JP2772389B2 - Resonant tag and method of manufacturing the same - Google Patents
Resonant tag and method of manufacturing the sameInfo
- Publication number
- JP2772389B2 JP2772389B2 JP63197769A JP19776988A JP2772389B2 JP 2772389 B2 JP2772389 B2 JP 2772389B2 JP 63197769 A JP63197769 A JP 63197769A JP 19776988 A JP19776988 A JP 19776988A JP 2772389 B2 JP2772389 B2 JP 2772389B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- metal foil
- opening
- dielectric
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Burglar Alarm Systems (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、高出力電界中において、誘導体である電気
絶縁性薄膜層を破壊し両電極を短絡させ、それによって
予め形成された共振周波数特性を容易に破壊することを
可能ならしめた共振タグおよびその製法に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method in which a high-power electric field destroys an electrically insulating thin film layer, which is a derivative, and short-circuits both electrodes. And a method of manufacturing the same.
デパート、スーパー・マーケット、一般小売店等では
商品を万引等による盗難から保護するため種々の商品保
護手段が採られているが、電子式検知装置を使用する場
合には、その制御領域内で電子的にその商品の存在を確
認することができるように、保護される品物に、可撓性
素材を用いて作られた或る特定の共振周波数特性を有す
る薄膜の平面状プリント回路を有するタグが、接着剤等
を用いて貼付固定されるか、または容易に破断しない
「ひも」状物で吊られるかして使用されている。検知装
置によって制御された領域内では、装置より発信される
共振周波数にタグが感知反応することにより商品の存在
が感知され、盗難から保護することが可能となるが、商
品の売買が確認された後に制御領域内でタグが検知装置
より発信される共振周波数に感知反応しないようにする
ためには、「タグを引き裂く」等してプリント回路を破
壊するか、タグのコイル面にアルミニウム箔等の金属箔
を貼付する等して電波を「遮蔽」するか、或は、或る種
の治具を用いて、機械的にタグのコンデンサー部分に存
在する誘電体の薄膜層を極端に薄くしておくことによ
り、高出力電界をかけた場合両電極が容易に短絡し共振
周波数特性が消失するようにした方法等がとられてい
る。In department stores, supermarkets, general retail stores, etc., various product protection measures are adopted to protect products from theft by shoplifting, etc. In order to be able to confirm the presence of the product, a tag having a thin-film planar printed circuit having a specific resonance frequency characteristic made of a flexible material is provided on the item to be protected. It is used by being adhered and fixed using an adhesive or the like, or suspended by a "string" that does not break easily. In the area controlled by the detection device, the tag detects and reacts to the resonance frequency transmitted from the device, so that the presence of the product can be detected and theft can be protected, but the sale of the product has been confirmed. In order to prevent the tag from responding to the resonance frequency transmitted from the detection device later in the control area, the printed circuit is destroyed by tearing the tag, etc. "Shield" the radio wave by attaching metal foil, or use a certain jig to mechanically make the dielectric thin film layer present in the capacitor part of the tag extremely thin. Thus, when a high output electric field is applied, a method is adopted in which both electrodes are easily short-circuited and the resonance frequency characteristic is lost.
「タグを引き裂く」等のことをしてプリント回路を破
壊するか、「タグにアルミニウム箔等の金属箔を貼付す
る」等をして人為的にタグの共振周波数特性を消去する
場合は、品物個別に行なわれるため手間がかかり、消去
を多量に処理するには不適である。If the printed circuit is destroyed by "tearing the tag", etc., or the resonance frequency characteristics of the tag are artificially erased by "pasting a metal foil such as aluminum foil on the tag", etc. Since it is performed individually, it takes time and is not suitable for processing a large amount of erasure.
