JP2671728B2 - Cutting method with wire saw - Google Patents
Cutting method with wire sawInfo
- Publication number
- JP2671728B2 JP2671728B2 JP27749092A JP27749092A JP2671728B2 JP 2671728 B2 JP2671728 B2 JP 2671728B2 JP 27749092 A JP27749092 A JP 27749092A JP 27749092 A JP27749092 A JP 27749092A JP 2671728 B2 JP2671728 B2 JP 2671728B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- cutting
- temperature
- work
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体材料、磁性材
料、セラミックス等の脆性物体をワイヤにより多数のス
ライス片（ウエハ）に切断する方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for cutting brittle objects such as semiconductor materials, magnetic materials and ceramics into a large number of sliced pieces (wafers) with a wire.
【０００２】[0002]
【従来の技術】複数のワイヤが水平面に沿って平行に緊
張されたマルチワイヤソーは、太陽電池のシリコンイン
ゴットのような脆性物体を薄厚のウエハに切断する場合
に用いられ、平行配設された複数の溝付ローラに所定の
ピッチで多条掛けされたワイヤ列を被切断物体（ワー
ク）に押し付け、その過程で砥粒を含む加工液（砥液）
をワイヤによる切断部位に供給しながら切断する装置で
ある。このマルチワイヤソーは、半導体材料、磁性材
料、セラミックス等の脆性物体を薄厚のウエハ状に切断
するのに汎用されている。2. Description of the Related Art A multi-wire saw, in which a plurality of wires are tensioned in parallel along a horizontal plane, is used for cutting a brittle object such as a silicon ingot of a solar cell into a thin wafer, and a plurality of wires arranged in parallel are used. The multi-threaded row of wires on the grooved roller is pressed against the object to be cut (workpiece), and in the process a machining fluid containing abrasive grains (abrasive fluid)
Is a device for cutting while supplying the wire to a cutting site. This multi-wire saw is generally used for cutting brittle objects such as semiconductor materials, magnetic materials and ceramics into thin wafers.
【０００３】図１はその例として挙げられる代表的なマ
ルチワイヤソーの斜視図である。回転自在に保持された
３個の溝ローラ１，１，１の外周面に嵌装された円筒状
の樹脂スリーブに所定のピッチで刻設されたワイヤガイ
ド溝に１本のワイヤ２を巻き付けて、所定のピッチのワ
イヤ列３を形成させる。このワイヤ列３を走行させる
（具体的にはワイヤを走行させる）とともに、ワーク昇
降台４によってワーク５を徐々に上昇させ、ワーク５を
スライス片に切断する。このとき、同時にワーク５の上
方に設置された砥液供給ノズル６から、砥液を含む砥液
７が供給され、スリットノズル６下部の孔から砥液７を
流出せしめ、ワーク５に供給する。供給された砥液７
は、走行するワイヤ列３とワーク５の間に入り研削切断
が進行する。FIG. 1 is a perspective view of a typical multi-wire saw as an example. One wire 2 is wound around a wire guide groove formed at a predetermined pitch on a cylindrical resin sleeve fitted on the outer peripheral surfaces of three groove rollers 1, 1, 1 rotatably held. , The wire rows 3 having a predetermined pitch are formed. While the wire row 3 is traveling (specifically, the wire is traveling), the work 5 is gradually raised by the work elevating table 4 and the work 5 is cut into slice pieces. At this time, at the same time, the abrasive liquid supply nozzle 6 installed above the work 5 supplies the abrasive liquid 7 containing the abrasive liquid, and the abrasive liquid 7 is caused to flow out from the hole below the slit nozzle 6 and supplied to the work 5. Supplied polishing liquid 7
Enters between the traveling wire row 3 and the work 5, and the grinding cutting proceeds.
【０００４】ワーク５は、脆性材料性のダミー板８に接
着され、ダミー板８はベース９に接着されている。な
お、ベース９は、ワーク昇降台４に締めつけネジ１０に
て脱着自在にとりつけられている。The work 5 is bonded to a dummy plate 8 made of a brittle material, and the dummy plate 8 is bonded to a base 9. The base 9 is detachably attached to the work elevating table 4 with a tightening screw 10.
