JP2679697B2 - Spool case - Google Patents

Spool case

Info

Publication number
JP2679697B2
JP2679697B2 JP33252895A JP33252895A JP2679697B2 JP 2679697 B2 JP2679697 B2 JP 2679697B2 JP 33252895 A JP33252895 A JP 33252895A JP 33252895 A JP33252895 A JP 33252895A JP 2679697 B2 JP2679697 B2 JP 2679697B2
Authority
JP
Japan
Prior art keywords
spool
case
container body
ridge
polygonal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP33252895A
Other languages
Japanese (ja)
Other versions
JPH09153510A (en
Inventor
勝一 木村
忠浩 深谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Micrometal Corp
Original Assignee
Nippon Micrometal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Micrometal Corp filed Critical Nippon Micrometal Corp
Priority to JP33252895A priority Critical patent/JP2679697B2/en
Publication of JPH09153510A publication Critical patent/JPH09153510A/en
Application granted granted Critical
Publication of JP2679697B2 publication Critical patent/JP2679697B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
    • B65H75/04—Kinds or types
    • B65H75/08—Kinds or types of circular or polygonal cross-section
    • B65H75/14—Kinds or types of circular or polygonal cross-section with two end flanges
    • B65H75/141—Kinds or types of circular or polygonal cross-section with two end flanges covers therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H49/00—Unwinding or paying-out filamentary material; Supporting, storing or transporting packages from which filamentary material is to be withdrawn or paid-out
    • B65H49/38—Skips, cages, racks, or containers, adapted solely for the transport or storage of bobbins, cops, or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/30—Handled filamentary material
    • B65H2701/36—Wires
    • B65H2701/361—Semiconductor bonding wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]

Landscapes

  • Wire Bonding (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、半導体素子あるい
は超電導素子用ボンデイングワイヤー用のスプールケー
スに関する。TECHNICAL FIELD The present invention relates to a spool case for a bonding wire for a semiconductor element or a superconducting element.

【０００２】[0002]

【従来の技術】従来から、筒状スプールを嵌合せしめる
上向膨出状の嵌合隆を一体に備えた合成樹脂製の容器本
体と、該容器本体の外縁周壁隆に嵌合する蓋体からなる
スプールケースが知られている（実公昭５５―７５９９
６号公報）。2. Description of the Related Art Conventionally, a synthetic resin container body integrally provided with an upwardly bulging fitting ridge for fitting a cylindrical spool, and a lid body fitted to the outer peripheral wall ridge of the container body. A spool case consisting of is known (Jitsuko Sho 55-7599)
No. 6).

【０００３】この従来ケースは、容器本体における嵌合
隆を緩円錐台状に形成したものであり、これによりスプ
ールを嵌合隆に堅固に固定させている。In this conventional case, the fitting ridge in the main body of the container is formed in the shape of a loose truncated cone, whereby the spool is firmly fixed to the fitting ridge.

【０００４】しかしながら、製造上の理由によりスプー
ルはその内径がバラつくことがあり、上記従来構造によ
れば、該スプール径が小さすぎるときは、スプール内周
面と嵌合隆とが広範囲にわたり密着して、スプールを取
出す時に抜き取り難く、強い力で抜き取ろうとすればス
プール外周に巻回せるボンデイングワイヤーが容器本体
の外周壁に接触して損傷する等の不具合を生ずる。However, due to manufacturing reasons, the inner diameter of the spool may vary. According to the above conventional structure, when the spool diameter is too small, the inner peripheral surface of the spool and the fitting ridge are in close contact with each other over a wide range. Then, when the spool is taken out, it is difficult to pull it out, and if it is attempted to pull it out with a strong force, the bonding wire that can be wound around the spool will come into contact with the outer peripheral wall of the container body and be damaged.

【０００５】これに対し、周壁に、外方へ膨出する突縁
を所定間隔をおいて複数個、一体形成した考案が提案さ
れている（実公平５―１２２０７号公報）。On the other hand, there has been proposed a device in which a plurality of protruding edges that bulge outward are integrally formed on a peripheral wall at predetermined intervals (Japanese Utility Model Publication No. 5-12207).

