth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は導電性高分子膜を固体電
解質として用いた積層形固体電解コンデンサの製造方法
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a laminated solid electrolytic capacitor using a conductive polymer film as a solid electrolyte.
【０００２】[0002]
【従来の技術】近年電子機器の高性能化が強まる中で各
種電子部品における小形化の要請は、電解コンデンサに
おいても例外ではなく、高密度実装化させて用いること
を可能とした電解コンデンサが各種提案され本格的な実
用化段階を迎えている。2. Description of the Related Art In recent years, as electronic devices have become more sophisticated, the demand for miniaturization of various electronic components is not an exception in electrolytic capacitors, and various types of electrolytic capacitors that can be used in high-density mounting are being used. It has been proposed and is at the stage of full-scale commercialization.
【０００３】この要請に応えた電解コンデンサの一つと
して、従来一般化している駆動用電解液に代えて各種半
導体を固体電解質として用いたものが知られいる。例え
ば、一対の陽極・陰極箔間にスペ−サを介在させて巻回
し形成したコンデンサ素子にＴＣＮＱ錯体に代表される
有機半導体を加熱・溶融含浸したもの、又はスペ−サを
取り除いた構造を有するものとして、陽極箔に所定の印
加電圧に耐え得る酸化皮膜を生成し、その上に直接有機
半導体を真空蒸着させてコンデンサとしたものであり、
いずれにしても温度特性或いは周波数特性において難点
があり、実用上解決すべき問題を抱える結果となってい
た。As one of the electrolytic capacitors that meet this demand, there is known an electrolytic capacitor that uses various semiconductors as a solid electrolyte in place of a conventionally generalized driving electrolyte. For example, a capacitor element formed by winding a pair of anode and cathode foils with a spacer interposed therebetween is heated and melt-impregnated with an organic semiconductor represented by a TCNQ complex, or has a structure in which the spacer is removed. As a thing, an oxide film that can withstand a predetermined applied voltage is generated on the anode foil, and an organic semiconductor is directly vacuum-deposited on the oxide film to form a capacitor.
In any case, there is a problem in the temperature characteristic or the frequency characteristic, which results in a problem to be solved practically.
【０００４】また、上記と同様にスペ−サ紙を使用しな
いものとして、陽極箔に印加電圧に耐え得る酸化皮膜を
生成させ、その上に化学酸化重合手段或いは電解酸化重
合手段を講じ、導電性高分子膜を形成させたものもあ
る。In the same manner as described above, assuming that no spacer paper is used, an oxide film capable of withstanding the applied voltage is formed on the anode foil, and a chemical oxidation polymerization means or an electrolytic oxidation polymerization means is provided thereon, and a conductive film is formed. Some have a polymer film formed.
【０００５】一般にコンデンサを電子機器に搭載する場
合には大容量が望まれるが、巻回形では、無効空間があ
るために高密度実装には適さず、高密度実装のためには
角形の積層構造がより有効であり、これらの要請に応え
るものとして酸化皮膜を生成した陽極箔を必要枚数積層
し、一端を接続した状態で化学酸化重合、電解酸化重合
を施し、前記酸化皮膜上に例えばポリピロ−ルからなる
導電性高分子膜を形成し、この導電性高分子膜上に陰極
引出層を形成してなる積層化構造のものが考えられる。In general, when a capacitor is mounted on an electronic device, a large capacity is desired. However, the wound type is not suitable for high-density mounting due to an ineffective space. The structure is more effective, and in order to meet these demands, a required number of anode foils having an oxide film formed thereon are laminated and subjected to chemical oxidation polymerization and electrolytic oxidation polymerization in a state where one end is connected, and for example, a polypyrroform It is conceivable that the conductive polymer film is formed of a laminated structure in which a conductive polymer film made of metal is formed and a cathode extraction layer is formed on the conductive polymer film.
