JP2658311B2 - Alloy brazing material - Google Patents
Alloy brazing materialInfo
- Publication number
- JP2658311B2 JP2658311B2 JP63309594A JP30959488A JP2658311B2 JP 2658311 B2 JP2658311 B2 JP 2658311B2 JP 63309594 A JP63309594 A JP 63309594A JP 30959488 A JP30959488 A JP 30959488A JP 2658311 B2 JP2658311 B2 JP 2658311B2
- Authority
- JP
- Japan
- Prior art keywords
- brazing material
- melting point
- brazing
- weight
- point metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/32—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C
- B23K35/325—Ti as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
- Contacts (AREA)
Description
【発明の詳細な説明】 A.産業上の利用分野 本発明は、ロウ材に係り、特にTiとAlとを主成分とす
る合金ロウ材に関したものである。The present invention relates to a brazing material, and more particularly to an alloy brazing material containing Ti and Al as main components.
B.発明の概要 本発明は、Ti（チタン）,Al（アルミニウム）を主成
分としたロウ材であり、低融点金属を含有する導電性合
金のロウ付接合に適した合金ロウ材である。B. Summary of the Invention The present invention is a brazing material mainly composed of Ti (titanium) and Al (aluminum), and is an alloy brazing material suitable for brazing of a conductive alloy containing a low melting point metal.
C.従来の技術 従来、低融点金属、例えばBi（ビスマス）を含有する
導電性の金属部材として、例えば電気接点がある。C. Prior Art Conventionally, as a conductive metal member containing a low melting point metal, for example, Bi (bismuth), there is, for example, an electric contact.
この種の電気接点においては、低融点金属を1.0重量
％以上含有させることが電気的性能の要求から多々行わ
れている。In this type of electrical contact, it is often the case that a low melting point metal is contained in an amount of 1.0% by weight or more from the viewpoint of electrical performance.
しかし、低融点金属を多く含むと、加熱時に、ロウ材
を流動温度以下で低融点金属が接合部の界面に析出（ま
たは溶出）し、ロウ材の「ぬれ性」を阻害して、結果と
してロウ付出来ない現象を引き起こしていた。However, if the low-melting-point metal is contained in a large amount, the low-melting-point metal precipitates (or elutes) at the interface of the joint at a temperature lower than the fluidizing temperature during heating, thereby impairing the "wetting property" of the brazing material. This caused a phenomenon that could not be brazed.
また、接合出来たとしても、低融点金属がロウ付接合
部に存在すると、接合強度が著しく低下し、容易に取れ
てしまうものであった。Further, even if joining was possible, if a low-melting-point metal was present in the brazed joint, the joining strength would be significantly reduced and would be easily removed.
上述のようなことから、低融点金属を含有する金属部
材の接合は、機械的に変形（例えば、「かしめ」）させ
るか、ネジ止め、といった手段で行っている。From the above, the joining of the metal member containing the low melting point metal is performed by means of mechanical deformation (for example, “caulking”) or screwing.
D.発明が解決しようとする課題 従来は、低融点金属を含有する金属部材の接合は、機
械的な手段で接合するものであったので、これを電気、
電子機器の接点と導体との接合に用いた場合には、多頻
度の開閉により、接合強度が低下して接触抵抗が増加し
たり、またそれに伴う発熱の発生等の問題があった。D. Problems to be Solved by the Invention Conventionally, the joining of metal members containing a low-melting-point metal was done by mechanical means,
When used for joining the contacts and conductors of electronic devices, there are problems such as frequent opening and closing, which lowers the joining strength, increases the contact resistance, and generates heat accordingly.
さらには、接点が脱落してしまう場合もあり、耐久性
は悪いものであった。Furthermore, the contact may fall off, resulting in poor durability.
E.課題を解決するための手段 発明者らは、種々実験を行った結果、TiとAlとでロウ
材を形成すれば、多量の低融点金属を含有していても、
安定にロウ付接合できることを見出した。E. Means for Solving the Problems The inventors have conducted various experiments and found that, if a brazing material is formed with Ti and Al, even if a large amount of low melting point metal is contained,
It has been found that brazing can be performed stably.
