JP2762639B2 - Head support arm - Google Patents
Head support armInfo
- Publication number
- JP2762639B2 JP2762639B2 JP32696289A JP32696289A JP2762639B2 JP 2762639 B2 JP2762639 B2 JP 2762639B2 JP 32696289 A JP32696289 A JP 32696289A JP 32696289 A JP32696289 A JP 32696289A JP 2762639 B2 JP2762639 B2 JP 2762639B2
- Authority
- JP
- Japan
- Prior art keywords
- support arm
- integrated circuit
- head
- heat
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
- Supporting Of Heads In Record-Carrier Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
【発明の詳細な説明】 〔概要〕 磁気ディスク装置等において記録再生用ヘッドを支持
し、かつヘッドに対する記録・再生信号を処理する集積
回路を実装した小型化に有利なヘッド支持アームに関
し、 支持アームに設けたフレキシブル印刷配線上にチップ
状の集積回路を直接的に実装し、しかも該集積回路で発
生する熱を支持アームより外部へ効率良く放散させる構
成により小型化を可能にすることを目的とし、 記録再生用ヘッドを保持したジンバルアームを一端部
に支持し、かつ該ヘッドに対する信号の制御及び増幅用
の集積回路が実装さたフレキシブル印刷配線板を一主面
に備えたヘッド支持アームにおいて、上記フレキシブル
印刷配線板は集積回路の実装領域に貫通穴を有し、チッ
プ状の集積回路は熱伝導手段と共に該貫通穴を通して上
記支持アームの一主面上に貼設した状態で封止材により
封止して実装され、該支持アームは集積回路実装面と対
応する背面側に放熱手段を設けるように構成する。DETAILED DESCRIPTION OF THE INVENTION [Summary] A head supporting arm which supports a recording / reproducing head in a magnetic disk device or the like and is mounted on an integrated circuit for processing a recording / reproducing signal for the head is advantageous for miniaturization. A chip-shaped integrated circuit is directly mounted on a flexible printed wiring provided in a semiconductor device, and the heat generated in the integrated circuit is efficiently dissipated to the outside from a support arm, thereby enabling downsizing. A head supporting arm supporting a gimbal arm holding a recording / reproducing head at one end, and a flexible printed wiring board on one main surface on which an integrated circuit for controlling and amplifying signals for the head is mounted, The flexible printed wiring board has a through hole in a mounting area of the integrated circuit, and the chip-shaped integrated circuit passes through the through hole together with the heat conducting means. The support arm is mounted on one main surface of the support arm by sealing it with a sealing material, and the support arm is configured to provide a heat radiating means on the back side corresponding to the integrated circuit mounting surface.
本発明は磁気ディスク装置等において記録再生用ヘッ
ドを支持し、かつヘッドに対する記録・再生信号を処理
する集積回路を実装した小型化に有利なヘッド支持アー
ムに関するものである。The present invention relates to a head supporting arm that supports a recording / reproducing head in a magnetic disk device or the like and is advantageous in miniaturization, in which an integrated circuit for processing a recording / reproducing signal for the head is mounted.
磁気ディスク装置において磁気記録媒体の記録情報を
磁気ヘッドにより再生する信号は非常に微弱であり、か
かる再生信号を増幅する集積回路は磁気ヘッドより離れ
た位置に設置すると外乱ノイズの影響を受け易いため、
該集積回路はでき得る限り磁気ヘッドの近くに設けるこ
とが要求され、通例として前記ヘッド支持アーム上に実
装している。しかし近来、磁気ディスク装置の小型化、
高速化に伴って磁気ヘッド及びヘッド支持アーム等も小
型、軽量化が進められ、該ヘッド支持アームへの前記集
積回路の実装構造も小型化することが必要とされる。In a magnetic disk drive, a signal for reproducing recorded information of a magnetic recording medium by a magnetic head is extremely weak, and an integrated circuit for amplifying such a reproduced signal is susceptible to disturbance noise when installed at a position apart from the magnetic head. ,
The integrated circuit is required to be provided as close to the magnetic head as possible, and is usually mounted on the head support arm. However, recently, miniaturization of magnetic disk drives,
With the increase in speed, the size and weight of the magnetic head, the head support arm, and the like have been reduced, and the mounting structure of the integrated circuit on the head support arm needs to be reduced in size.
従来の集積回路を実装した磁気ヘッド支持アームは第
５図に示すように、磁気ヘッド１がジンバルアーム２を
介して支持された支持アーム３上に印刷配線板、例えば
第６図に示すように配線導体4bをベース樹脂フィルム4a
とカバー樹脂フィルム4cにより挟着一体としたフレキシ
ブル印刷配線板４が配置され、そのフレキシブル印刷配
線板４上の所定領域に、磁気ヘッド１への記録信号の制
御及び該ヘッド１で再生した信号を増幅するフラットパ
ッケージ形集積回路５が実装されている。As shown in FIG. 5, a magnetic head supporting arm on which a conventional integrated circuit is mounted is a printed wiring board on a supporting arm 3 on which a magnetic head 1 is supported via a gimbal arm 2, for example, as shown in FIG. Wiring conductor 4b to base resin film 4a
A flexible printed wiring board 4 integrated with a cover resin film 4c is disposed, and in a predetermined area on the flexible printed wiring board 4, control of a recording signal to the magnetic head 1 and a signal reproduced by the head 1 are performed. A flat package type integrated circuit 5 to be amplified is mounted.
即ち、該フラットパッケージ形集積回路５は、第６図
に示すように例えばIC,LSI等からなるチップ5aが放熱性
の良いセラミック基体5bと電磁ノイズをシールドする金
属カバー5cとからなるパッケージ内に配設され、そのセ
ラミック基体5bから導出する複数本の接続リード5b
1が、前記フレキシブル印刷配線板４上の所定領域にカ
バー樹脂フィルム4cより露出するようにベース樹脂フィ
ルム4a上に形成された配線導体4bによる電極パターン上
に半田付け等により接続された形で実装されている。That is, as shown in FIG. 6, the flat package type integrated circuit 5 includes a chip 5a made of, for example, an IC or an LSI, in a package including a ceramic base 5b having good heat dissipation and a metal cover 5c for shielding electromagnetic noise. A plurality of connection leads 5b provided and derived from the ceramic base 5b
1 is mounted by soldering or the like on an electrode pattern of a wiring conductor 4b formed on a base resin film 4a so as to be exposed from a cover resin film 4c in a predetermined area on the flexible printed wiring board 4 Have been.
ところで磁気ディスク装置の小型化及び高速化に伴っ
て上記したような構成の磁気ヘッド支持アームを小型に
する場合、前記フラットパッケージ形集積回路５の実装
構造も小型にする必要がある。When the size of the magnetic head supporting arm having the above-described configuration is reduced with the downsizing and speeding-up of the magnetic disk drive, the mounting structure of the flat package integrated circuit 5 also needs to be reduced in size.
しかし、該フラットパッケージ形の集積回路５の容積
及び質量はパッケージの形状が規格化されているため、
そのような集積回路５の実装構造を適用することにより
前記磁気ヘッド支持アームの小型化は極めて困難であっ
た。However, the volume and mass of the flat package integrated circuit 5 are standardized because the package shape is standardized.
It has been extremely difficult to reduce the size of the magnetic head supporting arm by applying such a mounting structure of the integrated circuit 5.
そこで上記した問題を解決するため、前記フラットパ
ッケージ形の集積回路５内に配設されている該パッケー
ジの十数分の一程度の小さいIC,LSI等からなるチップ5a
を、前記フレキシッブル印刷配線板４上の所定領域に直
接的に実装する構造を用いることにより磁気ヘッド支持
アームの小型、軽量化が可能となるが、その反面、前記
IC,LSI等からなるチップ5aで発生する熱を放散させるた
めの放熱を配慮したパッケージがないため、そのような
チップ5aの放熱が不十分となる問題がある。Therefore, in order to solve the above-described problem, a chip 5a made of an IC, LSI, or the like having a size smaller by about tenths than that of the package provided in the flat package type integrated circuit 5 is described.