【０００６】しかしながら、このような積層化構造のも
のは積層化が容易でなく、陽極箔積層間間隔を一定に保
つことは困難であり、したがって陽極箔表面に生成した
誘電体酸化皮膜上に形成される導電性高分子膜が不均一
になり、静電容量減少、ｔａｎδ大、更には漏れ電流増
大となる等の問題を抱える結果となっていた。However, such a laminated structure is not easy to laminate, and it is difficult to keep the interval between the laminated anode foils constant. Therefore, it is difficult to form the laminate on the dielectric oxide film formed on the surface of the anode foil. The resulting conductive polymer film becomes non-uniform, resulting in problems such as a decrease in capacitance, an increase in tan δ, and an increase in leakage current.
【０００７】また、誘電体酸化皮膜を生成した陽極箔上
に導電性高分子膜を形成し、その上に導電ペ−ストを塗
布し陰電極膜とした基本素子を複数枚積層し、両端面部
に引出端子部を形成し積層形固体電解コンデンサとする
ものも考えられるが、この場合導電ペ−ストの乾燥時の
熱ストレスにより誘電体酸化皮膜にクラック等の欠陥が
生じ漏れ電流の増大やショ−ト不良発生等の問題を抱え
る結果となり、いずれにしても有効な対策とは言えなか
った。Further, a conductive polymer film is formed on an anode foil having a dielectric oxide film formed thereon, and a conductive paste is applied thereon to laminate a plurality of basic elements as negative electrode films. It is also conceivable that a lead-out terminal is formed on the capacitor to form a laminated solid electrolytic capacitor. -As a result, there were problems such as the occurrence of failures, and it could not be said to be an effective measure in any case.
【０００８】[0008]
【発明が解決しようとする課題】以上述べたように電解
コンデンサにおける小形高性能化の要請に対応しようと
する流れは極めて活発であり、日進月歩の状況を迎えて
いる。As described above, the trend of responding to the demand for small and high-performance electrolytic capacitors is extremely active, and the situation is steadily increasing.
【０００９】しかしながら、小形高性能化を満足し、か
つ回路基板への高密度実装化に適したチップ構造からな
る電解コンデンサとして現在のところ必ずしも満足でき
る状況には至っていない。However, at present, it has not always been possible to satisfy the requirements for an electrolytic capacitor having a chip structure suitable for high-density mounting on a circuit board while satisfying miniaturization and high performance.
【００１０】本発明は、上記の点に鑑みてなされたもの
で、作業性良好にして諸特性改善に大きく貢献できる導
電性高分子膜を固体電解質とした素子構成を有し、チッ
プ化構造に適した積層形固体電解コンデンサの製造方法
を提供することを目的とするものである。The present invention has been made in view of the above points, and has an element structure using a conductive polymer film as a solid electrolyte which can improve workability and greatly contribute to improvement of various characteristics. It is an object of the present invention to provide a method for manufacturing a suitable laminated solid electrolytic capacitor.
