JP2740788B2 - Circuit board dividing method and device - Google Patents
Circuit board dividing method and deviceInfo
- Publication number
- JP2740788B2 JP2740788B2 JP31013295A JP31013295A JP2740788B2 JP 2740788 B2 JP2740788 B2 JP 2740788B2 JP 31013295 A JP31013295 A JP 31013295A JP 31013295 A JP31013295 A JP 31013295A JP 2740788 B2 JP2740788 B2 JP 2740788B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- cutter
- dividing
- circuit board
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、大形基板に種々
の電子素子を取り付け、その後大形基板を分割して個々
の回路基板を形成する回路基板分割方法と装置に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board dividing method and apparatus for mounting various electronic elements on a large board, and thereafter dividing the large board to form individual circuit boards.
【０００２】[0002]
【従来の技術】従来、大形の基板を個々の回路基板に分
割する方法として、一般に大形基板にＶ字状の分割溝を
形成し、大形基板に電子素子を取り付け後、その分割溝
に沿って個々の回路基板に分割している。個々の回路基
板に分割する方法は、図７に示すように、大形基板１を
水平に配置し、表裏のＶ字状の分割溝２に円板周縁に鋸
刃を有したローリングカッタ３，４が表裏から当接し、
分割溝２をさらに切削して大形基板１の分割がなされ
る。この時大形基板１は、図示しない搬送機構により、
位置決めされて水平方向に移動し、回転するローリング
カッタ３，４間を通過して切断が行われる。2. Description of the Related Art Conventionally, as a method of dividing a large substrate into individual circuit boards, a V-shaped dividing groove is generally formed on a large substrate, and an electronic element is mounted on the large substrate. Are divided into individual circuit boards. As shown in FIG. 7, a method of dividing the circuit board into individual circuit boards is as follows. A large-sized board 1 is arranged horizontally, and a rolling cutter 3 having a saw blade on the periphery of a disc is formed in V-shaped dividing grooves 2 on the front and back sides. 4 abuts from both sides,
The division groove 2 is further cut to divide the large substrate 1. At this time, the large substrate 1 is moved by a transport mechanism (not shown).
The cutting is performed by passing between the rolling cutters 3 and 4 which are positioned, move in the horizontal direction, and rotate.
【０００３】また特開平６−２０９１４９号公報に開示
されているように、焼結ダイヤモンド製ローリングカッ
タを用いてセラミック基板に分割溝を形成する方法も提
案されている。このローリングカッタは、刃先が所定の
角度を有した山形に形成されているものである。Further, as disclosed in Japanese Patent Application Laid-Open No. 6-209149, there has been proposed a method of forming a dividing groove in a ceramic substrate using a rolling cutter made of sintered diamond. This rolling cutter has a cutting edge formed in a mountain shape having a predetermined angle.
【０００４】[0004]
【発明が解決しようとする課題】上記従来の技術の前者
の場合、図７に示すように、ロータリカッタ３，４の刃
先の位置が正確に一致せず、分割端面の形状が正確に直
線状にならず、バラツキがあるものであった。さらに、
分割時にこの刃先のズレ及び大形基板１に生じる応力が
大きいこと等により、分割によるバリが生じやすく、こ
のバリによっても回路基板の外形寸法の誤差が生じ、正
確な寸法の回路基板を形成することができないという問
題があった。特に小型の電子機器にとって上記回路基板
の寸法のバラツキが問題であった。さらに、分割時に回
路基板に生じる応力が大きいことから、搭載した電子素
子に悪影響が生じ、その特性等が変化したりする問題も
あった。また、ガラス繊維を有する回路基板の場合、上
記カッタの対面位置のズレにより、回路基板が分割され
ないという事態も生じ、カッタの位置決めや送りがきわ
めて面倒なものであった。In the former case of the above prior art, as shown in FIG. 7, the positions of the cutting edges of the rotary cutters 3 and 4 do not exactly match, and the shape of the divided end face is accurately linear. It did not change, and there was variation. further,
Due to the misalignment of the cutting edge and the large stress generated in the large-sized substrate 1 during the division, burrs are likely to occur due to the division, and the burrs also cause errors in the outer dimensions of the circuit board, thereby forming a circuit board with accurate dimensions. There was a problem that it was not possible. In particular, for small-sized electronic devices, there has been a problem of variation in dimensions of the circuit board. Furthermore, since the stress generated on the circuit board at the time of division is large, there is a problem that the mounted electronic elements are adversely affected and their characteristics are changed. Further, in the case of a circuit board having glass fibers, a situation occurs in which the circuit board is not divided due to a shift in the facing position of the cutter, and positioning and feeding of the cutter are extremely troublesome.