【０００６】しかしながら、突起物は小さい場合が多
く、成形が難しいため形状にバラツキが出てスプールと
の接触がうまくいかない場合がある。However, since the projections are often small and difficult to form, variations in shape may occur and contact with the spool may not be successful.

【０００７】又、厚みが薄くなる場合が多く、他の部分
よりも耐久性に乏しくなり繰り返し使用回数がこの突起
で制限されてしまうことがある。Further, the thickness is often thin, the durability is poorer than that of other portions, and the number of times of repeated use may be limited by this protrusion.

【０００８】[0008]

【発明が解決しようとする課題】本発明は、スプールを
堅固に固定し得ると共に、スプールの脱着作業が容易で
あり、成形しやすく、繰り返し使用に耐えるスプールケ
ースを提供することを目的とする。SUMMARY OF THE INVENTION It is an object of the present invention to provide a spool case which can firmly fix the spool, can be easily attached and detached from the spool, can be easily molded, and can be used repeatedly.

【０００９】[0009]

【課題を解決するための手段】本発明は、（１）筒状ス
プールを嵌合せしめる上向膨出状の嵌合隆を一体に備え
た合成樹脂製の容器本体と、該容器本体の外縁周壁隆に
嵌合する蓋体からなるスプールケースであって、上記容
器本体における嵌合隆のスプールと接触し支える部分の
平面形状を多角形とし、そのコーナー部を丸く縁取りし
たことを特徴とするボンデイングワイヤー用のスプール
ケース、（２）多角形状が４角形、５角形、又は６角形
である（１）記載のスプールケース、である。The present invention provides (1) a synthetic resin container body integrally provided with an upwardly bulging fitting ridge into which a cylindrical spool is fitted, and an outer edge of the container body. A spool case formed of a lid fitted to a peripheral wall ridge, characterized in that a planar shape of a portion of the fitting ridge in the container body which comes into contact with and supports the spool is polygonal, and a corner portion thereof is rounded. A spool case for a bonding wire, and (2) the spool case according to (1), wherein the polygonal shape is a square, a pentagon, or a hexagon.

【００１０】[0010]

【発明の実施の形態】上記構成によれば、容器本体の嵌
合隆にスプールを挿込むと、多角形のコーナー部が該ス
プールの内周面に圧接するをもって、合成樹脂からなる
容器本体の弾性により嵌合隆の周壁が多角形のコーナー
部と共に内方へ押圧されて該周壁全体及び多角形のコー
ナー部が弾性変形し、それにより生ずる周壁及び多角形
のコーナー部自身の反発力で、スプール内径の誤差を吸
収しつつ、多角形のコーナー部をスプール内周面へ強固
に押圧せしめて、スプールを固定状に保持する。According to the above construction, when the spool is inserted into the fitting ridge of the container body, the polygonal corner portions are pressed against the inner peripheral surface of the spool, and the container body made of synthetic resin By the elasticity, the peripheral wall of the fitting ridge is pressed inward together with the polygonal corner portion, and the entire peripheral wall and the polygonal corner portion are elastically deformed, and the repulsive force of the peripheral wall and the polygonal corner portion itself caused by the elastic deformation, The polygonal corner portion is firmly pressed against the inner peripheral surface of the spool while absorbing the error of the spool inner diameter to hold the spool in a fixed state.

【００１１】[0011]

【実施例】図１乃至図４は本発明の一実施例を表す。1 to 4 show an embodiment of the present invention.

【００１２】本実施例のスプールケースＡは図４に示す
ように、筒状スプールＢを嵌合せしめる上向膨出状の嵌
合隆３を備えた容器本体１と、該容器本体１に着脱自在
に嵌合する蓋体６からなる。As shown in FIG. 4, the spool case A of this embodiment has a container body 1 provided with an upwardly bulging fitting ridge 3 into which a cylindrical spool B is fitted, and is attached to and detached from the container body 1. It is composed of a lid body 6 which is freely fitted.

【００１３】図１は平面図、図２は立面図、図３は斜視
図、図４は使用状態を示すスプールケース全体の縦断面
図である。FIG. 1 is a plan view, FIG. 2 is an elevation view, FIG. 3 is a perspective view, and FIG. 4 is a vertical cross-sectional view of the entire spool case showing a usage state.