また、TiまたはAl共晶を作る材料を添加すると、Ti,A
lの拡敷層を安定化でき、接合を一層確実なものにでき
ることを見出した。Also, when a material that forms Ti or Al eutectic is added, Ti, A
It has been found that the extended layer of l can be stabilized and the bonding can be made more reliable.
すなわち、ロウ付部にTi,Alの拡散層が存在すること
で低融点金属の接合界面への侵入を効果的に防止でき、
安定にロウ付できることが判った。In other words, the presence of the Ti, Al diffusion layer in the brazed portion can effectively prevent the low-melting-point metal from entering the bonding interface,
It was found that brazing could be performed stably.
従って、本発明は、 低融点金属を含有する導電性金属を接合する合金ロウ
材であり、 （１）20〜90重量％のTiと、10〜80重量％のAlとからな
り、薄板状に形成した合金ロウ材。Therefore, the present invention is an alloy brazing material for joining a conductive metal containing a low-melting-point metal, comprising: (1) 20 to 90% by weight of Ti and 10 to 80% by weight of Al, Alloy brazing material formed.
（２）TiとAlと、これらTiまたはAlのいずれかと共晶を
作る材料からなる第３成分とからなり、且つ薄板状に形
成するとともに、 TiとAlとを合計で20重量％以上含有し、且つ重量比
で、Ti/Al＝20/80〜90/10、（Ti＋Al）／（第３成分）
＝20/80〜90/10とした合金ロウ材。(2) It is composed of Ti and Al, and a third component made of a material that forms a eutectic with either of these Ti or Al, is formed in a thin plate shape, and contains a total of 20% by weight or more of Ti and Al. And by weight ratio, Ti / Al = 20/80 to 90/10, (Ti + Al) / (third component)
= Alloy brazing material with 20/80 to 90/10.
の要件からなるものである。Requirements.
しかして、TiとAlとの割合、TiとAlと第３成分との割
合が上記の関係より外れる場合には安定したロウ付接合
を得ることが出来なかった。However, when the ratio between Ti and Al and the ratio between Ti and Al and the third component deviated from the above relationships, stable brazing could not be obtained.
なお、低融点金属としては、例えば、Bi（ビスマ
ス）、Sb（アンチモン）等の低融点金属として良く知ら
れている金属が該当する。また、導電性金属としては、
銅、銅合金、銀、銀合金、が該当する。As the low melting point metal, for example, a metal well known as a low melting point metal such as Bi (bismuth) and Sb (antimony) corresponds. Also, as the conductive metal,
Copper, copper alloy, silver, and silver alloy are applicable.
また、TiまたはAlのいずれかと共晶を作る材料（第３
成分）としては、例えば、Cu（銅）、In（インジウ
ム）、Ni（ニッケル）、Mn（マンガン）、Fe（鉄）のう
ちの少なくとも１種類が該当する。In addition, a material that forms a eutectic with either Ti or Al (No. 3
As the component, for example, at least one of Cu (copper), In (indium), Ni (nickel), Mn (manganese), and Fe (iron) corresponds.
さらに、ロウ材の使用条件としては、 ロウ付温度は、650〜1000℃。 Furthermore, the brazing material is used under the following conditions: brazing temperature: 650-1000 ° C.
ロウ付雰囲気は、真空中、不活性ガス中。The brazing atmosphere is in a vacuum or an inert gas.
ロウ材の厚さは、0.02〜1.0mm。The thickness of the brazing material is 0.02-1.0mm.
とするのが好ましい。It is preferred that
F.作用 ロウ付接合部にTi,Alの拡散層が存在することで低融
点金属の接合界面への侵入を効果的に防止でき、低融点
を含有する導電性金属と同種金属（または含まない金
属）を安定にロウ付することができる。F. Action The presence of a diffusion layer of Ti and Al at the brazed joint effectively prevents low-melting-point metal from entering the joining interface, and is the same (or does not include) the same kind of metal as the conductive metal containing low-melting point Metal) can be stably brazed.
G.実施例 本発明を以下の実施例に基づいて詳細に説明する。G. Examples The present invention will be described in detail based on the following examples.
（実施例−１） Cuが50重量％、Crが40重量％、Biが10重量％の成分か
らなる、低融点金属含有の金属部材と無酸素銅との接合
例である。(Example-1) This is an example of joining a low melting point metal-containing metal member and oxygen-free copper consisting of a component of 50 wt% of Cu, 40 wt% of Cr, and 10 wt% of Bi.
