JP2627131B2 - Molding method for recovered resin - Google Patents

Molding method for recovered resin

Info

Publication number
JP2627131B2
JP2627131B2 JP31554392A JP31554392A JP2627131B2 JP 2627131 B2 JP2627131 B2 JP 2627131B2 JP 31554392 A JP31554392 A JP 31554392A JP 31554392 A JP31554392 A JP 31554392A JP 2627131 B2 JP2627131 B2 JP 2627131B2
Authority
JP
Japan
Prior art keywords
mold
polyimide
molding method
molding
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP31554392A
Other languages
Japanese (ja)
Other versions
JPH06143278A (en
Inventor
紘 片岡
勇雄 梅井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
Original Assignee
Asahi Kasei Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei Corp filed Critical Asahi Kasei Corp
Priority to JP31554392A priority Critical patent/JP2627131B2/en
Publication of JPH06143278A publication Critical patent/JPH06143278A/en
Application granted granted Critical
Publication of JP2627131B2 publication Critical patent/JP2627131B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02WCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00Technologies for solid waste management
    • Y02W30/50Reuse, recycling or recovery technologies
    • Y02W30/62Plastics recycling; Rubber recycling

Landscapes

  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、塗装等による塗膜を
有する合成樹脂回収成形品を用いた射出成形法あるいは
ブロー成形法に係る。
The present invention relates, according to an injection molding method or a blow molding method using synthetic resin recovery molded article having a coating skin film by coating or the like.

【0002】[0002]

【従来の技術】最近、合成樹脂成形品を使用後、粉砕し
て再び成形に再利用する(以後、リサイクルと称す)こ
とが強く要求されている。
2. Description of the Related Art Recently, it has been strongly demanded that a synthetic resin molded article be used, pulverized and reused for molding again (hereinafter referred to as recycling).

【0003】例えば「プラスチックエージ,Sept,
172(1992)」には、ポリプロピレン製自動車バ
ンパーのリサイクル技術について述べられている。
[0003] For example, "Plastic Age, Sept,
172 (1992) "describes a technology for recycling polypropylene bumpers made of polypropylene.

【0004】自動車バンパーは合成樹脂成形品に塗装を
行って使用されており、該バンパーをリサイクルする場
合、塗料を取除いてから再使用しないと、塗料の粉砕物
が見苦しい異物となって、リサイクルした成形品の外観
を著しく悪くする。自動車バンパーの塗料には熱硬化性
塗料が一般に使用されており、該塗料をリサイクルに先
立って取除く試みが前記文献に示されている。
[0004] Automobile bumpers are used by painting a synthetic resin molded product. When the bumper is recycled, if the paint is not reused after the paint is removed, the pulverized paint becomes unsightly foreign matter and may be recycled. Significantly deteriorate the appearance of the molded article. Thermosetting coatings are commonly used in automotive bumper coatings, and attempts to remove the coatings prior to recycling are disclosed in the literature.

【0005】特公昭60−56604号公報には、ガラ
ス繊維、炭酸カルシウム、アスベスト、アルミニウム等
の充填材入り樹脂を射出成形し、表面平滑な成形品を射
出成形する方法が示されている。この方法は、樹脂を金
型へ射出するに先だち、高周波誘導加熱により金型表面
を加熱し、直ちに充填材入り樹脂を射出して成形する方
法である。つまり、金型表面が樹脂の軟化温度以上にあ
る状態で樹脂が金型キャビティへ射出されると、樹脂中
の充填材が成形品表面に飛び出した状態の成形品になら
ず、成形品の最表面が樹脂層で覆われた平滑表面とな
る。
Japanese Patent Publication No. Sho 60-56604 discloses a method of injection-molding a resin containing a filler such as glass fiber, calcium carbonate, asbestos, and aluminum, and injection-molding a molded article having a smooth surface. In this method, prior to injecting the resin into the mold, the surface of the mold is heated by high-frequency induction heating, and the resin containing the filler is immediately injected to be molded. In other words, when the resin is injected into the mold cavity while the mold surface is at or above the softening temperature of the resin, the filler in the resin does not become a molded product in a state of protruding to the surface of the molded product, and the molded product has the highest The surface becomes a smooth surface covered with the resin layer.