【０００５】また、上記従来の技術の後者の場合、単に
分割溝を形成するものであるが、これを用いて、さらに
分割も行おうとすると、上記従来の技術と同様の問題を
生じるものである。[0005] In the latter case of the above-mentioned prior art, a dividing groove is simply formed. However, if this is used to further divide, a problem similar to that of the above-mentioned prior art arises. .
【０００６】さらに、上記従来の技術において、基板切
断時に生じた切断粉が回路基板上の電子素子に付着し電
汽笛特性に誤差を生じさせたり、その他品質低下の原因
となる場合があった。そこで、特開平６−１９０６２０
号公報に開示されているように、回転刃の近傍に吸引装
置を設けて、切断粉を吸引するものもあるが、回転はに
より舞い上がる切断粉を全て吸引することは難しく完全
には吸引しきれないものであった。Further, in the above-mentioned conventional technology, cutting powder generated at the time of cutting the substrate may adhere to the electronic elements on the circuit board, causing an error in the electric whistle characteristic or causing other quality deterioration. Therefore, Japanese Patent Application Laid-Open No. Hei 6-190620
As disclosed in Japanese Patent Laid-Open Publication No. H10-209, there is a suction device provided with a suction device in the vicinity of the rotary blade to suction the cutting powder, but it is difficult to completely suck the cutting powder that flies due to the rotation. There was nothing.
【０００７】この発明は、上記従来の技術の問題点に鑑
みてされたもので、簡単な構成で、基板に大きな応力を
発生させることなく、正確に基板の分割が可能であり、
分割した回路基板の寸法精度も高い回路基板分割方法と
装置を提供することを目的とする。[0007] The present invention has been made in view of the above-mentioned problems of the conventional technology, and can accurately divide a substrate with a simple configuration without generating a large stress on the substrate.
It is an object of the present invention to provide a method and an apparatus for dividing a circuit board having high dimensional accuracy of the divided circuit boards.
【０００８】[0008]
【課題を解決するための手段】この発明は、Ｖ字状の分
割溝を有した絶縁性の大形基板を垂直方向に片持状態で
保持し、この大形基板の分割溝に沿って周端縁部が円筒
面のダイヤモンドカッタにより、上記分割溝に対応する
部分を縦横に切削しながら、対向する分割溝の溝底部ま
で切削して上記大形基板を分割する回路基板分割方法で
ある。SUMMARY OF THE INVENTION According to the present invention, a large insulating substrate having a V-shaped dividing groove is vertically held in a cantilevered state, and a peripheral portion is formed along the dividing groove of the large substrate. This is a circuit board dividing method in which a large-sized substrate is divided by cutting a portion corresponding to the dividing groove vertically and horizontally by a diamond cutter having a cylindrical edge to the bottom of the opposing dividing groove.
【０００９】さらに、縦横に分割溝が形成された絶縁性
の大形基板を垂直方向に片持状態で保持し、この大形基
板の垂直方向の分割溝に沿ってカッタにより切り目を入
れ、次に、水平方向に上記カッタを９０度回動させて、
水平方向の上記分割溝に沿って上記大形基板を切断し、
個々の回路基板に分割する回路基板分割方法である。Further, an insulating large substrate having vertical and horizontal dividing grooves formed therein is vertically held in a cantilever state, and a cut is made by a cutter along the vertical dividing grooves of the large substrate. Then, rotate the cutter 90 degrees in the horizontal direction,
Cutting the large substrate along the horizontal dividing groove,
This is a circuit board dividing method for dividing into individual circuit boards.
