JP2782940B2 - Floating magnetic head device - Google Patents
Floating magnetic head deviceInfo
- Publication number
- JP2782940B2 JP2782940B2 JP27087290A JP27087290A JP2782940B2 JP 2782940 B2 JP2782940 B2 JP 2782940B2 JP 27087290 A JP27087290 A JP 27087290A JP 27087290 A JP27087290 A JP 27087290A JP 2782940 B2 JP2782940 B2 JP 2782940B2
- Authority
- JP
- Japan
- Prior art keywords
- floating
- wiring board
- printed wiring
- magnetic head
- head device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
- Supporting Of Heads In Record-Carrier Devices (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は磁気記録媒体上に一定の間隔を保って浮上す
る浮動型磁気ヘッド装置に関するものである。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a floating magnetic head device which floats on a magnetic recording medium at a constant interval.
従来の技術 第８図及び第９図及び第10図はそれぞれ従来の浮動型
磁気ヘッド装置を示す斜視図及び側面図及び正面図であ
る。ここで第10図はプリント配線基板が屈曲されていな
い状態を示している。第８図および第９図および第10図
において１はステンレス等の金属の薄板にプレス加工等
を施す事によって形成され、ロードビームで、ロードビ
ーム１の一端1aは磁気記録媒体とほぼ平行に移動するア
ーム（図示せず）に接合されており、他端1bには浮動型
スライダ２がジンバル３を介して接合されている。浮動
型スライダ２には第10図に示す様に薄膜磁気ヘッド素子
2aが設けられており、しかも外部装置と薄膜磁気ヘッド
素子2aとを電気的に接続するための電極パッド2bが設け
られている。４はロードビーム１上に接着剤によって貼
りつけられた帯状のプリント配線基板で、プリント配線
基板４は高分子材料等によってできた可撓性を有する基
板4aの上に導電層4bを設けた構成となっている。叉導電
層4bの端部は電極パッド2bに熱圧着法や超音波圧着法に
よって構成されている。2. Description of the Related Art FIGS. 8, 9 and 10 are a perspective view, a side view and a front view, respectively, showing a conventional floating magnetic head device. Here, FIG. 10 shows a state where the printed wiring board is not bent. 8, 9, and 10, reference numeral 1 denotes a load beam formed by pressing a thin plate of metal such as stainless steel, and one end 1 a of the load beam 1 moves substantially parallel to the magnetic recording medium. The floating slider 2 is joined to the other end 1b via a gimbal 3. The floating slider 2 has a thin-film magnetic head element as shown in FIG.
2a, and an electrode pad 2b for electrically connecting an external device to the thin-film magnetic head element 2a. Reference numeral 4 denotes a strip-shaped printed wiring board adhered on the load beam 1 with an adhesive. The printed wiring board 4 has a structure in which a conductive layer 4b is provided on a flexible substrate 4a made of a polymer material or the like. It has become. The end of the conductive layer 4b is formed on the electrode pad 2b by a thermocompression bonding method or an ultrasonic compression bonding method.
発明が解決しようとする課題 従来この様な浮動型磁気ヘッド装置は浮動型スライダ
の共振周波数を高くするように設計されている。これは
以下の理由によるものである。浮動型スライダにはロー
ドビーム等を介して外部振動が伝えられる。この外部振
動の周波数と浮動型スライダの共振周波数が等しくなる
と浮動型スライダは共振を起こし、磁気記録媒体と接触
する事がある。また外部振動の周波数成分を解析してみ
ると、外部振動には60Hzの周波数が最も多く、周波数が
高くなっていくに従って次第にその割合は小さくなって
いく。従って浮動型のスライダの共振周波数が高ければ
高いほど外部振動と共振する確率は小さくなっていく。
第８図に示した浮動型磁気ヘッド装置においてはプリン
ト配線基板４の浮動型スライダ２側の側部を局所的に曲
げて浮動型スライダ２に接合していることにより、プリ
ント配線基板４の屈曲した部分の剛性が大きくなり浮動
型スライダ２の共振周波数を低くしてしまうという問題
点を有していた。Problems to be Solved by the Invention Conventionally, such a floating magnetic head device is designed to increase the resonance frequency of the floating slider. This is for the following reason. External vibration is transmitted to the floating slider via a load beam or the like. When the frequency of the external vibration becomes equal to the resonance frequency of the floating slider, the floating slider resonates and may come into contact with the magnetic recording medium. When analyzing the frequency component of the external vibration, the frequency of the external vibration is the highest at 60 Hz, and the ratio gradually decreases as the frequency increases. Therefore, the higher the resonance frequency of the floating slider, the smaller the probability of resonance with external vibration.