また一方、誘電体の薄膜層を機械的に薄くし両電極を
短絡し易くする方法は、タグの構成素材ごと厚さ方向に
押し潰すような方法で製造されるため、構成する各素材
の厚さが一定でないと、誘電体薄膜層の厚さが厚くなっ
た場合は絶縁破壊が行なわれないという問題が発生し易
い。本発明はこれらの問題を解決し、誘電体の絶縁破壊
と電極の短絡を確実にしかも容易に行ない得る共振タグ
およびその製造方法を提供せんとするものである。On the other hand, the method of mechanically thinning the dielectric thin film layer to easily short-circuit both electrodes is manufactured by crushing the material constituting the tag in the thickness direction. If the thickness is not constant, a problem that the dielectric breakdown does not occur when the thickness of the dielectric thin film layer is increased easily occurs. An object of the present invention is to solve these problems and to provide a resonance tag capable of reliably and easily performing dielectric breakdown and short-circuiting of an electrode, and a method of manufacturing the same.
本発明の共振タグは、ポリエチレン等の合成樹脂フィ
ルム薄膜層からなる誘電体の両面に、アルミニウム箔等
の金属箔からなる或る特定の周波数を有する共振周波数
回路を形成し、この両共振周波数回路の回路端子部を短
絡導通させてなり、少なくとも一方の共振周波数回路の
コンデンサー部電極板内に誘電体に達する開口部を設
け、該開口部を含む部分を加熱された治具で押圧して両
コンデンサー部電極板間の距離を所定の寸法としたこと
によって共振周波数特性を容易に破壊することができる
ようにしたことを特徴とする。The resonance tag of the present invention forms a resonance frequency circuit having a specific frequency made of a metal foil such as an aluminum foil on both surfaces of a dielectric made of a synthetic resin film thin film layer of polyethylene or the like. The circuit terminal portion of the capacitor is short-circuited, and an opening reaching the dielectric is provided in the capacitor electrode plate of at least one of the resonance frequency circuits, and the portion including the opening is pressed by a heated jig and both ends are pressed. The resonance frequency characteristic can be easily destroyed by setting the distance between the capacitor part electrode plates to a predetermined size.
本発明の共振タグの製造法は、更に詳しくは、ポリエ
チレン等の合成樹脂フィルム薄膜層を誘電体としその両
面にアルミニウム箔等の金属箔を貼合し、該金属箔の両
面にグラビヤ印刷等の印刷方法により、或る特定の周波
数を有する共振周波数回路が形成されるとともに、該両
側回路内のコンデンサー部電極板内に、片側の電極板に
或は両側の電極板の場合には両側同位置でほぼ重なり合
う様にして、直径0.3mm以上2mm以下の円形状の開口部が
形成されるようにエッチングレジストインキを印刷し、
化学的にエッチング処理を施すことにより回路と開口部
を形成し、前記回路の両側金属箔より構成される回路端
子部を短絡導通させ、一方の回路側に粘着剤を用いてシ
リコン紙等の離型紙を貼合し、反対側回路のコンデンサ
ー部電極板内に設けた開口部周辺を表面温度200℃以上2
50℃以下に熱せられた治具で押圧して両電極板間を所定
の寸法とし、コンデンサー部電極板側に上質紙等の紙を
接着剤で貼合し、所定のサイズにキスカットすることか
らなる。The manufacturing method of the resonance tag of the present invention, in more detail, a synthetic resin film thin film layer such as polyethylene is used as a dielectric, and a metal foil such as an aluminum foil is bonded to both surfaces thereof, and gravure printing or the like is performed on both surfaces of the metal foil. According to the printing method, a resonance frequency circuit having a specific frequency is formed, and in the capacitor portion electrode plates in the both side circuits, one side electrode plate or, in the case of both side electrode plates, the same position on both sides. Print the etching resist ink so that a circular opening with a diameter of 0.3 mm or more and 2 mm or less is formed, so that they almost overlap with each other.
A circuit and an opening are formed by chemically etching, a circuit terminal portion composed of a metal foil on both sides of the circuit is short-circuited, and one side of the circuit is separated from a silicon paper or the like using an adhesive. Paste the paper pattern and apply a surface temperature of 200 ° C or higher around the opening provided in the electrode plate of the capacitor part on the opposite circuit.
Pressing with a jig heated to 50 ° C or less to make a predetermined size between the two electrode plates, gluing high quality paper or other paper to the capacitor electrode plate side with an adhesive, and kiss cutting to a predetermined size Become.