【００１１】[0011]
【課題を解決するための手段】本発明は、誘電体酸化皮
膜を生成した櫛形の皮膜生成性金属箔の基部の先端部を
除く両面及び歯の根元の両面に絶縁塗膜を形成する工程
と、前記櫛形の皮膜生成性金属箔の歯の両面に順次化学
酸化重合並びに電解酸化重合手段を講じ導電性高分子膜
を形成し基本素子連を形成する工程と、この基本素子連
を前記絶縁塗膜部を接着し積層歯間に隙間を持たせそれ
ぞれ重なるよう複数枚積層し基本素子積層連群を形成す
る工程と、この基本素子積層連群の積層歯部に電解酸化
重合手段を講じ積層歯部に設けた導電性高分子膜上に更
に導電性高分子膜を形成してこの導電性高分子膜を介し
て前記積層歯間を一体化する工程と、この導電性高分子
膜上に陰極層を形成し積層素子連群を得る工程と、この
積層素子連群を歯の幅に沿って切断し単位素子を得る工
程と、この単位素子の陰極層に陰極引出端子を前記基部
の絶縁塗膜形成部以外に陽極引出端子を取着する工程と
を順次経る積層形固体電解コンデンサの製造方法を提供
することを特徴とするものである。According to the present invention, there is provided a process for forming an insulating coating film on both sides of a comb-shaped film-forming metal foil on which a dielectric oxide film is formed, excluding a base end portion, and on both sides of a tooth base. A step of forming a conductive polymer film by sequentially performing chemical oxidation polymerization and electrolytic oxidation polymerization on both surfaces of the teeth of the comb-shaped film-forming metal foil to form a basic element series; A step of forming a basic element laminated group by laminating a film portion and laminating a plurality of layers so as to overlap each other with a gap between the laminated teeth, and applying electrolytic oxidation polymerization means to the laminated tooth portion of the basic element laminated group. A step of further forming a conductive polymer film on the conductive polymer film provided in the portion, and integrating the stacked teeth through the conductive polymer film; and forming a cathode on the conductive polymer film. Forming a layer to obtain a stack of stacked elements; A stacked solid electrolytic process which sequentially performs a step of obtaining a unit element by cutting along a width and a step of attaching a cathode extraction terminal to a cathode layer of the unit element other than the insulating coating forming portion of the base at the cathode layer of the unit element A method of manufacturing a capacitor is provided.
【００１２】[0012]
【作用】このような構成によれば、あらかじめ基本素子
上に固体電解質としての導電性高分子膜を形成した後積
層化したものとなるため、導電性高分子膜が陽極箔上に
生成した誘電体酸化皮膜表面に均一に形成され、静電容
量、ｔａｎδ、漏れ電流特性の安定化に大きく寄与す
る。According to such a configuration, since a conductive polymer film as a solid electrolyte is formed on the basic element in advance and then laminated, the conductive polymer film is formed on the anode foil. It is uniformly formed on the surface of the body oxide film and greatly contributes to stabilization of capacitance, tan δ, and leakage current characteristics.
【００１３】また、積層素子全体を電解重合膜で完全に
一体化させ基本素子間に積層状態で存在した隙間をなく
した状態で陰極層を形成するものであるため、熱ストレ
スによる誘電体酸化皮膜のクラック発生を抑えることが
でき漏れ電流のさらなる安定化は元よりチップ化構造に
適したものとなる。Further, since the cathode layer is formed in a state in which the entire laminated element is completely integrated with the electrolytic polymerized film and the gap existing between the basic elements in the laminated state is eliminated, the dielectric oxide film due to thermal stress is formed. Cracks can be suppressed, and the leakage current can be further stabilized, which is suitable for a chip structure.
【００１４】[0014]
【実施例】以下、本発明の一実施例につき説明する。An embodiment of the present invention will be described below.
【００１５】まず、図２及び図３は基本素子連を示すも
ので、例えば厚さ１００μｍの高純度アルミニウム箔を
公知の手段でエッチングして表面を粗面化し、しかる後
櫛形に打ち抜いて基部１及び複数の歯２を設け、つぎに
化成処理を施し誘電体酸化皮膜３を生成し櫛形皮膜生成
性金属箔４とし、この櫛形皮膜生成性金属箔４の基部１
の先端部を除く両面及び歯２の根元までの両面にわたり
シリコ−ン、ポリイミド、ポリアミド、フッ素系樹脂な
どの絶縁塗料を塗布し絶縁塗膜５を形成し、しかる後前
記歯２の両面に化学酸化重合並びに電解酸化重合を施し
前記歯２の酸化皮膜上に導電性高分子膜６を形成し基本
素子連７を形成する。FIGS. 2 and 3 show a series of basic elements. For example, a high-purity aluminum foil having a thickness of 100 .mu.m is etched by a known means to roughen the surface. And a plurality of teeth 2, and then a chemical conversion treatment is performed to form a dielectric oxide film 3 to form a comb-shaped film-forming metal foil 4, and a base 1 of the comb-shaped film-forming metal foil 4.
An insulating coating such as silicone, polyimide, polyamide, or fluororesin is applied to both sides except the tip of the tooth and both sides up to the root of the tooth 2 to form an insulating coating film 5. Oxidative polymerization and electrolytic oxidative polymerization are performed to form a conductive polymer film 6 on the oxide film of the teeth 2 to form a series of basic elements 7.
【００１６】つぎに、この基本素子連７を図４に示すよ
うに前記絶縁塗膜５部を接触させて積層する歯２間に間
隔をもたせそれぞれ重なるように複数枚積層し前記絶縁
塗膜５を加熱するか、若しくは新たに接着材を介して絶
縁塗膜５部を接着し基本素子積層連群８を得る。Next, as shown in FIG. 4, a plurality of the basic element trains 7 are stacked so that the insulating coating film 5 is in contact with the insulating coating film 5 so as to be spaced apart from each other. Is heated or 5 parts of the insulating coating is newly bonded via an adhesive to obtain a basic element laminated group 8.
【００１７】しかして、基本素子積層連群８の積層歯９
部を電解酸化重合溶液に浸漬して図５に示すようにこの
積層歯９部表面の導電性高分子膜６上に、電解酸化重合
によって電解重合膜からなる導電性高分子膜６を形成
し、前記歯２間に存在する間隔を導電性高分子膜６で埋
め込みこの導電性高分子膜６を介して前記積層歯９を一
体化し、前記導電性高分子膜６上にカ−ボングラファイ
ト層、更にこの上に銀ペ−ストを塗布−乾燥−焼付して
陰極層１０を形成し積層素子連群１１を得る。Thus, the laminated teeth 9 of the basic element laminated group 8
The portion is immersed in an electrolytic oxidation polymerization solution to form a conductive polymer film 6 made of an electrolytic polymer film by electrolytic oxidation polymerization on the conductive polymer film 6 on the surface of the laminated teeth 9 as shown in FIG. The gap between the teeth 2 is filled with a conductive polymer film 6 to integrate the laminated teeth 9 via the conductive polymer film 6, and a carbon graphite layer is formed on the conductive polymer film 6. Further, a silver paste is applied, dried and baked thereon to form a cathode layer 10, thereby obtaining a laminated element assembly 11.
【００１８】つぎに、図６に示すようにこの積層素子連
群１１の基部１を歯２の幅（Ａ−Ａ）に沿って切断し、
図１に示すような単位素子１２とし、この単位素子１２
の陰極層１０に陰極引出端子１３を、また、この単位素
子１２の基部１の絶縁塗膜５形成部以外に陽極引出端子
１４をそれぞれ取着して、最後に樹脂外装１５を施し、
この樹脂外装１５から導出した陰極引出端子１３及び陽
極引出端子１４先端部を所望の位置に折曲げ（図示せ
ず）てなるものである。Next, as shown in FIG. 6, the base 1 of the laminated element assembly 11 is cut along the width (AA) of the teeth 2,
The unit element 12 as shown in FIG.
A cathode lead terminal 13 is attached to the cathode layer 10 and an anode lead terminal 14 is attached to the unit element 12 except for the portion where the insulating coating film 5 is formed on the base 1 of the unit element 12. Finally, a resin sheath 15 is applied.
The tips of the cathode lead-out terminal 13 and the anode lead-out terminal 14 derived from the resin outer casing 15 are bent to desired positions (not shown).
【００１９】以上のように構成してなる本発明によれ
ば、あらかじめ基本素子連７段階で固体電解質としての
導電性高分子膜６を形成した後積層化したものとなるた
め、導電性高分子膜６が櫛形皮膜生成性金属箔４上に生
成した誘電体酸化皮膜３表面に均一に形成され、静電容
量、ｔａｎδ、漏れ電流特性の安定化に大きく寄与す
る。According to the present invention having the above-described structure, the conductive polymer film 6 as a solid electrolyte is formed in advance in seven stages of the basic elements, and then laminated. The film 6 is uniformly formed on the surface of the dielectric oxide film 3 generated on the comb-shaped film-forming metal foil 4, and greatly contributes to stabilization of capacitance, tan δ, and leakage current characteristics.
【００２０】また、基本素子積層連群８全体を電解重合
膜からなる導電性高分子膜６で完全に一体化させ歯２間
（基本素子間）に積層状態で存在した隙間をなくした状
態で陰極層１０を形成するものであるため、熱ストレス
による誘電体酸化皮膜３のクラック発生を抑えることが
でき漏れ電流のさらなる安定化は元よりチップ化に適し
たものとなる。Further, the entire basic element stacking group 8 is completely integrated with the conductive polymer film 6 made of an electrolytic polymerized film so that the gap existing between the teeth 2 (between the basic elements) in a stacked state is eliminated. Since the cathode layer 10 is formed, generation of cracks in the dielectric oxide film 3 due to thermal stress can be suppressed, and further stabilization of leakage current is suitable for chip formation.
【００２１】つぎに、本発明と従来例によって得られた
固体電解ンデンサの特性比較について述べる。Next, a comparison of the characteristics of the solid electrolytic capacitors obtained by the present invention and the conventional example will be described.
【００２２】すなわち、以下に示す本発明Ａと従来例Ｂ
及び従来例Ｃの特性比較を下表に示す。試料はＡ、Ｂ、
Ｃとも５０個で、表中の括弧なし数値は平均値で、括弧
付数値はバラツキを示す。That is, the present invention A and the conventional example B shown below
The following table shows a comparison between the characteristics of Comparative Example 1 and Conventional Example C. The samples are A, B,
C is also 50, and the values without parentheses in the table are average values, and the values with parentheses indicate variations.
【００２３】（本発明Ａ）上記の実施例にて述べた手段
によって得られた、定格１０Ｖ−６．３μＦの積層形ア
ルミ固体電解コンデンサ。(Invention A) A laminated aluminum solid electrolytic capacitor rated at 10 V-6.3 μF obtained by the means described in the above embodiment.
【００２４】（従来例Ｂ）両面の一端近傍に絶縁塗膜を
設けた誘電体酸化皮膜を生成したアルミニウム箔複数枚
を、前記絶縁塗膜部を接着して前記アルミニウム箔間に
間隔を持たせて積層し積層体を形成した後、この積層体
を構成するアルミニウム箔の誘電体酸化皮膜上に化学酸
化重合及び電解酸化重合手段を講じ導電性高分子膜を形
成する構成を除き、他は本発明と同じ手段を講じて得ら
れた、定格１０Ｖ−６．３μＦの積層形アルミ固体電解
コンデンサ。(Conventional example B) A plurality of aluminum foils each having a dielectric oxide film provided with an insulating coating film near one end of both surfaces are bonded to the insulating coating portion so as to provide a space between the aluminum foils. After laminating to form a laminate, except for the configuration in which a conductive polymer film is formed by applying chemical oxidation polymerization and electrolytic oxidation polymerization means on the dielectric oxide film of the aluminum foil constituting the laminate, A laminated aluminum solid electrolytic capacitor rated at 10 V-6.3 μF, obtained by taking the same means as the invention.
【００２５】（従来例Ｃ）誘電体酸化皮膜を生成したア
ルミニウム箔の誘電体酸化皮膜上に化学酸化重合及び電
解酸化重合手段を講じ導電性高分子膜を形成し、その上
にカ−ボン層並びに銀ペ−スト層を設け陰極層を形成し
た基本素子を、絶縁塗膜を介して複数積層するようにし
た手段を除き、他は本発明と同じ手段を講じて得られ
た、定格１０Ｖ−６．３μＦの積層形アルミ固体電解コ
ンデンサ。(Conventional Example C) A conductive polymer film is formed on a dielectric oxide film of an aluminum foil on which a dielectric oxide film has been formed by means of chemical oxidation polymerization and electrolytic oxidation polymerization, and a carbon layer is formed thereon. Except for a means for laminating a plurality of elementary elements each having a silver paste layer and a cathode layer formed thereon via an insulating coating film, a rated element of 10 V- 6.3 μF laminated aluminum solid electrolytic capacitor.
【００２６】[0026]
【表１】 [Table 1]
【００２７】上表から明らかなように、従来例Ｂのもの
は、いずれの特性も極端に悪く実用上大きな問題があ
り、また従来例Ｃのものは、静電容量特性は問題はない
が、その他の特性はいずれも極端に悪く従来例Ｂ同様実
用的でないのに対して、本発明Ａのものは、静電容量、
ｔａｎδ、漏れ電流特性も良好で、かつショ−ト不良率
も極僅かで本発明の優れた改善効果を実証した。As can be seen from the above table, the prior art B has extremely poor performance in any case and has a serious problem in practical use, and the conventional art C has no problem in capacitance characteristics. All the other properties are extremely bad and are not practical as in Conventional Example B, whereas those of the present invention A have a capacitance,
The tan δ, the leakage current characteristics were good, and the short defect rate was extremely small, demonstrating the excellent improvement effect of the present invention.
【００２８】なお、上記実施例では皮膜生成性金属箔と
して、アルミニウム箔を用いたものを例示して説明した
が、タンタル箔又はニオブ箔を用いたものに適用できる
ことは勿論である。In the above embodiment, an aluminum foil was used as an example of the film-forming metal foil. However, it is needless to say that the invention can be applied to a tantalum foil or a niobium foil.
【００２９】[0029]
【発明の効果】本発明によれば、誘電体酸化皮膜を生成
した陽極箔全体に均一で十分な導電性高分子膜の形成が
可能となり、また熱ストレスによる誘電体酸化皮膜の損
傷も防止でき、諸特性改善に大きく貢献できる積層形固
体電解コンデンサの製造方法を得ることができる。According to the present invention, a uniform and sufficient conductive polymer film can be formed on the entire anode foil on which a dielectric oxide film has been formed, and the dielectric oxide film can be prevented from being damaged by thermal stress. In addition, it is possible to obtain a method of manufacturing a multilayer solid electrolytic capacitor that can greatly contribute to improvement of various characteristics.
【図１】本発明の実施例に係る積層形固体電解コンデン
サを示す断面図である。FIG. 1 is a sectional view showing a multilayer solid electrolytic capacitor according to an embodiment of the present invention.
【図２】本発明の実施例に係る基本素子連を示す側断面
図である。FIG. 2 is a side sectional view showing a series of basic elements according to the embodiment of the present invention.
【図３】本発明の実施例に係る基本素子連を示す平面図
である。FIG. 3 is a plan view showing a series of basic elements according to the embodiment of the present invention.
【図４】本発明の実施例に係る基本素子積層連を示す側
面図である。FIG. 4 is a side view showing a basic element stack according to an embodiment of the present invention.
【図５】本発明の実施例に係る積層素子連群を示す側断
面図である。FIG. 5 is a side sectional view showing a stacked element assembly according to the embodiment of the present invention.
【図６】本発明の実施例に係る積層素子連群を示す平面
図である。FIG. 6 is a plan view showing a group of stacked elements according to the embodiment of the present invention.