In the floating magnetic head device shown in FIG. 8, since the side of the printed wiring board 4 on the side of the floating slider 2 is locally bent and joined to the floating slider 2, the bending of the printed wiring board 4 is achieved. There is a problem that the rigidity of the portion which has been increased increases and the resonance frequency of the floating slider 2 is lowered.
本発明の前記従来の問題点を解決するもので、プリン
ト配線基板の曲げによる剛性を従来よりも小さくする事
ができ、従来の浮動型スライダの共振周波数よりも高い
共振周波数にすることができ、外部振動による浮動型ス
ライダの共振が発生する確率を小さくする事ができる浮
動型磁気ヘッド装置を提供する事を目的としている。In order to solve the above-mentioned conventional problems of the present invention, rigidity due to bending of a printed wiring board can be made smaller than before, and a resonance frequency higher than the resonance frequency of a conventional floating slider can be obtained. It is an object of the present invention to provide a floating magnetic head device that can reduce the probability of occurrence of resonance of a floating slider due to external vibration.
課題を解決するための手段 この目的を達成するために、プリント配線基板の端部
付近の幅を他の部分よりも広くするとともに、前記幅を
広くした部分の中央部付近に貫通孔を設け、その貫通孔
に沿って導電層を設け、幅を広くした部分を屈曲させて
前記導電層を浮動型スライダに接合させた。Means for Solving the Problems To achieve this object, the width near the end of the printed wiring board is made wider than the other parts, and a through hole is provided near the center of the widened part, A conductive layer was provided along the through hole, and the widened portion was bent to join the conductive layer to the floating slider.
作用 この構成により、プリント配線基板の屈曲部の剛性を
小さくする事ができる。Action With this configuration, the rigidity of the bent portion of the printed wiring board can be reduced.
実 施 例 第１図及び第２図及び第３図はそれぞれ本発明の一実
施例における浮動型磁気ヘッド装置を示す斜視図及び側
面図及び正面図である。第１図及び第２図及び第３図に
おいて、１はロードビーム、２は浮動型スライダ、2aは
薄膜磁気ヘッド素子、2bは電極パッド、３はジンバルで
これらは従来の構成の同じである。５はプリント配線基
板で、プリント配線基板５はポリイミド等の高絶縁性を
有し、しかも可撓性を有する基板5aの上に導電層5bを形
成した構成となっている。またプリント配線基板５の先
端部は第３図に示すように他の部分よりも幅が広くなっ
ており、その中央部には貫通孔5cが設けられている。し
かもその先端部の導電層5bは貫通孔5cに沿って形成され
ている。プリント配線基板５はロードビーム１の浮動型
スライダ２が設けられていない側の面に、ロードビーム
１の長手方向に沿って接着剤等によって先端部を除いて
張り付けられている。またプリント配線基板５はその先
端部を屈曲させて、導電層5bを電極パッド2bに熱圧着法
や超音波圧着法を用いて接合される。先端部がこの様な
構造のプリント配線基板５を用いると、浮動型スライダ
２にプリント配線基板５を接合させるために屈曲させた
部分の剛性を小さくする事ができるので、浮動型スライ
ダ２の共振周波数を高くする事ができる。なぜ剛性が小
さくなるかというと、先端部を屈曲させた際に第３図を
示す部分Ａの部分によじれが生じるので、その分従来の
構成のようなプリント配線基板を使用するよりも屈曲さ
せた部分の剛性が小さくなるのだと考えられる。FIG. 1, FIG. 2, and FIG. 3 are a perspective view, a side view, and a front view, respectively, showing a floating magnetic head device according to an embodiment of the present invention. 