JP2770803B2 - Electronic component mounting equipment - Google Patents
Electronic component mounting equipmentInfo
- Publication number
- JP2770803B2 JP2770803B2 JP7261167A JP26116795A JP2770803B2 JP 2770803 B2 JP2770803 B2 JP 2770803B2 JP 7261167 A JP7261167 A JP 7261167A JP 26116795 A JP26116795 A JP 26116795A JP 2770803 B2 JP2770803 B2 JP 2770803B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- bonding tool
- laser
- lead
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は電子部品搭載装置、
特に、ボンディングツールにより電子部品のリードを基
板のパッドに押さえながら接続する電子部品搭載装置に
関する。The present invention relates to an electronic component mounting apparatus,
In particular, the present invention relates to an electronic component mounting apparatus for connecting a lead of an electronic component to a pad of a substrate by using a bonding tool while pressing the lead.
【０００２】[0002]
【従来の技術】従来の電子部品搭載装置では、図３に示
すように電子部品のリードを基板のパッドに接続する
際、リード一本に付き一ヶ所押さえるボンディングツー
ル５と電子部品１のリード２のみにレーザを照射する照
射ヘッド８とボンディングツール５及び照射ヘッド８を
同時に移動させる一軸ステージ６を有している。（例え
ば、ヒューズ・エアクラフト社、レーザボンダ２９２
０；Surface Mount Technology ９月号 １９９０年
参照） 従来の技術を図面を参照して説明する。ボンディングツ
ール５で電子部品１のリード２を基板３のパッド４に加
圧させながら、レーザ照射ヘッド８から直接レーザをリ
ード２に照射し、パッド４に予め供給された半田を加熱
溶融し、リード２とパッド４を接続する。隣接する電子
部品リードを接続するためにボンディングツール５とレ
ーザ照射ヘッド８を二軸ステージ７で移動させることに
より行う。2. Description of the Related Art In a conventional electronic component mounting apparatus, as shown in FIG. 3, when a lead of an electronic component is connected to a pad of a substrate, a bonding tool 5 which holds down one lead per lead and a lead 2 of the electronic component 1 are used. An irradiation head 8 for irradiating only the laser, a bonding tool 5 and a uniaxial stage 6 for simultaneously moving the irradiation head 8 are provided. (Eg, Hughes Aircraft, Laser Bonder 292
0; Surface Mount Technology September, 1990
The conventional technology will be described with reference to the drawings. While the lead 2 of the electronic component 1 is pressed against the pad 4 of the substrate 3 by the bonding tool 5, a laser is directly irradiated to the lead 2 from the laser irradiation head 8, and the solder supplied to the pad 4 is heated and melted, and the lead is melted. 2 and the pad 4 are connected. The connection is performed by moving the bonding tool 5 and the laser irradiation head 8 on the biaxial stage 7 to connect adjacent electronic component leads.
【０００３】[0003]
【発明が解決しようとする課題】上述した従来の電子部
品搭載装置では、レーザを電子部品リードに直接照射
し、加熱されたリードで基板パッドに供給された半田を
溶融し接続している。しかし、電子部品リード表面に金
メッキ等のレーザの吸収率が低い処理が施されている場
合、電子部品リード表面でレーザの大部分が反射し、供
給されている半田を溶融するためには与える熱量を増大
させなければならないという問題点があった。また、レ
ーザ発振器→光ファイバ→レーザ照射ヘッドの光軸を数
μｍ以下の精度で位置合せしなければならないという困
難性があった。In the above-described conventional electronic component mounting apparatus, a laser is directly radiated to the electronic component leads, and the solder supplied to the substrate pads is melted and connected by the heated leads. However, if the surface of the electronic component leads is subjected to a process such as gold plating that has a low laser absorptivity, most of the laser is reflected on the surface of the electronic component leads and the amount of heat applied to melt the supplied solder Has to be increased. Further, there is a difficulty that the optical axis of the laser oscillator → the optical fiber → the laser irradiation head must be aligned with an accuracy of several μm or less.
【０００４】[0004]
【課題を解決するための手段】本発明の電子部品搭載装
置は、電子部品と基板の接続において電子部品のリード
の１本１本をボンディングツールにより基板のパッドに
押さえつつ外部からの熱により接続部分の半田を溶融し
接続する装置において、電子部品と電子部品のリード
と、基板と、基板のパッドと、リードをパッドに押しつ
けるボンディングツールと、ボンディングツールを上下
に駆動させる一軸ステージと、ボンディングツールをＸ
Ｙ方向に移動させる二軸ステージと、ボンディングツー
ルと一体となって移動しボンディングツールの外側から
その側面に向けてレーザ発振器から導かれたレーザ光を
照射しボンディングツールの側面を加熱させ、ボンディ
ングツールの側面からの熱伝導により半田を溶融させて
リードとパッドを接続するレーザ照射ヘッドとを含んで
構成される。According to the electronic component mounting apparatus of the present invention, in connecting the electronic component and the substrate, each of the leads of the electronic component is connected to the pad of the substrate by a bonding tool by external heat while being held down by a bonding tool. In a device for melting and connecting parts of a solder, an electronic component and a lead of the electronic component, a substrate, a pad of the substrate, a bonding tool for pressing the lead against the pad, a uniaxial stage for driving the bonding tool up and down, and a bonding tool To X
A two-axis stage that moves in the Y direction, and moves integrally with the bonding tool from outside the bonding tool
The side of the bonding tool is heated by irradiating the side of the bonding tool with laser light guided from the laser oscillator.