By using a structure in which the magnetic head supporting arm is directly mounted on a predetermined area on the flexible printed wiring board 4, the size and weight of the magnetic head supporting arm can be reduced.
Since there is no package in consideration of heat radiation for dissipating the heat generated in the chip 5a composed of an IC, an LSI or the like, there is a problem that the heat radiation of such a chip 5a becomes insufficient.
本発明は上記した従来の問題点に鑑み、支持アームに
設けたフレキシブル印刷配線板上にチップ状の集積回路
を直接的に実装し、しかも該集積回路で発生する熱を支
持アームより外部へ効率良く放散させる構成により小型
化を可能にしたヘッド支持アームを提供することを目的
とするものである。In view of the above-mentioned conventional problems, the present invention directly mounts a chip-shaped integrated circuit on a flexible printed wiring board provided on a support arm, and efficiently transfers heat generated by the integrated circuit to the outside from the support arm. It is an object of the present invention to provide a head support arm that can be miniaturized by a structure that disperses well.
本発明は上記した目的を達成するため、記録再生用ヘ
ッドを保持したジンバルアームを一端部に支持し、かつ
該ヘッドに対する信号の制御及び増幅用の集積回路が実
装されたフレキシブル印刷配線板を一主面に備えたヘッ
ド支持アームにおいて、上記フレキシブル印刷配線板は
集積回路の実装領域に貫通穴を有し、チップ状の集積回
路は熱伝導手段と共に該貫通穴を通して上記支持アーム
の一主面上に貼設した状態で封止材により封止して実装
され、該支持アームは集積回路実装面と対応する背面側
に放熱手段を設けるように構成する。In order to achieve the above-described object, the present invention provides a flexible printed wiring board having a gimbal arm holding a recording / reproducing head at one end and an integrated circuit for controlling and amplifying signals for the head mounted thereon. In the head support arm provided on the main surface, the flexible printed wiring board has a through-hole in a mounting area of the integrated circuit, and the chip-shaped integrated circuit passes through the through-hole together with the heat conducting means on one main surface of the support arm. The support arm is configured to be sealed with a sealing material and mounted thereon, and the support arm is configured to provide a heat radiating means on the back side corresponding to the integrated circuit mounting surface.
本発明では支持アーム上のフレキシブル印刷配線板に
おける集積回路の実装領域に貫通穴を設け、該貫通穴に
前記支持アームより突出した熱伝導用突起部及び熱伝導
性の良い接着剤等からなる熱伝導手段を介してチップ状
集積回路を貼設し、かつ封止材により封止した実装構成
とすることにより、支持アームの小型化が可能となる。
また該チップ状集積回路で発生する熱が該支持アーム側
へ容易に伝導され、その伝導された熱は更に該支持アー
ムの集積回路実装面と対応する背面側に設けた放熱フイ
ン等からなる放熱手段によって効率良く放熱される。In the present invention, a through-hole is provided in the mounting area of the integrated circuit in the flexible printed wiring board on the support arm, and the through-hole is formed of a heat-conductive projection protruding from the support arm and a heat-conductive adhesive or the like. By adopting a mounting structure in which the chip-shaped integrated circuit is attached via the conduction means and sealed with a sealing material, the size of the support arm can be reduced.
Further, the heat generated in the chip-shaped integrated circuit is easily conducted to the support arm side, and the conducted heat is further radiated by a radiation fin or the like provided on the back side corresponding to the integrated circuit mounting surface of the support arm. The heat is efficiently radiated by the means.
以下図面を用いて本発明の実施例について詳細に説明
する。Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
第１図は本発明に係るヘッド支持アームの第１実施例
を示す要部断面図である。FIG. 1 is a sectional view showing a main part of a first embodiment of a head support arm according to the present invention.