1, 2 and 3, 1 is a load beam, 2 is a floating slider, 2a is a thin film magnetic head element, 2b is an electrode pad, and 3 is a gimbal, which is the same as the conventional configuration. Reference numeral 5 denotes a printed wiring board. The printed wiring board 5 has a structure in which a conductive layer 5b is formed on a flexible substrate 5a having high insulation properties such as polyimide. The front end of the printed wiring board 5 is wider than other parts as shown in FIG. 3, and a through hole 5c is provided at the center. In addition, the conductive layer 5b at the tip is formed along the through hole 5c. The printed wiring board 5 is attached to the surface of the load beam 1 on the side where the floating type slider 2 is not provided, along the longitudinal direction of the load beam 1 except for the tip portion with an adhesive or the like. The printed wiring board 5 is bent at its tip, and the conductive layer 5b is bonded to the electrode pad 2b using a thermocompression bonding method or an ultrasonic compression bonding method. When the printed wiring board 5 having the above-described structure is used, the rigidity of a portion bent to join the printed wiring board 5 to the floating slider 2 can be reduced. The frequency can be increased. The reason why the rigidity is reduced is that, when the tip is bent, the portion A shown in FIG. 3 is twisted, so that the bent portion is more bent than using a printed circuit board as in the conventional configuration. It is thought that the stiffness of the part which became is small.
以下剛性が小さくなる事を具体的に証明する。第４図
はプリント配線基板の剛性がどのくらいあるかを試験す
る試験装置の概略図である。以下試験方法を第４図を用
いて説明する。まずブロック６とブロック７の間に試験
するプリント配線基板８をの一端を挟み、他端をブロッ
ク９とブロック10で挟む。そして第４図に示す様にブロ
ック９とブロック10を角度Ｂだけ回動させ、その時に必
要な荷重を測定した。本実施例に用いられるプリント配
線基板では貫通孔が設けられている部分を曲げた。その
結果を第５図に示す。第５図から判るように本実施例に
用いるプリント配線基板では従来のプリント配線基板に
比べて約半分の荷重で、同程度の角度Ｂになる。すなわ
ち本実施例に用いられるプリント配線基板の構造では従
来のプリント配線基板よりも屈曲させた部分の剛性が小
さいことが判る。Hereinafter, it will be specifically proved that the rigidity is reduced. FIG. 4 is a schematic view of a test apparatus for testing the rigidity of a printed wiring board. Hereinafter, the test method will be described with reference to FIG. First, one end of the printed wiring board 8 to be tested is sandwiched between the blocks 6 and 7, and the other end is sandwiched between the blocks 9 and 10. Then, as shown in FIG. 4, the block 9 and the block 10 were rotated by the angle B, and the load required at that time was measured. In the printed wiring board used in the present example, the portion provided with the through hole was bent. The results are shown in FIG. As can be seen from FIG. 5, the angle of the printed wiring board used in the present embodiment is about the same as that of the conventional printed wiring board with approximately half the load and the angle B. That is, in the structure of the printed wiring board used in the present embodiment, it is understood that the rigidity of the bent portion is smaller than that of the conventional printed wiring board.