And a laser irradiation head for connecting the lead and the pad by melting the solder by heat conduction from the side of the working tool .
【０００５】[0005]
【発明の実施の形態】次に、本発明の実施形態につい
て、図面を参照して詳細に説明する。Next, embodiments of the present invention will be described in detail with reference to the drawings.
【０００６】図１は本発明の一実施形態を示す構成図で
ある。図１に示す電子部品実装装置は、電子部品と基板
の接続において、電子部品のリードの１本１本をボンデ
ィングツールにより基板のパッドに押さえつつ、外部か
らの熱により接続部分の半田を溶融し接続する装置にお
いて、電子部品のリードの１本１本をボンディングツー
ルにより基板のパッドに押さえつつ、外部からの熱によ
り接続部分の半田を溶融し接続する装置において、電子
部品１と電子部品のリード２と、基板３と、基板のパッ
ド４と、リード２をパッド４に押しつけるボンディング
ツール５と、ボンディングツール５を上下に駆動させる
一軸ステージ６と、ボンディングツール５をＸＹ方向に
移動させる二軸ステージ７と、ボンディングツール５と
一体となって移動しボンディングツール５の側面にレー
ザを照射しボンディングツール５を加熱することにより
リード２とパッド４を接続するレーザ照射ヘッド８とを
含んで構成される。FIG. 1 is a block diagram showing an embodiment of the present invention. In the electronic component mounting apparatus shown in FIG. 1, in connecting the electronic component and the substrate, each of the leads of the electronic component is pressed against the pad of the substrate by a bonding tool, and the solder at the connection portion is melted by external heat. In the connecting device, an electronic component 1 and a lead of the electronic component are connected by melting the solder of the connecting portion by external heat while connecting each of the leads of the electronic component to a pad of the substrate by a bonding tool. 2, a substrate 3, a pad 4 of the substrate, a bonding tool 5 for pressing the lead 2 against the pad 4, a uniaxial stage 6 for driving the bonding tool 5 up and down, and a biaxial stage for moving the bonding tool 5 in the XY directions. 7 and move together with the bonding tool 5 and irradiate a laser to the side surface of the bonding tool 5 to perform bonding. Configured to include a laser irradiation head 8 for connecting the lead 2 and the pads 4 by heating Lumpur 5.
【０００７】ボンディングツール５でリード２をパッド
４に加圧させながら、レーザ照射ヘッド８よりレーザを
ボンディングツール５の側面に照射する。ボンディング
ツール５はレーザ吸収率の高い材質でできているため短
時間で高温となる。ボンディングツール５の熱はリード
２に伝導し、更にパッド４に予め供給された半田に伝導
・溶融させリード２とパッド４を接続する。隣接するリ
ードの接続には、ボンディングツール５とレーザ照射ヘ
ッド８を二軸ステージ７で移動させることにより行う。While pressing the lead 2 against the pad 4 with the bonding tool 5, a laser is irradiated from the laser irradiation head 8 to the side surface of the bonding tool 5. Since the bonding tool 5 is made of a material having a high laser absorptivity, the temperature becomes high in a short time. The heat of the bonding tool 5 is conducted to the lead 2, and is further conducted and melted to the solder previously supplied to the pad 4, thereby connecting the lead 2 and the pad 4. Connection between adjacent leads is performed by moving the bonding tool 5 and the laser irradiation head 8 on the biaxial stage 7.
【０００８】図２は本発明の他の実施形態を示す構成図
である。レーザ照射ヘッド８の内部に半導体レーザ１１
が収容されており、ここから出たレーザ光が直線ボンデ
ィングツール５を加熱する。FIG. 2 is a block diagram showing another embodiment of the present invention. The semiconductor laser 11 is provided inside the laser irradiation head 8.
Are stored, and the laser beam emitted from this heats the linear bonding tool 5.
【０００９】[0009]
【発明の効果】以上説明したように本発明の電子部品搭
載装置は、ボンディングツールで押さえつけた電子部品
リードを直接レーザを加熱する代わりに、リードを押さ
えつけたボンディングツールの側面にレーザを照射し、
ボンディングツール自体を加熱することにより半田を溶
融し接続する。そのため電子部品リードの表面の状態に
関わらず同一の条件で接続できるという効果がある。さ
らに、半導体レーザをレーザ照射ヘッドに内蔵させるこ
とにより、アライメントが容易になるという効果があ
る。As described above, the electronic component mounting apparatus of the present invention irradiates the laser to the side of the bonding tool holding down the lead, instead of directly heating the laser with the electronic component lead held down by the bonding tool.