【０００５】[0005]
【発明が解決しようとする課題】マルチワイヤソーによ
る切断のような遊離砥粒による研削加工においては、砥
液の条件、すなわち砥粒の材質と直径、砥液中の混合物
の混合比率、砥液温度の選定が高精度高能率切断を実現
するうえで重要な要素となる。それらの条件の中で、砥
液温度は粘性をコントロールすると共に化学反応を促進
する要素であるため、高精度高能率切断を実現するため
には、最適な温度の砥液を供給することは欠かせないも
のである。In the grinding process using loose abrasive grains such as cutting with a multi-wire saw, the conditions of the abrasive liquid, that is, the material and diameter of the abrasive grains, the mixture ratio of the mixture in the abrasive liquid, the temperature of the abrasive liquid, Selection is an important factor in realizing high precision and high efficiency cutting. Under these conditions, the temperature of the polishing fluid is an element that controls the viscosity and promotes the chemical reaction, so it is essential to supply the polishing fluid at the optimum temperature in order to achieve highly accurate and efficient cutting. It cannot be done.
【０００６】したがって、上記従来技術によるマルチワ
イヤソーによる切断方法においても、砥液の温度を研削
に最適なレベルにセットして使用していた。しかし、研
削に最適である砥液の温度が、マルチワイヤソーの溝ロ
ーラに対して適しているとは限らない。Therefore, even in the cutting method using the multi-wire saw according to the above-mentioned conventional technique, the temperature of the polishing liquid is set to an optimum level for grinding and used. However, the temperature of the polishing liquid that is optimum for grinding is not always suitable for the groove roller of the multi-wire saw.
【０００７】溝ローラの樹脂スリーブの温度が上昇する
と、線膨張係数が大きい樹脂スリーブに熱変形を生じ、
切断中のワイヤガイド溝の位置が微妙に変化して切断の
精度が悪化してしまう。また、ワイヤによってワイヤガ
イド溝が損耗したり、切れ込みが生じ易くなる。ワイヤ
ガイド溝の損耗はワイヤの位置を不安定にするもので、
切断精度の低下をもたらし、ワイヤガイド溝の切れ込み
はワイヤ切断の原因ともなる。すなわち、樹脂スリーブ
の温度は低くかつ安定的に保つことが必要である。な
お、回転する樹脂スリーブはまわりの空気によって冷却
されるので、温度の安定化という観点にたてば入熱を防
止して室温と同レベルに維持するのが理想的といえる。When the temperature of the resin sleeve of the groove roller rises, the resin sleeve having a large linear expansion coefficient is thermally deformed,
The position of the wire guide groove during the cutting changes subtly and the cutting accuracy deteriorates. In addition, the wire easily wears the wire guide groove or easily causes a cut. Wear of the wire guide groove makes the position of the wire unstable,
This leads to a reduction in cutting accuracy, and the notch in the wire guide groove also causes cutting of the wire. That is, the temperature of the resin sleeve needs to be kept low and stable. Since the rotating resin sleeve is cooled by the surrounding air, it is ideal to prevent heat input and maintain it at the same level as room temperature from the viewpoint of stabilizing the temperature.
【０００８】ところで、樹脂スリーブへの直接的な入熱
はワイヤとワイヤに付着した砥液によって行われる。研
削時の加工熱および摺動熱の影響により、ワークから出
るワイヤの温度はワークに入るワイヤの温度よりも高
く、ワイヤに付着してワークからでる砥液の温度はスリ
ットノズルから供給される砥液の温度よりも高い。すな
わち、ワークから出るワイヤおよびワイヤに付着した砥
液によって溝ローラの樹脂スリーブの温度が上昇するの
である。溝ローラへの入熱は、当然のことながら、ワー
クから出た直後のワイヤが巻きつく溝ローラで大きい。
図１において、ワイヤ列３を往復走行させながら切断す
る往復式ワイヤソー（例えば特公昭56-198号）の場合に
は、ワーク５の左右の溝ローラに交互に入熱させる。ま
た、ワイヤ列３を一方向に走行させて切断する一方向ワ
イヤソーの場合には、ワーク５からワイヤ列３が出る側
に位置する溝ローラへの入熱が大きい。By the way, direct heat input to the resin sleeve is performed by the wire and the abrasive liquid attached to the wire. Due to the processing heat and sliding heat during grinding, the temperature of the wire coming out of the work is higher than the temperature of the wire entering the work, and the temperature of the abrasive liquid adhering to the wire and coming out of the work is supplied by the slit nozzle. Higher than liquid temperature. That is, the temperature of the resin sleeve of the groove roller rises due to the wire coming out of the work and the abrasive liquid attached to the wire. The heat input to the groove roller is naturally large at the groove roller around which the wire is wound immediately after it comes out of the work.
