JP2790512B2 - Manufacturing method of flexible circuit board - Google Patents
Manufacturing method of flexible circuit boardInfo
- Publication number
- JP2790512B2 JP2790512B2 JP2027207A JP2720790A JP2790512B2 JP 2790512 B2 JP2790512 B2 JP 2790512B2 JP 2027207 A JP2027207 A JP 2027207A JP 2720790 A JP2720790 A JP 2720790A JP 2790512 B2 JP2790512 B2 JP 2790512B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- self
- circuit board
- synthetic resin
- protective film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Laminated Bodies (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、自己形状保持性を持たないフレキシブルな
導電体積層合成樹脂フィルムを用いて回路板を作成する
方法に関するものである。本発明で言う自己形状保持性
を持たないとは、導電体積層合成樹脂フィルムが、１部
を支えるだけでは、折れ曲がりや、たわみを起こし、平
坦の状態を保てない性質や、２本のロール間に橋渡しし
て平坦性が得られても、水や空気を当てると、たわんで
ロール間に落ちてしまう性質を示し、たとえば、70μｍ
以下の厚さの銅箔を20μｍ以下の厚さの接着剤により、
200μｍ以下の厚さのポリエチレングリコールテフタレ
ート樹脂やポリイミド樹脂から成るフィルムに積層した
銅張積層フィルムや、１μｍ以下の厚さのインジウムす
ず酸化物（ITO）をスパッタリング法等の真空技術で、3
00μｍ以下の厚さのポリエーテルスルホン樹脂等から成
るフィルムに積層した透明導電性フィルムが該当する。Description: TECHNICAL FIELD The present invention relates to a method for producing a circuit board using a flexible conductor laminated synthetic resin film having no self-shape retention. The term "having no self-shape retention property" as used in the present invention means that the conductor-laminated synthetic resin film bends or bends only by supporting one part, and cannot maintain a flat state, or two rolls. Even if flatness is obtained by bridging between them, it shows the property that it deflects between rolls when exposed to water or air, for example, 70 μm
Copper foil of the following thickness with an adhesive of a thickness of 20 μm or less,
A copper-clad laminated film laminated on a film made of polyethylene glycol terephthalate resin or polyimide resin with a thickness of 200 μm or less, or indium tin oxide (ITO) with a thickness of 1 μm or less by a vacuum technique such as a sputtering method.
A transparent conductive film laminated on a film made of a polyether sulfone resin or the like having a thickness of 00 μm or less corresponds to the above.
従来、前述のような銅張積層フィルムや、透明導電性
フィルムを用いて、回路形成加工を行なう場合、自己形
状保持性を有しない為に、工程中の移送において、コン
ベアロール間に落ちてしまったり、エッチング液のスプ
レー等によって折れ曲がったり搬送位置がずれて装置内
に引っかかったりして、生産に支障を起すことが多かっ
た。Conventionally, when a circuit is formed using a copper-clad laminated film or a transparent conductive film as described above, it has no self-shape retention, so it has fallen between conveyor rolls during transfer during the process. In many cases, the sheet is bent by the spraying of an etching solution or the like, or the transfer position is shifted and stuck in the apparatus, thereby causing troubles in production.
本発明は、自己形状保持性に持たないフレキシブルな
導電体積層合成樹脂フィルムに自己形状保持性を与える
ことでこれらの問題を解決する方法を提供することにあ
る。An object of the present invention is to provide a method for solving these problems by imparting self-shape retention to a flexible conductor laminated synthetic resin film having no self-shape retention.
すなわち、自己保持性を持たないフレキシブルな導電
体積層合成樹脂フィルムの回路形成加工を行わない面
に、易剥離性の保護フィルムを易剥離性の面において圧
着し、さらに、該フィルムを自己形状保持特性を有する
基体に強固に接着せしめて回路形成加工を行なうこと
で、回路形成設備に特殊な改造を施すことなく、フェノ
ール樹脂やエポキシ樹脂を紙やガラス布等に含浸させて
製造される硬質の銅張積層板の回路形成加工設備や、液
晶表示素子用透明導電膜付ガラス板の回路形成加工設備
を用いて、回路形成を可能にせしめる方法である。That is, an easily peelable protective film is pressure-bonded to the surface of the flexible conductor laminated synthetic resin film having no self-holding property, which is not subjected to circuit formation processing, on the easily peelable face, and further, the film is held in a self-shape. By performing circuit formation processing by firmly adhering it to a substrate having characteristics, it is possible to manufacture a hard material that is manufactured by impregnating paper or glass cloth with phenolic resin or epoxy resin without applying special modification to circuit forming equipment. This is a method that enables circuit formation using circuit formation processing equipment for a copper-clad laminate or circuit formation processing equipment for a glass plate with a transparent conductive film for a liquid crystal display element.