この種の共振タグにおいて、コンデンサー部の両電極
を高出力電界中において容易に短絡するようにするため
には、両電極の金属箔間隔が0.0003mm以下に維持される
必要があるが、この0.0003mm以下の間隔を得るために
は、本発明では両側回路内のコンデンサー部電極板内の
金属箔のみに誘導体に達する所定の大きさの開口部を設
け、該開口部を含む部分を加熱された治具で押圧して開
口部付近の電極板間の誘電体の厚さを所定の厚さとする
ことによって行なう。In this type of resonance tag, in order to easily short-circuit both electrodes of the capacitor section in a high output electric field, the metal foil interval between both electrodes needs to be maintained at 0.0003 mm or less. In order to obtain an interval of less than mm, in the present invention, an opening of a predetermined size reaching the insulator was provided only in the metal foil in the electrode plate of the capacitor part in the two-sided circuit, and the portion including the opening was heated. This is performed by pressing with a jig to make the thickness of the dielectric between the electrode plates near the opening a predetermined thickness.
コンデンサー部電極板に設ける開口部の大きさは、誘
電体や金属箔の厚さによって異なるが、通常直径0.3mm
以上2mm以下の円形状とすると良い。しかしながら、開
口部は電極板間を加熱押圧したとき誘電体である合成樹
脂が流動しやすい様に設けるため、その形状は、円形状
に限らず他の形状でも良く、設ける数も1個とする必要
もない。したがって、両側回路内のコンデンサー部電極
板の両方に設けても良く、その場合両側同位置でほぼ重
なり合う様に設け、好ましくは一方の開口部の大きさを
他方の開口部のそれよりも大きくすると良い。また、片
側の電極板にのみに開口部を設けるときは、厚い金属箔
からなる電極板の方へ設けると有利である。The size of the opening provided in the capacitor part electrode plate depends on the thickness of the dielectric and metal foil, but it is usually 0.3 mm in diameter.
It is good to make it a circular shape of not less than 2 mm. However, since the opening is provided so that the synthetic resin, which is a dielectric, flows easily when the space between the electrode plates is heated and pressed, the shape thereof is not limited to a circular shape, and may be another shape, and the number provided is one. No need. Therefore, it may be provided on both sides of the capacitor part electrode plate in the circuit on both sides, in which case it is provided so as to substantially overlap at the same position on both sides, and preferably, the size of one opening is made larger than that of the other opening. good. When the opening is provided only on one electrode plate, it is advantageous to provide the opening toward the electrode plate made of thick metal foil.
開口部の部分を加熱押圧するには、開口部周辺の誘電
体の表面に貼られている金属箔面を加熱された治具で押
圧することによつて行なう。この場合、誘電体である合
成樹脂フィルム薄膜層の表面に回路が形成された状態の
まま行なってもよく、また一方の回路面に紙等を貼り合
わせたのち行なってもよい。通常、取り扱い性が向上す
ることから、紙を一面に貼ったもので行なう。その場
合、金属箔面側から加熱押圧する。回路の設けられてい
る一方の側に粘着剤等の接着剤を塗布してシリコン紙等
の離型紙を貼るとよい。The heating and pressing of the opening portion is performed by pressing the surface of the metal foil attached to the surface of the dielectric around the opening with a heated jig. In this case, the process may be performed with the circuit formed on the surface of the synthetic resin film thin film layer as a dielectric, or after the paper or the like is attached to one circuit surface. Usually, it is performed with a piece of paper stuck on one side because the handleability is improved. In that case, heat pressing is performed from the metal foil surface side. An adhesive such as an adhesive may be applied to one side where the circuit is provided, and a release paper such as silicon paper may be attached.