In FIG. 1, in the case of a reciprocating wire saw (for example, Japanese Patent Publication No. 56-198) that cuts while reciprocating the wire row 3, heat is alternately applied to the left and right groove rollers of the work 5. Further, in the case of a one-way wire saw that travels the wire row 3 in one direction and cuts it, the heat input to the groove roller located on the side where the wire row 3 exits from the work 5 is large.
【０００９】エレクトロニクス分野のウエハは極めて高
い切断精度が要求されるので、樹脂スリーブの熱変形あ
るいはワイヤガイド溝の損傷は最小限に抑制する必要が
ある。ワイヤガイド溝の寿命が延長されれば、溝ローラ
の交換頻度が減少し、コストおよび工数の削減につなが
る。Since wafers in the electronics field require extremely high cutting accuracy, it is necessary to minimize thermal deformation of the resin sleeve or damage to the wire guide groove. If the life of the wire guide groove is extended, the frequency of exchanging the groove roller is reduced, which leads to a reduction in cost and man-hours.
【００１０】したがって本発明の主たる課題は、マルチ
ワイヤソーの切断能率を維持しつつ、溝ローラの樹脂ス
リーブの切断中の熱変形等を防止して高い切断精度を保
つとともに、ワイヤガイド溝の損耗や切れ込みを防止す
ることで、溝ローラの耐久性を向上させることにある。Therefore, a main object of the present invention is to maintain high cutting efficiency of the multi-wire saw, prevent thermal deformation during cutting of the resin sleeve of the groove roller to maintain high cutting accuracy, and wear and tear of the wire guide groove. It is to improve the durability of the groove roller by preventing the cut.
【００１１】[0011]
【課題を解決するための手段】上記目的を達成するた
め、本発明は、ワイヤが平行に張設されたワイヤ列を走
行させ該ワイヤ列に対象の被切断物体の切断を押し付
け、各ワイヤによる被切断物体の切断部位に砥粒を含む
砥液を供給しながら複数のスライス片に切断する方法に
おいて、走行する前記ワイヤ列が被切断物へ進入する側
の前記ワイヤ列に供給する砥液の温度と、被切断物から
出る側の前記ワイヤ列に供給する砥液の温度とをそれぞ
れ独立に調整して供給する点を、その構成とするもので
ある。In order to achieve the above-mentioned object, the present invention is to run a wire row in which wires are stretched in parallel and press the cutting of an object to be cut on the wire row, In the method of cutting into a plurality of slice pieces while supplying an abrasive liquid containing abrasive grains to the cutting site of the object to be cut, in the abrasive liquid supplied to the wire row on the side where the running wire row enters the object to be cut The point is that the temperature and the temperature of the abrasive liquid supplied to the wire row on the side exiting the object to be cut are independently adjusted and supplied.
【００１２】[0012]
【作用】高能率切断を実現するために適した砥液温度Ｔ
ｃは、ワークと砥粒の材質の組合せによって決まる。し
かし一方、溝ローラの樹脂スリーブの熱変形の防止、あ
るいは溝ローラの耐久性維持のために適した温度Ｔｒ
は、一般的にＴｃよりも低いことが多い。[Operation] Abrasive temperature T suitable for high efficiency cutting
c is determined by the combination of the material of the work and the abrasive grains. However, on the other hand, the temperature Tr suitable for preventing thermal deformation of the resin sleeve of the groove roller or maintaining durability of the groove roller.
Is often lower than Tc.
【００１３】したがってワークを切断するためのワーク
入側のワイヤ列に供給する砥液の温度Ｔ1 は、Ｔｃに等
しいか研削による発熱を考慮してＴｃより若干低めに調
整する。また、ワーク出側のワイヤ列に供給する砥液の
温度Ｔ2 は、Ｔｒに等しいか摺動で発熱したワイヤから
の伝熱を考慮してＴｒより低めに調整し、好ましくは溝
ローラに巻きつく時の温度を室温と同一にする。Therefore, the temperature T 1 of the polishing liquid supplied to the wire row on the work entry side for cutting the work is adjusted to be equal to Tc or slightly lower than Tc in consideration of heat generated by grinding. Further, the temperature T 2 of the abrasive liquid supplied to the wire row on the work output side is equal to Tr or adjusted to be lower than Tr in consideration of heat transfer from the wire that has generated heat by sliding, and is preferably wound on a groove roller. Make the temperature at the same temperature as room temperature.