これにより、特別な設備を設計、製作することなく従
来より数多く設置されている設備が使えることになり、
高額の設備投資が回避される。As a result, many facilities can be used without having to design and manufacture special facilities.
High capital investment is avoided.
本発明で言う自己形状保持性を有する基体とは前述の
硬質の銅張積層板や、透明導電膜付ガラス板であっても
よいし、他の適当な硬質の板を用いてもよい。易剥離性
の保護フィルムとしては、100μｍ以下の厚さのポリエ
チレン樹脂フィルムや、塩化ビニル樹脂フイルム、ポリ
エチレングリコールテフタレート樹脂フィルム等に50μ
ｍ以下の粘着剤やエチレン酢酸ビニル樹脂等を積層した
ものが選ばれ、例えばサンエー化学工業（株）の「サニ
テクト」やスミロン（株）の「スミロン」として、市販
されている。特に、ピール強度が200g/25mm幅以下であ
るものが好ましい。なぜならば、回路形成加工を終えた
後で、自己保持性を持たないフレキシブルな導電体積層
合成樹脂フィルムを自己形状保持性を有する基体から剥
がす際に、200g/25mm幅を超えるような力を必要とする
と、剥がす力によってフィルムが折れ曲がり、フィルム
自体が損傷する問題や、回路形成された導電体層に断線
や電気抵抗の上昇が生じる問題があるためである。該保
護フィルムを自己形状保持性を持たないフレキシブルな
導電体積層合成樹脂フィルムに積層する方法としては、
回路形成加工設備に適した大きさに裁断する前に、連続
フィルムとしてニップロール等でラミネートしてもよい
し、裁断した後に、枚葉でラミネートすることも可能で
あるが、通常裁断する前の方が効率的である。The substrate having the self-shape retention property referred to in the present invention may be the above-described hard copper-clad laminate, a glass plate with a transparent conductive film, or another suitable hard plate. As an easily peelable protective film, a polyethylene resin film having a thickness of 100 μm or less, a vinyl chloride resin film, a polyethylene glycol terephthalate resin film, etc.
m or less laminated with an adhesive or ethylene vinyl acetate resin or the like, and are commercially available, for example, as "Sanitect" of San-A Chemical Industry Co., Ltd. or "Sumilon" of Sumilon Co., Ltd. Particularly, those having a peel strength of 200 g / 25 mm width or less are preferable. This is because a force exceeding 200 g / 25 mm width is required after peeling the flexible conductor laminated synthetic resin film without self-holding property from the substrate with self-shape holding property after completing the circuit formation processing. In this case, the film is bent by the peeling force, and there is a problem that the film itself is damaged, and there is a problem that the conductor layer formed with the circuit is disconnected and an electric resistance is increased. As a method of laminating the protective film on a flexible conductor laminated synthetic resin film having no self-shape retention property,
Before cutting to a size suitable for circuit forming processing equipment, it may be laminated as a continuous film with nip rolls, etc., or after cutting, it is possible to laminate with single sheet, but usually before cutting Is efficient.