【0006】[0006]

【発明が解決しようとする課題】しかしながら、塗装等
の塗膜を有する合成樹脂回収成形品をリサイクルする
に際し、塗膜を取り除いてから利用するのでは、その
手間が多大であり、経済的に実施することが困難であ
る。
[SUMMARY OF THE INVENTION However, when recycling the synthetic resin recovery molded article having a coating skin film coating or the like and to use after removing the coating skin film, the time is great, economical Is difficult to implement.

【0007】 また、金型の高周波加熱を伴う成形法を
用いることで、塗膜の粉砕物が得られる成形品表面に
露出しないようにし、塗膜を取除くことなくリサイク
ルすることも考えられる。
[0007] Moreover, by using the molding method with high-frequency heating of the mold, so as not to expose the surface of the molded article which pulverized coating skin film can be obtained, also possible to recycle without removing the coating skin layer Can be

【0008】しかし、金型の高周波誘導加熱を行う設備
は非常に高価であることに加え、大型金型になると均一
に加熱するのが困難となり、成形品の表面状態にバラツ
キを生じやすくなる。従って、金型の高周波誘導加熱を
伴なう成形法は、小型で高価な成形品の成形に主に用い
られており、リサイクルには適さないものである。
[0008] However, equipment for high-frequency induction heating of a mold is very expensive, and in a large-sized mold, it becomes difficult to uniformly heat the mold, and the surface condition of a molded product tends to vary. Therefore, a molding method involving high-frequency induction heating of a mold is mainly used for molding a small and expensive molded product, and is not suitable for recycling.

【0009】 本発明は、このような従来の問題点に鑑
みてなされたもので、リサイクルに際し、塗膜を有す
る合成樹脂回収成形品の塗膜を除去することなく、こ
れを原料として大型で表面状態の良好な成形品を簡便な
設備で得られるようにすることを目的とする。
[0009] The present invention has been made in view of such conventional problems, upon recycling, without removing the coating skin layer of the synthetic resin recovery molded article having a coating skin film, large this as a raw material It is an object of the present invention to obtain a molded article having a good surface condition with simple equipment.

【0010】[0010]

【課題を解決するための手段及び作用】このために本発
明では、室温における熱伝導率が0.05cal/cm
・sec・℃以上の金属から成る主金型の型キャビティ
を形成する型壁面に、熱伝導率が0.002cal/c
m・sec・℃以下の断熱層が0.05〜3mm厚に設
けられた金型を用い、塗膜を有する合成樹脂回収成形
品を原料として用いて成形することとしているものであ
る。
According to the present invention, the thermal conductivity at room temperature is 0.05 cal / cm.
The heat conductivity is 0.002 cal / c on the mold wall surface forming the mold cavity of the main mold composed of a metal having a temperature of sec sec.
using a mold m · sec · ° C. or less of the heat insulating layer is provided 0.05~3mm thickness, but you are be formed using a synthetic resin recovery molded article having a coating skin film as a raw material.

【0011】すなわち、本発明は、冷却された主金型の
型キャビティを形成する型壁面を断熱層で被覆し、射出
された合成樹脂の熱により断熱層表面を加熱し、表面温
度を該合成樹脂の軟化温度以上に保持しつつ、リサイク
ル樹脂を成形し、金型表面の再現性に優れた大型成形品
を経済的に得る方法である。
That is, according to the present invention, the mold wall forming the mold cavity of the cooled main mold is covered with a heat insulating layer, and the surface of the heat insulating layer is heated by the heat of the injected synthetic resin, and the surface temperature is adjusted. This is a method for economically obtaining a large molded product excellent in reproducibility of a mold surface by molding a recycled resin while maintaining the temperature at or above the softening temperature of the resin.