【００１０】またこの発明は、表裏面で互いに対向した
分割溝を有した大形基板を垂直方向に片持状態で保持す
る基板保持部材と、この基板保持部材を上記大形基板と
ともに所定位置に搬送する搬送装置と、上記大形基板の
上記分割溝に沿って上記大形基板の表面を切削する周端
縁部が円筒面のダイヤモンドカッタと、このダイヤモン
ドカッタを回転駆動する駆動装置と、上記分割溝を切削
しながら上記大形基板を分割する回路基板分割装置であ
る。さらに、上記カッタを有したカッタ装置は、上記カ
ッタの切断方向を垂直方向と水平方向に切り替えること
ができるものである。The present invention also provides a substrate holding member for vertically holding a large substrate having divided grooves facing each other on the front and back surfaces in a cantilever state, and moving the substrate holding member together with the large substrate into a predetermined position. A transport device for transporting, a diamond cutter having a cylindrical peripheral edge that cuts the surface of the large substrate along the dividing groove of the large substrate, a driving device for rotating and driving the diamond cutter, This is a circuit board dividing apparatus that divides the large substrate while cutting the dividing groove. Further, the cutter device having the cutter can switch the cutting direction of the cutter between a vertical direction and a horizontal direction.
【００１１】さらに、上記ダイヤモンドカッタの近傍
に、上記ダイヤモンドカッタが上記基板に当接している
個所を囲むように空気を噴射する複数の噴射孔と、上記
複数の噴射孔の内側に位置し空気を吸引する吸引口が形
成されたものである。上記吸引口は、上記ダイヤモンド
カッタと対向し、切断される回路基板の裏面側に設けら
れる基板押えの両側に開口し、この吸引口の周囲に上記
噴射孔が形成されたものである。[0011] Further, a plurality of injection holes for injecting air around the diamond cutter so as to surround a portion where the diamond cutter is in contact with the substrate, and an air hole positioned inside the plurality of injection holes for injecting air. A suction port for suction is formed. The suction port is opposite to the diamond cutter and is opened on both sides of a substrate holder provided on the back side of the circuit board to be cut. The injection hole is formed around the suction port.
【００１２】この回路基板分割方法と装置は、垂直方向
に保持された大形基板表面を、周面が薄い円筒面のダイ
ヤモンドカッタにより切削しながら大形基板の分割を行
い、正確に分割溝の通りに分割し、大形基板及びその基
板上の電子素子に無理なストレスが生じないものであ
る。また、上記噴射孔から噴射された空気流がその間の
吸引口に引き込まれ、エアーカーテンとなって、上記ダ
イヤモンドカッタによる粉がその周辺へ飛ばないものだ
る。According to the circuit board dividing method and apparatus, the large board divided vertically while cutting the surface of the large board held in the vertical direction by a diamond cutter having a thin cylindrical surface is formed. The large-sized substrate and the electronic elements on the substrate are not subjected to excessive stress. In addition, the air flow injected from the injection hole is drawn into the suction port therebetween, forming an air curtain, and the powder by the diamond cutter does not fly to the periphery.
【００１３】[0013]
【発明の実施の形態】以下この発明の実施の形態につい
て図面に基づいて説明する。図１〜図３はこの発明の第
一実施形態であり、この実施形態の回路基板分割装置
は、図１〜図４に示すように、Ｖ字状の分割溝２を有し
各種電子素子６，７が装着された大形基板１の側縁部１
１を、垂直方向に片持状態で保持する４個の基板保持部
材１２が設けられている。この基板保持装置１２は、垂
直方向の搬送ガイド１４と水平方向の搬送ガイド１６に
沿って、図示しない駆動装置により移動可能に設けられ
ている。搬送ガイド１４の下方には、大形基板１を多数
垂直方向に並べて保持し、基板保持部材１２が大形基板
１を１枚ずつ取り出す、カセット１８が設けられてい
る。このカセット１８の側方には、大形基板１を水平、
垂直方向に分割するカッタ装置２０が設けられている。
カッタ装置２０は、回転軸２２を中心にモータにより９
０度回動可能に設けられている。また、この回路基板分
割装置の操作を行う操作ボックス２４が、正面中央部上
方に取り付けられている。Embodiments of the present invention will be described below with reference to the drawings. FIGS. 1 to 3 show a first embodiment of the present invention. As shown in FIGS. 1 to 4, a circuit board dividing apparatus according to this embodiment has a V-shaped dividing groove 2 and various electronic elements 6. , 7 mounted on the side edge 1 of the large substrate 1
There are provided four substrate holding members 12 for holding the substrate 1 vertically in a cantilevered state. The substrate holding device 12 is provided so as to be movable by a driving device (not shown) along a vertical transport guide 14 and a horizontal transport guide 16. Below the transport guide 14, there is provided a cassette 18 for holding a large number of large substrates 1 in a vertical direction and for the substrate holding member 12 to take out the large substrates 1 one by one. The large substrate 1 is placed horizontally on the side of the cassette 18.