【００１４】容器本体１は図１〜４に示すように、合成
樹脂材を使用して真空成形法等により成形したもので、
該容器本体１は、その外周縁に断面形状が略逆Ｖ字状の
周壁隆２を突出させると共に、中央部にスプールＢを嵌
合する嵌合隆３を突出状に一体形成する。As shown in FIGS. 1 to 4, the container body 1 is formed by a vacuum forming method using a synthetic resin material.
The container body 1 has a peripheral wall ridge 2 having a substantially inverted V-shaped cross section projected on the outer peripheral edge thereof, and a fitting ridge 3 into which the spool B is fitted is integrally formed in the central portion in a projecting shape.

【００１５】嵌合隆３は、平面形状多角形で且つ若干先
細りの丸く縁取りしたテーパーを有する緩角錐台状に形
成し、その高さは前記周壁隆２よりも高く突出させる。The fitting ridge 3 is formed in the shape of a gentle truncated pyramid having a planer polygonal shape and a slightly tapered rounded edging taper, and the height thereof is higher than that of the peripheral wall ridge 2.

【００１６】多角形状は特に制限するものではないが、
多角形の中で各辺がへこんだ形状（花びら型や星形型な
ど）は、接触部が細くなり、強度不足で摩擦力が減少し
たり折れたりする。三角形の場合は、辺が長くなりすぎ
スプールとの接触時の摩擦を起こすための反力が悪くな
る。Although the polygonal shape is not particularly limited,
A polygonal shape with concave sides (petal shape, star shape, etc.) makes the contact part thinner, and the strength is insufficient and the frictional force decreases or breaks. In the case of a triangle, the sides become too long, and the reaction force for causing friction during contact with the spool deteriorates.

【００１７】又、多角の数が多くなるにつれ、スプール
の保持力が小さくなり、又成形上も煩雑になるので４〜
６角程度が好ましい。Further, as the number of polygons increases, the holding force of the spool becomes smaller and the molding becomes complicated, so that
Hexagonal angles are preferred.

【００１８】多角形のコーナー部は丸く縁取りする。こ
のコーナー部をスプールと接触させ保持させる。コーナ
ー部の丸みの程度は接触するスプール材質との摩擦によ
り変更する。丸みを設けることにより、スプール内周面
へきちっとはまり、着脱も容易である。The corners of the polygon are rounded. This corner is held in contact with the spool. The degree of roundness of the corner is changed by friction with the spool material that comes into contact. By providing the roundness, it fits snugly on the inner peripheral surface of the spool and can be easily attached and detached.

【００１９】必要に応じ多角形柱の高さ方向にテーパー
を付ける。テーパーを設けるのは、着脱が容易になるた
めである。If necessary, the polygonal column is tapered in the height direction. The taper is provided because it can be easily attached and detached.

【００２０】蓋体６は、容器本体１の周壁隆２の外面に
嵌合する側周部６ａと、嵌合隆３に嵌合したスプールＢ
の上面開口部分に嵌入する凹窪部６ｂとからなる合成樹
脂製の一体成形品で、嵌合隆３に嵌合、保持されるスプ
ールＢの固定をより確実ならしめると共に、そのスプー
ルＢに巻回されたボンデイングワイヤーＷを保護する。The lid 6 has a side peripheral portion 6a fitted to the outer surface of the peripheral wall ridge 2 of the container body 1 and a spool B fitted to the fitting ridge 3.
It is an integrally molded product made of synthetic resin consisting of a recessed concave portion 6b fitted in the opening portion of the upper surface of the spool. Protects the turned bonding wire W.

【００２１】[0021]

【発明の効果】以上説明したように、本発明のスプール
ケースは、多角形柱の各辺でコーナー部を支えるため、
コーナー部の反発力が増し、コーナー部が強固にスプー
ルに圧接して確実且つ堅固にスプールを保持すると共
に、スプールを容易に着脱出来る。このためスプールに
巻いてある線に誤って触れたりキズを付けたりすること
がなく、落下させることもなくなる。As described above, since the spool case of the present invention supports the corner portion on each side of the polygonal column,
The repulsive force of the corner portion increases, the corner portion firmly presses against the spool to securely and firmly hold the spool, and the spool can be easily attached and detached. Therefore, the wire wound on the spool will not be accidentally touched or scratched, and will not be dropped.