【0012】本発明で原料として用いる合成樹脂回収成
形品としては、一般に射出成形に使用される合成樹脂で
成形された成形品が全て使用できる。例えば、ポリエチ
レン、ポリプロピレン等のポリオレフィン、ポリスチレ
ン、スチレン−アクリルニトリル共重合体、ABS樹脂
等のスチレン系樹脂、ナイロン6、ナイロン66等のポ
リアミド、ポリアセタール、ポリエステル、ポリフェニ
レンエーテル系樹脂、ポリ塩化ビニル系樹脂、等の成形
品である。
As the synthetic resin recovered molded article used as a raw material in the present invention, any molded article molded from a synthetic resin generally used for injection molding can be used. For example, polyolefin such as polyethylene and polypropylene, polystyrene, styrene-acrylonitrile copolymer, styrene resin such as ABS resin, polyamide such as nylon 6, nylon 66, polyacetal, polyester, polyphenylene ether resin, polyvinyl chloride resin , Etc.

【0013】 塗膜を有する回収成形品とは、成形品
表面に塗装、メッキ、ホットスタンピング、印刷等の後
加工を施した回収成形品である。リサイクル成形が経済
的に成り立つには、回収成形品がまとまって集められる
ことが重要であり、例えば、自動車のバンパー、エアー
スポイラー等の自動車部品がまず実施され易い。自動車
バンパーはポリプロピレン製が多く、更に2層又は3層
のメタリック塗装が多く、本発明に最も良好に使用でき
る。
[0013] The recovery molded article having a coating skin layer, coated on the surface of the molded article, plating, a hot stamping, recovering the molded article having been subjected to post-processing such as printing. In order for recycling molding to be economically viable, it is important that collected molded products are collected collectively. For example, automobile parts such as automobile bumpers and air spoilers are easily implemented first. Most automobile bumpers are made of polypropylene, and furthermore have two or three layers of metallic coating, and can be used most preferably in the present invention.

【0014】本発明に用いる主金型材質は、熱伝導率が
0.05cal/cm・sec・℃以上のもので、鉄又
は鉄を50重量%以上含有する鋼材、アルミニウム又は
アルミニウムを50重量%以上含有する合金、亜鉛合
金、銅合金、例えばベリリウム銅合金等の一般に合成樹
脂の金型に使用されている金属を包含する。特に鋼材が
最も良好に使用できる。
The main mold material used in the present invention has a thermal conductivity of 0.05 cal / cm.sec..degree. C. or more, iron or a steel material containing 50% by weight or more of iron, aluminum or 50% by weight of aluminum. Metals generally used in synthetic resin molds, such as alloys, zinc alloys, copper alloys such as beryllium copper alloys, are included. In particular, steel materials can be used most preferably.

【0015】本発明において、主金型の型キャビティを
形成する型壁面は、後述する断熱層との密着性を高める
ため、クロムメッキ又は/及びニッケルメッキで被覆さ
れていることが好ましい。
In the present invention, the mold wall forming the mold cavity of the main mold is preferably coated with chromium plating and / or nickel plating in order to enhance the adhesion with the heat insulating layer described later.

【0016】 本発明において、主金型の型キャビティ
を形成する型壁面は、断熱層で覆われているもので、こ
の断熱層を設けておくことにより、あたかもあらかじめ
金型を加熱しておいてから成形を行なうのと同様の作用
が得られるものである。即ち、加熱可塑化された合成樹
脂が断熱層と接してもその断熱作用によって直ちに冷却
固化せずに流動状態の維持が図られるので、合成樹脂中
に塗膜の粉砕物が混在していても、それが外部に露出
することなく覆い隠されやすくなる。
In the present invention, the mold wall forming the mold cavity of the main mold is covered with a heat-insulating layer. By providing this heat-insulating layer, it is possible to heat the mold in advance. The same operation as when molding is performed can be obtained. That is, since the heat plasticized synthetic resin maintained in a fluid state without immediately cooled and solidified by the heat insulation effect even in contact with the heat-insulating layer is achieved, pulverized coating skin layer is not mixed in the synthetic resin However, it is easy to cover it without exposing it to the outside.

【0017】断熱層は、熱伝導率が0.002cal/
cm・sec・℃以下であることが必要である。熱伝導
率がこれを超えると、必要な断熱性を得るために断熱層
を厚くしなければならなくなって、成形品の冷却効率が
悪化して成形サイクルが長くなる。
The heat insulating layer has a thermal conductivity of 0.002 cal /
It is necessary that the temperature be less than cm · sec · ° C. If the thermal conductivity exceeds this, the thickness of the heat insulating layer must be increased in order to obtain the required heat insulating property, and the cooling efficiency of the molded product deteriorates, and the molding cycle becomes longer.