A cutter device 20 for vertically dividing is provided.
The cutter device 20 is driven by a motor around a rotation shaft 22.
It is provided to be able to rotate 0 degrees. Further, an operation box 24 for operating the circuit board dividing device is mounted above the front center.
【００１４】カッタ装置２０には、円板状のダイヤモン
ドカッタ２６が取り付けられている。このダイヤモンド
カッタ２６は、図示しない駆動装置により回転駆動さ
れ、図２に示すように、周端縁部に円筒面状に形成され
たダイヤモンド砥粒層２８が形成され、大形基板１をこ
の砥粒層２８により切削して、図３に示すように断面コ
字形の溝３０を形成しながら分割するものである。ま
た、カッタ装置２０には、図２に示すように、大形基板
１を裏面側から保持する基板押え２９が設けられ、大形
基板１の分割時に大形基板１のカッタ装置２０とは反対
側の分割溝２に嵌合して保持するものである。A disk-shaped diamond cutter 26 is attached to the cutter device 20. The diamond cutter 26 is rotationally driven by a driving device (not shown), and as shown in FIG. 2, a diamond abrasive layer 28 formed in a cylindrical shape on the peripheral edge is formed. The cutting is performed by the grain layer 28 to form a groove 30 having a U-shaped cross section as shown in FIG. As shown in FIG. 2, the cutter device 20 is provided with a substrate holder 29 for holding the large substrate 1 from the back side, and is opposite to the cutter device 20 of the large substrate 1 when the large substrate 1 is divided. This is fitted and held in the side divided groove 2.
【００１５】カッタ装置２０の側方には、分割した各回
路基板３２を搬出する公知のコンベア部３４が設けられ
ている。さらに、この回路基板分割装置の各部の動作を
行う公知の図示しない駆動装置とその制御装置が設けら
れている。A known conveyor section 34 for carrying out the divided circuit boards 32 is provided on the side of the cutter device 20. Further, a known driving device (not shown) for operating each part of the circuit board dividing device and its control device are provided.
【００１６】次にこの発明の実施形態の回路基板分割方
法について説明する。先ず、垂直方向の搬送ガイド１４
に沿って図示しない駆動装置により基板保持部材１２を
移動させ、大形基板１の側縁部１１を、基板保持部材１
２により垂直方向に片持状態で挟持する。この時、図示
しない位置決め機構により、正確に大形基板１は基板保
持部材１２の所定位置に位置決めされて保持される。こ
の後、水平方向の搬送ガイド１６に沿って基板保持装置
１２を移動させ、大形基板１をカッタ装置２０に対面さ
せ、ダイヤモンドカッタ２６を回転させながら垂直方向
に向いた状態で、縦方向にカッタ装置２０を移動させ
る。そして、ダイヤモンドカッタ２６により、図４の
〜の順に下一列目の回路基板３２の上端部まで切り目
を入れる。この時の切り目は、図３に示すように、ダイ
ヤモンドカッタ２６のダイヤモンド砥粒層２８によっ
て、コ字形の溝３０が形成され、裏面側の分割溝２に溝
３０の底部が到達して、分離がなされる。Next, a circuit board dividing method according to an embodiment of the present invention will be described. First, the vertical transport guide 14
The substrate holding member 12 is moved by a driving device (not shown) along the line, and the side edge 11 of the large substrate 1 is moved to the substrate holding member 1.
