JP2639649B2 - Method of forming connection part of power cable - Google Patents
Method of forming connection part of power cableInfo
- Publication number
- JP2639649B2 JP2639649B2 JP61306388A JP30638886A JP2639649B2 JP 2639649 B2 JP2639649 B2 JP 2639649B2 JP 61306388 A JP61306388 A JP 61306388A JP 30638886 A JP30638886 A JP 30638886A JP 2639649 B2 JP2639649 B2 JP 2639649B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductive
- layer
- power cable
- heat
- crosslinked
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、架橋ポリエチレン電力ケーブルの接続部の
新規な形成方法に関するものである。Description: FIELD OF THE INVENTION The present invention relates to a novel method for forming connections of cross-linked polyethylene power cables.
（従来の技術） 現在、わが国の電力ケーブルには架橋ポリエチレンを
絶縁層とするポリエチレン電力ケーブルが主流をなして
きており、技術の改良と共にその需要は急速に伸びて、
紙絶縁電力ケーブルやゴム絶縁電力ケーブルを凌駕して
いると共に、益々ポリエチレン電力ケーブル自体の高電
圧化が実現する傾向にある。(Prior art) At present, polyethylene power cables using cross-linked polyethylene as an insulating layer have become the mainstream in Japan's power cables.
In addition to being superior to paper-insulated power cables and rubber-insulated power cables, there is a trend toward increasingly higher voltages for polyethylene power cables themselves.
このようなポリエチレンを絶縁電力ケーブルの代表的
構造は、導体、内部半導電層、絶縁層、外部半導電層を
順次形成した構造で、絶縁体の内外は、電界の均一化、
使用時の絶縁層の膨張収縮に対して、導体・遮蔽と絶縁
層との密着をよくし、コロナ放電を阻止するために内外
半導電層が設けられている。A typical structure of such a polyethylene insulated power cable is a structure in which a conductor, an inner semiconductive layer, an insulating layer, and an outer semiconductive layer are sequentially formed.
Inner and outer semiconductive layers are provided to improve the adhesion between the conductor / shield and the insulating layer against expansion and contraction of the insulating layer during use and to prevent corona discharge.
従って、このようなケーブルを接続する場合には、当
然ケーブルの接続部もケーブル同等の電気的性能を備え
ていなければならない。Therefore, when connecting such a cable, the connecting portion of the cable must naturally have the same electrical performance as the cable.
従来のポリエチレン電力ケーブルの接続方法は、接続
すべき架橋ポリエチレンケーブルを段剥し、その導体相
互を接続した後、内部半導電層、絶縁層、外部半導電層
を順次形成した構造で、各層はケーブルの構造に対応し
て形成される。The conventional method of connecting a polyethylene power cable is a structure in which a cross-linked polyethylene cable to be connected is stepped off, its conductors are connected to each other, and then an inner semiconductive layer, an insulating layer, and an outer semiconductive layer are sequentially formed. It is formed corresponding to the structure of FIG.
図１はその代表的接続構造を示す縦断面図で、接続す
べき架橋ポリエチレンケーブルa,bは、それぞれ導体1a,
1b、内部半導電層2a,2b、架橋ポリエチレン絶縁層3a,3
b、及び外部半導電層4a,4bを有している。なお、その外
側には金属遮蔽層5a,5b、ビニルシース6a,6bが設けられ
ている。FIG. 1 is a longitudinal sectional view showing a typical connection structure, in which cross-linked polyethylene cables a and b to be connected are conductors 1a and 1a, respectively.
1b, inner semiconductive layers 2a, 2b, crosslinked polyethylene insulating layers 3a, 3
b and external semiconductive layers 4a and 4b. In addition, metal shielding layers 5a and 5b and vinyl sheaths 6a and 6b are provided outside thereof.
かかる電力ケーブルの接続端は相互に段剥されてお
り、接続するケーブルの導体1a,1bを圧着スリーブ７に
より接続し、これを含む外側にはケーブルの内部半電層
2a,2bに電気的に接続するように接続用内部半導電層８
を設け、次にその外側に架橋剤入りポリエチレンテープ
を所定の厚さに巻き付けて外部から加熱溶融させるいわ
ゆるテープ式モールドジョイントをするか、架橋剤入り
ポリエチレンを押出モールドすることにより架橋ポリエ
チレン絶縁層９を形成している。なお、この絶縁層９の
外側には接続用外部半導電層10を設けるが、前記接続用
内部半導電層８及び接続用外部半導電層10は架橋剤入り
半導電性テープを巻いてモールド成形して架橋するか、
架橋剤無添加の半導電性テープを巻いてモールド成形す
るか、又は架橋された半導電性熱収縮性テープを被せ加
熱収縮させる方法によって行なわれていた。さらに、こ
れらの各層の形成後、ケーブル構造に対応して接続部に
も金属遮蔽層やシース等ケーブル構造に応じた外部被覆
が形成される。The connection ends of the power cable are peeled off from each other, and the conductors 1a and 1b of the cable to be connected are connected by a crimp sleeve 7.