【００２２】又、突起物がなく鋳型形状が単純となるた
め成形しやすく、ケースの生産歩留まりもよくなりケー
ス単価が安くなる。Further, since there is no protrusion and the shape of the mold is simple, the molding is easy, the production yield of the case is improved, and the case unit price is reduced.

【００２３】又、コーナー部の肉厚が安定し、薄くなる
部分がなく、強度が増し、繰り返し使用回数が増加す
る。Further, the thickness of the corner portion is stable, there is no thinned portion, the strength is increased, and the number of times of repeated use is increased.

【００２４】又、突起物がないため、コーナー部の表面
に成形上の凹凸シワが生じなくなり、再使用のための洗
浄性が向上する。Further, since there are no protrusions, uneven wrinkles are not formed on the surface of the corner portion during molding, and the cleaning property for reuse is improved.

【図面の簡単な説明】[Brief description of the drawings]

【図１】容器本体の平面図である。FIG. 1 is a plan view of a container body.

【図２】容器本体の立面図である。FIG. 2 is an elevational view of a container body.

【図３】容器本体の斜視図である。FIG. 3 is a perspective view of a container body.

【図４】使用状態を示すスプールケース全体の縦断面図
である。FIG. 4 is a vertical cross-sectional view of the entire spool case showing a usage state.

【符号の説明】[Explanation of symbols]

１ 容器本体 ２ 周壁隆 ３ 嵌合隆 ４ コーナー部 ５ 嵌合隆周壁 ６ 蓋体 ７ テーパー部 Ａ スプールケース Ｂ スプール Ｗ ボンデイングワイヤー 1 Container Main Body 2 Surrounding Wall Ridge 3 Fitting Ridge 4 Corner 5 Fitting Ridge Surrounding Wall 6 Lid 7 Tapered Part A Spool Case B Spool W Bonding Wire

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】 筒状スプールを嵌合せしめる上向膨出状
の嵌合隆を一体に備えた合成樹脂製の容器本体と、該容
器本体の外縁周壁隆に嵌合する蓋体からなるスプールケ
ースであって、上記容器本体における嵌合隆のスプール
と接触し支える部分の平面形状を多角形とし、そのコー
ナー部を丸く縁取りしたことを特徴とするボンデイング
ワイヤー用のスプールケース。1. A spool comprising a synthetic resin container body integrally provided with an upwardly bulging fitting ridge into which a tubular spool is fitted, and a lid body fitted to an outer peripheral wall ridge of the container body. A spool case for a bonding wire, characterized in that a planar shape of a portion of the case body in contact with and supporting the spool of the fitting ridge is polygonal, and a corner of the case is rounded. 【請求項２】 多角形状が４角形、５角形、又は６角形
である請求項１記載のスプールケース。2. The spool case according to claim 1, wherein the polygonal shape is a tetragon, a pentagon, or a hexagon.
JP33252895A 1995-11-29 1995-11-29 Spool case Expired - Lifetime JP2679697B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33252895A JP2679697B2 (en) 1995-11-29 1995-11-29 Spool case

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33252895A JP2679697B2 (en) 1995-11-29 1995-11-29 Spool case

Publications (2)

Publication Number Publication Date
JPH09153510A JPH09153510A (en) 1997-06-10
JP2679697B2 true JP2679697B2 (en) 1997-11-19

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JP33252895A Expired - Lifetime JP2679697B2 (en) 1995-11-29 1995-11-29 Spool case

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019009312A1 (en) 2017-07-04 2019-01-10 田中電子工業株式会社 Bonding wire winding spool, winding structure, and spool case

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2826307B1 (en) 1997-08-08 1998-11-18 田中電子工業株式会社 Spool case for bonding wire
EP0896363B1 (en) * 1997-08-08 2004-10-13 Tanaka Denshi Kogyo Kabushiki Kaisha Spool case of bonding wire
KR100398831B1 (en) * 2001-10-12 2003-09-19 헤라우스오리엔탈하이텍 주식회사 Spool case for bonding wire and method for handling spool using the case

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019009312A1 (en) 2017-07-04 2019-01-10 田中電子工業株式会社 Bonding wire winding spool, winding structure, and spool case

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