図において、11は記録再生用ヘッドをジンバルアーム
を介して支持するアルミニウム（Al）等からなる軽量な
支持アームであり、該支持アーム11の集積回路を実装す
る一方の面には熱伝導用突起部12と、またその突起部12
を設けた面と反対側の他方の面に放熱フィン13が一体に
設けられている。In the figure, reference numeral 11 denotes a lightweight support arm made of aluminum (Al) or the like which supports a recording / reproducing head via a gimbal arm, and one surface of the support arm 11 on which an integrated circuit is mounted is provided with a heat conduction protrusion. Part 12 and its protruding part 12
The heat dissipating fins 13 are integrally provided on the other surface opposite to the surface provided with.
また、該支持アーム11の熱伝導用突起部12を設けた一
方の面上には、ベース樹脂フィルム14a上の配線導体14b
がカバー樹脂フィルム14cより露出した電極パターン
と、該ベース樹脂フィルム14aの電極パターンの中心に
貫通穴14dを設けたフレキシブル印刷配線板14が、該貫
通穴14dを前記突起部12に嵌合させた状態で接着剤等に
より貼設されている。Further, on one surface of the support arm 11 on which the heat conducting projection 12 is provided, a wiring conductor 14b on the base resin film 14a is provided.
The electrode pattern exposed from the cover resin film 14c and the flexible printed wiring board 14 having a through hole 14d at the center of the electrode pattern of the base resin film 14a fitted the through hole 14d to the protrusion 12. It is stuck with an adhesive or the like in this state.
更に、該突起部12上には、ヘッドへの記録信号の制御
及ヘッドで再生した信号を増幅するための例えばIC,LSI
等からなるチップ状集積回路15を直接的に熱伝導性の良
い伝導性銀銅系ペーストなどからなる接着剤により固着
すると共に、該チップ状集積回路15の複数の接続端子と
前記フレキシブル印刷配線基板14の各配線導体14bから
なる電極パターンとをワイヤリード16によりワイヤボン
ディングや半田付け等によって接続した状態に実装し、
その実装したチップ状の集積回路15は耐湿性、耐熱性の
良い、例えばエポキシ樹脂、或いはシリコーン樹脂など
にシリカ等の充填剤を配合した熱放散性の良好な封止樹
脂材17により図示のように封止した構成としている。Further, on the protruding portion 12, for example, an IC, an LSI for controlling a recording signal to the head and amplifying a signal reproduced by the head.
The chip-like integrated circuit 15 made of the same is directly fixed with an adhesive made of a conductive silver-copper-based paste having good thermal conductivity, and a plurality of connection terminals of the chip-like integrated circuit 15 and the flexible printed circuit board. The electrode pattern composed of the 14 wiring conductors 14b is mounted in a state where the electrode pattern is connected by wire bonding or soldering with the wire lead 16,
The mounted chip-shaped integrated circuit 15 is provided with a sealing resin material 17 having good moisture resistance and heat resistance, such as epoxy resin, silicone resin, etc., and a good heat dissipation property in which a filler such as silica is blended. Is sealed.
従って、かかる本実施例の構成にあっては、チップ状
集積回路15の直接的な実装構造によりヘッド支持アーム
の小型化が容易となり、かつ該チップ状集積回路15で発
生する熱は、直接固着された熱伝導用突起部12を通して
該支持アーム11へ放散され、更に放熱フィン13より効率
良く放熱される。Therefore, in the configuration of the present embodiment, the direct mounting structure of the chip-shaped integrated circuit 15 facilitates the miniaturization of the head support arm, and the heat generated in the chip-shaped integrated circuit 15 is directly fixed. The heat is dissipated to the support arm 11 through the heat-conducting projections 12 and further radiated more efficiently from the radiation fins 13.
なお、該放熱フィン13の配設により前記支持アーム11
の捩じり方向への応力等に対する剛性が高められるなど
の副次的な効果も有している。Note that the disposition of the radiation fins 13 allows the support arm 11 to be mounted.