Internal semiconductive layer 8 for connection so as to be electrically connected to 2a, 2b
A polyethylene tape containing a cross-linking agent is wrapped around the outside thereof to a predetermined thickness, and a so-called tape-type mold joint for heating and melting from the outside is used. Is formed. An external semiconductive layer 10 for connection is provided outside the insulating layer 9, and the internal semiconductive layer 8 for connection and the external semiconductive layer 10 for connection are formed by winding a semiconductive tape containing a crosslinking agent. To crosslink or
The method has been carried out by winding and molding a semiconductive tape without a crosslinking agent added, or by covering with a crosslinked semiconductive heat shrinkable tape and heat shrinking. Further, after the formation of each of these layers, an external coating corresponding to the cable structure such as a metal shielding layer and a sheath is formed at the connection portion corresponding to the cable structure.
なお、この場合、内外半導電層形成は従来は架橋剤を
添加し接続モールド時の熱で架橋される架橋剤入り半導
電性テープまたは架橋剤無添加の非架橋半導電性テープ
を横巻きする方法、あるいは架橋された半導電性熱収縮
チューブを被せ加熱収縮させる方法等によって行なわて
いた。In this case, in order to form the inner and outer semiconductive layers, a semiconductive tape containing a crosslinking agent or a non-crosslinked semiconductive tape without a crosslinking agent, which is conventionally added with a crosslinking agent and crosslinked by heat during connection molding, is wound horizontally. It has been carried out by a method, a method of covering a cross-linked semiconductive heat-shrinkable tube and shrinking by heating.
（発明が解決しようとする問題点） 前記したような電力ケーブルの接続部における内外半
導電層を形成する場合に、テープ巻方式と加熱架橋熱収
縮チューブ方式とがあるが、前者のテープ巻方式では半
導電性層表面の平滑度が劣り、内外半導電層に界面不整
を生じコロナ放電を生じ易く、破壊電圧が低くなる。又
後者の架橋熱収縮チューブ方式では、半導電層表面の平
滑度は優れているが、絶縁層との間の密着性が充分では
なく、然もこの密着性はケーブルの高圧化傾向に伴い、
水トリー対策としても、重要な問題である。(Problems to be Solved by the Invention) When forming the inner and outer semiconductive layers in the connection portion of the power cable as described above, there are a tape winding method and a heat-crosslinking heat shrinkable tube method. In this case, the smoothness of the surface of the semiconductive layer is inferior, interface irregularities occur in the inner and outer semiconductive layers, corona discharge easily occurs, and the breakdown voltage is reduced. In the latter cross-linked heat-shrinkable tube method, the smoothness of the semiconductive layer surface is excellent, but the adhesion between the insulating layer and the insulating layer is not sufficient.
This is an important issue for water tree measures.
（問題点を解決するための手段及び作用） 本発明は、前記の如き問題点を解決するためになされ
たもので、架橋ポリエチレン電力ケーブルの接続におい
て、接続部の内外の半導電層を形成する材料として、予
め架橋剤を添加しかつカーボンブラック入りの半導電材
料を電子線照射により半架橋を行なった半導電性熱収縮
性チューブを用意し（以下この架橋剤入り材料を中間的
に架橋することを半架橋と呼ぶ）、これを内外半導電性
層形成のため、その何れか一方もしくは両方に適用し、
ケーブル接続に際してそれぞれ所定の位置にモールド時
の加熱によって、熱収縮させると共に残存している未分
解の架橋剤を熱分解して完全に架橋された半導電層を形
成するものである。(Means and Actions for Solving the Problems) The present invention has been made to solve the above problems, and forms a semiconductive layer inside and outside a connection portion in connection of a crosslinked polyethylene power cable. As a material, a semiconductive heat-shrinkable tube prepared by adding a crosslinking agent in advance and semi-crosslinking a semiconductive material containing carbon black by electron beam irradiation is prepared (hereinafter, the material containing the crosslinking agent is intermediately crosslinked). This is called semi-crosslinking), which is applied to one or both of the inner and outer semiconductive layers to form a semiconductive layer.
At the time of cable connection, heat is contracted by heating during molding at predetermined positions, and the remaining undecomposed crosslinking agent is thermally decomposed to form a completely crosslinked semiconductive layer.