【0018】本発明の断熱層の厚みは、0.05〜3m
mの範囲で適当に選択される。0.05mm未満では断
熱効果が少なく、3mmを超えると成形時の成形品の冷
却効果が低下し、成形効率が低下する。冷却された主金
型の表面を断熱層で被覆し、加熱可塑化合成樹脂が射出
されて該断熱層表面に接すると、断熱層は射出された合
成樹脂の熱によって加熱され、温度が上る。そして時間
と共に主金型により冷却され、温度は低下してゆく。断
熱層の熱伝導率が小さい程、又断熱層が厚い程、断熱層
は高い温度になり、冷却されてゆく速度は小さくなり、
高い温度に保たれている時間が長くなる。
The thickness of the heat insulating layer of the present invention is 0.05 to 3 m.
It is appropriately selected in the range of m. If it is less than 0.05 mm, the heat insulating effect is small, and if it exceeds 3 mm, the cooling effect of the molded article during molding is reduced, and the molding efficiency is reduced. When the surface of the cooled main mold is covered with a heat-insulating layer and the heat-plasticized synthetic resin is injected and comes into contact with the heat-insulating layer surface, the heat-insulating layer is heated by the heat of the injected synthetic resin and the temperature rises. Then, it is cooled by the main mold with time, and the temperature decreases. The lower the thermal conductivity of the thermal insulation layer and the thicker the thermal insulation layer, the higher the temperature of the thermal insulation layer, the lower the rate of cooling,
The time during which the high temperature is maintained is prolonged.

【0019】射出成形では断熱層の厚みは0.05〜
0.5mm厚が好ましく、更に好ましくは0.07〜
0.3mmである。
In the injection molding, the thickness of the heat insulating layer is 0.05 to
The thickness is preferably 0.5 mm, more preferably 0.07 to
0.3 mm.

【0020】本発明はブロー成形の金型にも応用できる
が、ブロー成形金型の断熱層の厚みは0.2〜3mm厚
が好ましく、更に好ましくは0.3〜2mmである。
Although the present invention can be applied to a blow molding die, the thickness of the heat insulating layer of the blow molding die is preferably from 0.2 to 3 mm, more preferably from 0.3 to 2 mm.

【0021】断熱層表面は鏡面状であっても良いし、必
要に応じて皮しぼ状、織布表面状等の微細凹凸状であっ
ても良い。微細凹凸状の場合の断熱層の厚みは平均厚み
で示すものとする。
The surface of the heat-insulating layer may be mirror-like or, if necessary, fine irregularities such as a grain-like or woven fabric surface. The thickness of the heat insulating layer in the case of fine irregularities is indicated by an average thickness.

【0022】ところで断熱層で被覆した金型は、 1)複雑な形状の金型キャビティを有する金型に適用で
きる 2)冷却時間の増大が小さく、且つ断熱効果が大きい 3)数万回の繰返し成形に耐える こと等を満たすことが好ましく、このためには、断熱層
には、次のことが要求される。すなわち、実質的に金型
最表面にあって薄層であること、また断熱物質に関して
は、熱伝導度が低いこと、耐熱性に優れること、引張強
度、伸びが大きくしかも冷熱サイクルに強いこと、表面
硬度が大きいこと、耐摩耗性に優れること、金型本体へ
の塗布が良好にできること、金型本体との密着性が良い
ことである。
By the way, the mold covered with the heat insulating layer can be applied to: 1) a mold having a mold cavity having a complicated shape; 2) a small increase in cooling time and a large heat insulating effect; and 3) tens of thousands of repetitions. It is preferable to satisfy the conditions such as endurance to molding. For this purpose, the following is required for the heat insulating layer. That is, it is a thin layer substantially on the outermost surface of the mold, and with respect to the heat insulating material, it has low thermal conductivity, excellent heat resistance, high tensile strength, high elongation and resistance to thermal cycles, High surface hardness, excellent abrasion resistance, good application to the mold body, and good adhesion to the mold body.

【0023】一方、数万回の成形に耐える本格金型には
鋼鉄等の強靭な材質で型キャビティを形成することがこ
れまでの常識である。射出成形では2mm厚程度の薄肉
の型キャビティを高速で合成樹脂が射出されるため、鋼
鉄等の強靭な材質で型キャビティを形成することが数万
回の成形を行う本格金型ではこれまで必須と考えられて
いる。
On the other hand, it has been common sense to form a mold cavity with a tough material such as steel in a full-scale mold that can withstand tens of thousands of moldings. In injection molding, synthetic resin is injected at a high speed into a thin mold cavity with a thickness of about 2 mm, so forming a mold cavity with a tough material such as steel is indispensable for a full-scale mold that performs tens of thousands of moldings. It is believed that.

【0024】我々は、これについて更に深い研究を行
い、主金型の表面を薄い合成樹脂で被覆しても、一定の
条件を満たす合成樹脂から成る断熱層を使用すれば、数
万回の射出成形に耐えることを発見した。
We have conducted further research on this, and even if the surface of the main mold is coated with a thin synthetic resin, if a heat insulating layer made of a synthetic resin that meets certain conditions is used, tens of thousands of injections are performed. It has been found that it can withstand molding.

【0025】 すなわち、射出成形では、金型に射出さ
れた加熱可塑化樹脂は冷却された金型壁面に接触して接
触面に直ちに固化層を形成し、引続き射出される樹脂は
固化層と固化層の間を進行し、流動先端(flow f
ront)に達すると、金型壁面の方向へ向い、金型壁
面と接して固化層となる。
That is, in the injection molding, the heat plasticized resin injected into the mold comes into contact with the cooled mold wall surface and immediately forms a solidified layer on the contact surface, and the subsequently injected resin solidifies with the solidified layer. Proceeding between the layers, the flow front (f low w f
When it reaches (ront), it faces in the direction of the mold wall surface and contacts the mold wall surface to form a solidified layer.

【0026】すなわち、射出される樹脂は金型壁面を上
から押しつける様に流れ、金型壁面をひきずる様に流れ
ない。
That is, the injected resin flows so as to press the mold wall surface from above, and does not flow like dragging the mold wall surface.

【0027】従って、金型表面を選択された合成樹脂か
ら成る薄い断熱層で被覆すれば該断熱層は射出される樹
脂で直接磨耗することは無く、数万回の射出成形に耐え
得ることを見い出した。
Therefore, if the mold surface is covered with a thin heat-insulating layer made of a selected synthetic resin, the heat-insulating layer will not be directly worn by the injected resin, and can withstand tens of thousands of injection moldings. I found it.

【0028】本発明に良好に使用できる断熱材としては
各種の耐熱樹脂が使用できる。また、耐熱性樹脂の中で
もポリイミドが本発明では特に良好に使用できる。
Various heat-resistant resins can be used as the heat insulating material which can be suitably used in the present invention. Further, among heat-resistant resins, polyimide can be used particularly preferably in the present invention.

【0029】一般的にポリイミドは直鎖型と熱硬化型に
分けられそれらのポリイミド前躯体としては各種あり、
次の表1の様に分類される。
Polyimides are generally classified into linear type and thermosetting type, and there are various types of polyimide precursors.
They are classified as shown in Table 1 below.

【0030】[0030]

【表1】 射出成形では、冷却された金型へ、加熱され可塑化され
た合成樹脂が射出され、それが金型内で冷却されて成形
されるため、各成形毎に、金型表面では100℃にも及
ぶ加熱と冷却が繰り返される。ポリイミドと鉄等の金属
では、熱膨張係数が1桁も異なっているので、100℃
にも及ぶ加熱と冷却が繰り返される毎に、金属とポリイ
ミドとの界面に激しい応力が発生することになる。この
応力に数万回にわたって耐え得るポリイミドとして、破
断強度、破断伸度共に大きく、且つ金型との密着力が大
きいことが必要であり、強靭な直鎖型の高分子量ポリイ
ミドが最も好ましいことを発見した。
[Table 1] In injection molding, a heated and plasticized synthetic resin is injected into a cooled mold, which is cooled and molded in the mold. Extensive heating and cooling are repeated. Since metals such as polyimide and iron have different coefficients of thermal expansion by one digit,
Every time heating and cooling are repeated, intense stress is generated at the interface between the metal and the polyimide. As a polyimide that can withstand this stress for tens of thousands of times, it is necessary that the breaking strength and the breaking elongation are both large and that the adhesion to the mold is large, and that a tough linear high molecular weight polyimide is most preferable. discovered.