2 to vertically clamp the cantilever. At this time, the large substrate 1 is accurately positioned and held at a predetermined position of the substrate holding member 12 by a positioning mechanism (not shown). Thereafter, the substrate holding device 12 is moved along the horizontal transport guide 16 so that the large-sized substrate 1 faces the cutter device 20, and the diamond cutter 26 is rotated in the vertical direction while rotating in the vertical direction. The cutter device 20 is moved. Then, a cut is made by the diamond cutter 26 up to the upper end of the circuit board 32 in the lower first row in the order of FIG. At this time, as shown in FIG. 3, a U-shaped groove 30 is formed by the diamond abrasive layer 28 of the diamond cutter 26, and the bottom of the groove 30 reaches the divided groove 2 on the back side, and the separation is performed. Is made.
【００１７】またこの時、ダイヤモンドカッタ２６は大
形基板１をほとんど押圧することなく表面を切削して溝
３０を形成するすることができ、大形基板１にはほとん
ど応力が生じない。従って、表面の電子素子６，７にも
力が作用せず、分割時に生じる応力による悪影響がな
い。At this time, the diamond cutter 26 can cut the surface of the large-sized substrate 1 without substantially pressing the large-sized substrate 1 to form the groove 30, and almost no stress is generated in the large-sized substrate 1. Therefore, no force acts on the electronic elements 6 and 7 on the surface, and there is no adverse effect due to the stress generated at the time of division.
【００１８】次に、カッタ装置２０を回動させるモータ
を作動させてカッタ装置２０を９０度回動させ、ダイヤ
モンドカッタ２６を水平状態にして大形基板１を対面さ
せ、水平方向にカッタ装置２０を移動させる。そして、
先ず図４のの位置の分割溝２に沿って、大形基板１の
端部を切り離し、次に、の位置の分割溝２に沿って大
形基板１の表面にダイヤモンドカッタ２６を当てて移動
させると、個々の回路基板３２が順に分割されて行く。
この時も上記と同様に、大形基板１にはほとんど応力が
生じない。Next, the motor for rotating the cutter device 20 is operated to rotate the cutter device 90 by 90 degrees, the diamond cutter 26 is placed in a horizontal state, and the large substrate 1 is faced. To move. And
First, the end of the large substrate 1 is cut off along the division groove 2 at the position shown in FIG. 4, and then the diamond cutter 26 is moved along the division groove 2 at the position on the surface of the large substrate 1. Then, the individual circuit boards 32 are sequentially divided.
At this time, almost no stress is generated in the large-sized substrate 1 as described above.
【００１９】分割された個々の回路基板３２は、コンベ
アー部３４により所定の位置に搬出される。さらに、次
の分割に際して、カッタ装置２０は９０度逆に回動し、
垂直状態となって次の列の回路基板３２に縦方向に１列
分の分割溝２を分離する。そして上記と同様に、９０度
回動してダイヤモンドカッタ２６を水平方向にして、カ
ッタ装置２０により、の位置の分割溝２で大形基板１
を分割する。同様に、次の列の回路基板３２の分割に際
しても、一旦、垂直方向の分割溝２に沿って分割して、
その後水平方向の分割を行う。ここで、垂直方向の分割
を一度に行わないのは、一度に多数列分の分割をしてし
まうと、大形基板１が片持状態であるため、下方の回路
基板３２が不安定となり、正確な分割ができないからで
ある。従って、大形基板１の剛性によっては、垂直方向
に一度に分割しても良い。Each of the divided circuit boards 32 is carried out to a predetermined position by a conveyor unit 34. Further, at the time of the next division, the cutter device 20 rotates 90 degrees in reverse,
In the vertical state, the division grooves 2 for one row are separated in the vertical direction on the circuit board 32 of the next row. In the same manner as described above, the diamond cutter 26 is turned horizontally by 90 degrees, and the large substrate 1
Split. Similarly, when dividing the circuit board 32 in the next row, the circuit board 32 is once divided along the dividing groove 2 in the vertical direction.
Thereafter, horizontal division is performed. Here, the reason why the vertical division is not performed at once is that if a large number of columns are divided at a time, the large circuit board 1 is in a cantilever state, so that the lower circuit board 32 becomes unstable, This is because accurate division cannot be performed. Therefore, depending on the rigidity of the large-sized substrate 1, it may be divided at a time in the vertical direction.