上記のように、半導電性熱収縮性チューブをケーブル
接続部に適用すると、加熱モールドの際に軟化が少なく
変形しにくく、かつ、絶縁層との密着が強固になり、形
成したケーブル接続部の電気的性能は向上する。As described above, when the semiconductive heat-shrinkable tube is applied to the cable connecting portion, the softening is less likely to be deformed during the heating molding, and the adhesion with the insulating layer becomes strong, and the formed cable connecting portion is The electrical performance is improved.
（実施例） 本発明の実施例の接続部の縦断面図を第１図により説
明する。接続するケーブルとしては、154kv,1C×2000mm
2CVケーブルを用いた。図において、接続すべき架橋ポ
リエチレンケーブルa,bは、それぞれ導体1a,1b、内部半
導電層2a,2b、架橋ポリエチレン絶縁層3a,3b及び外部半
導電層4a,4bを有している。5a,5bは金属遮蔽層、6a及び
6bはビニルシース、７は導体の圧着スリーブ、８は接続
部の内部半導電層、９は接続部の架橋ポリエチレン絶縁
層、10は接続部の外部半導電層である。(Example) A longitudinal sectional view of a connecting portion according to an example of the present invention will be described with reference to FIG. 154kv, 1C × 2000mm as cable to connect
Two CV cables were used. In the figure, crosslinked polyethylene cables a and b to be connected have conductors 1a and 1b, inner semiconductive layers 2a and 2b, crosslinked polyethylene insulating layers 3a and 3b, and outer semiconductive layers 4a and 4b, respectively. 5a and 5b are metal shielding layers, 6a and
6b is a vinyl sheath, 7 is a crimping sleeve of a conductor, 8 is an internal semiconductive layer of the connecting portion, 9 is a cross-linked polyethylene insulating layer of the connecting portion, and 10 is an external semiconductive layer of the connecting portion.
一般に、架橋剤としては、ジクミルパーオキサイド
（DCP）が最も良く用いられているが、その他2.5−ジメ
チル−2.5−ジ（ターシャリブチルパーオキシ）ヘキサ
ン、2.5−ジメチル−2.5−ジ（ターシャリブチルパーオ
キシ）ヘキサン３、１−３−ビス（ターシャリブチルパ
ーオキシ）イソプロピルベンゼン等の有機過酸化物が用
いられるが、本実施例において接続部の内部半導電層８
および接続部の外部半導電層10には、ジクミルパーオキ
サイド（DCP）を添加し、かつ電子線処理をした半架橋
の半導電性熱収縮性チューブを用い、通常の方法により
第１図に示すようにケーブル接続部を形成した。Generally, dicumyl peroxide (DCP) is most often used as a cross-linking agent, but other 2.5-dimethyl-2.5-di (tert-butylperoxy) hexane, 2.5-dimethyl-2.5-di (tertiary) Organic peroxides such as butylperoxy) hexane 3, 1-3-bis (tert-butylperoxy) isopropylbenzene and the like are used. In this embodiment, the internal semiconductive layer 8 of the connection portion is used.
1 and a semi-crosslinked semiconductive heat-shrinkable tube to which dicumyl peroxide (DCP) has been added and which has been treated with an electron beam. The cable connection was formed as shown.
上記の実施例をＡとし、比較例としてそれぞれ実施例
における内外半導電層形成に代えて非架橋半導電性テー
プを用いたものをB,架橋剤入り半導電性テープを用いた
ものをC,電子線照射架橋半導電性熱収縮チューブを用い
たものをＤとして製作し、交流破壊電圧を求めた。その
結果を第１表に示す。The above example is A, and those using a non-crosslinked semiconductive tape instead of forming the inner and outer semiconductive layers in the examples as comparative examples are B, and those using a semiconductive tape containing a crosslinking agent are C, A sample using an electron beam irradiation crosslinked semiconductive heat shrinkable tube was manufactured as D, and the AC breakdown voltage was determined. Table 1 shows the results.
第１表においてＡで示すとおり本発明の実施例の架橋
剤入電子線照射処理した半架橋の半導電性熱収縮性チュ
ーブを用いた接続方法により得られた接続部の交流破壊
電圧が、比較例に比して最も高くなっていることが判
る。 As shown by A in Table 1, the AC breakdown voltage of the connection obtained by the connection method using the semi-crosslinked semiconductive heat-shrinkable tube subjected to the electron beam irradiation treatment with the crosslinking agent of the example of the present invention was compared. It turns out that it is the highest compared with the example.