【００１４】これによって、切断に寄与する砥液温度は
Ｔｃに、溝ローラ表面の温度はＴｒと、ほとんど同じ値
とすることができ、溝ローラの熱変形を防止できるた
め、切断能力の低下を招くことなく、溝ローラの消耗を
減少させることができる。As a result, the temperature of the abrasive liquid that contributes to the cutting can be set to Tc, and the temperature of the groove roller surface can be set to almost the same value as Tr, and thermal deformation of the groove roller can be prevented, thus lowering the cutting ability. It is possible to reduce the consumption of the groove rollers without inviting them.
【００１５】切断に寄与するための砥液と溝ローラ耐久
のための砥液に独立した温度の砥液を供給する方法とし
ては、それぞれに独立した供給管を設ければよい。ある
いは、１つの供給管で砥液を途中まで運び、以後分岐さ
せてそれぞれの側で加熱、または冷却手段からなる温度
を調整する手段によって温度を調整してもよい。As a method of supplying the polishing liquid for contributing to cutting and the polishing liquid for durability of the groove roller with the polishing liquid at independent temperatures, independent supply pipes may be provided respectively. Alternatively, the temperature may be adjusted by a means for adjusting the temperature by heating or cooling on each side by carrying the polishing liquid part way through one supply pipe and branching it thereafter.
【００１６】なお、Ｔ1 は、Ｔｃがワークの種類により
異なるため、Ｔｃの値により適宜決定すればよいが、通
常は２５℃以上４０℃以下の範囲で選定される。また、
Ｔ2については、Ｔｒを考慮して、１５℃以上２５℃未
満の範囲であるのが望ましい。Since Tc differs depending on the type of work, T 1 may be appropriately determined according to the value of Tc, but is usually selected in the range of 25 ° C to 40 ° C. Also,
Considering Tr, T 2 is preferably in the range of 15 ° C. or higher and lower than 25 ° C.
【００１７】[0017]
【実施例】本発明による実施例を図２により具体的に説
明する。図２は本発明の方法に使用するマルチワイヤソ
ーの例を示した図である。回転自在に保持された３個の
溝ローラ１，１，１の外周面に溝ローラ１，１，１の長
手方向に所定のピッチで刻設された溝に線刃となる１本
のワイヤ２を巻き付けて所定のピッチのワイヤ列３を形
成する。溝ローラ１，１，１のいずれかを回転させるこ
とで、ワイヤ列３を一方向に走行させる。このとき、砥
液供給管６ａより砥液７をワイヤ列３に供給し、ワイヤ
列３の走行に引きずられて砥液７はワーク５とワイヤ列
３の間に供給される。あわせて、ワーク昇降台４を徐々
に上昇させることで、ワーク５はワイヤ列３に押圧さ
れ、研削作用によりワーク５はスライス片に切断され
る。EXAMPLE An example according to the present invention will be specifically described with reference to FIG. FIG. 2 is a diagram showing an example of a multi-wire saw used in the method of the present invention. One wire 2 serving as a wire blade in a groove formed at a predetermined pitch in the longitudinal direction of the groove rollers 1, 1, 1 on the outer peripheral surface of the three groove rollers 1, 1, 1 held rotatably Is wound to form a wire row 3 having a predetermined pitch. By rotating any of the groove rollers 1, 1, 1 the wire row 3 is run in one direction. At this time, the abrasive liquid 7 is supplied to the wire row 3 from the abrasive liquid supply pipe 6 a, and the abrasive liquid 7 is supplied between the work 5 and the wire row 3 by being dragged by the traveling of the wire row 3. At the same time, by gradually raising the work elevating table 4, the work 5 is pressed by the wire row 3, and the work 5 is cut into slice pieces by the grinding action.