【００２０】この回路基板分割方法と装置によれば、垂
直方向に保持された大形基板１の表面を、周面が薄い円
筒面のダイヤモンドカッタ２６により切削しながら分割
を行い、正確に分割溝２の通りに分割が行われ、大形基
板１及びその上の電子素子６，７に無理な応力が生じな
いものである。従って、バリの発生もなく、分割線も正
確であり、寸法の正確なものである。また、基板保持部
材１２や、搬送ガイド１４，１６により、正確な位置決
めと移動が可能であり、この点でも寸法精度を高くする
ことができる。さらに、水平垂直方向の分割を一つのカ
ッタ装置２０で行うことができ、装置全体も小型化する
ことができる。According to the circuit board dividing method and apparatus, the surface of the large substrate 1 held in the vertical direction is divided while being cut by the diamond cutter 26 having a cylindrical surface with a thin peripheral surface, and the dividing groove is accurately formed. Division is performed in two ways, so that unreasonable stress does not occur in the large substrate 1 and the electronic elements 6 and 7 thereon. Therefore, there is no burr, the dividing line is accurate, and the dimension is accurate. Further, accurate positioning and movement can be performed by the substrate holding member 12 and the transport guides 14 and 16, and in this respect, dimensional accuracy can be improved. Furthermore, the division in the horizontal and vertical directions can be performed by one cutter device 20, and the entire device can be downsized.
【００２１】次にこの発明の第二実施形態について、図
５、図６を基にして説明する。この実施形態では、ダイ
ヤモンドカッタ２６と対向する基板押え２９に、吸引装
置４０を設けたものである。この吸引装置４０は、基板
押え２９の両側の面に開口した吸引口４２と、この吸引
口４２を囲むように吸引口４２の周囲に多数形成され空
気を噴射する噴射孔４４を有している。噴射孔４４は、
ダイヤモンドカッタ２６が回路基板３２に当接している
個所を囲むように空気を噴射する。吸引口４２の奥に
は、吸引管路４６に接続される吸引口４８が形成され、
噴射孔４４は、加圧エアが供給される取付部５０に連通
している。Next, a second embodiment of the present invention will be described with reference to FIGS. In this embodiment, a suction device 40 is provided on a substrate holder 29 facing the diamond cutter 26. The suction device 40 has a suction port 42 opened on both sides of the substrate holder 29, and a plurality of injection holes 44 formed around the suction port 42 so as to surround the suction port 42 and eject air. . The injection hole 44 is
Air is injected so that the diamond cutter 26 surrounds the place where the diamond cutter 26 is in contact with the circuit board 32. A suction port 48 connected to a suction conduit 46 is formed at the back of the suction port 42,
The injection hole 44 communicates with a mounting portion 50 to which pressurized air is supplied.
【００２２】この実施形態の回路基板分割装置は、噴射
孔４４から噴射された空気流がその間の吸引口４２に引
き込まれ、噴射孔４４からの空気流がエアーカーテンと
なって、ダイヤモンドカッタ２６による粉が確実に吸引
口４２に引き込まれる。従ってダイヤモンドカッタ２６
による細かい粉が、周囲に飛び散ることなく、吸引口４
２に引き込まれ、回路基板３２上の電子素子に、切断粉
がつくことはない。In the circuit board dividing apparatus of this embodiment, the air flow injected from the injection hole 44 is drawn into the suction port 42 therebetween, and the air flow from the injection hole 44 serves as an air curtain, and is formed by the diamond cutter 26. The powder is reliably drawn into the suction port 42. Therefore, the diamond cutter 26
The fine powder due to the suction port 4
The cutting powder is not attached to the electronic elements on the circuit board 32.
【００２３】尚、この発明のカッタは、適宜の幅のもの
を選択することができるものであり、基板保持部材や搬
送装置、駆動装置も適宜設定可能なものである。またカ
ッタ装置、は適宜複数設けても良く、水平垂直毎に各々
設けたり、複数のダイヤモンドカッタを並列に並べても
良いものである。さらに、カッタは、ダイヤモンドカッ
タ以外に、他の切削部分を有するカッタを用いても良
く、適宜選択可能である。The cutter according to the present invention can be selected to have an appropriate width, and the substrate holding member, the transfer device, and the drive device can also be set as appropriate. In addition, a plurality of cutter devices may be provided as appropriate, each of which may be provided for each of the horizontal and vertical directions, or a plurality of diamond cutters may be arranged in parallel. Further, as the cutter, a cutter having another cutting portion other than the diamond cutter may be used, and can be appropriately selected.