上記の実施例および比較例について接続部における絶
縁体と半導電層との間の界面の乱れ、界面のボイド、界
面接着力および界面近傍の架橋度を調べた結果を第２表
に示す。Table 2 shows the results of examining the turbulence of the interface between the insulator and the semiconductive layer in the connection part, the voids at the interface, the interface adhesive strength, and the degree of crosslinking near the interface in the above Examples and Comparative Examples.
第１表に示す如く本発明の実施例が比較例よりも交流
破壊電圧が向上しているのは、第２表から本発明による
半架橋導電性熱収縮チューブの適用に起因していること
は明らかである。 As shown in Table 1, the reason why the example of the present invention has an improved AC breakdown voltage as compared with the comparative example is based on the fact that the application of the semi-crosslinked conductive heat-shrinkable tube according to the present invention can be seen from Table 2. it is obvious.
（発明の効果） 架橋ポリエチレン絶縁電力ケーブルの接続部形成に際
して、本発明のように、半導電性熱収縮性チューブを適
用すれば、交流破壊電圧の向上ができ、該電力ケーブル
の電圧化に大きく寄与するとができる。(Effect of the Invention) When forming a connection portion of a crosslinked polyethylene insulated power cable, if a semiconductive heat-shrinkable tube is applied as in the present invention, the AC breakdown voltage can be improved, and the power cable can be greatly increased in voltage. Can contribute.
第１図は本発明の電力ケーブルの接続部形成方法により
得られた接続部の縦断面図である。 符号の説明 a,b:電力ケーブル、1a,1b:導体、2a,2b:内部半導電層、
3a,3b:絶縁体、4a,4b:外部半導電層、5a,5b:金属遮蔽
層、6a,6b:シース、7:圧着スリーブ、8:内部半導電層、
9:絶縁層、10:外部半導電層FIG. 1 is a longitudinal sectional view of a connecting portion obtained by the method for forming a connecting portion of a power cable according to the present invention. Description of the symbols a, b: power cable, 1a, 1b: conductor, 2a, 2b: inner semiconductive layer,
3a, 3b: insulator, 4a, 4b: outer semiconductive layer, 5a, 5b: metal shielding layer, 6a, 6b: sheath, 7: crimp sleeve, 8: inner semiconductive layer,
9: insulating layer, 10: external semiconductive layer
───────────────────────────────────────────────────── フロントページの続き (72)発明者 丹羽 利夫 東京都江東区木場１丁目５番１号 藤倉 電線株式会社内 (56)参考文献 特公 昭58−47831（ＪＰ，Ｂ２) ──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Toshio Niwa 1-5-1 Kiba, Koto-ku, Tokyo Fujikura Electric Wire Co., Ltd. (56) References JP-B-58-47831 (JP, B2)
Claims (1)
の接続端を段剥ぎし、導体相互を圧着スリーブで接続
し、しかる後その外側に内部半導電層、絶縁層、外部半
導電層を順次形成して接続部を形成するに際して、少な
くとも該内部半導電層もしくは該外部半導電層の一方に
架橋剤を添加しかつ半架橋とした半導電性熱収縮チュー
ブを被覆し、加熱収縮せしめて形成することを特徴とす
る電力ケーブルの接続部の形成方法。1. A connecting end of a crosslinked polyethylene power cable to be connected is stepped off, and conductors are connected to each other by a crimp sleeve. Thereafter, an inner semiconductive layer, an insulating layer, and an outer semiconductive layer are sequentially formed on the outside thereof. When forming a connection portion, a cross-linking agent is added to at least one of the inner semi-conductive layer and the outer semi-conductive layer, and a semi-crosslinked semi-conductive heat-shrinkable tube is coated and heat-shrinked to form the connection portion. A method for forming a connection portion of a power cable, the method comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61306388A JP2639649B2 (en) | 1986-12-24 | 1986-12-24 | Method of forming connection part of power cable |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61306388A JP2639649B2 (en) | 1986-12-24 | 1986-12-24 | Method of forming connection part of power cable |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63161805A JPS63161805A (en) | 1988-07-05 |
| JP2639649B2 true JP2639649B2 (en) | 1997-08-13 |
Family
ID=17956418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61306388A Expired - Lifetime JP2639649B2 (en) | 1986-12-24 | 1986-12-24 | Method of forming connection part of power cable |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2639649B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2706323B2 (en) * | 1989-07-19 | 1998-01-28 | 古河電気工業株式会社 | Connection method of cross-linked polyethylene power cable |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5847831A (en) * | 1981-09-18 | 1983-03-19 | Hitachi Constr Mach Co Ltd | Oil-pressure circuit for oil-pressure shovel |
-
1986
- 1986-12-24 JP JP61306388A patent/JP2639649B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63161805A (en) | 1988-07-05 |
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