加熱押圧は、誘電体である合成樹脂の種類によって異
なるが、ポリエチレン等の熱可塑性樹脂の場合、表面温
度200℃以上250℃以下に熱せられた治具で押圧するとよ
い。開口部の大きさを0.3mm以上2mm以下に限定している
場合は、先端直径が2mm以上5mm以下の円形状の有効接触
が可能な先端形状を有した治具で押圧して両電極間を所
定の寸法とする。表面温度200℃以上250℃以下に熱せら
れた治具で開口部周辺のアルミニウム箔等の金属箔を押
圧した場合、この温度の熱で開口部周辺両側のアルミニ
ウム箔等の金属箔間端部に存在する合成樹脂フィルム薄
膜層が溶融収縮することにより0.0003mm以下の極薄膜層
フィルムを形成することが可能となり、従って絶縁破壊
可能な電極板間距離を得ることができる。The heating pressure depends on the type of the synthetic resin as the dielectric, but in the case of a thermoplastic resin such as polyethylene, it is preferable to press with a jig heated to a surface temperature of 200 ° C. or more and 250 ° C. or less. If the size of the opening is limited to not less than 0.3 mm and not more than 2 mm, press the jig with a tip having a circular tip with a tip diameter of 2 mm or more and 5 mm or less to enable effective contact, and press the gap between both electrodes. It has a predetermined size. When a metal foil such as an aluminum foil around the opening is pressed with a jig heated to a surface temperature of 200 ° C or more and 250 ° C or less, the heat of this temperature causes the edge between the metal foils such as the aluminum foil on both sides around the opening to be pressed. By melting and shrinking the existing synthetic resin film thin film layer, it is possible to form an ultrathin film having a thickness of 0.0003 mm or less, so that a distance between electrode plates capable of dielectric breakdown can be obtained.
通常の場合、円形状の開口部の直径を0.3mm以上2mm以
下に限定しているのは、0.3mm以上は多量生産時の印刷
方法の印刷限界から定められ、2mm以下は電気特性面に
おける共振周波数設計上の調整限界からの2つの理由に
よるものである。更に、加熱された円形状治具の有効接
触可能な先端を2mm以上5mm以下に限定しているのは、2m
m以上は開口部の径が2mmのとき治具の径が2mmの場合、
使用される生産設備の精度から、開口部に存在するポリ
エチレン等の合成樹脂フィルム薄膜層からなる誘電体
を、溶融破壊する危険が発生し易いことから定められ、
5mm以下は使用される金属箔がアルミニウム箔の場合、
その熱伝導性が良いため、径が大きいと熱集中効果が悪
くなり合成樹脂フィルム薄膜層の熱溶融が均一でなくな
り、安定した絶縁破壊可能な電極板間距離が得られにく
いことの理由からである。Normally, the diameter of the circular opening is limited to 0.3 mm or more and 2 mm or less, because 0.3 mm or more is determined by the printing limit of the printing method at the time of mass production, and 2 mm or less is the resonance in electrical characteristics. This is due to two reasons from frequency design adjustment limits. In addition, the effective contact tip of the heated circular jig is limited to 2 mm or more and 5 mm or less.
When the diameter of the opening is 2 mm and the jig diameter is 2 mm,
From the precision of the production equipment used, the dielectric consisting of a thin film layer of a synthetic resin film such as polyethylene existing in the opening is determined because the risk of melting and breaking easily occurs,
5mm or less, if the metal foil used is aluminum foil,
Because its thermal conductivity is good, the larger the diameter is, the worse the heat concentration effect is, the thermal melting of the synthetic resin film thin film layer is not uniform, and it is difficult to obtain a stable inter-electrode distance between dielectric plates. is there.
本発明において、誘電体はポリエチレン、ポリプロピ
レンなどほか、ポリエステルなどのプラスチックフィル
ムも使用できるが、価格および加工性の点からポリエチ
レン、ポリプロピレン等ポリオレフィン系のものが好ま
しい。誘電体は、上記したように薄ければ薄い程よい
が、その製造上の制約から厚さが限定されるが、本発明
では30μ以下であれば十分に使用できる。In the present invention, in addition to polyethylene and polypropylene, a plastic film such as polyester can be used as the dielectric, but a polyolefin-based material such as polyethylene or polypropylene is preferable from the viewpoint of cost and workability. As described above, the thinner the dielectric, the better. However, the thickness is limited due to manufacturing restrictions. However, in the present invention, a dielectric having a thickness of 30 μm or less can be used satisfactorily.
本発明において、金属箔は特に限定されないが価格、
加工性等の点からアルミニウム箔が好ましく、その厚さ
は通常この種の用途に使用される範囲のものが使用でき
るが、特に共振周波数回路側では50μ前後であり、非共
振周波数回路側では10μ前後で使用される。In the present invention, the metal foil is not particularly limited, but the price,
Aluminum foil is preferred from the viewpoint of workability and the like, and its thickness can be used in a range normally used for this kind of application, but it is particularly around 50μ on the resonance frequency circuit side and 10μ on the non-resonance frequency circuit side. Used before and after.
金属箔は、印刷後化学的にエッチング処理を施すこと
により回路と開口部を形成し、両側金属箔より形成され
る回路端子部を短絡導通させた後回路側に接着剤を用い
てシリコン紙等の離型紙を貼合するが、離型紙として
は、使用される如何なる接着剤に対しても効果的な離型
性を有し、加熱された治具で押圧したとき効果的な緩衝
性を有する紙質と厚さを有するものを選択すると良い。
使用される接着剤は、−20℃の低温から40℃までの高温
域で使用される各種ガラス製品、ポリエチレン、ポリプ
ロピレン、ポリエステル等の合成樹脂フィルム単体、或
は樹脂が塗布された製品等に対し或る一定期間外力を加
えられても容易に剥れない程度の接着強度を有している
ことが必要である。After printing, the metal foil is chemically etched to form a circuit and an opening, and the circuit terminals formed by the metal foil on both sides are short-circuited. The release paper is laminated, but as the release paper, it has an effective release property to any adhesive used, and has an effective buffering property when pressed with a heated jig It is preferable to select one having paper quality and thickness.
The adhesive used is for various glass products used in the high temperature range from -20 ° C to 40 ° C, synthetic resin films such as polyethylene, polypropylene, polyester, etc., or products coated with resin. It is necessary that the adhesive has such an adhesive strength that it is not easily peeled off even when an external force is applied for a certain period of time.
共振タグのコンデンサー部電極板側には、常法にした
がって、印刷等が施された上質紙等の紙が接着剤で積層
される。On the capacitor part electrode plate side of the resonance tag, paper such as high quality paper on which printing or the like has been applied is laminated with an adhesive according to a conventional method.
以下、本発明の一実施例を図面に基き説明するが、本
発明はこれに限定されるものではない。Hereinafter, an embodiment of the present invention will be described with reference to the drawings, but the present invention is not limited thereto.
共振周波数を有するタグは、第1図に示す如く誘電体
2として電磁気学的数値「誘電正接」が、できるだけ小
さな0.03mm以下の厚さを有するポリエチレン等のポリオ
レフィン系樹脂フィルムまたは他の合成樹脂フィルムを
用い、このフィルム(誘電体2)の両面に、アルミニウ
ム箔等の金属箔1、3を押し出しまたは熱圧着等の方法
により貼り合わせた材料を基板材料として製造される。As shown in FIG. 1, a tag having a resonance frequency has a dielectric material 2 having an electromagnetic value "dielectric loss tangent" having a thickness of 0.03 mm or less, a polyolefin resin film such as polyethylene or other synthetic resin film. And a material in which metal foils 1 and 3 such as aluminum foil are bonded to both surfaces of this film (dielectric 2) by a method such as extrusion or thermocompression bonding is used as a substrate material.
使用される金属箔のうちで特にアルミニウム箔の場
合、電気的物性、貼り合わせまたはエッチング作業等の
加工適性、更には商品の物性等から、アルミニウムの純
度としては99.0%以上99.7%以下が望ましい。Among the metal foils used, in particular, in the case of an aluminum foil, the purity of aluminum is desirably 99.0% or more and 99.7% or less in view of electrical properties, suitability for processing such as bonding or etching, and physical properties of the product.