【0031】本発明に良好に使用できる直鎖型の高分子
量ポリイミドの例を表2に示した。なお、Tgはガラス
転移温度、又、nはくりかえし単位の数を表わす。
Table 2 shows examples of linear high-molecular-weight polyimides which can be favorably used in the present invention. Here, Tg represents a glass transition temperature, and n represents the number of repeating units.

【0032】[0032]

【表2】 直鎖型ポリイミドのTgは構成成分によって異り、その
例を表3および表4に示した。本発明者らの知見ではT
gが200℃以上が良く、更に好ましくは230℃以上
である。
[Table 2] The Tg of the linear polyimide differs depending on the constituent components, and examples thereof are shown in Tables 3 and 4. According to the knowledge of the present inventors, T
g is preferably 200 ° C. or more, more preferably 230 ° C. or more.

【0033】[0033]

【表3】 [Table 3]

【0034】[0034]

【表4】 射出成形は複雑な形状の成形品を一度の成形で得られる
ところに経済的価値がある。この複雑な金型表面をポリ
イミドで被覆し、且つ強固に密着させるには、ポリイミ
ド前駆体溶液を塗布し、次いで加熱してポリイミドを形
成させることが好ましい。
[Table 4] Injection molding has economic value in that a molded article having a complicated shape can be obtained by one molding. In order to coat the complex mold surface with polyimide and to make it tightly adhere, it is preferable to apply a polyimide precursor solution and then heat to form polyimide.

【0035】直鎖型高分子量ポリイミドは前駆体溶液を
金型壁面に塗布し、次いで加熱して形成される。更に、
該ポリイミドは、ガラス転移温度(以後Tgと略称)が
200℃以上の高耐熱性樹脂であり、強度及び伸度に優
れ、その破断伸度は10%以上であり、型壁面との密着
力は500g/10mm巾以上であることが好ましい。
The straight-chain high-molecular-weight polyimide is formed by applying a precursor solution to a mold wall surface and then heating. Furthermore,
The polyimide is a high heat-resistant resin having a glass transition temperature (hereinafter abbreviated as Tg) of 200 ° C. or more, excellent in strength and elongation, its breaking elongation is 10% or more, and its adhesion to the mold wall surface is The width is preferably 500 g / 10 mm or more.

【0036】直鎖型ポリイミド前駆体は、例えば芳香族
ジアミンと芳香族テトラカルボン酸二無水物を開環重付
加反応させることにより合成される。
The linear polyimide precursor is synthesized, for example, by subjecting an aromatic diamine and an aromatic tetracarboxylic dianhydride to a ring-opening polyaddition reaction.

【0037】[0037]

【化1】 これ等ポリイミド前駆体は加熱して脱水環化反応させる
ことによりポリイミドを形成する。
Embedded image These polyimide precursors are heated to cause a dehydration cyclization reaction to form a polyimide.

【0038】本発明に最も好ましい直鎖型ポリイミド前
駆体はポリアミド酸でありその代表例の繰り返し単位
と、それをイミド化したポリイミドの繰り返し単位を次
に示す。
The most preferred straight-chain polyimide precursor in the present invention is polyamic acid, and a typical example of the repeating unit and a repeating unit of imidized polyimide are shown below.

【0039】[0039]

【化2】 Embedded image

【0040】[0040]

【化3】 Embedded image

【0041】[0041]

【化4】 上記のポリイミド前駆体のポリマーは、カルボキシル基
等の極性基のため金型との密着性が良く、金型表面上で
ポリイミドを反応形成させることにより金型表面に密着
したポリイミド薄層が得られる。
Embedded image The above-mentioned polymer of the polyimide precursor has good adhesiveness with the mold due to a polar group such as a carboxyl group, and a polyimide thin layer adhered to the mold surface is obtained by reacting and forming polyimide on the mold surface. .

