JP2674207B2 - Cutting method for brittle materials - Google Patents
Cutting method for brittle materialsInfo
- Publication number
- JP2674207B2 JP2674207B2 JP11479989A JP11479989A JP2674207B2 JP 2674207 B2 JP2674207 B2 JP 2674207B2 JP 11479989 A JP11479989 A JP 11479989A JP 11479989 A JP11479989 A JP 11479989A JP 2674207 B2 JP2674207 B2 JP 2674207B2
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- wire
- auxiliary
- cut
- abrasive grains
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
- B28D1/025—Use, recovery or regeneration of abrasive mediums
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
- B23D57/0007—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires
- B23D57/0023—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires with a plurality of saw wires or saw wires having plural cutting zones
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mining & Mineral Resources (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 この発明は大理石、セラミックス、磁性材料等のいわ
ゆる大型脆性材料をワイヤにより切断する技術に係り、
より詳しくは一方向に高速走行するワイヤに被切断部材
を押し当てつつ当該部分に砥粒を含む加工液を供給して
切断する方式のワイヤ式切断装置による切断加工方法に
関する。Description: TECHNICAL FIELD The present invention relates to a technique for cutting a so-called large-sized brittle material such as marble, ceramics, and magnetic material with a wire,
More specifically, the present invention relates to a cutting method using a wire-type cutting device that presses a member to be cut against a wire traveling at a high speed in one direction and supplies a cutting liquid containing abrasive grains to the portion to cut the wire.
従来の技術 ワイヤ式切断装置（一般にワイヤソーと呼んでいる）
は、基本的には走行するワイヤに被切断部材を押し当て
切断する方式を採用したものであり、ワイヤを複数のガ
イドローラ相互間にわたって任意設定間隔で平行に張設
し、このワイヤ列に被切断部材を押し当てながら当該部
分に砥粒を含む加工液を供給することにより、いわゆる
ラッピング作用を行なわせて切断するものである。Conventional technology Wire-type cutting device (generally called a wire saw)
Basically adopts a method in which a member to be cut is pressed against a running wire to cut it, and the wire is stretched in parallel between a plurality of guide rollers at an arbitrary set interval and the wire row is covered. By supplying a working liquid containing abrasive grains to the portion while pressing the cutting member, a so-called lapping action is performed to perform cutting.
このような方式のワイヤソーとしては、ワイヤを往復
走行させつつワイヤの繰り出し巻取りを一方向とする方
式（特公昭52−12954号公報，特開昭52−98291号公報
等）と、ワイヤを一方向に高速走行させる方式（特開昭
61−117060号公報等）があり、主に半導体材料、磁性材
料等のいわゆる小型の脆性材料をウエハ状に切断するの
に採用されている。As a wire saw of such a system, a method in which the wire is reciprocated and the wire is unwound and wound in one direction (Japanese Patent Publication No. 52-12954, Japanese Patent Application Laid-Open No. 52-98291, etc.) Method of running at high speed in the direction
61-117060) and is mainly used for cutting so-called small brittle materials such as semiconductor materials and magnetic materials into wafers.
一方、大理石、セラミックスをはじめとする大型（切
断幅が例えば250mm,300mmを超えるもの）の脆性材料に
対する上記ワイヤソーの適用はなく、これらの大型材料
の切断は、遊離砥粒や固定砥粒を使用したバンドソー
や、帯鋸に固定砥粒を固着させたいわゆる無端環状帯鋸
盤、有端直線往復帯鋸盤、金属円盤の外周に鋸歯を設け
たいわゆるODソーが主流である。On the other hand, the wire saw is not applied to large brittle materials such as marble and ceramics (cutting widths exceeding 250 mm and 300 mm, for example), and free abrasive grains or fixed abrasive grains are used to cut these large materials. The band saw, the so-called endless annular band saw with fixed abrasives fixed to the band saw, the endless linear reciprocating band saw, and the so-called OD saw with saw teeth on the outer circumference of the metal disk are the mainstream.
