JP2734882B2 - Electronic device substrate structure - Google Patents
Electronic device substrate structureInfo
- Publication number
- JP2734882B2 JP2734882B2 JP4140375A JP14037592A JP2734882B2 JP 2734882 B2 JP2734882 B2 JP 2734882B2 JP 4140375 A JP4140375 A JP 4140375A JP 14037592 A JP14037592 A JP 14037592A JP 2734882 B2 JP2734882 B2 JP 2734882B2
- Authority
- JP
- Japan
- Prior art keywords
- board
- substrate
- sub
- connector
- main
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0292—Programmable, customizable or modifiable circuits having a modifiable lay-out, i.e. adapted for engineering changes or repair
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
Landscapes
- Structure Of Printed Boards (AREA)
Description
【０００１】[0001]
【産業上の利用分野】この発明は、電子機器の基板構造
に関し、特に手動による回路の接続及び切離し用のコネ
クタを備えた電子機器の基板構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board structure of an electronic device, and more particularly to a board structure of an electronic device provided with a connector for manually connecting and disconnecting circuits.
【０００２】[0002]
【従来の技術】従来から電子楽器等の電子機器において
は、機器本体に固定された基板側にコネクタを設け、こ
のコネクタと他の基板側に設けたコネクタとを手動によ
り抜き差しすることにより、両基板の配線を電気的に分
離又は接続するようになっていた。2. Description of the Related Art Conventionally, in an electronic device such as an electronic musical instrument, a connector is provided on a board side fixed to the main body of the instrument, and this connector and a connector provided on another board side are manually connected and disconnected, so that both sides are connected. The wiring of the substrate is electrically separated or connected.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、このよ
うな従来の電子機器の基板構造にあっては、基板が紙基
材フェノール樹脂積層板やガラス布基材エポキシ樹脂含
浸積層板のような比較的脆弱な材料からなっているの
で、手動により接続されるコネクタ部に所定以上のこじ
るような外力がかかると、基板が割れる場合があった。
そして、その割れ方は常に一様ではないので、割れを発
見しにくいことが多く、回路が働かなくなってその原因
を探し出すのに多大の労力と時間とを必要とするもので
あった。However, in such a conventional electronic device substrate structure, the substrate is made of a relatively thin paper substrate such as a paper-based phenolic resin laminate or a glass cloth-based epoxy resin impregnated laminate. Since the connector is made of a fragile material, the substrate may be cracked if an external force such as a predetermined amount is applied to the connector portion to be manually connected.
Since the cracks are not always uniform, it is often difficult to find the cracks, and the circuit does not work, and it takes a lot of effort and time to find the cause.
【０００４】また、このように基板が割れた場合は、従
来その基板自体を新品基板と交換するのが普通であり、
きわめて不経済であってその対策が強く要望されてい
た。[0004] Further, when the substrate is broken as described above, the substrate itself is usually replaced with a new substrate.
It was extremely uneconomical and there was a strong demand for measures.
【０００５】この発明は上記の点に鑑みてなされたもの
であり、基板が割れた場合にも新品と交換する必要がな
く且つ修理が容易な電子機器の基板構造を提供すること
を目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to provide a substrate structure of an electronic device which does not need to be replaced with a new one even when the substrate is broken and which can be easily repaired. .
【０００６】[0006]
【課題を解決するための手段】この発明は上記の目的を
達成するため、機器本体に固定され配線パターンを形成
したメイン基板と、このメイン基板と一体で上記配線パ
ターンに接続されたコネクタを有するサブ基板とからな
る電子機器の基板構造であって、上記メイン基板とサブ
基板との境界部に、上記コネクタに所定以上の力が作用
した時に破断し得る可断部を設けるとともに、この可断
部に近接して上記メイン基板及びサブ基板の相対向する
配線パターン部に補修用線材接続用の一対のランドを設
けた電子機器の基板構造を提供するものである。In order to achieve the above object, the present invention has a main board fixed to an apparatus main body and having a wiring pattern formed thereon, and a connector integrated with the main board and connected to the wiring pattern. a substrate structure for an electronic apparatus comprising a sub-board, the boundary portion between the main board and the sub board, Rutotomoni, this variable is provided a soluble cross section that may be broken when a predetermined force or more to the connector acts Interruption
The main board and the sub board oppose each other close to the part
A pair of lands for connecting repair wire rods are provided in the wiring pattern.