次に本実施例の浮動型磁気ヘッド装置と従来の浮動型
磁気ヘッド装置それぞれの浮動型スライダ共振周波数を
測定した。共振周波数は浮動型スライダに光線を照射し
て、その反射光を光センサーで受光し、その受光した光
の強さによって測定する。第６図および第７図はそれぞ
れ従来および本実施例のの浮動型磁気ヘッド装置の共振
周波数を測定した結果を示すグラフである。第６図にお
いて共振周波数は18KHzと24KHzである事がわかる。また
第７図において共振周波数は22KHzと30KHzである事が判
る。このように本実施例の浮動型磁気ヘッド装置の共振
周波数は従来の浮動型磁気ヘッド装置の共振周波数より
も高いことがわかる。従って従来の浮動型磁気ヘッド装
置よりも外部振動による共振の発生確率を小さくする事
ができる。Next, the floating slider resonance frequency of each of the floating magnetic head device of this embodiment and the conventional floating magnetic head device was measured. The resonance frequency is measured by irradiating the floating slider with a light beam, receiving the reflected light with an optical sensor, and measuring the intensity of the received light. FIG. 6 and FIG. 7 are graphs showing the results of measuring the resonance frequency of the floating magnetic head device of the conventional and the present embodiment, respectively. In FIG. 6, it can be seen that the resonance frequencies are 18 KHz and 24 KHz. In FIG. 7, it can be seen that the resonance frequencies are 22 KHz and 30 KHz. Thus, it can be seen that the resonance frequency of the floating magnetic head device of this embodiment is higher than the resonance frequency of the conventional floating magnetic head device. Accordingly, the probability of occurrence of resonance due to external vibration can be reduced as compared with the conventional floating magnetic head device.
発明の効果 本発明はプリント配線基板の端部付近の幅を他の部分
よりも広くするとともに、前記幅を広くした部分の中央
部付近に貫通孔を設け、その貫通孔に沿って導電層を設
け、端部付近を屈曲させて導電層を浮動型スライダに接
合させた事により、プリント配線基板の屈曲部の剛性を
小さくする事ができるので、浮動型スライダの共振周波
数を高くする事ができるので、浮動型スライダが共振を
起こす確率を従来よりは小さくする事ができるので、磁
気記録媒体と浮動型スライダが衝突する事が少なくな
り、信頼性が向上する。Advantageous Effects of the Invention The present invention increases the width near the end of the printed wiring board than other portions, provides a through hole near the center of the widened portion, and forms a conductive layer along the through hole. The rigidity of the bent portion of the printed wiring board can be reduced by providing the conductive layer to the floating slider by bending the vicinity of the end, thereby increasing the resonance frequency of the floating slider. As a result, the probability that the floating slider causes resonance can be made smaller than before, so that the collision between the magnetic recording medium and the floating slider is reduced, and the reliability is improved.
第１図から第３図まではそれぞれ本発明の一実施例にお
ける浮動型磁気ヘッド装置を示す斜視図および側面図お
よび正面図、第４図はプリント配線基板の剛性を試験す
る試験装置をしめす図、第５図は従来例と本実施例にそ
れぞれ用いられるプリント配線基板の曲げ角と荷重の関
係を示すグラフ、第６図および第７図はそれぞれ従来例
および本実施例の共振周波数を示すグラフ、第８図から
第10図まではそれぞれ従来の浮動型磁気ヘッド装置を示
す斜視図および側面図および正面図である。 １……ロードビーム ２……浮動型スライダ ３……ジンバル ５……プリント配線基板 5a……基板 5b……導電層 5c……貫通孔1 to 3 are a perspective view, a side view, and a front view, respectively, showing a floating magnetic head device according to an embodiment of the present invention. FIG. 4 is a view showing a test device for testing the rigidity of a printed wiring board. FIG. 5 is a graph showing the relationship between the bending angle and the load of the printed wiring board used in the conventional example and this embodiment, respectively. FIGS. 6 and 7 are graphs showing the resonance frequency of the conventional example and this embodiment, respectively. 8 to 10 are a perspective view, a side view and a front view, respectively, showing a conventional floating magnetic head device. 1 ... Load beam 2 ... Floating slider 3 ... Gimbal 5 ... Printed wiring board 5a ... Substrate 5b ... Conductive layer 5c ... Through hole
Claims (1)
と、前記ロードビームに設けられ、電磁変換素子を有し
た浮動型スライダと、可撓性を有した基板上に少なくと
も導電層を有し、前記ロードビームに少なくとも端部付
近を除いて接合され、前記端部付近を屈曲させて前記導
電層を前記浮動型スライダに接合したプリント配線基板
とを備え、前記プリント配線基板の端部付近の幅を他の
部分よりも広くするとともに、前記幅を広くした部分の
中央部付近に貫通孔を設け、前記貫通孔に沿って導電層