１ 基部 ２ 歯 ３ 誘電体酸化皮膜 ４ 櫛形皮膜生成性金属箔 ５ 絶縁塗膜 ６ 導電性高分子膜 ７ 基本素子連 ８ 基本素子積層連群 ９ 積層歯 １０ 陰極層 １１ 積層素子連群 １２ 単位素子 １３ 陰極引出端子 １４ 陽極引出端子 １５ 樹脂外装 DESCRIPTION OF SYMBOLS 1 Base 2 Teeth 3 Dielectric oxide film 4 Comb-shaped film forming metal foil 5 Insulating coating film 6 Conductive polymer film 7 Basic element series 8 Basic element stacking group 9 Stacking teeth 10 Cathode layer 11 Stacking element group 12 Unit element 13 Cathode extraction terminal 14 Anode extraction terminal 15 Resin exterior
Claims (1)
成性金属箔の基部の先端部を除く両面及び歯の根元の両
面に絶縁塗膜を形成する工程と、前記櫛形の皮膜生成性
金属箔の歯の両面に順次化学酸化重合並びに電解酸化重
合手段を講じ導電性高分子膜を形成し基本素子連を形成
する工程と、この基本素子連を前記絶縁塗膜部を接着し
積層歯間に隙間を持たせそれぞれ重なるよう複数枚積層
し基本素子積層連群を形成する工程と、この基本素子積
層連群の積層歯部に電解酸化重合手段を講じ積層歯部に
設けた導電性高分子膜上に更に導電性高分子膜を形成し
てこの導電性高分子膜を介して前記積層歯間を一体化す
る工程と、この導電性高分子膜上に陰極層を形成し積層
素子連群を得る工程と、この積層素子連群を歯の幅に沿
って切断し単位素子を得る工程と、この単位素子の陰極
層に陰極引出端子を前記基部の絶縁塗膜形成部以外に陽
極引出端子を取着する工程とを順次経ることを特徴とす
る積層形固体電解コンデンサの製造方法。1. A step of forming an insulating coating film on both sides of a comb-shaped film-forming metal foil on which a dielectric oxide film has been formed, excluding a base end portion and on both surfaces of a tooth base, and said comb-shaped film-forming metal. A step of forming a conductive polymer film by sequentially applying chemical oxidation polymerization and electrolytic oxidation polymerization means on both surfaces of the teeth of the foil to form a series of basic elements; Forming a basic element stacking group by laminating a plurality of layers so as to overlap each other with a gap therebetween, and a conductive polymer provided in the stacking tooth section by applying electrolytic oxidation polymerization means to the stacking teeth section of the basic element stacking group A step of forming a conductive polymer film on the film and integrating the laminated teeth through the conductive polymer film; and forming a cathode layer on the conductive polymer film to form a stack of stacked elements. And cutting the stacked element series along the width of the teeth to obtain a unit element. And a step of attaching a cathode lead-out terminal to the cathode layer of the unit element and an anode lead-out terminal in a portion other than the insulating film forming portion of the base in order to produce a multilayer solid electrolytic capacitor. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14954291A JP2832651B2 (en) | 1991-05-24 | 1991-05-24 | Manufacturing method of multilayer solid electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14954291A JP2832651B2 (en) | 1991-05-24 | 1991-05-24 | Manufacturing method of multilayer solid electrolytic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04348016A JPH04348016A (en) | 1992-12-03 |
| JP2832651B2 true JP2832651B2 (en) | 1998-12-09 |
Family
ID=15477426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14954291A Expired - Fee Related JP2832651B2 (en) | 1991-05-24 | 1991-05-24 | Manufacturing method of multilayer solid electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2832651B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3663952B2 (en) * | 1999-02-17 | 2005-06-22 | 松下電器産業株式会社 | Manufacturing method of solid electrolytic capacitor |
| TW442809B (en) * | 1999-02-17 | 2001-06-23 | Matsushita Electric Ind Co Ltd | Method and apparatus for manufacturing solid electrolytic capacitor |
| US6790556B1 (en) | 1999-12-06 | 2004-09-14 | E.C.R. - Electro Chemical Research, Ltd. | Electrochemical energy storage device having improved enclosure arrangement |
| US6576365B1 (en) | 1999-12-06 | 2003-06-10 | E.C.R. - Electro Chemical Research Ltd. | Ultra-thin electrochemical energy storage devices |
| JP5411047B2 (en) * | 2010-04-02 | 2014-02-12 | Ｎｅｃトーキン株式会社 | Multilayer solid electrolytic capacitor and manufacturing method thereof |
-
1991
- 1991-05-24 JP JP14954291A patent/JP2832651B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04348016A (en) | 1992-12-03 |
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