【００１８】このとき、たとえば溝ローラ１，１，１内
に示す矢印の方向に溝ローラ１，１，１が回転している
とすれば、砥液供給管６ａより研削に適した温度Ｔ1 の
砥液７ａを、砥液供給管６ｂより、溝ローラ１，１，１
の保護に適した温度Ｔ2 の砥液７ｂを供給する。砥液供
給管６ａより供給された砥液７ａは、ワイヤ列３の走行
によってワーク５の切断部へと引き込まれ、ワーク昇降
台４の上昇に伴って徐々にワーク５の研削が進行する。
一方、砥液供給管６ｂより溝ローラ１，１，１の保護に
適した温度の砥液７ｂが供給されているため、溝ローラ
１，１，１の保護、あるいは熱膨張防止に適した温度で
ワイヤ列３が走行することとなる。At this time, assuming that the groove rollers 1, 1, 1 are rotating in the direction of the arrow shown in the groove rollers 1, 1, 1 for example, a temperature T 1 suitable for grinding from the abrasive liquid supply pipe 6a. Grinding liquid 7a is fed from the grinding liquid supply pipe 6b to the groove rollers 1, 1, 1
The polishing liquid 7b having a temperature T 2 suitable for protecting the above is supplied. The abrasive liquid 7a supplied from the abrasive liquid supply pipe 6a is drawn into the cutting portion of the work 5 by the traveling of the wire row 3, and the work 5 is gradually ground as the work elevating table 4 moves up.
On the other hand, since the abrasive liquid 7b having a temperature suitable for protecting the groove rollers 1, 1, 1 is supplied from the abrasive liquid supply pipe 6b, a temperature suitable for protecting the groove rollers 1, 1, 1 or preventing thermal expansion. Thus, the wire row 3 travels.
【００１９】他方、スライス片に切断されたワーク５
は、従来と同様の方法によって取り出される。すなわち
ワーク５は、脆性材料のダミー板８に接着され、ダミー
板８は、ベース９に接着されている。また、ベース９
は、ワーク昇降台４に締めつけネジ１０にて脱着自在に
とりつけられている。マルチワイヤソーによりワーク５
の最上部からダミー板８の途中まで切断を行い、切断終
了後締めつけネジ１０を緩めてベース９を取り外す。続
いて、ベース９よりダミー板８を取り外し、スライス片
に切断されているワーク５を１枚ずつダミー板８より取
り外して薄厚のスライス片が完成する。On the other hand, the work 5 cut into slice pieces
Are taken out in the same manner as in the past. That is, the work 5 is bonded to the dummy plate 8 made of a brittle material, and the dummy plate 8 is bonded to the base 9. Also, the base 9
Is detachably attached to the work lift table 4 with a tightening screw 10. Work 5 with a multi-wire saw
The dummy plate 8 is cut from the uppermost part to the middle, and after the cutting is completed, the tightening screw 10 is loosened and the base 9 is removed. Subsequently, the dummy plate 8 is removed from the base 9, and the works 5 cut into slice pieces are removed one by one from the dummy plate 8 to complete a thin slice piece.
【００２０】なお、本実施例においては温度Ｔ1 の砥液
をワイヤ列に供給したが、ワークに直接供給しても同様
の効果が得られるのは言うまでもない。In the present embodiment, the abrasive liquid at the temperature T 1 was supplied to the wire array, but it goes without saying that the same effect can be obtained by directly supplying it to the work.
【００２１】〔実施例１〕断面φ２００ｍｍ、長さ１５
０ｍｍのシリコンインゴットをＧＣ♯600 砥粒とラッピ
ングオイルからなる比重１．７５の砥液を用い、ワイヤ
列数１２０、ワイヤピッチ１．１５ｍｍ、ワイヤ走行速
度４００ｍ／ｍｉｎ、切込み速度０．４０ｍｍ／ｍｉｎ
の条件で切断し、超高分子量ポリエチレン製の溝ローラ
の耐久試験を行った。なお、特開平1-306171号公報にも
記載されているように、この条件下での切断精度、切断
能率に優れる砥液温度は、３５℃前後である。[Embodiment 1] Cross section φ200 mm, length 15
A 0 mm silicon ingot was used with GC # 600 abrasive grains and lapping oil with a specific gravity of 1.75, the number of wire rows was 120, the wire pitch was 1.15 mm, the wire traveling speed was 400 m / min, and the cutting speed was 0.40 mm / min.