を設け、前記幅を広くした部分を屈曲させて前記導電層
を浮動型スライダに接合させた事を特徴とする浮動型磁
気ヘッド装置。1. A load beam formed by a leaf spring, a floating slider provided on the load beam and having an electromagnetic transducer, and at least a conductive layer on a flexible substrate, A printed wiring board joined to the load beam except for at least the vicinity of the end, and bending the vicinity of the end to join the conductive layer to the floating slider. Along with being wider than the other portions, a through hole is provided near the center of the widened portion, a conductive layer is provided along the through hole, and the widened portion is bent to form the conductive layer. A floating magnetic head device which is joined to a floating slider.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27087290A JP2782940B2 (en) | 1990-10-08 | 1990-10-08 | Floating magnetic head device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27087290A JP2782940B2 (en) | 1990-10-08 | 1990-10-08 | Floating magnetic head device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04146516A JPH04146516A (en) | 1992-05-20 |
| JP2782940B2 true JP2782940B2 (en) | 1998-08-06 |
Family
ID=17492142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27087290A Expired - Lifetime JP2782940B2 (en) | 1990-10-08 | 1990-10-08 | Floating magnetic head device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2782940B2 (en) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0755688Y2 (en) * | 1992-06-12 | 1995-12-20 | ティアック株式会社 | Flexible printed circuit board for head |
| US6282064B1 (en) * | 1994-03-15 | 2001-08-28 | International Business Machines Corporation | Head gimbal assembly with integrated electrical conductors |
| US5491597A (en) * | 1994-04-15 | 1996-02-13 | Hutchinson Technology Incorporated | Gimbal flexure and electrical interconnect assembly |
| JP2955829B2 (en) | 1994-04-15 | 1999-10-04 | ハッチンソン テクノロジー インコーポレイテッド | Head suspension |
| US5598307A (en) * | 1994-04-15 | 1997-01-28 | Hutchinson Technology Inc. | Integrated gimbal suspension assembly |
| US5839193A (en) * | 1994-04-15 | 1998-11-24 | Hutchinson Technology Incorporated | Method of making laminated structures for a disk drive suspension assembly |
| US5835306A (en) * | 1995-06-07 | 1998-11-10 | Hutchinson Technology Incorporated | Integrated gimbal suspension assembly with assymetric bond pad |
| US5742996A (en) * | 1996-01-03 | 1998-04-28 | International Business Machines Corporation | Method of manufacturing a transducer suspension system |
| US5818662A (en) * | 1996-07-15 | 1998-10-06 | International Business Machines Corporation | Static attitude and stiffness control for an integrated suspension |
| US6381100B1 (en) | 1996-12-19 | 2002-04-30 | Hutchinson Technology Incorporated | Integrated lead suspension flexure with balanced parallel leads for insulator layer hygrothermal compensation |
| JPH10247310A (en) * | 1996-12-19 | 1998-09-14 | Hutchinson Technol Inc | Integrated lead suspension curvature body for temperature/humidity correction provided with successively arranged, metal-lined, and suspended insulator part |
| US6147839A (en) * | 1996-12-23 | 2000-11-14 | Hutchinson Technology, Inc. | Head suspension with outriggers extending across a spring region |
| US6612016B1 (en) | 1997-12-18 | 2003-09-02 | Hutchinson Technology Incorporated | Method of making integrated lead suspension flexure with balanced parallel leads for insulator layer hygrothermal compensation |
| JP2010135004A (en) * | 2008-12-04 | 2010-06-17 | Hitachi Ltd | Head supporting mechanism |
-
1990
- 1990-10-08 JP JP27087290A patent/JP2782940B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04146516A (en) | 1992-05-20 |
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