誘電体2としてのポリエチレン等の樹脂フィルムの両
面に貼り合される金属箔のうち、その片側の金属箔1
は、LCR回路及び回路端子部として使用され、金属箔が
アルミニウム箔の場合は0.050mm以上、0.060mm以下の厚
さの箔が望ましい。この金属箔との反対面の金属箔3
は、コンデンサー電極板および回路端子部として使用さ
れ、金属箔がアルミニウム箔の場合は0.006mm以上、0.0
10mm以下の厚さの箔が使用される。Among the metal foils to be bonded to both sides of a resin film such as polyethylene as the dielectric 2, one of the metal foils 1
Is used as an LCR circuit and a circuit terminal. When the metal foil is an aluminum foil, a foil having a thickness of 0.050 mm or more and 0.060 mm or less is desirable. Metal foil 3 on the opposite side of this metal foil
Is used as a capacitor electrode plate and a circuit terminal part, when the metal foil is aluminum foil, 0.006 mm or more, 0.0
A foil with a thickness of 10 mm or less is used.
或る特定の共振周波数を得るため、この基板材料の両
面、即ち金属箔上に各種印刷方法例えば、グラビヤ印
刷、シルクスクリーン印刷、フレキソ印刷、凸版輪転印
刷等により耐エッチング性を有するインク4(第2図)
を用いて「共振周波数回路」と、同金属箔の片面に開口
部7が形成されるように印刷し、その後酸またはアルカ
リ等の薬液を用いて化学的にエッチング処理を施し、第
2図の如き共振周波数回路を形成する。第2図の例では
金属箔1に開口部7を形成しているが、開口部7は金属
箔3に設けても良く、また、誘電体2を挟んで金属箔
1、3の両方に設けても良い。In order to obtain a specific resonance frequency, the ink 4 having an anti-etching property by using various printing methods, for example, gravure printing, silk screen printing, flexographic printing, letterpress printing, etc., on both sides of the substrate material, that is, on the metal foil, is used. (Fig. 2)
2 and the metal foil is printed so that an opening 7 is formed on one side of the metal foil, and then chemically etched using a chemical such as an acid or an alkali. Such a resonance frequency circuit is formed. Although the opening 7 is formed in the metal foil 1 in the example of FIG. 2, the opening 7 may be provided in the metal foil 3 or provided in both the metal foils 1 and 3 with the dielectric 2 interposed therebetween. May be.
エッチング処理に続いてポリエチレン等の樹脂フィル
ム(誘電体2)両面の金属箔1、3の回路端子部5、6
を、特殊治具を使用し、ポリエチレン等の樹脂フィルム
を破壊しかっ押し潰す等の機械的作業により第3図の如
く短絡導通させ、共振回路を完成させる。Subsequent to the etching process, circuit terminals 5, 6 of metal foils 1, 3 on both surfaces of a resin film (dielectric 2) of polyethylene or the like.
Using a special jig, a short circuit is conducted as shown in FIG. 3 by mechanical work such as breaking and crushing a resin film such as polyethylene to complete a resonance circuit.
続いて、回路I(金属箔1)面に紙類、合成樹脂フィ
ルム類、ガラス瓶等に対し十分な接着強度を示す粘着剤
8を塗布し、シリコーン紙等の離型紙9を貼り合わせる
(第4図)。Subsequently, an adhesive 8 having sufficient adhesive strength is applied to the surface of the circuit I (metal foil 1) to papers, synthetic resin films, glass bottles, and the like, and a release paper 9 such as silicone paper is attached (fourth). Figure).