【0042】上記のポリイミド前駆体のポリマーはN−
メチルピロリドン等の溶媒に溶かし、金型壁面に塗布さ
れる。
The polymer of the above polyimide precursor is N-
It is dissolved in a solvent such as methylpyrrolidone and applied to the mold wall.

【0043】ポリイミドと主金型との密着力は、室温で
500g/10mm巾以上が好ましく、更に好ましくは
1kg/10mm巾以上である。これは密着したポリイ
ミドを10mm巾に切り、接着面と直角方向に20mm
/分の速度で引張った時の剥離力である。この剥離力は
測定場所、測定回数によりかなりバラツキが見られる
が、最小値が大きいことが重要であり、安定して大きい
剥離力であることが好ましい。密着力は金型の主要部の
密着力の最小値である。主金型をクロムメッキ、ニッケ
ルメッキした場合はより安定した剥離力をもたらす。
The adhesion between the polyimide and the main mold is preferably at least 500 g / 10 mm width at room temperature, more preferably at least 1 kg / 10 mm width. This is to cut the adhered polyimide into 10mm width, 20mm in the direction perpendicular to the adhesive surface
/ Min. Although this peeling force varies considerably depending on the measurement location and the number of measurements, it is important that the minimum value is large, and it is preferable that the peeling force be stably large. The adhesion is the minimum value of the adhesion of the main part of the mold. When the main mold is plated with chromium or nickel, a more stable peeling force is provided.

【0044】断熱層の熱伝導率は小さい程好ましいが、
ポリイミドの熱伝導率は0.002cal/cm・se
c・℃以下のものが好ましく使用できる。
Although the heat conductivity of the heat insulating layer is preferably as small as possible,
The thermal conductivity of polyimide is 0.002 cal / cm · se
Those having a temperature of c · ° C. or less can be preferably used.

【0045】直鎖型高分子量ポリイミドの強度及び伸度
は大きいことが好ましく、特に破断伸度が大きいことが
耐冷熱サイクルには好ましく、その破断伸度は10%以
上が好ましく、更に好ましくは20%以上である。破断
伸度の測定法はASTM D638に準じて行う。
The strength and elongation of the straight-chain high molecular weight polyimide are preferably large, and particularly preferably high in elongation at break for a cold and heat resistant cycle, and the elongation at break is preferably 10% or more, more preferably 20% or more. % Or more. The elongation at break is measured according to ASTM D638.

【0046】[0046]

【実施例】次の物を用い実験を行った。EXAMPLE An experiment was conducted using the following.

【0047】主金型:鋼材(S55C)でつくられ、鏡
面状の型表面には0.02mm厚の鏡面状硬質クロムメ
ッキを有する。鋼材の熱伝導率は約0.2cal/cm
・sec・℃である。
Main mold: made of steel (S55C), and has a mirror-like hard chrome plating of 0.02 mm thickness on the mirror-like mold surface. The thermal conductivity of steel is about 0.2 cal / cm
· Sec · ° C.

【0048】ポリイミド:直鎖型ポリイミド前駆体、ポ
リイミドワニス「トレニース#3000」(東レ(株)
商品名)硬化後のポリイミドのTgは300℃、熱伝導
率は0.0005cal/cm・sec・℃、破断伸度
は60%である。
Polyimide: straight-chain polyimide precursor, polyimide varnish "Trenice # 3000" (Toray Industries, Inc.)
(Trade name) The cured polyimide has a Tg of 300 ° C, a thermal conductivity of 0.0005 cal / cm · sec · ° C, and a breaking elongation of 60%.

【0049】ポリイミド被覆金型:主金型表面を十分に
脱脂し、次いで上記ポリイミドを塗布し、120℃→2
10℃→290℃の順に加熱し、この塗布、加熱を5回
繰返してポリイミド層を形成する。次いで、バフにダイ
ヤモンドペーストをつけて研磨を行い、0.11mm厚
の鏡面状直鎖型ポリイミド被覆金型を得る。
Polyimide-coated mold: The surface of the main mold is sufficiently degreased, then the above-mentioned polyimide is applied, and the temperature is reduced to 120 ° C. → 2
Heating is performed in the order of 10 ° C. → 290 ° C., and this application and heating are repeated five times to form a polyimide layer. Next, the buff is polished with a diamond paste to obtain a 0.11 mm-thick mirror-surface linear type polyimide-coated mold.