This also has a secondary effect such as an increase in rigidity against stress in the torsional direction.
第２図は本発明に係るヘッド支持アームの第２実施例
を示す要部断面図であり、第１図と同等部分には同一符
号を付している。FIG. 2 is a sectional view of a main part showing a second embodiment of the head support arm according to the present invention, and the same reference numerals are given to the same parts as in FIG.
この図で示す実施例が第一図の実施例と異なる点は、
記録再生用ヘッドをジンバルアームを介して支持するAl
等からなる軽量な支持アーム21の集積回路を実装する一
方の面とは反対側の他方の面に放熱フィン13のみが一体
に設けられており、該集積回路を実装する一方の面に貼
設された前記フレキシブル印刷配線板14のベース樹脂フ
ィルム14aに穿設された貫通穴14dに熱伝導の良好な導電
性銀銅系ペーストなどからなる熱伝導材22を充填すると
共に、その充填した熱伝導材22上にチップ状集積回路15
を直接固着して実装したことである。The difference between the embodiment shown in this figure and the embodiment shown in FIG.
Al supporting the recording / reproducing head via a gimbal arm
Only the heat radiation fins 13 are integrally provided on the other surface opposite to the one surface on which the integrated circuit of the lightweight support arm 21 made of, for example, is mounted, and attached to one surface on which the integrated circuit is mounted. A heat conductive material 22 made of a conductive silver-copper paste or the like having good heat conductivity is filled in a through hole 14d formed in the base resin film 14a of the flexible printed wiring board 14 and the filled heat conductive material. Chip-like integrated circuit 15 on material 22
Is directly fixed and mounted.
この実施例の構成によっても第一図による実施例と同
様にヘッド支持アームの小型化が容易となり、かつ該チ
ップ状集積回路15で発生する熱は、直接固着され、前記
貫通穴14dに充填された熱伝導性の良い熱伝導材22層及
び該支持アーム21を通して放熱フィン13より効率良く放
熱される。According to the configuration of this embodiment, similarly to the embodiment shown in FIG. 1, the head support arm can be easily miniaturized, and the heat generated in the chip-shaped integrated circuit 15 is directly fixed and filled in the through hole 14d. The heat is efficiently dissipated from the heat radiating fins 13 through the heat conductive material 22 layer having good heat conductivity and the support arm 21.
なお、本実施例での支持アーム21では、第１図で示す
第１実施例の支持アームに一体的に設けている熱伝導用
突起部がないので、その分だけ該支持アーム21の加工が
容易で、低コストとなる。In the support arm 21 of the present embodiment, since there is no heat conduction projection provided integrally with the support arm of the first embodiment shown in FIG. 1, the processing of the support arm 21 is reduced accordingly. Easy and low cost.
また、第３図は本発明に係るヘッド支持アームの第３
実施例を示す要部断面図であり、第２図と同等部分には
同一符号を付している。FIG. 3 shows a third embodiment of the head support arm according to the present invention.
FIG. 2 is a sectional view of a main part showing an embodiment, and the same reference numerals are given to the same parts as in FIG.
この図で示す実施例が第２図の実施例と異なる点は、
他方の面に放熱フィン13が一体に設けられたAl等からな
る軽量な支持アーム21の集積回路を実装する一方の面
に、熱伝導用銅（Cu）箔31を介してベース樹脂フィルム
14a上の配線導体14bがカバー樹脂フィルム14cより露出
した電極パターンとその電極パターンで囲まれたベース
樹脂フィルム14a部分に実装するチップ状集積回路15が
遊嵌する貫通穴32とを設けたフレキシブル印刷配線板14
が接着剤等により貼設されており、該チップ状集積回路
15は、前記ベース樹脂フィルム14aに穿設された貫通穴3
2内に露出する熱伝導用銅箔31部分に熱伝導性の良い導
電性銀銅系ペーストなどの接着剤により直接固着して実
装したことである。The difference between the embodiment shown in this figure and the embodiment shown in FIG.