ここで、大型脆性材料の切断にワイヤソーが適用され
ない理由は、ワイヤの表面にダイヤモンド砥粒を固着し
たり、ダイヤモンド等の高硬度材をコーティングしたワ
イヤは、一般に非常に高価であること、ワイヤを走行さ
せるローラ等の摩耗が大きいこと、切断精度が高くない
こと、一方ワイヤを一方向に高速走行させて切断する方
式のワイヤソーの場合は切断能率および切断精度におい
て往復走行式のワイヤソーに比べて優れているが、往復
走行式、一方向高速走行式のいずれも従来のワイヤソー
は砥粒の供給・排出、切断切り屑の排出に難点があるこ
と、また切断部が長くなると砥粒の摩耗が大きくなり切
断能力が低下し、ソーマークが発生し易いことが主たる
理由で、大型脆性材料の切断には適用されていない。Here, the reason why the wire saw is not applied to the cutting of the large brittle material is that the diamond abrasive grains are fixed to the surface of the wire, or the wire coated with a high hardness material such as diamond is generally very expensive. The wear of the rollers to be run is large and the cutting accuracy is not high. On the other hand, the wire saw that cuts the wire by running it in one direction at high speed is superior in cutting efficiency and cutting accuracy to the reciprocating wire saw. However, in both the reciprocating traveling type and the one-way high speed traveling type, the conventional wire saw has difficulty in supplying and discharging abrasive grains and discharging cutting chips, and the abrasion of the abrasive grains becomes large when the cutting portion becomes long. It is not applied to the cutting of large brittle materials, mainly because the cutting ability decreases and saw marks are likely to occur.
ところで、近年ビルの壁材や床材、ホテルのフロント
等、インテリア商品として大理石等の天然極薄石材、ま
た高強度耐熱材や電子材料としてのセラミックス等は薄
板大面積となってきており、高能率、高歩留および高精
度の切断方法あるいは装置の開発が望まれていた。By the way, in recent years, natural ultra-thin stone materials such as marble as interior products such as wall materials and floor materials for buildings, hotel fronts, etc., as well as high-strength heat-resistant materials and ceramics as electronic materials have become large-sized thin sheets. It has been desired to develop a cutting method or device with high efficiency, high yield and high accuracy.
一方、ワイヤを一方向に高速走行させて切断を行なう
方法は、高能率、高歩留、高精度で、かつ加工コストが
安価につくという優れた効果を有するが、例えば一辺が
1mを超えるような大理石等の場合切断溝が細くかつ長い
ため、前記したように砥粒の供給・排出、切り屑の排出
が困難となり砥粒や切り屑が当該溝内に堆積し砥粒が十
分に供給されず、切断精度が低下するという難点があ
る。On the other hand, the method of cutting the wire by running the wire in one direction at high speed has excellent effects of high efficiency, high yield, high accuracy, and low processing cost.
In the case of marble that exceeds 1 m, since the cutting groove is thin and long, it is difficult to supply and discharge abrasive grains and discharge chips as described above, and the abrasive grains and chips accumulate in the groove and There is a problem that the cutting accuracy is lowered due to insufficient supply.
したがって、かかる問題を解決すれば、一方向高速走
行式ワイヤソーで大型脆性材料の切断が可能となるが、
この解決策は未だ見い出されていないのが実情である。Therefore, if such a problem is solved, it is possible to cut a large brittle material with a one-way high speed traveling wire saw.
The reality is that this solution has not yet been found.
発明が解決しようとする課題 この発明は前に述べたような実情よりみて、ワイヤソ
ーの有する多数同時切断により高能率と切断代が小さく
高歩留という長所を生かして、特に切断能率および切断
精度の高い一方向高速走行式のワイヤソーにより容易に
大型の脆性材料の切断を可能とする切断加工方法を提案
しようとするものである。SUMMARY OF THE INVENTION In view of the situation as described above, the present invention takes advantage of the fact that a wire saw has a large number of simultaneous cuts to take advantage of high efficiency and a small cutting margin and high yield. The present invention is intended to propose a cutting method that enables a large brittle material to be easily cut by a high-speed wire saw that moves in one direction.