自己形状保持性を持たないフレキシブルな導電体積層
合成樹脂フィルムに張り合わされた保護フィルムを、自
己形状保持特性を有する基体に強固に接着せしめる方法
としては塗布型接着剤噴射型接着剤等を用いて、全表面
で接着する方法と、強力な両面接着テープ、両面粘着テ
ープ等で周辺部等、１部のみ接着する方法を目的に応じ
選ぶことができる。強固な接着としては、ピール強度
が、導電体積層合成樹脂フィルムと保護フィルム間のピ
ール強度より、十分に大きいことを意味し、通常500g/2
5mm幅以上が望ましい。500g/25mm幅未満では、回路形成
加工を終えた後で、自己形状保持性を持たないフレキシ
ブルな導電体積層合成樹脂フィルムを、自己形状保持性
を有する基体から剥がす際に、自己形状保持性を持たな
いフレキシブルな導電体積層合成樹脂フィルムに圧着さ
れた易剥離性の保護フィルムの易剥離面で確実に自己形
状保持性を持たないフレキシブルな導電体積層合成樹脂
フィルムを剥離することが出来なくなるためである。As a method of firmly bonding a protective film bonded to a flexible conductor laminated synthetic resin film having no self-shape holding property to a substrate having self-shape holding properties, a coating type adhesive jet type adhesive or the like is used. Depending on the purpose, a method of bonding on the entire surface and a method of bonding only one portion such as a peripheral portion with a strong double-sided adhesive tape or a double-sided adhesive tape can be selected. Strong adhesion means that the peel strength is sufficiently larger than the peel strength between the conductor laminated synthetic resin film and the protective film, usually 500 g / 2
A width of 5 mm or more is desirable. When the width is less than 500 g / 25 mm, the self-shape holding property is reduced when the flexible conductor laminated synthetic resin film having no self-shape holding property is peeled off from the substrate having the self-shape holding property after the completion of the circuit formation processing. Since the flexible conductor laminated synthetic resin film which does not have self-shape retention cannot be reliably peeled off on the easily peeled surface of the easily peelable protective film pressed against the flexible conductor laminated synthetic resin film which does not have It is.
すなわち、本発明は、自己形状保持性を有する導電体
積層基体用に汎用となっている回路形成装置を用いて、
自己形状保持性を持たないフレキシブルな導電体積層合
成樹脂フィルムを回路形成加工するための製造方法であ
って、回路形成加工後には、自己形状保持性を持たない
フレキシブルな導電体積層のみが、自己形状保持性を有
する基体に固定するための接着剤等の付加的なものを裏
面に残すことなく剥がせることに特徴がある。That is, the present invention uses a circuit forming apparatus that is widely used for a conductor laminated substrate having self-shape retention,
This is a manufacturing method for forming a circuit of a flexible conductor laminated synthetic resin film having no self-shape holding property. It is characterized in that it can be peeled off without leaving an additional material such as an adhesive for fixing to a substrate having shape retention properties on the back surface.
実施例１ 図５に示されるような、35μｍ厚さの銅箔１を15μｍ
厚さの接着剤２で75μｍ厚さのポリイミドフィルム３に
積層したフレキシブル回路版製造用銅張積層フィルム
に、図１で示されるように、易剥離性の保護フィルム４
（サンエー化学（株）製サニテクトPAC−Ａ−65、剥離
強度10g/25mm、厚さ65μｍ）を貼り、さらに、強粘着性
の両面接着テープ５（日東電工（株）製No.500、剥離強
度1375g/25mm、厚さ160μｍ）を用いて、四辺をすきま
なく、ガラス・エポキシ含浸硬質積層板６に固定した。
この図１に示される積層体を、汎用の銅箔エッチング機
（東京化工機（株）製）により銅箔のパターン加工を行
なったところ、図３に示されるように、何ら支障なく、
移送された。Example 1 A copper foil 1 having a thickness of 35 μm as shown in FIG.
As shown in FIG. 1, an easily peelable protective film 4 is formed on a copper-clad laminate film for manufacturing a flexible circuit board, which is laminated on a polyimide film 3 having a thickness of 75 μm with an adhesive 2 having a thickness of
(Sanect PAC-A-65 manufactured by San-A Chemical Co., Ltd., peel strength: 10 g / 25 mm, thickness: 65 μm), and furthermore, a double-sided adhesive tape 5 with strong adhesiveness (No. 500 manufactured by Nitto Denko Corporation, peel strength) (1375 g / 25 mm, thickness 160 μm), and was fixed to the glass / epoxy-impregnated rigid laminate 6 without gaps on all sides.
When the laminate shown in FIG. 1 was subjected to copper foil pattern processing using a general-purpose copper foil etching machine (manufactured by Tokyo Kakoki Co., Ltd.), as shown in FIG.
Transferred.