高出力電界中において誘電体であるポリエチレン等の
樹脂フィルム薄膜層(誘電体2)の電気絶縁性を破壊
し、両電極である金属箔1、3を容易に短絡させるため
には両電極の金属箔間隔が0.0003mm以下に維持される必
要がある。0.0003mm以下の一定した電極間隔を得るに
は、本発明では第5図に示す如く、エッチングにより形
成された回路I面(金属箔1)内のコンデンサー部電極
板中の開口部7の周辺部を反対側の回路II面(金属箔
3)のコンデンサー部電極板から表面が200℃以上250℃
以下の温度に加熱された2mm以上5mm以下の有効接触が可
能な先端径を有する円形状治具を用いて押圧する。加熱
と押圧により開口部7周辺の金属箔1、3間に存在する
ポリエチレン等の合成樹脂フィルムよりなる誘電体2が
溶融収縮することにより、0.0003mm以下の極薄膜層フィ
ルムを形成することが可能となり、従って絶縁破壊可能
な電極板間距離を得ることができる。開口部周辺を加熱
押圧後、第6図に示す如く、コンデンサー部電極側に接
着剤10を用いて上質紙等の紙11貼合し所定のサイズにキ
スカットすることによりタグを完成させる。この上質紙
等の紙11には、印刷等を施しておくことは勿論である。In order to break the electrical insulation of the resin film thin film layer of dielectric such as polyethylene (dielectric 2) and easily short-circuit the metal foils 1 and 3 which are both electrodes in a high output electric field, the metal of both electrodes is required. The foil spacing must be kept below 0.0003mm. In order to obtain a constant electrode spacing of 0.0003 mm or less, in the present invention, as shown in FIG. 5, the periphery of the opening 7 in the capacitor electrode plate in the circuit I surface (metal foil 1) formed by etching. The surface from the capacitor part electrode plate on the other side of the circuit II surface (metal foil 3) is 200 ° C or higher and 250 ° C
Pressing is performed using a circular jig heated to the following temperature and having a tip diameter capable of effective contact of 2 mm or more and 5 mm or less. The dielectric member 2 made of a synthetic resin film such as polyethylene existing between the metal foils 1 and 3 around the opening 7 is melted and shrunk by heating and pressing, so that an ultrathin layer film of 0.0003 mm or less can be formed. Therefore, the distance between the electrode plates that can cause dielectric breakdown can be obtained. After the area around the opening is heated and pressed, as shown in FIG. 6, a paper 11 such as a high-quality paper is stuck on the electrode side of the condenser section using an adhesive 10, and the tag is completed by kiss cutting to a predetermined size. Needless to say, printing or the like is performed on the paper 11 such as high-quality paper.
本発明は、上記の如く、片面或は両側回路内のコンデ
ンサー電極板内に設けた開口部周辺を回路II面(金属箔
3)側より加熱された治具で押圧するため、金属箔1、
3間に存在する誘電体2のポリエチレン等の合成樹脂フ
ィルム薄膜層が溶融収縮するため、機械的に外力を加え
て0.0003mm以下の絶縁破壊可能な極薄膜層にしたものと
較べ、非常に安定した電極間距離を得ることができる。As described above, the present invention presses the periphery of the opening provided in the capacitor electrode plate in one side or both sides of the circuit with a jig heated from the circuit II side (metal foil 3) side.
Since the synthetic resin film thin film layer such as polyethylene of the dielectric material 2 existing between the three melts and shrinks, it is very stable as compared with an ultra thin film layer capable of dielectric breakdown of 0.0003 mm or less by applying an external force mechanically. The obtained distance between the electrodes can be obtained.
第1図ないし第6図は本発明共振タグの製造方法を説明
するための図で、各工程で得られる積層材の断面模式図
を示し、 第7図は共振タグの1例を示す分解斜視図である。 図中、 1、3……金属箔 2……誘電体 4……耐エッチング性インク 5、6……回路端子部 7……開口部 8……粘着剤 9……離型紙 10……接着剤 11……紙1 to 6 are views for explaining a method of manufacturing the resonance tag of the present invention, and show schematic cross-sectional views of a laminated material obtained in each step. FIG. 7 is an exploded perspective view showing one example of a resonance tag. FIG. In the figure, 1, 3 ... metal foil 2 ... dielectric 4 ... etching resistant ink 5, 6 ... circuit terminal 7 ... opening 8 ... adhesive 9 ... release paper 10 ... adhesive 11 …… Paper
Claims (4)
からなる誘電体の両面に、アルミニウム箔等の金属箔か
らなる或る特定の周波数を有する共振周波数回路を形成
し、この両共振周波数回路の回路端子部を短絡導通させ
てなり、少なくとも一方の共振周波数回路のコンデンサ
ー部電極板内の金属箔のみに誘電体面に達する開口部を
設け、該開口部を含む部分を加熱された治具で押圧して
両コンデンサー部電極板間の距離を所定の寸法としたこ
とを特徴とする共振タグ。1. A resonance frequency circuit having a specific frequency made of a metal foil such as an aluminum foil is formed on both sides of a dielectric made of a synthetic resin film thin film layer of a polyethylene or the like. An opening reaching the dielectric surface is provided only in the metal foil in the electrode plate of the capacitor portion of at least one of the resonance frequency circuits, and the portion including the opening is pressed by a heated jig. A resonance tag having a predetermined distance between the electrode plates of the two capacitors.