There is provided a substrate structure of only electronic devices.
【０００７】[0007]
【作用】この発明による電子機器の基板構造は上記のよ
うに構成することにより、コネクタに所定未満の力しか
作用しない通常の状態では、メイン基板とサブ基板とが
一体状態を維持し、電子機器への組立てが容易である。The board structure of the electronic device according to the present invention is structured as described above, so that the main board and the sub-board maintain an integrated state in a normal state in which only a force less than a predetermined force acts on the connector. Easy to assemble.
【０００８】また、コネクタに所定以上の力が作用する
と、サブ基板が可断部でメイン基板から破断されるが、
メイン基板は機器本体に固定された状態で無傷のまま残
存する。したがって破断したサブ基板をあらかじめ用意
された機器本体の所定箇所である固定部にねじ等で固定
し、メイン基板との間を線材で接続するようにすれば修
理はきわめて簡単である。When a force exceeding a predetermined level acts on the connector, the sub-board is broken from the main board at the cutable portion.
The main board remains intact while being fixed to the device body. Therefore, if the broken sub-board is fixed to a fixed portion, which is a predetermined portion of the device body prepared in advance, with a screw or the like, and the main board is connected with a wire, repair is extremely simple.
【０００９】[0009]
【実施例】以下、この発明の実施例を図面に基づいて具
体的に説明する。図１は、この発明の一実施例を示す平
面図、図２は基板破断時の修理済み状態を示す平面図で
ある。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be specifically described below with reference to the drawings. FIG. 1 is a plan view showing an embodiment of the present invention, and FIG. 2 is a plan view showing a repaired state when the substrate is broken.
【００１０】図１において、基板１０は、配線パターン
１を形成したメイン基板１１と、このメイン基板１１と
一体で上記の配線パターン１に接続されたコネクタ２を
有するサブ基板１２とからなる。メイン基板１１とサブ
基板１２との境界部は、一対のスリットＳ１，Ｓ１と、
スリットＳ１，Ｓ１の一端からそれぞれ垂直に折れ曲
り、ミシン目状に大小の透孔Ｓ２が一直線上に点在する
可断部Ｓ３とから構成され、コネクタ２に所定以上の力
が作用した時には必ず可断部Ｓ３が破断し得るようにな
っている。なお、ここで所定以上の力とは、コネクタ２
自体が破損したり、コネクタ２とサブ基板１２とが分離
したりする力をいう。In FIG. 1, a substrate 10 includes a main substrate 11 on which a wiring pattern 1 is formed, and a sub-substrate 12 having a connector 2 connected to the wiring pattern 1 integrally with the main substrate 11. The boundary between the main board 11 and the sub-board 12 has a pair of slits S1 and S1,
Each of the slits S1 and S1 is vertically bent from one end thereof, and is formed of a cutable portion S3 in which large and small through holes S2 are dotted in a straight line in a perforated shape. The cutable portion S3 can be broken. Here, the force equal to or greater than a predetermined value is defined as the connector 2
It refers to a force that breaks itself or separates the connector 2 and the sub-board 12.
【００１１】メイン基板１１は、複数の取付ねじ３で図
示しない機器本体に取り付けられ、配線パターン１が可
断部Ｓ３を横断する部分は細くなってそれぞれネック部
１ａを形成しており、このネック部１ａを挾んでメイン
基板１１側とサブ基板１２側にそれぞれ小透孔回りのラ
ンド１ｂ，１ｃが設けてあり、配線パターン１の終端部
とコネクタ２との接続部にもランド１ｄが設けてある。The main substrate 11 is attached to a device body (not shown) with a plurality of attachment screws 3, and the portion where the wiring pattern 1 crosses the cut-off portion S3 is thinned to form neck portions 1a. Lands 1b and 1c around the small through-hole are provided on the main board 11 side and the sub-board 12 side, respectively, with the section 1a interposed therebetween. is there.