課題を解決するための手段 この発明は一方向高速ワイヤ式切断装置における前記
問題、すなわち砥粒の供給・排出・切り屑の排出の困難
性を解決する手段として、切断用ワイヤとは別に補助ワ
イヤを配設し、この補助ワイヤを切断用ワイヤと対しし
て走行させながら切断する方法をとったもので、切断用
ワイヤ列の内側に補助ワイヤ列を切断用ワイヤ列と対に
間隔配置し、切断用ワイヤ列と補助ワイヤ列に砥粒を含
む加工液を供給しつつ切断加工する方法を要旨とするも
のである。Means for Solving the Problems The present invention provides an auxiliary wire separate from a cutting wire as a means for solving the above-mentioned problem in a one-way high-speed wire cutting device, that is, the difficulty of supplying and discharging abrasive grains and discharging chips. Is arranged, the auxiliary wire is cut while the auxiliary wire is being run against the cutting wire, and the auxiliary wire row is arranged inside the cutting wire row in a pair with the cutting wire row. The gist is a method of cutting while supplying a working liquid containing abrasive grains to the cutting wire row and the auxiliary wire row.
作用 一方向高速ワイヤ式切断装置による切断加工は、多数
の案内溝を有する溝ローラを三角形あるいは四角形の各
頂点に平行配置し、この溝ローラ相互間にわたって張設
した一方向高速走行のワイヤ群に、昇降式の材料固定台
上に固定した被切断部材を押し当てながら、加工液供給
ノズルより砥粒を含む加工液を切断部に供給して切断す
る方式であり、切断用ワイヤ列の内側に当該ワイヤ列と
対に配置した補助ワイヤ列が切断溝内の切断用ワイヤ列
の直上を走行することによって、切断部へ砥粒が十分に
供給されるとともに、切断溝内の砥粒および切り屑の排
出が容易となり切断溝内に堆積することがない。Action Cutting with a one-way high-speed wire-type cutting device is performed by arranging groove rollers having a large number of guide grooves in parallel with each vertex of a triangle or a quadrangle, and then arranging them in a wire group for high-speed one-way running stretched between the groove rollers. While pressing the workpiece to be cut, which is fixed on the lifting type material fixing table, the cutting liquid is supplied from the cutting liquid supply nozzle to the cutting portion to cut the cutting liquid. The auxiliary wire array arranged in a pair with the wire array runs just above the cutting wire array in the cutting groove, whereby the abrasive grains are sufficiently supplied to the cutting portion, and the abrasive particles and chips in the cutting groove are provided. Will be easily discharged and will not be deposited in the cutting groove.
切断用ワイヤ列と補助ワイヤ列には、それぞれ各別に
設けた加工液供給用ノズルから砥粒を含む加工液が供給
される。The cutting wire row and the auxiliary wire row are supplied with the working liquid containing abrasive grains from the respective working liquid supply nozzles provided separately.
実施例 第１図はこの発明方法を実施するための装置構成例を
示す概略図、第２図は同上装置の加工液供給部を拡大し
て示す概略図、第３図は同上装置による切断途中の状態
を拡大して示す縦断側面図で、ここでは溝ローラが４個
構成のワイヤソーを例にとり説明する。Embodiments FIG. 1 is a schematic view showing an example of the apparatus configuration for carrying out the method of the present invention, FIG. 2 is an enlarged view showing a machining liquid supply section of the same apparatus, and FIG. 3 is a cutting process by the same apparatus. FIG. 2 is an enlarged vertical sectional side view showing the above state, and here, a wire saw having four groove rollers will be described as an example.
（１）は被切断部材、（２）被切断部材昇降装置、
（３）は周面に多数の溝が付設されている切断用ワイヤ
の溝ローラ、（４）は切断用ワイヤ、（５）は切断用ワ
イヤ列への加工液供給ノズル、（６）は補助ワイヤの溝
ローラ、（７）は補助ワイヤ、（８）は補助ワイヤ列へ
の加工液供給ノズルであり、補助ワイヤ（７）は被切断
部材（１）の切断部において切断用ワイヤ（４）の直上
を走行するごとく設置され、切断用ワイヤの溝ローラ
（３）および補助ワイヤの溝ローラ（６）はそれぞれモ
ータ（M1）、モータ（M2）にて駆動されるように構成さ
れている。(1) a member to be cut, (2) a lifting device for a member to be cut,
(3) is a groove roller of a cutting wire having a large number of grooves on its peripheral surface, (4) is a cutting wire, (5) is a working fluid supply nozzle for the cutting wire row, and (6) is an auxiliary A wire groove roller, (7) is an auxiliary wire, (8) is a working liquid supply nozzle to the auxiliary wire row, and the auxiliary wire (7) is a cutting wire (4) at the cutting portion of the member (1) to be cut. Is installed so that it travels directly above, and the groove roller (3) for the cutting wire and the groove roller (6) for the auxiliary wire are configured to be driven by a motor (M 1 ) and a motor (M 2 ), respectively. There is.
上記構成の一方向高速ワイヤ式切断装置において、被
切断部材（１）は昇降装置（２）により押し上げられ
て、４個の溝ローラ（３）に掛けられている一方向に高
速走行するワイヤ（４）列に押し当てられて同時多数切
断が行わわれるとともに、別設の４個の溝ローラ（６）
に掛けられている補助ワイヤ（７）が切断用ワイヤ
（４）と対をなして切断溝内を走行する。In the one-way high-speed wire type cutting device having the above-mentioned configuration, the member to be cut (1) is pushed up by the elevating device (2), and the wire running in one direction is fastened by the four groove rollers (3) ( 4) While being pressed against the row to perform a large number of simultaneous cuts, four groove rollers (6) separately provided
The auxiliary wire (7) hung on the pair forms a pair with the cutting wire (4) and runs in the cutting groove.
切断中は切断用ワイヤ列および補助ワイヤ列にそれぞ
れの加工液供給ノズル（５）（８）より加工液が供給さ
れるため、切断途中の状態を第３図に示すごとく、切断
用ワイヤ（４）と補助ワイヤ（７）との間に砥粒および
切り屑と油の混合した流動性のある混合液（11）が充満
し、補助ワイヤ（７）の上方には砥粒や切り屑の堆積物
（12）が充満する。Since the working fluid is supplied from the working fluid supply nozzles (5) and (8) to the cutting wire row and the auxiliary wire row during cutting, the cutting wire (4) is cut as shown in FIG. ) And the auxiliary wire (7) are filled with abrasive particles and a fluid mixture (11) in which chips and oil are mixed, and above the auxiliary wire (7), abrasive particles and chips are accumulated. Thing (12) is full.
すなわち、補助ワイヤ（７）がない場合は堆積物（1
2）により切断部への砥粒の持込みが不十分となるが、
この発明では補助ワイヤ（７）からも加工液が供給され
るので砥粒の持込みが良好となり、常に切断用ワイヤ
（４）と補助ワイヤ（７）間に混合液（11）が充満する
ことになる。したがって、切断能率や切断精度が悪化す
ることがないのである。That is, if the auxiliary wire (7) is not present, the sediment (1
Due to 2), the carry-in of abrasive grains to the cutting part becomes insufficient, but
In this invention, since the working fluid is supplied also from the auxiliary wire (7), the carry-in of the abrasive grains becomes good, and the mixed solution (11) is always filled between the cutting wire (4) and the auxiliary wire (7). Become. Therefore, the cutting efficiency and the cutting accuracy do not deteriorate.
なお、補助ワイヤ（７）の走行方向はここでは切断用
ワイヤ（４）と同一方向の場合を示すが、逆方向に走行
させることも可能である。逆方向に走行させる場合は、
補助ワイヤへの加工液供給ノズル（８）を切断用ワイヤ
の入、出側、もしくは出側のみに配置する。また、切断
用ワイヤ（４）および補助ワイヤ（７）は切断の開始か
ら終了まで一方向送りされる。両ワイヤの走行速度は同
一である必要はなく、補助ワイヤの方を低速としてもよ
い。また、使用するワイヤも必ずしも同一径である必要
はなく、好ましくは切断用ワイヤより補助ワイヤの方を
若干細くし、かつワイヤ表面に凹凸や粗面加工、あるい
は螺旋状溝等を付与すると加工液持込み効果がよくな
る。The traveling direction of the auxiliary wire (7) is shown here as the same direction as the cutting wire (4), but it is also possible to travel in the opposite direction. When running in the opposite direction,
The machining liquid supply nozzle (8) for the auxiliary wire is arranged on the inlet side, outlet side or outlet side of the cutting wire. The cutting wire (4) and the auxiliary wire (7) are fed in one direction from the start to the end of cutting. The traveling speeds of both wires do not have to be the same, and the auxiliary wire may be slower. Further, the wire to be used does not necessarily have to have the same diameter, and preferably the auxiliary wire is made slightly thinner than the cutting wire, and the wire surface is provided with unevenness or roughening, or a spiral groove, etc. The carry-on effect improves.
第４図は上記ワイヤ切断装置の運転方法を示す図で、
（ａ）は切断加工中における切断用ワイヤ（４）および
補助ワイア（７）の走行速度を一定にした場合、（ｂ）
はワイヤの長さが（ａ）の場合より短かく、切断途中で
ワイアの走行を逆転させる場合、（ｃ）は補助ワイヤが
短かい場合、（ｄ）は（ａ）において切断用ワイヤ走行
速度と補助ワイヤ走行速度を同一とした場合の運転方法
を例示したものであり、いずれの運転方法を採用しても
補助ワイヤによる加工液供給効果は変わらない。FIG. 4 is a diagram showing a method of operating the above wire cutting device,
(A) shows the case where the traveling speeds of the cutting wire (4) and the auxiliary wire (7) during the cutting process are constant, (b)
Is shorter than that in the case of (a), reverses the running of the wire during cutting, (c) is the auxiliary wire is short, (d) is the cutting wire running speed in (a). And the auxiliary wire traveling speed are the same, the working liquid supply effect by the auxiliary wire does not change regardless of which operating method is adopted.
第１表はこの発明を実機に適用して100mm角×400mm長
さの大理石を厚さ6mmに切断した場合の結果を、従来の
大径ブレードにより切断した場合と比較して示したもの
である。Table 1 shows the result when the present invention is applied to an actual machine and a marble of 100 mm square and 400 mm length is cut into a thickness of 6 mm, in comparison with the case of cutting with a conventional large-diameter blade. .
第１表より明らかなごとく、従来のブレード方式では
1.2枚／時間であるのに対し、本発明では10〜11枚／時
間と高い切断能率となり、歩留は従来の31.5％から90％
に向上し、かつ表面が滑らかで平坦度良好な製品が得ら
れた。As is clear from Table 1, in the conventional blade method
In contrast to 1.2 sheets / hour, the present invention provides a high cutting efficiency of 10 to 11 sheets / hour, and the yield is 31.5% to 90% of the conventional rate.
And the surface was smooth and the flatness was good.
（発明の効果） 以上説明したごとく、この発明方法によれば、補助ワ
イヤにより加工液を補充することができるので、ワイヤ
ソーによる大型脆性材料の切断が可能となり、例えば一
辺が1mを超えるような大理石であっても一方向高速走行
ワイヤソーにより高能率、高精度で多数枚同時切断で
き、薄板大面積の脆性材料の製造に大きく寄与し得る。 (Effect of the invention) As described above, according to the method of the present invention, since the working fluid can be replenished by the auxiliary wire, it is possible to cut a large brittle material with a wire saw, and for example, a marble whose one side exceeds 1 m. Even in this case, a unidirectional high-speed traveling wire saw can cut a large number of sheets simultaneously with high efficiency and high accuracy, which can greatly contribute to the production of a brittle material having a large thin plate area.
第１図はこの発明を実施するための一方向走行式の装置
構成例を示す概略図、第２図は同上ワイヤ式切断装置の
加工液供給部を拡大して示す概略図、第３図は同上ワイ
ヤ式切断装置による切断途中の状態を拡大して示す縦断
側面図、第４図は同上ワイヤ式切断装置の運転方法を例
示したもので、（ａ）は切断加工中における切断用ワイ
ヤおよび補助ワイヤの走行速度を一定にした場合、
（ｂ）はワイヤの長さが（ａ）の場合より短かく、切断
途中でワイヤの走行を逆転させる場合、（ｃ）は補助ワ
イヤが短かい場合、（ｄ）は（ａ）において切断用ワイ
ヤ走行速度と補助ワイヤ走行速度を同一とした場合をそ
れぞれ示す。 １……被切断部材、3,6……溝ローラ ４……切断用ワイヤ 5,8……加工液供給ノズル ７……補助ワイヤFIG. 1 is a schematic view showing an example of the configuration of a one-way traveling type apparatus for carrying out the present invention, FIG. 2 is an enlarged schematic view showing a working fluid supply unit of the same wire type cutting apparatus, and FIG. Same as above, a longitudinal side view showing an enlarged state during cutting by the wire-type cutting device, and FIG. 4 illustrates an operating method of the wire-type cutting device. (A) is a cutting wire and an auxiliary during cutting. If the traveling speed of the wire is constant,
(B) is shorter than the case of (a), when the traveling of the wire is reversed in the middle of cutting, (c) is when the auxiliary wire is short, (d) is for cutting in (a) The case where the wire traveling speed and the auxiliary wire traveling speed are the same is shown respectively. 1 ... cutting member, 3,6 ... groove roller 4 ... cutting wire 5,8 ... machining liquid supply nozzle 7 ... auxiliary wire
Claims (1)
高速走行させつつ、該ワイヤ列に被切断部材を押し当て
ながら当該部分に砥粒を含む加工液を供給して切断する
方法において、前記切断用ワイヤ列の内側に補助ワイヤ
列を切断用ワイヤ列と対をなすごとく間隔配置し、切断
用ワイヤ列と補助ワイヤ列に砥粒を含む加工液を供給し
つつ切断加工することを特徴とする脆性材料の切断加工
方法。1. A method of cutting a wire row stretched at a predetermined interval while traveling at high speed in one direction while pressing a member to be cut against the wire row while supplying a working liquid containing abrasive grains to the portion. In, the auxiliary wire row is arranged inside the cutting wire row so as to form a pair with the cutting wire row, and the cutting wire row and the auxiliary wire row are cut while being supplied with a working liquid containing abrasive grains. A method for cutting a brittle material, characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11479989A JP2674207B2 (en) | 1989-05-08 | 1989-05-08 | Cutting method for brittle materials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11479989A JP2674207B2 (en) | 1989-05-08 | 1989-05-08 | Cutting method for brittle materials |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02292165A JPH02292165A (en) | 1990-12-03 |
| JP2674207B2 true JP2674207B2 (en) | 1997-11-12 |
Family
ID=14646978
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11479989A Expired - Lifetime JP2674207B2 (en) | 1989-05-08 | 1989-05-08 | Cutting method for brittle materials |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2674207B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ITFI20050166A1 (en) * | 2005-07-22 | 2007-01-23 | Andrea Corsi | EQUIPMENT FOR SAGAGING OF STONE MATERIALS |
| IT1396968B1 (en) * | 2009-12-18 | 2012-12-20 | Pedrini Ivano | DIAMOND WIRE MACHINE FOR NATURAL OR ARTIFICIAL STONE CUTTING WITH WIRE CLEANING SYSTEM |
| JP5590001B2 (en) * | 2011-10-04 | 2014-09-17 | 信越半導体株式会社 | Work cutting method and wire saw |
| DE102012203275A1 (en) * | 2012-03-01 | 2013-09-05 | Siltronic Ag | Apparatus and method for simultaneously separating a plurality of slices from a workpiece |
| JP6345044B2 (en) * | 2014-09-04 | 2018-06-20 | 株式会社ディスコ | Wire electrical discharge machine |
-
1989
- 1989-05-08 JP JP11479989A patent/JP2674207B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02292165A (en) | 1990-12-03 |
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