開口部の大きさが直径0.3mm以上2mm以下の円形状である
ことを特徴とする請求項第1項記載の共振タグ。2. The resonance tag according to claim 1, wherein the size of the opening provided in the metal foil in the capacitor part electrode plate is a circle having a diameter of 0.3 mm or more and 2 mm or less.
電極板内のほぼ対応する位置にそれぞれ設けたことを特
徴とする請求項第1項記載の共振タグ。3. The resonance tag according to claim 1, wherein said openings are provided at substantially corresponding positions in the capacitor plate on both sides of the dielectric.
を誘電体とし、その両面に、アルミニウム箔等の金属箔
を貼合し、該金属箔の両面にグラビヤ印刷等の印刷方法
により、或る特定の周波数を有する共振周波数回路が形
成されるとともに該両側回路内のコンデンサー部電極板
内にその片側の電極板に或は両側の場合は同位置で重な
り合う様に直径0.3mm以上2mm以下の円形状の開口部が形
成されるようにエッチングレジストインキを印刷し、化
学的にエッチング処理を施すことにより前記金属箔より
なる回路と開口部を形成し、前記両側金属箔より構成さ
れる回路端子部を短絡導通させ、一方の回路側に粘着剤
を用いてシリコン紙等の離型紙を貼合し、反対側回路の
コンデンサー部電極板内に設けた開口部周辺を表面温度
200℃以上250℃以下に熱せられた治具で押圧して両電極
板間を所定の寸法とし、コンデンサー部電極板側に上質
紙等の紙を接着剤で貼合し、所定のサイズにキスカット
することからなることを特徴とする共振タグの製造法。A synthetic resin film thin film layer of polyethylene or the like is used as a dielectric, and a metal foil such as an aluminum foil is stuck on both sides thereof, and a specific method is applied to both sides of the metal foil by a printing method such as gravure printing. A circular shape having a diameter of 0.3 mm or more and 2 mm or less so that a resonance frequency circuit having a frequency of An etching resist ink is printed so as to form an opening, and a circuit and an opening formed of the metal foil are formed by chemically performing an etching process, and a circuit terminal portion formed of the metal foils on both sides is formed. The circuit is short-circuited, release paper such as silicon paper is adhered to one circuit side using an adhesive, and the surface temperature around the opening provided in the capacitor electrode plate of the opposite circuit
Press with a jig heated to 200 ° C or more and 250 ° C or less to make the distance between the two electrode plates a predetermined size, glue high quality paper or the like to the capacitor electrode plate side with an adhesive, and kiss cut to a predetermined size A method of manufacturing a resonance tag, comprising:
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63197769A JP2772389B2 (en) | 1988-08-08 | 1988-08-08 | Resonant tag and method of manufacturing the same |
US07/343,747 US4985288A (en) | 1988-04-30 | 1989-04-27 | Resonant frequency characteristic tag and method of manufacturing the same |
EP19890107773 EP0340670A3 (en) | 1988-04-30 | 1989-04-28 | Resonant frequency characteristic tag and method of manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63197769A JP2772389B2 (en) | 1988-08-08 | 1988-08-08 | Resonant tag and method of manufacturing the same |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0245897A JPH0245897A (en) | 1990-02-15 |
JP2772389B2 true JP2772389B2 (en) | 1998-07-02 |
Family
ID=16380042
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63197769A Expired - Fee Related JP2772389B2 (en) | 1988-04-30 | 1988-08-08 | Resonant tag and method of manufacturing the same |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2772389B2 (en) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01277791A (en) * | 1988-04-30 | 1989-11-08 | Tokai Kinzoku Kk | Resonant tag and manufacture thereof |
-
1988
- 1988-08-08 JP JP63197769A patent/JP2772389B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH0245897A (en) | 1990-02-15 |
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