【００１２】また、サブ基板１２には２個のねじ止め用
ボス１２ａが一体的に固設されているが、これは修理時
にのみ必要となるものであって、最初の出荷時には未使
用状態に保たれている。Further, two screwing bosses 12a are integrally fixed to the sub-board 12, but they are required only at the time of repair, and are not used at the time of first shipment. Is kept.
【００１３】この実施例は上記のような構成からなるの
で、サブ基板１２上に設けたコネクタ２を図示しない他
の基板側のコネクタに抜き差しする時、コネクタ２に所
定未満の力がかかる通常の状態では可断部Ｓ３が破断す
ることはなく、サブ基板１２はメイン基板１１と一体の
状態に保たれている。Since this embodiment has the above-mentioned structure, when the connector 2 provided on the sub-board 12 is connected to or disconnected from a connector on another board (not shown), a normal force is applied to the connector 2 less than a predetermined value. In this state, the severable portion S3 is not broken, and the sub-board 12 is maintained in an integrated state with the main board 11.
【００１４】しかし、コネクタ２に通常抜去方向（使用
方向）以外の所定以上の力、例えば、所定以上のこじる
力がかかると、サブ基板１２は可断部Ｓ３で破断してメ
イン基板１１から分離するが、配線パターン１のネック
部１ａが破損するだけで、メイン基板１１は機器本体に
固定された状態で残り、サブ基板１２からコネクタ２が
分離したり、サブ基板１２自体が割れたりすることはな
い。However, when a force greater than a predetermined value other than the normal pull-out direction (use direction), for example, a predetermined squeezing force is applied to the connector 2, the sub-substrate 12 is broken at the cutable portion S3 and separated from the main substrate 11. However, only the neck portion 1a of the wiring pattern 1 is damaged, and the main board 11 remains in a state of being fixed to the device main body, and the connector 2 is separated from the sub-board 12 or the sub-board 12 itself is broken. There is no.
【００１５】したがって、その場合には、図２に示すよ
うに、今まで未使用であった２個のボス１２ａ,１２ａ
を介して取付ねじ４,４を機器本体の予備のねじ孔に螺
着することにより、サブ基板１２を機器本体に取り付け
た後、メイン基板１１側のランド１ｂとサブ基板１２側
のランド１ｃ間を、補修用の線材(例えばジャンパ線)５
で連結して両ランド部にハンダ付け６すればよく、基板
１０を新品と取り換える必要はない。すなわち、この時
必要なものは２本の取付ねじ４，４と数本の線材５だけ
であり、その修理もきわめて簡単である。なお、メイン
基板１１側を補修用の線材で連結した後、サブ基板１２
を機器本体に取り付ける作業手順でもよい。Therefore, in this case, as shown in FIG. 2, the two bosses 12a, 12a
After the sub-board 12 is attached to the main body of the device by screwing the mounting screws 4 and 4 into the spare screw holes of the main body of the device via To a repair wire (for example, a jumper wire) 5
And solder 6 to both lands.
There is no need to replace 10 with a new one. That is, at this time, only two mounting screws 4 and 4 and several wires 5 are required, and repair thereof is extremely simple. After connecting the main board 11 with a repair wire, the sub-board 12
May be a work procedure for attaching to the device body.
【００１６】なお、この発明は電子楽器の基板構造に限
るものではなく、他のいかなる電子機器の基板構造にも
適用することが可能である。The present invention is not limited to the board structure of an electronic musical instrument, but can be applied to the board structure of any other electronic equipment.