（ａ）低融点金属を含有した部材について −100メッシュの粒径のCr（クロム）粉末を、アルミ
ナ容器（内径68mm）に約160g入れ、このCr粉末上にCu−
Bi合金（約400g）を載置し、容器に蓋をかぶせ、これを
真空炉内にて脱ガスと共にCu−Bi合金の融点以下の温度
で加熱処理して、まずCr粒子を拡散結合させて多孔質の
溶浸母材を形成する。(A) About a member containing a low-melting-point metal-About 160 g of Cr (chromium) powder having a particle size of 100 mesh is put into an alumina container (inner diameter 68 mm), and Cu-
Place the Bi alloy (approx. 400 g), cover the vessel, cover the vessel and heat-treat it at a temperature lower than the melting point of the Cu-Bi alloy together with degassing in a vacuum furnace. Form a porous infiltration matrix.
その後温度を上げて、Cu,Biを溶浸母材に溶浸させ
る。Thereafter, the temperature is increased to infiltrate Cu and Bi into the infiltration base material.
この際にアルミナ容器内は、Bi蒸気を含んだ雰囲気と
なり、Biを多量に含有した複合金属が得られる。At this time, the interior of the alumina container becomes an atmosphere containing Bi vapor, and a composite metal containing a large amount of Bi is obtained.
こうして得られて金属材料を、容器から取り出し、外
面を機械加工して所定の寸法形状にする。The metal material thus obtained is removed from the container and the outer surface is machined to a predetermined size and shape.
（ｂ）ロウ材について −325メッシュの粒径のTiとAlの粉末と、これらTi、A
lと共晶を作る第３成分としてのCu粉末（−325メッシ
ュ）とを用意し、Tiが35重量％、Alが30重量％、Cuが35
重量％となるように混合する。この混合粉末を非酸化性
雰囲気中で加熱溶解し、得られたインゴットを圧延成形
して薄板状にし、約0.2mmの箱状のロウ材に加工する。(B) Regarding brazing material-Ti and Al powder having a particle size of -325 mesh,
l and Cu powder (−325 mesh) as a third component that forms a eutectic are prepared, and Ti is 35% by weight, Al is 30% by weight, and Cu is 35% by weight.
Mix by weight. The mixed powder is heated and melted in a non-oxidizing atmosphere, and the obtained ingot is roll-formed into a thin plate and processed into a box-shaped brazing material of about 0.2 mm.
（ｃ）ロウ付について 上気ロウ材（Ti−Al−Cu）を、Cu−Cr−Bi合金部材
と、無酸素銅からなる部材との間に入れ、これらをアル
ミナ容器内に設置し、且つ蓋をし、真空炉にて加熱処理
（950℃,15分間）して接合した。(C) Brazing An upper brazing material (Ti-Al-Cu) is put between a Cu-Cr-Bi alloy member and a member made of oxygen-free copper, these are placed in an alumina container, and The lid was put on, and a heat treatment (950 ° C., 15 minutes) was performed in a vacuum furnace to join.
（ｄ）ロウ付の結果について 上記のようにして得られた接合物は、強固に接合され
ており、しかもロウ材も十分に流動しているとが確認さ
れた。(D) Regarding the result of brazing It was confirmed that the joint obtained as described above was firmly joined and the brazing material was also sufficiently flowing.
また、Ｘ線マイクロアナライザにて接合部の断面を観
察すると、Ti,Alの拡散層によって、Biの界面への析出
は防止され、安定したロウ付接合層が形成されているこ
とが確認された。Observation of the cross section of the joint with an X-ray microanalyzer confirmed that the Ti and Al diffusion layers prevented Bi from depositing on the interface and formed a stable brazing joint layer. .
（実施例−２〜38） 上述の実施例−１と同様な条件で、ロウ材の成分を変
えてロウ付接合について調べた。(Examples 2-38) Under the same conditions as in Example 1 described above, brazing was examined by changing the components of the brazing material.
その結果は図及び下表に示す通りであった。 The results were as shown in the figure and the table below.
なお、実施例−30〜35,37,38における、接合強度は良
好であり、引っ張り試験の結果、ロウ付部ではなく、接
合した母材の部分が破壊する結果であった。 In Examples -30 to 35, 37, and 38, the joining strength was good, and as a result of the tensile test, not the brazed portion but the joined base material was broken.