The solder is melted and connected by heating the bonding tool itself. Therefore, there is an effect that connection can be made under the same condition regardless of the state of the surface of the electronic component lead. Further, by incorporating the semiconductor laser into the laser irradiation head, there is an effect that the alignment becomes easy.
【図１】本発明の一実施形態を示す構成図である。FIG. 1 is a configuration diagram showing an embodiment of the present invention.
【図２】本発明の他の実施形態を示す構成図である。FIG. 2 is a configuration diagram showing another embodiment of the present invention.
【図３】従来の一例を示す構成図である。FIG. 3 is a configuration diagram showing an example of the related art.
１ 電子部品 ２ リード ３ 基板 ４ パッド ５ ボンディングツール ６ 一軸ステージ ７ 二軸ステージ ８ レーザ照射ヘッド ９ 光ファイバー １０ レーザ発振器 １１ 半導体レーザ DESCRIPTION OF SYMBOLS 1 Electronic component 2 Lead 3 Substrate 4 Pad 5 Bonding tool 6 Uniaxial stage 7 Biaxial stage 8 Laser irradiation head 9 Optical fiber 10 Laser oscillator 11 Semiconductor laser
フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) H05K 3/34Continuation of the front page (58) Field surveyed (Int.Cl. 6 , DB name) H05K 3/34
Claims (3)
のリードの１本１本をボンディングツールにより基板の
パッドに押さえつつ外部からの熱により接続部分の半田
を溶融し接続する装置において、電子部品と前記電子部
品のリードと基板と前記基板のパッドと前記リードを前
記パッドに押しつけるボンディングツールと、前記ボン
ディングツールを上下に駆動させる一軸ステージと、前
記ボンディングツールをＸＹ方向に移動させる二軸ステ
ージと、前記ボンディングツールと一体となって移動し
前記ボンディングツールの外側からその側面に向けてレ
ーザ発振器から導かれたレーザ光を照射し前記ボンディ
ングツールの側面を加熱させ、前記ボンディングツール
の側面からの熱伝導により半田を溶融させて前記リード
と前記パッドを接続するレーザ照射ヘッドとを含むこと
を特徴とする電子部品搭載装置。An apparatus for connecting an electronic component to a board by connecting each of the leads of the electronic component by pressing each of the leads of the electronic component to a pad of the substrate by a bonding tool while melting solder at a connection portion by external heat. A bonding tool for pressing the leads of the electronic component, the substrate, the pads of the substrate and the pads against the pads, a uniaxial stage for driving the bonding tool up and down, and a biaxial stage for moving the bonding tool in XY directions. , the bonding tool and moved together to heat the side of the direction from the outside of the bonding tool to the side irradiated with laser light guided from Les <br/> chromatography the oscillator the bonding tool, the bonding tool
An electronic component mounting apparatus, comprising: a laser irradiation head for connecting the lead and the pad by melting solder by heat conduction from a side surface of the electronic component.
ドに内蔵させた請求項１記載の電子部品搭載装置。2. The electronic component mounting apparatus according to claim 1, wherein said laser oscillator is built in said laser irradiation head.
用いる請求項２記載の電子部品搭載装置。3. The electronic component mounting apparatus according to claim 2, wherein a semiconductor laser is used as said laser oscillator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7261167A JP2770803B2 (en) | 1995-05-30 | 1995-10-09 | Electronic component mounting equipment |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7-132413 | 1995-05-30 | ||
| JP13241395 | 1995-05-30 | ||
| JP7261167A JP2770803B2 (en) | 1995-05-30 | 1995-10-09 | Electronic component mounting equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0951162A JPH0951162A (en) | 1997-02-18 |
| JP2770803B2 true JP2770803B2 (en) | 1998-07-02 |
Family
ID=26466998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7261167A Expired - Lifetime JP2770803B2 (en) | 1995-05-30 | 1995-10-09 | Electronic component mounting equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2770803B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19990012352A (en) * | 1997-07-29 | 1999-02-25 | 윤종용 | Implementation method of abnormal alarm of key phone system |
| US7003874B1 (en) * | 1998-09-03 | 2006-02-28 | Micron Technology, Inc. | Methods of bonding solder balls to bond pads on a substrate |
| JP2005347415A (en) * | 2004-06-01 | 2005-12-15 | Miyachi Technos Corp | Electric part mounting method |
| DE102015103779A1 (en) * | 2015-03-16 | 2016-09-22 | Pac Tech-Packaging Technologies Gmbh | Chip arrangement and method for forming a contact connection |
| WO2021047737A1 (en) * | 2019-09-11 | 2021-03-18 | Hesse Gmbh | Ultrasonic tool and ultrasonic connection device therefor |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0474445A (en) * | 1990-07-16 | 1992-03-09 | Mitsubishi Electric Corp | Method and apparatus for bonding |
| JPH07118579B2 (en) * | 1993-03-01 | 1995-12-18 | 日本電気株式会社 | Lead component mounting apparatus and method |
-
1995
- 1995-10-09 JP JP7261167A patent/JP2770803B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0951162A (en) | 1997-02-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19980317 |