【００２４】[0024]
【発明の効果】この発明の回路基板分割方法と装置は、
大形基板に大きな力を加えることなく、正確に分割させ
ることができ、分割時にバリが生じたり、寸法精度が悪
くなったりすることがなく、大形基板を正確に所定の大
きさの回路基板毎に分割することができる。また、分割
する基板の種類を選ばず、ガラス繊維を含んだものも容
易に正確に分割可能である。The circuit board dividing method and apparatus according to the present invention are:
The large board can be accurately divided without applying a large force to the large board without causing burrs or dimensional accuracy degradation at the time of division. Each can be divided. In addition, regardless of the type of substrate to be divided, a substrate containing glass fibers can be easily and accurately divided.
【００２５】またこの発明の回路基板分割方法と装置に
より、回路基板状の電子素子に切断粉が付着することが
なく、効率よく高品質の回路基板を組み立てることがで
きる。Further, according to the circuit board dividing method and apparatus of the present invention, a high-quality circuit board can be efficiently assembled without cutting powder adhering to a circuit board-shaped electronic element.
【図１】この発明の回路基板分割装置の一実施形態の正
面図である。FIG. 1 is a front view of an embodiment of a circuit board dividing device according to the present invention.
【図２】この発明の回路基板分割装置に用いるダイヤモ
ンドカッタの第一実施形態の使用状態を示す概略図であ
る。FIG. 2 is a schematic view showing a use state of the first embodiment of the diamond cutter used in the circuit board dividing device of the present invention.
【図３】この発明の第一実施形態の回路基板分割装置に
より分割した大形基板の部分断面図である。FIG. 3 is a partial cross-sectional view of a large board divided by the circuit board dividing apparatus according to the first embodiment of the present invention.
【図４】この発明の第一実施形態の大形基板の正面図で
ある。FIG. 4 is a front view of the large substrate according to the first embodiment of the present invention.
【図５】この発明の第二実施形態の回路基板分割装置に
用いる吸引装置の正面図である。FIG. 5 is a front view of a suction device used in a circuit board dividing device according to a second embodiment of the present invention.
【図６】この発明の第二実施形態の回路基板分割装置に
用いる吸引装置の斜視図である。FIG. 6 is a perspective view of a suction device used for a circuit board dividing device according to a second embodiment of the present invention.
【図７】従来の技術の回路基板分割装置の使用状態を示
す概略図である。FIG. 7 is a schematic diagram showing a state of use of a conventional circuit board dividing apparatus.
１ 大形基板 ２ 分割溝 １２ 基板保持装置 １４，１６ 搬送ガイド ２０ カッタ装置 ２６ ダイヤモンドカッタ ２９ 基板押え ４２ 吸引口 ４４ 噴射孔 DESCRIPTION OF SYMBOLS 1 Large board 2 Dividing groove 12 Substrate holding device 14, 16 Transport guide 20 Cutter device 26 Diamond cutter 29 Substrate retainer 42 Suction port 44 Injection hole
Claims (8)
で保持し、この大形基板の分割部分をカッタにより切削
しながら分割する回路基板分割方法。1. A circuit board dividing method for holding an insulating large substrate in a cantilever state in a vertical direction, and dividing the divided portion of the large substrate while cutting it with a cutter.
縁性の大形基板を垂直方向に片持状態で保持し、この大
形基板の分割溝に沿って、周端縁部が円筒面のダイヤモ
ンドカッタにより、上記分割溝に対応する部分を切削し
ながら、対向する分割溝の溝底部まで切削して上記大形
基板を分割する回路基板分割方法。2. A large-sized insulating substrate having opposed dividing grooves formed on the front and back surfaces is vertically held in a cantilever state, and a peripheral edge is cylindrical along the dividing grooves of the large-sized substrate. A circuit board dividing method for cutting a large substrate by cutting a portion corresponding to the above-mentioned dividing groove by a diamond cutter on a surface and cutting the bottom of the opposing dividing groove to the groove bottom.