A light-weight support arm 21 made of Al or the like, on which the radiation fins 13 are integrally provided, is mounted on the other surface. An integrated circuit is mounted on one surface through a copper (Cu) foil 31 for heat conduction.
Flexible printing provided with an electrode pattern in which the wiring conductor 14b on 14a is exposed from the cover resin film 14c and a through hole 32 into which the chip-shaped integrated circuit 15 to be mounted on the base resin film 14a surrounded by the electrode pattern is loosely fitted. Wiring board 14
Is attached by an adhesive or the like, and the chip-shaped integrated circuit is
Reference numeral 15 denotes a through-hole 3 formed in the base resin film 14a.
That is, the heat conductive copper foil 31 exposed in the inside 2 is directly fixed and mounted with an adhesive such as a conductive silver-copper paste having good heat conductivity.
この実施例の構成によっても第１図、第２図による実
施例と同様にヘッド支持アームの小型化が容易となり、
かつ該チップ状集積回路15で発生する熱は、直接固着さ
れた熱伝導用銅箔31を介して前記支持アーム21へ効果的
に伝導され、放熱フィン13より効率良く放熱される。According to the structure of this embodiment, the head support arm can be easily miniaturized as in the embodiment shown in FIGS. 1 and 2.
Further, the heat generated in the chip-shaped integrated circuit 15 is effectively conducted to the support arm 21 via the heat-conducting copper foil 31 directly fixed, and is radiated more efficiently than the radiation fins 13.
更に、第４図は本発明に係るヘッド支持アームの第４
実施例を示す要部断面図であり、第３図と同等部分には
同一符号を付している。FIG. 4 shows a fourth embodiment of the head support arm according to the present invention.
FIG. 4 is a sectional view of an essential part showing an embodiment, and the same reference numerals are given to the same parts as those in FIG.
この図で示す実施例が第３図の実施例と異なる点は支
持アーム21上に熱伝導用銅箔31を介して貼設されたフレ
キシブル印刷配線板14の集積回路実装領域に配設された
チップ状集積回路15の周囲を、銅（Cu）等からなる金属
薄板枠41でその一部が前記熱伝導用銅箔31とのみ電気的
に導通するように配設され、この金属薄板枠41内に前記
した耐湿性、耐熱性の良い、例えばエポキシ樹脂、或い
はシリコーン樹脂などにシリカ等の充填剤を配合した熱
放散性の良好な封止樹脂材43を充填して封止し、更にそ
の金属薄板枠41上を同様な金属薄板カバー42で覆った実
装構成としたことである。The embodiment shown in this figure is different from the embodiment shown in FIG. 3 in that it is arranged in an integrated circuit mounting area of a flexible printed wiring board 14 stuck on a support arm 21 via a copper foil 31 for heat conduction. Around the chip-shaped integrated circuit 15, a metal thin plate frame 41 made of copper (Cu) or the like is disposed so that a part thereof is electrically connected only to the copper foil 31 for heat conduction. The above-mentioned moisture resistance, heat resistance is good, for example, epoxy resin, or silicone resin or the like is filled with a good heat dissipation good sealing resin material 43 in which a filler such as silica is blended, and further sealed. This is a mounting structure in which the metal thin plate frame 41 is covered with a similar metal thin plate cover.
この実施例の構成によっても第３図による実施例と同
様にヘッド支持アームの小型化が容易となり、かつ該チ
ップ状集積回路15で発生する熱は、直接固着された熱伝
導用銅箔31を介して前記支持アーム21へ効果的に伝導さ
れ、放熱フィン13より効率良く放熱される。更にチップ
状集積回路15の封止樹脂材43による封止が金属薄板枠41
の配設により容易となると共に、該金属薄板枠41と金属
薄膜カバー42とにより前記チップ状集積回路15に対する
外部からの電磁ノイズをシールドすることが可能となる
等の種々の利点を有している。According to the structure of this embodiment, the head support arm can be easily miniaturized similarly to the embodiment shown in FIG. 3, and the heat generated in the chip-shaped integrated circuit 15 is generated by the heat conductive copper foil 31 directly fixed. The heat is effectively transmitted to the support arm 21 through the radiating fins 13 and is more efficiently radiated. Further, the sealing of the chip-shaped integrated circuit 15 with the sealing resin material 43 is performed by the metal sheet frame 41.