従って、これらの結果から、 ロウ材をTiとAlとで形成し、且つ両者の成分比（重量
比）を、Ti/Alが20/80〜90/10とすれば良いことが判っ
た。Therefore, from these results, it was found that the brazing material should be formed of Ti and Al, and the component ratio (weight ratio) of both should be 20/80 to 90/10 for Ti / Al.
Ti,Alと共晶を作る第３成分を添加すると、Ti,Alの拡
散層を安定化させる効果があり、含有させる上限は80重
量％であることが判った。It was found that the addition of the third component that forms a eutectic with Ti and Al has the effect of stabilizing the diffusion layer of Ti and Al, and the upper limit of the content is 80% by weight.
好ましい組成は、TiとAlと共晶を作る材料（第３成
分）との組合せであり、且つ成分比（重量比）を、 Ti/Al＝20/80〜90/10 （Ti＋Al）／（第３成分）＝20/80〜90/10とすれば良い
ことが判った。A preferred composition is a combination of a material (third component) that forms a eutectic with Ti and Al, and the component ratio (weight ratio) is Ti / Al = 20/80 to 90/10 (Ti + Al) / (second component). (3 components) = 20/80 to 90/10.
（その他の実施例） 接合する一方の金属部材を、AgにBiを添加して形成
し、これを無酸素銅からなる部材に前述の場合と同様な
結果が得られることを確認した。(Other Examples) One metal member to be joined was formed by adding Bi to Ag, and it was confirmed that the same result as in the above-described case was obtained for a member made of oxygen-free copper.
（比較例） 比較のために一般的に知れらている、Ag−Cu−In系ロ
ウ材、及びCu−Mn−Ni系ロウ材を用い温度条件を前者は
800℃、後者は950℃とし、且つ他の条件は上記実施例−
１と同様にしてロウ材を試みたが、いずれも剥離し、ロ
ウ付ができなかった。(Comparative Example) For the comparison, Ag-Cu-In-based brazing material and Cu-Mn-Ni-based brazing material, which are generally known for comparison, were used to determine the temperature conditions.
800 ° C, the latter at 950 ° C, and other conditions are as in the above-described Example.
A brazing material was tried in the same manner as in Example 1, but all were peeled off and could not be brazed.
H.発明の効果 本発明のロウ材は、Ti,Alを主成分としていることか
ら、ロウ付部にTi,Alの拡散層を形成し、この拡散層が
低融点金属の接合界面への侵入を効果的に防止できるこ
とから、従来ロウ付が不可能であった多量（1.0重量％
以上）の低融点金属を含有する導電性金属のロウ付がで
きるようになった。H. Effect of the Invention Since the brazing material of the present invention is mainly composed of Ti and Al, a diffusion layer of Ti and Al is formed at the brazing portion, and this diffusion layer invades the bonding interface of the low melting point metal. (1.0% by weight)
The above) has enabled the brazing of the conductive metal containing the low melting point metal.
しかも、Ti,Alと共晶を作る金属材料を添加するとロ
ウ付接合を一層安定に行うことができる。Moreover, when a metal material that forms a eutectic with Ti and Al is added, brazing can be performed more stably.
また、合金ロウ材であるから、線状（線ロウ）、板状
（板ロウ）に加工成形することも容易であり、適用範囲
が拡大する。Further, since it is an alloy brazing material, it can be easily formed into a linear shape (line brazing) or a plate shape (plate brazing), and the applicable range is expanded.
従って、電気、電子機器における低融点金属を含有す
る接点の接合に適用した場合には、接触抵抗の低減、安
定化及び発熱防止、を図ることができ、さらには、耐久
性の向上が図れ、品質向上に寄与できるものである。Therefore, when applied to the joining of contacts containing a low melting point metal in electric and electronic devices, it is possible to reduce the contact resistance, stabilize and prevent heat generation, and further improve the durability, It can contribute to quality improvement.
図は、各実施例における成分と評価の説明図。 The figure is an explanatory view of components and evaluation in each example.