基板を垂直方向に片持状態で保持し、この大形基板の垂
直方向の分割溝に沿ってカッタにより切り目を入れ、次
に水平方向の上記分割溝に沿って上記大形基板を切断
し、個々の回路基板に分割する請求項１又は２記載の回
路基板分割方法。 3. A large insulating material having divided grooves formed vertically and horizontally.
Hold the board vertically in a cantilevered state, and
Make a cut with a cutter along the vertical dividing groove.
Cut the large substrate along the horizontal dividing groove
3. The circuit according to claim 1, wherein the circuit is divided into individual circuit boards.
Road board division method.
で保持する基板保持部材と、この基板保持部材を上記大
形基板とともに所定位置に搬送する搬送装置と、上記大
形基板の分割部分を所定の分割方向に切削するカッタ
と、このカッタを回転駆動する駆動装置とを備えた回路
基板分割装置。4. A substrate holding member for holding an insulating large substrate in a cantilever state in a vertical direction, a transfer device for transferring the substrate holding member to a predetermined position together with the large substrate, A circuit board dividing device comprising: a cutter for cutting a divided portion in a predetermined dividing direction; and a driving device for rotating and driving the cutter.
方向に片持状態で保持する基板保持部材と、この基板保
持部材を上記大形基板とともに所定位置に搬送する搬送
装置と、上記大形基板の上記分割溝に沿って上記大形基
板の表面を切削するための周端縁部が円筒面のダイヤモ
ンドカッタと、このダイヤモンドカッタを回転駆動する
駆動装置とを備えた回路基板分割装置。5. A substrate holding member for vertically holding an insulating large substrate having a dividing groove in a cantilever state, a transfer device for transferring the substrate holding member together with the large substrate to a predetermined position, A circuit board division comprising: a diamond cutter having a cylindrical peripheral edge for cutting the surface of the large substrate along the division groove of the large substrate; and a driving device for rotating and driving the diamond cutter. apparatus.
カッタの切断方向を垂直方向と水平方向に切り替えるこ
とができる請求項４または５記載の回路基板分割装置。 6. A cutter device having said cutter, wherein said cutter device comprises:
It is possible to switch the cutter direction between vertical and horizontal.
The circuit board dividing device according to claim 4 or 5, wherein
ダイヤモンドカッタが上記基板に当接している個所を囲
むように空気を噴射する複数の噴射孔と、上記複数の噴
射孔の内側に位置し空気を吸引する吸引口が形成された
請求項４，５または６記載の回路基板分割装置。7. A plurality of injection holes for injecting air in the vicinity of the diamond cutter so as to surround a portion where the diamond cutter is in contact with the substrate, and for injecting air inside the plurality of injection holes. 7. The circuit board dividing device according to claim 4, wherein a suction port for sucking is formed.
と対向し、切断される回路基板の裏面側に設けられる基
板押えの両側に開口し、この吸引口の周囲に上記噴射孔
が形成された請求項７記載の回路基板分割装置。8. The suction port, wherein the suction port is opposite to the diamond cutter and is opened on both sides of a substrate holder provided on the back side of the circuit board to be cut, and the injection hole is formed around the suction port. Item 8. The circuit board dividing device according to Item 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31013295A JP2740788B2 (en) | 1995-11-02 | 1995-11-02 | Circuit board dividing method and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31013295A JP2740788B2 (en) | 1995-11-02 | 1995-11-02 | Circuit board dividing method and device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09130014A JPH09130014A (en) | 1997-05-16 |
| JP2740788B2 true JP2740788B2 (en) | 1998-04-15 |
Family
ID=18001559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31013295A Expired - Fee Related JP2740788B2 (en) | 1995-11-02 | 1995-11-02 | Circuit board dividing method and device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2740788B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4663335B2 (en) * | 2004-01-28 | 2011-04-06 | アルプス電気株式会社 | Manufacturing method of electronic circuit unit |
| JP2012049260A (en) * | 2010-08-25 | 2012-03-08 | Ricoh Microelectronics Co Ltd | Cutting method and cutting device |
-
1995
- 1995-11-02 JP JP31013295A patent/JP2740788B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH09130014A (en) | 1997-05-16 |
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