The groove roller made of ultra-high molecular weight polyethylene was subjected to a durability test by cutting under the conditions of. As described in JP-A-1-306171, the temperature of the abrasive liquid, which is excellent in cutting accuracy and cutting efficiency under these conditions, is around 35 ° C.
【００２２】図２における装置を用いて３５℃に調整し
た砥液を、砥液供給管６ａ、６ｂの両方より供給して切
断試験を行った結果、４回目の切断でワイヤが溝ローラ
に切れ込んだ。一方、砥液供給管６ａからは、３５℃の
砥液、６ｂからは、２５℃の砥液を供給して切断試験を
行った結果、１０回目の切断後も溝ローラへのワイヤの
切れ込みは見られなかった。A cutting test was carried out by supplying a grinding liquid adjusted to 35 ° C. by using the apparatus shown in FIG. 2 from both the grinding liquid supply pipes 6a and 6b. As a result, the wire was cut into the groove roller at the fourth cutting. It is. On the other hand, as a result of performing a cutting test by supplying a 35 ° C. polishing liquid from the polishing liquid supply pipe 6a and a 25 ° C. polishing liquid from 6b, it is confirmed that the wire is not cut into the groove roller even after the 10th cutting. I couldn't see it.
【００２３】〔実施例２〕断面１２５×１２５ｍｍ、長
さ１５０ｍｍの石英インゴットをＧＣ♯600 砥粒とラッ
ピングオイルからなる比重１．７５の砥液を用いて、ワ
イヤ列数７０、ワイヤピッチ２．０ｍｍ、ワイヤ径０．
２０ｍｍ、ワイヤ走行速度４００ｍ／ｍｉｎの条件で切
断し、超高分子量ポリエチレンの溝ローラの耐久試験と
切断能率の測定を行った。Example 2 A quartz ingot having a cross section of 125 × 125 mm and a length of 150 mm was prepared using GC # 600 abrasive grains and lapping oil having a specific gravity of 1.75, and the number of wire rows was 70 and the wire pitch was 2. 0 mm, wire diameter 0.
Cutting was performed under the conditions of 20 mm and a wire running speed of 400 m / min, and an endurance test and cutting efficiency of a groove roller of ultra-high molecular weight polyethylene were performed.
【００２４】図２における装置を用いて３５℃に調整し
た砥液を、砥液供給管６ａおよび６ｂの両方より供給し
て切断試験を行った結果、ワークを押し上げる速度は、
０．７ｍｍ／ｍｉｎまで可能であったが、３回目の切断
にてワイヤが溝ローラ切れ込んだ。また、砥液供給管６
ａおよび６ｂから２５℃に調整した砥液を供給して切断
試験を行った結果、１０回切断してもワイヤは溝ローラ
に切り込まなかったが、ワークを押し上げる速度は、
０．５ｍｍ／ｍｉｎが限界であった。さらに、図２にお
ける装置を用いて砥液供給管６ａからは３５℃に調整し
た砥液を、砥液供給管６ｂからは２５℃に調整した砥液
を供給し、切断試験を行った。その結果、１０回目の切
断後も溝ローラへのワイヤの切れ込みは発生せず、ワー
クの押し上げ速度は０．７ｍｍ／ｍｉｎまで可能であっ
た。The abrasive liquid adjusted to 35 ° C. using the apparatus shown in FIG. 2 was supplied from both the abrasive liquid supply pipes 6a and 6b, and a cutting test was conducted.
Although it was possible up to 0.7 mm / min, the wire cut into the groove roller at the third cutting. Further, the polishing liquid supply pipe 6
As a result of performing a cutting test by supplying an abrasive liquid adjusted to 25 ° C. from a and 6b, the wire did not cut into the groove roller even after cutting 10 times, but the speed of pushing up the work was
The limit was 0.5 mm / min. Further, a cutting test was conducted by using the apparatus shown in FIG. 2 to supply the abrasive liquid adjusted to 35 ° C. from the abrasive liquid supply pipe 6a and the abrasive liquid adjusted to 25 ° C. from the abrasive liquid supply pipe 6b. As a result, the wire was not cut into the groove roller even after the 10th cutting, and the work could be pushed up to 0.7 mm / min.