【0050】回収樹脂:シルバーメタリック塗装された
変性ポリプロピレン製バンパーの回収品を粉砕した物。
Recovered resin: A crushed recovered product of a modified polypropylene bumper coated with silver metallic.

【0051】回収樹脂を、クロムメッキを有する主金型
と、ポリイミド被覆金型を用いて、いずれも金型温度を
30℃にして射出成形を行った。
Using a main mold having chromium plating and a polyimide-coated mold, the recovered resin was subjected to injection molding at a mold temperature of 30 ° C.

【0052】ポリイミド被覆金型で成形した成形品では
塗料片が成形品表面に飛び出すことが少なく、表面平滑
な成形品となった。これに対し、主金型で成形した成形
品では塗料片の一部が成形品表面に飛び出し、成形品表
面も粗面であり、これを商品として使用するためには厚
肉の塗装を必要とした。
In the molded article molded using the polyimide-coated mold, the paint pieces were less likely to jump out onto the molded article surface, and the molded article had a smooth surface. On the other hand, in the molded product molded with the main mold, a part of the paint piece jumps out to the molded product surface, and the molded product surface is also rough, so thick coating is necessary to use this as a product. did.

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 B29K 105:26 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 6 Identification code Agency reference number FI Technical display location B29K 105: 26

Claims (4)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 室温に於ける熱伝導率が0.05cal
/cm・sec・℃以上の金属から成る主金型の型キャ
ビティを形成する型壁面に、熱伝導率が0.002ca
l/cm・sec・℃以下の断執層が0.05〜3mm
厚に設けられた金型を用い、塗膜を有する合成樹脂回
収成形品を原料として用いて成形する回収樹脂の成形
法。
1. The thermal conductivity at room temperature is 0.05 cal.
/Cm.sec..degree. C. or more on the mold wall surface forming the mold cavity of the main mold made of metal having a thermal conductivity of 0.002 ca.
0.05 to 3 mm for a barrier layer of 1 / cm · sec · ° C or less
Using a mold provided in the thickness, molding recovered resin molding using a synthetic resin recovery molded article having a coating skin film as a raw material.
【請求項2】 成形法が射出成形法あるいはブロー成形
法である請求項1の成形法。
2. The molding method according to claim 1, wherein the molding method is an injection molding method or a blow molding method.
【請求項3】 合成樹脂回収成形品がポリオレフィン系
樹脂組成物から成る請求項1又は2の成形法。
3. The molding method according to claim 1, wherein the synthetic resin recovered molded article comprises a polyolefin resin composition.
【請求項4】 断熱層がポリイミドから成る請求項1〜
3のいずれかの成形法。
4. A heat insulating layer comprising a polyimide.
3. The molding method of any one of 3.
JP31554392A 1992-11-02 1992-11-02 Molding method for recovered resin Expired - Fee Related JP2627131B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31554392A JP2627131B2 (en) 1992-11-02 1992-11-02 Molding method for recovered resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31554392A JP2627131B2 (en) 1992-11-02 1992-11-02 Molding method for recovered resin

Publications (2)

Publication Number Publication Date
JPH06143278A JPH06143278A (en) 1994-05-24
JP2627131B2 true JP2627131B2 (en) 1997-07-02

Family

ID=18066615

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31554392A Expired - Fee Related JP2627131B2 (en) 1992-11-02 1992-11-02 Molding method for recovered resin

Country Status (1)

Country Link
JP (1) JP2627131B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7785486B2 (en) 2001-09-14 2010-08-31 Robert Bosch Gmbh Method of etching structures into an etching body using a plasma

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997004938A1 (en) * 1995-07-25 1997-02-13 Asahi Kasei Kogyo Kabushiki Kaisha Process for molding synthetic resins
JP6418619B1 (en) * 2017-10-19 2018-11-07 トーノファインプレーティング株式会社 Mold, mold manufacturing method, resin molding apparatus and molded product molding method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7785486B2 (en) 2001-09-14 2010-08-31 Robert Bosch Gmbh Method of etching structures into an etching body using a plasma

Also Published As

Publication number Publication date
JPH06143278A (en) 1994-05-24

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