Claims (2)
点金属を含有する導電性金属の接合に用いるロウ材にお
いて、 20〜90重量％のTiと、10〜80重量％のAlとからなり、薄
板状に形成したことを特徴とする合金ロウ材。1. A brazing material used for bonding a conductive metal containing a low melting point metal having a melting point substantially equal to that of Bi or Sb, comprising 20 to 90% by weight of Ti and 10 to 80% by weight of Al. An alloy brazing material formed of a thin plate.
点金属を含有する導電性金属の接合に用いるロウ材にお
いて、 TiとAlと、これらTiまたはAlのいずれかと共晶を作る材
料からなる第３成分とからなり、且つ薄板状に形成する
とともに、TiとAlとを合計で20重量％以上含有し、且つ
重量比を、Ti/Al＝20/80〜90/10、（Ti＋Al）／（第３
成分）＝20/80〜90/10としたことを特徴とする合金ロウ
材。2. A brazing material used for bonding a conductive metal containing a low melting point metal having a melting point substantially equal to the melting point of Bi or Sb, wherein Ti and Al and a eutectic are formed with either Ti or Al. It is composed of a third component made of a material, is formed in a thin plate shape, contains at least 20% by weight of Ti and Al in total, and has a weight ratio of Ti / Al = 20/80 to 90/10, ( Ti + Al) / (third
(Component) = 20/80 to 90/10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63309594A JP2658311B2 (en) | 1988-12-07 | 1988-12-07 | Alloy brazing material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63309594A JP2658311B2 (en) | 1988-12-07 | 1988-12-07 | Alloy brazing material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02155594A JPH02155594A (en) | 1990-06-14 |
| JP2658311B2 true JP2658311B2 (en) | 1997-09-30 |
Family
ID=17994913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63309594A Expired - Lifetime JP2658311B2 (en) | 1988-12-07 | 1988-12-07 | Alloy brazing material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2658311B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5177029B2 (en) * | 2009-03-17 | 2013-04-03 | 日立電線株式会社 | Brazing clad material and product using the same |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0717975B2 (en) * | 1983-01-11 | 1995-03-01 | 郁男 岡本 | Amorphous alloy foil strip for brazing |
| DE3316807A1 (en) * | 1983-05-07 | 1984-11-08 | Robert Bosch Gmbh, 7000 Stuttgart | HARD SOLDER ALLOY FOR JOINING OXIDE CERAMICS UNDER OR WITH METALS |
| JPS62227596A (en) * | 1986-03-31 | 1987-10-06 | Toshiba Corp | Ceramics-metal joining member |
| JP2532240B2 (en) * | 1987-04-08 | 1996-09-11 | セイコー電子工業株式会社 | Brazing material |
-
1988
- 1988-12-07 JP JP63309594A patent/JP2658311B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02155594A (en) | 1990-06-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5160366A (en) | Silver-metal oxide composite material and process for producing the same | |
| US4448605A (en) | Ductile brazing alloys containing reactive metals | |
| US3985512A (en) | Telluride containing impregnated electric contact material | |
| JP3495770B2 (en) | Brazing filler metal for ceramics | |
| JPS62212095A (en) | Brazing filler metal | |
| JP2658311B2 (en) | Alloy brazing material | |
| US5286441A (en) | Silver-metal oxide composite material and process for producing the same | |
| JP2658310B2 (en) | Powdered brazing material | |
| JP2611403B2 (en) | Vacuum interrupter | |
| US4490437A (en) | Ductile nickel based brazing alloy foil | |
| JP2611402B2 (en) | Vacuum interrupter | |
| JP2748658B2 (en) | Manufacturing method of brazing material | |
| JPH0455086A (en) | Production of brazing material | |
| JPH0494893A (en) | Manufacture of brazing filler material | |
| JPH02155595A (en) | Production of brazing material | |
| JPH03297593A (en) | Brazing filler metal and brazing method | |
| JPH03297595A (en) | Brazing filler metal and brazing method | |
| JPH042020A (en) | Manufacture of vacuum interrupter | |
| JPH0494892A (en) | Manufacture of brazing filler material | |
| JPH02160324A (en) | Vacuum interrupter | |
| JPH02160322A (en) | Vacuum interrupter | |
| JPH03297594A (en) | Brazing filler metal and brazing method | |
| JPS5940792B2 (en) | Method for surface metallization of metal oxides | |
| JPS648412B2 (en) | ||
| JPH05101751A (en) | Manufacture of electrode material |