In addition, the metal thin plate frame 41 and the metal thin film cover 42 have various advantages such as being able to shield electromagnetic noise from the outside with respect to the chip-shaped integrated circuit 15. I have.
以上の説明から明らかなように、本発明に係るヘッド
支持アームによれば、フレキシブル印刷配線板が貼設さ
れた放熱フィン付の支持アーム上に熱伝導材を介してチ
ップ状集積回路を封止樹脂材により封止した状態に実装
した構成とすることにより、該ヘッド支持アームの小型
化、軽量化が可能となる。またチップ状集積回路で発生
する熱は、直接固着された熱伝導材を介して支持アーム
側へ効果的に伝導され、放熱フィンより効率良く放熱さ
れる等、実用上優れた利点を有し、小型化、高速化する
磁気ディスク装置、光磁気ディスク装置、或いは光ディ
スク装置等のヘッド支持アームに適用して極めて有利で
ある。As is apparent from the above description, according to the head support arm according to the present invention, the chip-shaped integrated circuit is sealed via the heat conductive material on the support arm with the radiation fin on which the flexible printed wiring board is attached. By adopting a configuration in which the head support arm is mounted in a state sealed with a resin material, the size and weight of the head support arm can be reduced. Also, the heat generated in the chip-shaped integrated circuit has practically superior advantages, such as being effectively conducted to the support arm side via the directly fixed heat conducting material, and being efficiently dissipated from the radiation fins. The present invention is extremely advantageous when applied to a head support arm of a magnetic disk device, a magneto-optical disk device, an optical disk device, or the like that can be reduced in size and speed.
第１図は本発明に係るヘッド支持アームの第１実施例を
示す要部断面図、 第２図は本発明に係るヘッド支持アームの第２実施例を
示す要部断面図、 第３図は本発明に係るヘッド支持アームの第３実施例を
示す要部断面図、 第４図は本発明に係るヘッド支持アームの第４実施例を
示す要部断面図、 第５図は従来の磁気ヘッド支持アームを説明するための
斜視図、 第６図は従来の支持アームへの集積回路の実装構造を示
す要部断面図である。 第１図〜第４図において、 11,21は支持アーム、12は熱伝導用突起部、13は放熱フ
ィン、14はフレキシブル印刷配線板、14aはベース樹脂
フィルム、14bは配線導体、14cはカバー樹脂フィルム、
14d,32は貫通穴、15はチップ状集積回路、16はワイヤリ
ード、17,43は封止樹脂材、22は熱伝導材、31は熱伝導
用銅箔、41は金属薄板枠、42は金属薄板カバーをそれぞ
れ示す。FIG. 1 is a cross-sectional view of a main part showing a first embodiment of a head support arm according to the present invention. FIG. 2 is a cross-sectional view of a main part showing a second embodiment of the head support arm according to the present invention. FIG. 4 is a sectional view of a main part showing a third embodiment of the head support arm according to the present invention. FIG. 4 is a sectional view of a main part showing a fourth embodiment of the head support arm according to the present invention. FIG. 6 is a perspective view for explaining a support arm, and FIG. 6 is a sectional view of a main part showing a conventional mounting structure of an integrated circuit on a support arm. 1 to 4, 11 and 21 are support arms, 12 is a projection for heat conduction, 13 is a radiation fin, 14 is a flexible printed wiring board, 14a is a base resin film, 14b is a wiring conductor, and 14c is a cover. Resin film,
14d and 32 are through holes, 15 is a chip-shaped integrated circuit, 16 is a wire lead, 17 and 43 are a sealing resin material, 22 is a heat conductive material, 31 is a heat conductive copper foil, 41 is a thin metal sheet frame, and 42 is The metal sheet cover is shown respectively.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 笠井 希一郎 神奈川県川崎市中原区上小田中1015番地 富士通株式会社内 (56)参考文献 特開 昭50−143072（ＪＰ，Ａ) 実開 平３−45679（ＪＰ，Ｕ) 実開 昭59−91742（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.6，ＤＢ名) H05K 7/20 G11B 21/16 G11B 5/60────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kiichiro Kasai 1015 Kamiodanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture Inside Fujitsu Limited (56) References JP-A-50-143072 (JP, A) Japanese Utility Model No. 3-45679 (JP, U) Actually open sho 59-91742 (JP, U) (58) Fields investigated (Int. Cl. 6 , DB name) H05K 7/20 G11B 21/16 G11B 5/60