【００２５】[0025]
【発明の効果】以上の説明から明らかな如く、本発明に
よれば、マルチワイヤソーの高精度高能率の切断能力を
維持しつつ、溝ローラの熱膨張も防止してその溝部分の
損耗を防止することで、切断精度の低下を防止し、結果
として溝ローラの耐久性を向上させることができる。As is apparent from the above description, according to the present invention, while maintaining the high-precision and high-efficiency cutting ability of the multi-wire saw, thermal expansion of the groove rollers is prevented and wear of the groove portions is prevented. By doing so, it is possible to prevent a decrease in cutting accuracy and, as a result, improve the durability of the groove roller.
【図１】従来のマルチワイヤソーの斜視図である。FIG. 1 is a perspective view of a conventional multi-wire saw.
【図２】本発明の方法に実施の使用するマルチワイヤソ
ー例の斜視図である。FIG. 2 is a perspective view of an example of a multi-wire saw used for carrying out the method of the present invention.
１…溝ローラ、２…ワイヤ、３…ワイヤ列、４…ワーク
昇降台、５…ワーク、６…砥液供給管、７…砥液。DESCRIPTION OF SYMBOLS 1 ... Groove roller, 2 ... Wire, 3 ... Wire row, 4 ... Work lift, 5 ... Work, 6 ... Abrasive liquid supply pipe, 7 ... Abrasive liquid.
Claims (1)
させ、該ワイヤ列に被切断物体を押しつけ、各ワイヤに
よる被切断物体の切断部位に砥粒を含む砥液を供給しな
がら複数のスライス片に切断する方法において、 走行する前記ワイヤ列が被切断物へ進入する側の前記ワ
イヤ列に供給する砥液の温度と、被切断物から出る側の
前記ワイヤ列に供給する砥液の温度とをそれぞれ独立に
調整して供給することを特徴とするワイヤソーによる切
断方法。1. A plurality of wires are provided while running in a wire row in which wires are stretched in parallel, pressing an object to be cut against the wire row, and supplying a polishing liquid containing abrasive grains to a cut portion of the object to be cut by each wire. In the method of cutting into slice pieces, the temperature of the abrasive liquid supplied to the wire array on the side where the running wire array enters the object to be cut, and the abrasive solution supplied to the wire array on the side to exit from the object to be cut. The method for cutting with a wire saw is characterized in that the temperature and the temperature of each are independently adjusted and supplied.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27749092A JP2671728B2 (en) | 1992-10-15 | 1992-10-15 | Cutting method with wire saw |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27749092A JP2671728B2 (en) | 1992-10-15 | 1992-10-15 | Cutting method with wire saw |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06126733A JPH06126733A (en) | 1994-05-10 |
| JP2671728B2 true JP2671728B2 (en) | 1997-10-29 |
Family
ID=17584327
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27749092A Expired - Lifetime JP2671728B2 (en) | 1992-10-15 | 1992-10-15 | Cutting method with wire saw |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2671728B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120192848A1 (en) * | 2009-10-07 | 2012-08-02 | Akira Nakashima | Method of slicing silicon ingot using wire saw and wire saw |
| CN107962693A (en) * | 2017-11-28 | 2018-04-27 | 乐山新天源太阳能科技有限公司 | The spray equipment of diamond wire silicon chip cutter |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5135623B2 (en) * | 2006-04-06 | 2013-02-06 | Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 | Cutting method of semiconductor ingot |
| JP2009029078A (en) * | 2007-07-30 | 2009-02-12 | Toyo Advanced Technologies Co Ltd | Wire saw device |
| CN107553763A (en) * | 2016-06-30 | 2018-01-09 | 广东先导先进材料股份有限公司 | A kind of method and cutter device of multi-wire saw chip |
| CN110587831B (en) * | 2019-09-16 | 2022-02-01 | 顺德中山大学太阳能研究院 | A wire-electrode cutting equipment for photovoltaic dual glass assembly |
-
1992
- 1992-10-15 JP JP27749092A patent/JP2671728B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120192848A1 (en) * | 2009-10-07 | 2012-08-02 | Akira Nakashima | Method of slicing silicon ingot using wire saw and wire saw |
| CN107962693A (en) * | 2017-11-28 | 2018-04-27 | 乐山新天源太阳能科技有限公司 | The spray equipment of diamond wire silicon chip cutter |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06126733A (en) | 1994-05-10 |
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