【００１７】[0017]
【発明の効果】以上述べたように、この発明による電子
機器の基板構造は、基板がメイン基板とサブ基板とから
なるようにして両者の境界部に所定以上の力で破断し得
る可断部を設けたので、万一基板が割れた場合にも、そ
の割れ目は必ずメイン基板とサブ基板の境界部であり、
割れた両基板は再利用が可能で、予め両基板には破断時
修復手段を設けてあるので、修理も容易であって、メン
テナンスに要するコストを大幅に減少させることができ
る。As described above, according to the board structure of the electronic device according to the present invention, the board is composed of the main board and the sub-board, and the cut-off portion which can be broken by a predetermined force or more at the boundary between them. Even if the board breaks, the crack is always the boundary between the main board and the sub board,
Both substrates crack can be reused, at break in advance the substrates
Since the repair means is provided, repair is easy and the cost required for maintenance can be greatly reduced.
【図１】この発明の一実施例を示す平面図である。FIG. 1 is a plan view showing an embodiment of the present invention.
【図２】同じくその基板破断時の修理済み状態を示す平
面図である。FIG. 2 is a plan view showing a repaired state when the substrate is broken.
１…配線パターン、２…コネクタ、３，４…取付ねじ、
５…線材、１０…基板、１１…メイン基板、１２…サブ
基板、Ｓ１…スリット、Ｓ２…透孔、Ｓ３…可断部1: Wiring pattern, 2: Connector, 3, 4: Mounting screw,
5: Wire rod, 10: Substrate, 11: Main substrate, 12: Sub-substrate, S1: Slit, S2: Through hole, S3: Cutable part
Claims (1)
したメイン基板と、該メイン基板と一体で前記配線パタ
ーンに接続されたコネクタを有するサブ基板とからなる
電子機器の基板構造であって、 前記メイン基板とサブ基板との境界部に、前記コネクタ
に所定以上の力が作用した時に破断し得る可断部を設け
るとともに、該可断部に近接して前記メイン基板及びサ
ブ基板の相対向する配線パターン部に補修用線材接続用
の一対のランドを設けたことを特徴とする電子機器の基
板構造。1. A board structure of an electronic device, comprising: a main substrate fixed to a device main body and having a wiring pattern formed thereon; and a sub-board having a connector integrally connected to the main substrate and connected to the wiring pattern. At the boundary between the main board and the sub-board, a breakable portion is provided that can be broken when a force greater than a predetermined force acts on the connector.
And the main substrate and the support
For repair wire connection to the opposite wiring pattern part of the circuit board
A substrate structure of an electronic device , comprising: a pair of lands .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4140375A JP2734882B2 (en) | 1992-06-01 | 1992-06-01 | Electronic device substrate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4140375A JP2734882B2 (en) | 1992-06-01 | 1992-06-01 | Electronic device substrate structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05335697A JPH05335697A (en) | 1993-12-17 |
| JP2734882B2 true JP2734882B2 (en) | 1998-04-02 |
Family
ID=15267366
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4140375A Expired - Fee Related JP2734882B2 (en) | 1992-06-01 | 1992-06-01 | Electronic device substrate structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2734882B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4522976B2 (en) * | 2006-07-24 | 2010-08-11 | 三菱電機株式会社 | refrigerator |
| JP4823375B1 (en) | 2010-05-28 | 2011-11-24 | 株式会社東芝 | Electronics |
| JP5810783B2 (en) * | 2011-09-16 | 2015-11-11 | ヤマハ株式会社 | Terminal member and electronic device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0268465U (en) * | 1988-11-11 | 1990-05-24 | ||
| JP2516104Y2 (en) * | 1990-05-30 | 1996-11-06 | アイシン精機株式会社 | Printed wiring board |
| JPH0456365U (en) * | 1990-09-25 | 1992-05-14 |
-
1992
- 1992-06-01 JP JP4140375A patent/JP2734882B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05335697A (en) | 1993-12-17 |
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