実施例２ 図６に示されたような、100μｍ厚さのポリエーテル
スルホン樹脂フィルム８に300Å厚さのITO7を積層した
透明導電フィルムを、図２に示されたように、易剥離性
の保護フィルム４を貼り、さらに、スプレーのり（住友
3M（株）製）を用いて、接着剤層９を形成し、厚さ1.1m
mのガラス板に強固に固定した。この図２に示される積
層体を、実施例１と同様の設備でITOのパターン加工を
行なったところ、何ら支障なく移送された。Example 2 As shown in FIG. 6, a transparent conductive film obtained by laminating a 300 μm thick ITO 7 on a 100 μm thick polyether sulfone resin film 8 as shown in FIG. Paste film 4 and spray glue (Sumitomo
3M) to form an adhesive layer 9 having a thickness of 1.1 m.
m firmly fixed to a glass plate. The laminate shown in FIG. 2 was subjected to ITO pattern processing with the same equipment as in Example 1, and was transferred without any trouble.
比較例 図４に示されるように、本発明によらないで、図５に
示される銅張積層フィルムと図６に示される透明導電フ
ィルムをパターン加工しようとしたところ、エッチング
液スプレー11によりフィルムがコンベアローラー12の間
に落ち込んでしまい、正常な加工が行なえなかった。COMPARATIVE EXAMPLE As shown in FIG. 4, the copper-clad laminated film shown in FIG. 5 and the transparent conductive film shown in FIG. It fell between the conveyor rollers 12 and normal processing could not be performed.
図１、図２は本発明を実施する為の、自己形状保持性を
持たないフィルムに自己形状保持性を与える方法を例示
した断面図である。 図３は、本発明を用いて、フィルムの加工を行なう場合
の説明図である。 図４、本発明を用いないでフィルムの加工を行なう場合
の問題点を示す説明図である。 図５、図６は、本発明の対象となる自己形状保持性を持
たないフィルムを例示した断面図である。1 and 2 are cross-sectional views illustrating a method for imparting self-shape retention to a film having no self-shape retention for implementing the present invention. FIG. 3 is an explanatory diagram in the case of processing a film using the present invention. FIG. 4 is an explanatory diagram showing a problem when processing a film without using the present invention. FIG. 5 and FIG. 6 are cross-sectional views illustrating a film having no self-shape retention that is the object of the present invention.
Claims (1)
体積層合成樹脂フィルムを用いて回路板を作成する方法
において、該フィルムの回路形成加工を行わない面に、
易剥離性の保護フィルムを圧着し、さらに、該保護フィ
ルムを自己形状保持性を有する基体に強固に接着せしめ
て、回路形成加工を行った後に、該フィルムを、易剥離
性の保護フィルムとの圧着面で剥離し、自己保持性を持
たないフレキシブル回路板を得ることを特徴とするフレ
キシブル回路板の製造方法。In a method for producing a circuit board using a flexible conductor laminated synthetic resin film having no self-holding property, a surface of the film that is not subjected to circuit formation processing is provided.
After pressing the easily peelable protective film, the protective film is firmly adhered to a substrate having a self-shape retaining property, and after performing a circuit forming process, the film is bonded to the easily peelable protective film. A method for manufacturing a flexible circuit board, wherein a flexible circuit board having no self-holding property is obtained by peeling off at a pressure-bonded surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2027207A JP2790512B2 (en) | 1990-02-08 | 1990-02-08 | Manufacturing method of flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2027207A JP2790512B2 (en) | 1990-02-08 | 1990-02-08 | Manufacturing method of flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03232294A JPH03232294A (en) | 1991-10-16 |
| JP2790512B2 true JP2790512B2 (en) | 1998-08-27 |
Family
ID=12214658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2027207A Expired - Fee Related JP2790512B2 (en) | 1990-02-08 | 1990-02-08 | Manufacturing method of flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2790512B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4862238B2 (en) * | 2001-09-06 | 2012-01-25 | 東レ株式会社 | Circuit board manufacturing method |
| JP4669888B2 (en) | 2008-01-16 | 2011-04-13 | 品川リフラクトリーズ株式会社 | Immersion nozzle support exchange mechanism |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6052082A (en) * | 1983-08-31 | 1985-03-23 | 日本メクトロン株式会社 | Method of producing flexible circuit board |
| JPS60109294A (en) * | 1983-11-18 | 1985-06-14 | ソニー株式会社 | Method of producing flexible circuit board |
-
1990
- 1990-02-08 JP JP2027207A patent/JP2790512B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03232294A (en) | 1991-10-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |