JP2772178B2 - Condenser - Google Patents
CondenserInfo
- Publication number
- JP2772178B2 JP2772178B2 JP3279971A JP27997191A JP2772178B2 JP 2772178 B2 JP2772178 B2 JP 2772178B2 JP 3279971 A JP3279971 A JP 3279971A JP 27997191 A JP27997191 A JP 27997191A JP 2772178 B2 JP2772178 B2 JP 2772178B2
- Authority
- JP
- Japan
- Prior art keywords
- flow path
- wall surface
- heat
- passage
- medium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、相変化の伴う媒体によ
り熱を輸送する二相流体ループ式排熱システム等に組込
むのに適した凝縮装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a condensing apparatus suitable for being incorporated in a two-phase fluid loop heat rejection system for transferring heat by means of a phase-change medium.
【０００２】[0002]
【従来の技術】宇宙構造物の排熱処理システムとして、
相変化の伴う媒体、例えばフロン、アンモニア、水など
の流れにより熱を輸送する二相流体ループ式排熱システ
ムが有望視されている。図４にはこの排熱システムの概
略図が示されている。2. Description of the Related Art As an exhaust heat treatment system for a space structure,
Promising is a two-phase fluid loop heat removal system that transports heat by means of a flow of a medium with a phase change, such as Freon, ammonia, and water. FIG. 4 shows a schematic diagram of this heat removal system.
【０００３】この排熱システムは、蒸発器１、輸送管
２、凝縮器３、輸送管４、ポンプ５を閉ループに接続し
てなる流体ループ６と、この流体ループ６内の圧力を調
整するアキュムレータ７とで構成される。[0003] This exhaust heat system includes a fluid loop 6 formed by connecting an evaporator 1, a transport pipe 2, a condenser 3, a transport pipe 4, and a pump 5 to a closed loop, and an accumulator for adjusting the pressure in the fluid loop 6. 7 is comprised.
【０００４】このシステムでは次のようにして排熱が行
われる。すなわち、被冷却物８に熱的に接続された蒸発
器１に輸送管４を介して媒体液が流れると、この媒体液
は被冷却物８で発生した熱を奪って蒸発し、気液二相流
状態になる。この気液二相流体は輸送管２を通って凝縮
器３へ送られる。凝縮器３では冷却装置であるラジエー
タ９の作用により気液二相流体中の蒸気を凝縮する。し
たがって、媒体は液単相状態となる。このとき、媒体が
吸収していた熱はラジエータ９からふく射によって排熱
される。液単相状態の媒体は、輸送管４を通してポンプ
５へ移動し、ここで加圧されて蒸発器１へと還流する。
なお、アキュムレータ７は、流体ループ６へ媒体液を出
し入れすることにより、流体ループ６内の圧力を調整
し、凝縮器９の能力を増減させることによって、被冷却
物８の温度をほぼ一定に保つ役割を果たしている。[0004] In this system, exhaust heat is performed as follows. That is, when the medium liquid flows through the transport pipe 4 to the evaporator 1 which is thermally connected to the object to be cooled 8, the medium liquid evaporates by removing heat generated in the object to be cooled 8 and evaporates. It becomes a phase flow state. This gas-liquid two-phase fluid is sent to the condenser 3 through the transport pipe 2. In the condenser 3, the vapor in the gas-liquid two-phase fluid is condensed by the action of a radiator 9 as a cooling device. Therefore, the medium is in a liquid single-phase state. At this time, the heat absorbed by the medium is discharged from the radiator 9 by radiation. The medium in the liquid single-phase state moves to the pump 5 through the transport pipe 4, where the medium is pressurized and refluxed to the evaporator 1.
The accumulator 7 keeps the temperature of the object 8 to be cooled substantially constant by adjusting the pressure in the fluid loop 6 by moving medium fluid into and out of the fluid loop 6 and increasing or decreasing the capacity of the condenser 9. Plays a role.
【０００５】しかしながら、上記のように構成された排
熱システムにあっても次のような問題があった。すなわ
ち、この排熱システムでは、凝縮器３を出た後の媒体液
が過冷却状態となる。この場合、過冷却度が小さいと、
ポンプ５内で媒体が蒸発し、ポンプ５でキャビテーショ
ンが発生して媒体を循環させることが困難になる。逆に
過冷却度が大きいと、被冷却物８の温度を一定に保てな
くなる。したがって、凝縮された媒体の過冷却度を被冷
却物８の発生熱量に拘らずある範囲に保つ必要がある。
しかし、従来のシステム、特に凝縮器３では、被冷却物
８の発生熱量の減少に伴って凝縮器３からの排熱量が減
少すると、ラジエータ９の温度が低下し、これが原因し
て凝縮器流路の壁面温度が低下するため、過冷却度が大
きく増加する。この増加を抑制するには、アキュムレー
タ７から媒体液を送り出して凝縮器流路内に存在する媒
体液の媒体蒸気に対する体積比を大きくする必要があ
る。このため、アキュムレータ７で調節すべき媒体質量
が大きくなり、大きな容量のアキュムレータ７を必要と
する問題があった。[0005] However, the heat exhaust system configured as described above has the following problems. That is, in this exhaust heat system, the medium liquid after leaving the condenser 3 is in a supercooled state. In this case, if the degree of subcooling is small,
The medium evaporates in the pump 5, cavitation occurs in the pump 5, and it becomes difficult to circulate the medium. Conversely, if the degree of supercooling is large, the temperature of the object to be cooled 8 cannot be kept constant. Therefore, the degree of supercooling of the condensed medium needs to be maintained within a certain range regardless of the amount of heat generated by the object 8 to be cooled.
However, in the conventional system, particularly in the condenser 3, when the amount of heat exhausted from the condenser 3 decreases with a decrease in the amount of heat generated from the object 8 to be cooled, the temperature of the radiator 9 decreases, which causes Since the wall surface temperature of the road decreases, the degree of supercooling greatly increases. To suppress this increase, it is necessary to send out the medium liquid from the accumulator 7 to increase the volume ratio of the medium liquid existing in the condenser flow path to the medium vapor. For this reason, the mass of the medium to be adjusted by the accumulator 7 becomes large, and there is a problem that the accumulator 7 having a large capacity is required.
【０００６】[0006]
【発明が解決しようとする課題】このように従来の二相
流体ループ式排熱システムでは、特に凝縮器から出た媒
体液の過冷却度を一定範囲に保持することが困難で、こ
れが原因して大型のアキュムレータを必要とする問題が
あった。As described above, in the conventional two-phase fluid loop type heat removal system, it is difficult to keep the degree of supercooling of the medium liquid discharged from the condenser within a certain range. There is a problem that requires a large accumulator.
【０００７】そこで本発明は、凝縮された媒体の過冷却
度を常にほぼ一定、つまり温度をほぼ一定の範囲に保つ
ことができ、たとえば二相流体ループ式排熱システムに
組込んだときに、アキュムレータの小型小容量化に寄与
できる凝縮装置を提供することを目的としている。Therefore, the present invention can maintain the degree of supercooling of the condensed medium almost always, that is, the temperature can be kept in a substantially constant range. For example, when incorporated in a two-phase fluid loop type heat removal system, It is an object of the present invention to provide a condensing device that can contribute to reducing the size and capacity of an accumulator.
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するため
に、本発明に係る凝縮装置では、凝縮用の流路の内壁面
と上記内壁面を冷却するための冷却装置との間の熱抵抗
を可変する手段を備えている。In order to achieve the above object, in a condensing device according to the present invention, a heat resistance between an inner wall surface of a condensing flow path and a cooling device for cooling the inner wall surface is provided. Is provided.
【０００９】[0009]
【作用】排熱量の変化に対応させて凝縮用の流路の内壁
面と冷却装置との間の熱抵抗を変化させることによっ
て、上記内壁面の温度を一定範囲に保つことができる。
すなわち、排熱量が増加した場合には、凝縮用の流路の
内壁面温度が上昇するので、熱抵抗を減少させる。これ
によって内壁面と冷却装置との温度差が小さくなるので
上記内壁面の温度上昇を抑制できる。また、逆に排熱量
が減少した場合には、内壁面温度が低下するので、熱抵
抗を増加させる。これによって内壁面と冷却装置との温
度差が大きくなるので上記内壁面の温度低下を抑制でき
る。このように、凝縮用の流路の内壁面温度を一定範囲
に保てるため、凝縮液の過冷却度を一定範囲に保つこと
が可能となる。The temperature of the inner wall surface can be kept within a certain range by changing the thermal resistance between the inner wall surface of the flow path for condensation and the cooling device in accordance with the change in the amount of exhaust heat.
That is, when the amount of exhaust heat increases, the temperature of the inner wall surface of the flow path for condensation increases, so that the thermal resistance decreases. As a result, the temperature difference between the inner wall surface and the cooling device becomes smaller, so that the temperature rise of the inner wall surface can be suppressed. Conversely, when the amount of exhaust heat decreases, the temperature of the inner wall surface decreases, so that the thermal resistance increases. As a result, the temperature difference between the inner wall surface and the cooling device is increased, so that the temperature decrease of the inner wall surface can be suppressed. As described above, since the inner wall surface temperature of the condensing flow path can be maintained within a certain range, the degree of supercooling of the condensate can be maintained within a certain range.
【００１０】[0010]
【実施例】以下、図面を参照しながら実施例を説明す
る。図１には本発明の一実施例に係る凝縮装置、ここに
は二相流体ループ式排熱システム用の凝縮装置１１が示
されている。Embodiments will be described below with reference to the drawings. FIG. 1 shows a condenser according to one embodiment of the present invention, here a condenser 11 for a two-phase fluid loop heat removal system.
【００１１】この凝縮装置１１は、大きく分けて熱伝導
の良い材料で形成された流路形成板１２と、この流路形
成板１２内に図２および図３に示すように複数形成され
た凝縮用の流路１３と、これらの流路１３に気液二相媒
体を分配供給する上流側ヘッダ１４と、各流路１３を通
った媒体を集める下流側ヘッダ１５と、流路形成板１２
に複数の固定熱伝導部材１６を介して熱的に接続された
ラジエータ１７と、流路形成板１２とラジエータ１７と
の間の熱抵抗を可変する熱抵抗可変装置１８とで構成さ
れている。そして、上流側ヘッダ１４は輸送管１９を介
して図示しない蒸発器に接続され、また下流側ヘッダ１
５は輸送管２０を介して図示しないポンプに接続され
る。The condensing device 11 is roughly divided into a flow path forming plate 12 made of a material having good heat conductivity, and a plurality of condensing forms formed in the flow path forming plate 12 as shown in FIGS. Flow path 13, an upstream header 14 for distributing and supplying a gas-liquid two-phase medium to these flow paths 13, a downstream header 15 for collecting media passing through each flow path 13, and a flow path forming plate 12.
The radiator 17 is thermally connected to the radiator 17 via a plurality of fixed heat conducting members 16 and a thermal resistance variable device 18 that varies the thermal resistance between the flow path forming plate 12 and the radiator 17. The upstream header 14 is connected to an evaporator (not shown) via a transport pipe 19, and the downstream header 1
Reference numeral 5 is connected to a pump (not shown) via a transport pipe 20.
【００１２】流路形成板１２は、図３に示すように、図
中上面が平坦に形成されており、下面に突条２１が複数
平行に形成されたものとなっている。そして、各突条２
１の中心部に、これら突条２１の延びる方向に前述した
凝縮用の流路１３がそれぞれ形成されている。As shown in FIG. 3, the flow path forming plate 12 has a flat upper surface in the figure and a plurality of ridges 21 formed in parallel on the lower surface. And each ridge 2
The above-described condensing flow path 13 is formed in the central portion of the projection 1 in the direction in which the projections 21 extend.
【００１３】ラジエータ１７は、流路形成板１２の図３
における上面側、つまり平坦に形成された面側に前述し
た固定熱伝導部材１６を介して固定されている。各固定
熱伝導部材１６は、流路形成板１２の平坦な面で、かつ
前記突条２１の境界部分に対応した位置に突条２１と平
行状態に配置されている。このような配置によって、隣
接する固定熱伝導部材１６間に、これらの部材と流路形
成板１２およびラジエータ１７とで囲まれた断面矩形の
熱抵抗調整用の隙間２２が流路１３に沿って複数形成さ
れている。The radiator 17 is provided on the flow path forming plate 12 as shown in FIG.
Is fixed to the upper surface side, that is, the flat surface side, via the above-described fixed heat conducting member 16. Each of the fixed heat conducting members 16 is disposed parallel to the ridge 21 at a position corresponding to the boundary of the ridge 21 on the flat surface of the flow path forming plate 12. With such an arrangement, a gap 22 for adjusting a thermal resistance having a rectangular cross section surrounded by the adjacent fixed heat conducting members 16 and the channel forming plate 12 and the radiator 17 is formed along the channel 13. A plurality is formed.
【００１４】熱抵抗可変装置１８は、各隙間２２へそれ
ぞれ移動自在に挿入された可動熱伝導板２３と、前述し
た下流側ヘッダ１５の側に配置されて各可動熱伝導板２
３の一端側を共通に連結する連結板２４と、この連結板
２４を介して各可動熱伝導板２３を図２中実線矢印２５
で示す方向に移動させて各隙間２２への挿入度を可変す
る駆動装置２６とで構成されている。各可動熱伝導板２
３は、熱伝導率の良い銅、アルミニウム等で流路形成板
１２とラジエータ１７との間の距離よりわずかに薄い厚
みに形成されている。The variable thermal resistance device 18 includes a movable heat conductive plate 23 movably inserted into each of the gaps 22 and the movable heat conductive plate 2 disposed on the downstream header 15 described above.
2 and a movable plate 23 through which the movable heat conducting plates 23 are connected by solid lines 25 in FIG.
And a driving device 26 that moves in the direction shown by the arrow to change the degree of insertion into each gap 22. Each movable heat conduction plate 2
Numeral 3 is made of copper, aluminum, or the like having good thermal conductivity and is formed to have a thickness slightly smaller than the distance between the flow path forming plate 12 and the radiator 17.
【００１５】一方、駆動装置２６は、下流側ヘッダ１５
を通った媒体の温度を検出する図示しない温度センサの
出力Ｔ1 を導入し、このＴ1 が一定の範囲に入るように
可動熱伝導板２３の挿入度を制御するように構成されて
いる。具体的には、Ｔ1 が予め定められたＴ0 より増加
の方向に変化したときには可動熱伝導板２３の挿入度を
増加させるように制御し、Ｔ0 より減少する方向に変化
したときには可動熱伝導板２３の挿入度を減少させるよ
うに制御する。On the other hand, the driving device 26 is connected to the downstream header 15.
Introducing the output T 1 of the temperature sensor (not shown) for detecting the temperature of the medium passing through the, the T 1 is configured to control the insertion of the movable heat conducting plate 23 to enter a predetermined range. Specifically, when T 1 changes in a direction increasing from a predetermined T 0 , control is performed so as to increase the degree of insertion of the movable heat conductive plate 23, and when T 1 changes in a direction decreasing from T 0 , the movable heat conducting plate 23 increases. Control is performed to reduce the degree of insertion of the conductive plate 23.
【００１６】このような構成であると、上流側ヘッダ１
４を介して各流路１３に流れ込む気液二相媒体の蒸気温
度が上昇し、これに伴って下流側ヘッダ１５から流れ出
る媒体液の温度がＴ0 より上昇しようとすると、駆動装
置２６は隙間２２への挿入度を増加させるように可動熱
伝導板２３を移動制御する。この制御が行われると、流
路形成板１２とラジエータ１７との間に可動熱伝導板２
３の介在する度合が増すので、流路形成板１２とラジエ
ータ１７との間に存在する熱伝達路の通路断面積が増加
し、流路形成板１２とラジエータ１７との間の熱抵抗が
減少する。この減少によって各流路１３の内壁面とラジ
エータ１７との間の温度差が小さくなり、各流路１３の
内壁面温度が低下し、これによって下流側ヘッダ１５か
ら流れ出る媒体液温度が低下する。With such a configuration, the upstream header 1
When the vapor temperature of the gas-liquid two-phase medium flowing into each flow path 13 through the flow path 4 increases and the temperature of the medium liquid flowing out of the downstream header 15 tends to rise above T 0 , the driving device 26 The movement of the movable heat conductive plate 23 is controlled so as to increase the degree of insertion into the plate 22. When this control is performed, the movable heat conductive plate 2 is placed between the flow path forming plate 12 and the radiator 17.
3 increases, the cross-sectional area of the heat transfer path between the flow path forming plate 12 and the radiator 17 increases, and the thermal resistance between the flow path forming plate 12 and the radiator 17 decreases. I do. Due to this decrease, the temperature difference between the inner wall surface of each flow path 13 and the radiator 17 becomes smaller, and the temperature of the inner wall surface of each flow path 13 decreases, whereby the temperature of the medium liquid flowing out of the downstream header 15 decreases.
【００１７】一方、下流側ヘッダ１５から流れ出る媒体
液の温度がＴ0 より低下しようとすると、駆動装置２６
は隙間２２への挿入度を減少させるように可動熱伝導板
２３を移動制御する。この制御が行われると、前述の場
合とは逆に、流路形成板１２とラジエータとの間に可動
熱伝導板２３の介在する度合が減少するので、流路形成
板１２とラジエータ１７との間の熱抵抗が増加する。こ
の増加によって各流路１３の内壁面とラジエータ１７と
の間の温度差が大きくなり、各流路１３の内壁面温度が
上昇し、これによって下流側ヘッダ１５から流れ出る媒
体液温度が上昇する。On the other hand, if the temperature of the medium flowing out of the downstream header 15 is going to fall below T 0 , the driving device 26
Controls the movement of the movable heat conducting plate 23 so as to reduce the degree of insertion into the gap 22. When this control is performed, contrary to the above-described case, the degree of interposition of the movable heat conductive plate 23 between the flow path forming plate 12 and the radiator decreases, so that the flow path forming plate 12 and the radiator 17 The thermal resistance between them increases. Due to this increase, the temperature difference between the inner wall surface of each flow passage 13 and the radiator 17 increases, and the temperature of the inner wall surface of each flow passage 13 rises, whereby the temperature of the medium liquid flowing out of the downstream header 15 rises.
【００１８】このように、熱抵抗可変装置１８を設けて
いるので、上流側ヘッダ１４を介して流れ込む気液二相
媒体の蒸気温度が変化した場合でも、換言すると被冷却
物の発生熱量が変化した場合でも凝縮装置１１からほぼ
一定温度の凝縮媒体液を送り出すことが可能となる。し
たがって、凝縮媒体液の過冷却度を常に一定範囲に抑え
ることができるので、実施例のように二相流体ループ式
排熱システムに組込んだときにはアキュムレータの小容
量化に寄与できる。また、実施例のように、可動熱伝導
部材２３の移動方向を流路１３の延びる方向に対して平
行させ、かつ可動熱伝達部材２３を流路１３に沿って下
流側に移動させるにしたがって流路形成板１２とラジエ
ータ１７との間の熱抵抗を減少させる構成であると、流
路１３内の液体積に対する蒸気体積の比を増すことがで
きるので、アキュムレータから流体ループへ移動させる
媒体質量を抑えることができ、アキュムレータを一層小
容量化できる。As described above, since the thermal resistance variable device 18 is provided, even when the vapor temperature of the gas-liquid two-phase medium flowing through the upstream header 14 changes, in other words, the amount of heat generated by the object to be cooled changes. Even in this case, it is possible to send out the condensing medium liquid at a substantially constant temperature from the condensing device 11. Therefore, the degree of supercooling of the condensing medium liquid can always be kept within a certain range, and when incorporated in a two-phase fluid loop type heat removal system as in the embodiment, it is possible to contribute to a reduction in the capacity of the accumulator. Further, as in the embodiment, the moving direction of the movable heat conducting member 23 is made parallel to the direction in which the flow path 13 extends, and the flow direction is changed as the movable heat transfer member 23 is moved downstream along the flow path 13. With a configuration in which the thermal resistance between the passage forming plate 12 and the radiator 17 is reduced, the ratio of the vapor volume to the liquid volume in the flow path 13 can be increased, so that the mass of the medium moved from the accumulator to the fluid loop is reduced. Therefore, the capacity of the accumulator can be further reduced.
【００１９】なお、本発明は上述した実施例に限定され
るものではない。すなわち、上述した実施例では、流路
形成板１２とラジエータ１７との間への可動熱伝導板２
３の挿入度を可変することによって流路形成板１２とラ
ジエータ１７との間の熱抵抗を可変するようにしている
が、流路形成板１２とラジエータ１７との間に流体を介
在させたり、流路形成板１２とラジエータ１７との間の
距離を変えたりすることによって両者間の熱抵抗を可変
するようにしてもよい。また、本発明に係る凝縮装置
は、その使用を二相流体ループ式排熱システムに限定さ
れるものではなく、各種のシステムにおいて使用できる
ことは勿論である。The present invention is not limited to the embodiment described above. That is, in the above-described embodiment, the movable heat conductive plate 2 is inserted between the flow path forming plate 12 and the radiator 17.
Although the thermal resistance between the flow path forming plate 12 and the radiator 17 is changed by changing the insertion degree of 3, the fluid is interposed between the flow path forming plate 12 and the radiator 17, The thermal resistance between the flow path forming plate 12 and the radiator 17 may be varied by changing the distance between the two. Further, the use of the condensing device according to the present invention is not limited to the two-phase fluid loop type heat removal system, and it goes without saying that the condensing device can be used in various systems.
【００２０】[0020]
【発明の効果】以上述べたように、本発明によればほぼ
一定温度の凝縮媒体液を常に送り出すことができるの
で、たとえば二相流体ループ式排熱システムに組込んだ
ときには、アキュムレータの小容量化に寄与できるとと
もにシステムの安定した運転に寄与できる。As described above, according to the present invention, since the condensing medium liquid at a substantially constant temperature can always be sent out, the small capacity of the accumulator can be reduced, for example, when the condensing medium liquid is incorporated in a two-phase fluid loop type heat removal system. And stable operation of the system.
【図１】本発明の一実施例に係る凝縮装置の斜視図。FIG. 1 is a perspective view of a condenser according to an embodiment of the present invention.
【図２】図１におけるＡ−Ａ線に沿って切断し矢印方向
に見た図。FIG. 2 is a view taken along the line AA in FIG. 1 and viewed in the direction of the arrow.
【図３】図１におけるＢ−Ｂ線に沿って切断し矢印方向
に見た図。FIG. 3 is a view taken along line BB in FIG. 1 and viewed in the direction of the arrow.
【図４】二相流体ループ式排熱システムの概略図。FIG. 4 is a schematic diagram of a two-phase fluid loop heat removal system.
１１…凝縮装置、 １２…流路形成
板、１３…凝縮用の流路、１４…上流側ヘッダ、１５…
下流側ヘッダ、 １６…固定熱伝導部材、
１７…ラジエータ、 １８…熱抵抗可変
装置、２１…突条、２２…熱抵抗調整用の隙間、２３…
可動熱伝導部材、 ２６…駆動装置。11: Condenser, 12: Flow path forming plate, 13: Flow path for condensation, 14: Upstream header, 15 ...
Downstream header, 16 ... fixed heat conducting member,
17: radiator, 18: variable thermal resistance, 21: ridge, 22: gap for adjusting thermal resistance, 23:
Movable heat conducting member, 26 ... Drive device.
フロントページの続き (72)発明者 川本 浩一 神奈川県川崎市幸区小向東芝町１番地 株式会社東芝総合研究所内 (56)参考文献 実開 平３−57989（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.6，ＤＢ名) F28D 15/02Continuing from the front page (72) Inventor Koichi Kawamoto 1 Toshiba, Komukai Toshiba-cho, Saisaki-ku, Kawasaki-shi, Kanagawa Prefecture (56) References Tokai Shiba 3-57989 (JP, U) (58) Investigated Field (Int.Cl. 6 , DB name) F28D 15/02
Claims (2)
内壁面を冷却するための冷却装置と、前記流路の内壁面
と前記冷却装置との間の熱抵抗を、前記流路の内壁面と
前記冷却装置との間に設けられた熱伝達路の通路断面積
を可変することにより可変する熱抵抗可変手段とを備
え、 前記熱抵抗を可変する手段は、前記流路の内壁面と前記
冷却装置との間に設けられて通路断面積の不変な第一の
熱伝達路を構成する固定熱伝導部材と、前記流路の内壁
面と前記冷却装置との間に挿入度可変に設けられて通路
断面積の可変な第２の熱伝達路を構成する可動熱伝導部
材と、前記流路を通過後の流体温度に対応させて前記可
動熱伝導部材の挿入度を調整する手段とを具備してなる
ことを特徴とする凝縮装置。1. A flow path for condensing steam, a cooling device for cooling an inner wall surface of the flow passage, and a heat resistance between the inner wall surface of the flow passage and the cooling device, A heat transfer path provided between the inner wall surface of the passage and the cooling device; anda heat resistance change unit that changes the passage cross-sectional area of the heat transfer passage. A fixed heat conducting member that is provided between an inner wall surface and the cooling device and forms a first heat transfer path having an invariable passage cross-sectional area, and a degree of insertion between the inner wall surface of the flow passage and the cooling device. A movable heat conducting member variably provided to constitute a second heat transfer path having a variable passage cross-sectional area; and an insertion degree of the movable heat conducting member adjusted to correspond to a fluid temperature after passing through the flow path. And a condensing device.
方向に移動自在に設けられ、上記流路の下流側方向へ移
動されるにしたがって前記第２の熱伝達路の通路断面積
を減少させるものであることを特徴とする請求項１に記
載の凝縮装置。2. The movable heat conducting member is provided so as to be movable in a direction along the flow path, and has a passage cross-sectional area of the second heat transfer path as it moves in a downstream direction of the flow path. 2. The condensing device according to claim 1, wherein the concentration is reduced.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3279971A JP2772178B2 (en) | 1991-10-25 | 1991-10-25 | Condenser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3279971A JP2772178B2 (en) | 1991-10-25 | 1991-10-25 | Condenser |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05118779A JPH05118779A (en) | 1993-05-14 |
| JP2772178B2 true JP2772178B2 (en) | 1998-07-02 |
Family
ID=17618494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3279971A Expired - Fee Related JP2772178B2 (en) | 1991-10-25 | 1991-10-25 | Condenser |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2772178B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007210425A (en) * | 2006-02-09 | 2007-08-23 | Nissan Motor Co Ltd | Heat radiator of interior member for vehicle |
| WO2017110740A1 (en) * | 2015-12-25 | 2017-06-29 | 日本電気株式会社 | Heat-dissipating device, phase-change cooling device in which same is used, and method for dissipating heat |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3057989U (en) * | 1998-09-25 | 1999-06-08 | 劉 富欽 | Evaporative cooler |
-
1991
- 1991-10-25 JP JP3279971A patent/JP2772178B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05118779A (en) | 1993-05-14 |
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