Claims (1)
ムを一端部に支持し、かつ該ヘッドに対する信号の制御
及び増幅用の集積回路（15）が実装されたフレキシブル
印刷配線板（14）を一主面に備えたヘッド支持アームに
おいて、 上記フレキシブル印刷配線板（14）は集積回路（15）の
実装領域に貫通穴（14d）を有し、チップ状の集積回路
（15）は熱伝導手段（12）と共に該貫通穴（14d）を通
して上記支持アーム（11）の一主面上に貼設した状態で
封止材（17）により封止して実装され、該支持アーム
（11）は集積回路実装面と対応する背面側に放熱手段
（13）を設けたことを特徴とするヘッド支持アーム。1. A flexible printed wiring board (14) supporting at one end a gimbal arm holding a recording / reproducing head and mounting an integrated circuit (15) for signal control and amplification for the head. In the head support arm provided on the main surface, the flexible printed wiring board (14) has a through hole (14d) in the mounting area of the integrated circuit (15), and the chip-shaped integrated circuit (15) Along with 12), it is mounted on one main surface of the support arm (11) through the through hole (14d) and sealed with a sealing material (17). The support arm (11) is an integrated circuit. A head support arm, wherein a heat radiating means (13) is provided on the back side corresponding to the mounting surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32696289A JP2762639B2 (en) | 1989-12-15 | 1989-12-15 | Head support arm |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32696289A JP2762639B2 (en) | 1989-12-15 | 1989-12-15 | Head support arm |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03187295A JPH03187295A (en) | 1991-08-15 |
| JP2762639B2 true JP2762639B2 (en) | 1998-06-04 |
Family
ID=18193734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32696289A Expired - Fee Related JP2762639B2 (en) | 1989-12-15 | 1989-12-15 | Head support arm |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2762639B2 (en) |
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| CN1299543C (en) * | 2004-02-26 | 2007-02-07 | 友达光电股份有限公司 | Flexible circuit board |
| US7347347B2 (en) | 1999-05-28 | 2008-03-25 | Fujitsu Limited | Head assembly, disk unit, and bonding method and apparatus |
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| JP3883037B2 (en) * | 2001-02-28 | 2007-02-21 | 株式会社日立製作所 | Medium recording / playback system |
| JP3660640B2 (en) * | 2001-07-02 | 2005-06-15 | アルプス電気株式会社 | Chip-on-suspension type magnetic head and manufacturing method thereof |
| JP3595306B2 (en) | 2002-01-31 | 2004-12-02 | 株式会社東芝 | Head suspension assembly and magnetic disk drive having the same |
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-
1989
- 1989-12-15 JP JP32696289A patent/JP2762639B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7347347B2 (en) | 1999-05-28 | 2008-03-25 | Fujitsu Limited | Head assembly, disk unit, and bonding method and apparatus |
| US7041208B2 (en) | 2001-12-11 | 2006-05-09 | Sau Lan Tang Staats | Microfluidic devices and methods for two-dimensional separations |
| CN1299543C (en) * | 2004-02-26 | 2007-02-07 | 友达光电股份有限公司 | Flexible circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03187295A (en) | 1991-08-15 |
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| LAPS | Cancellation because of no payment of annual fees |