JP2617541B2 - Wire bonding equipment - Google Patents
Wire bonding equipmentInfo
- Publication number
- JP2617541B2 JP2617541B2 JP63277845A JP27784588A JP2617541B2 JP 2617541 B2 JP2617541 B2 JP 2617541B2 JP 63277845 A JP63277845 A JP 63277845A JP 27784588 A JP27784588 A JP 27784588A JP 2617541 B2 JP2617541 B2 JP 2617541B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- wire bonding
- bonding apparatus
- metal wire
- tension mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体装置の製造装置に関し、特に、ワイヤ
ーボンディング装置に関する。The present invention relates to a semiconductor device manufacturing apparatus, and more particularly, to a wire bonding apparatus.
従来、半導体装置（IC、LSI、トランジスタ等）の半
導体チップの電極パッドとリードフレームの内部リード
との接続は金やアルミニウムの細線により接続されてい
る。この接続作業を行なうのがワイマーボンディング装
置で、作業効率向上のために、インデックス速度あるい
は接続信頼性等ために種々の改善がなされてきた。2. Description of the Related Art Conventionally, connection between electrode pads of a semiconductor chip of a semiconductor device (IC, LSI, transistor, etc.) and internal leads of a lead frame is connected by a thin wire of gold or aluminum. This connection operation is performed by a Weimmer bonding apparatus, and various improvements have been made to improve the operation efficiency, index speed, connection reliability, and the like.
第３図は従来のワイヤーボンディング装置の側面図、
第４図（ａ）及び（ｂ）は第３図中のBB矢視図である。
ワイヤーボンディング装置の動作を説明すると。まず、
接続ツール２の中心にある穴を通る金属細線（以下ワイ
ヤーと言う）１、例えば、30μｍ程度の直径をもつアル
ミニウム線の先端をトーチロッド３の放電により溶融し
球状に成型し球状部分14を作る。このとき、第４図
（ｂ）に示すように、ワイヤー１が供給されないよう
に、ガイド12のガイド穴13を通過したワイヤー１を、カ
ットクランパ７の両側の突起部11を、図面には示してい
ないが、電磁ソレノイドで動かして挟み固定する。次
に、接続ツール２を支持するボンディングアーム４を移
動させて、接続ツール２を半導体チップの電極パッド
（図示せず）の上に位置決めする。次に、接続ツール２
を下降させ電極パッドにワイヤー１の球状部分14を押つ
け圧着する。次に、第４図（ａ）に示すように、ワイヤ
ー１を挟み固定しているカットクランパ７を緩めて、接
続ツール２を上昇させる。この操作により、ワイヤー１
は電極パッドにワイヤー１の一端を接続し、他端は接続
ツール２を通してスプール９に巻かれたままの状態にな
っている。次に、ボンディングアーム４を移動させ、リ
ードフレーム（図示せず）の内部リードの溶接すべき位
置の上に接続ツール２を位置決めする。このとき、ワイ
ヤーの弛みによりワイヤー１が過剰に供給されないよう
に、ワイヤー１を締付けるフェルトテンション８の摩擦
力と、テンション機構10の二つアーム15とテンション機
構10の中央から矢印Ａの方向に直接ワイヤー１に空気を
吹き付けることによりワイヤー１に張力を働かせ、ワイ
ヤー１の弛み防止を行なう。次に、接続ツール２を下降
させ、リードフレームの内部リードにワイヤー１を圧着
接続する。次に、第４図（ｂ）に示すように、再び、カ
ットクランパ７でワイヤー１を挟み固定した後、接続ツ
ール２を上昇させる。この接続ツール２の上昇力により
ワイヤー１の接続端とカットクランパ７により固定され
た部分との間に張力を働かせることにより、溶接端付近
でワイヤー１を切断する。ここまでの動作により、一つ
の電極パッドとリードフレームの一つの内部リードとを
ワイヤーで接続したことになる。再び、トーチロッッド
の放電によりワイヤー１の先端を球状に成型する。この
一連の操作を複数回繰り返して複数個の電極パッドとリ
ードフレームの内部リードとをワイヤー１で接続して配
線接続作業を完了する。FIG. 3 is a side view of a conventional wire bonding apparatus,
4 (a) and 4 (b) are views as viewed from the direction of the arrows BB in FIG.
The operation of the wire bonding apparatus will be described. First,
The tip of a thin metal wire (hereinafter referred to as a wire) 1 passing through a hole in the center of the connection tool 2, for example, an aluminum wire having a diameter of about 30 μm is melted by the discharge of the torch rod 3 and formed into a spherical shape to form a spherical portion 14. . At this time, as shown in FIG. 4 (b), the wire 1 passing through the guide hole 13 of the guide 12 and the protrusions 11 on both sides of the cut clamper 7 are shown in the drawing so that the wire 1 is not supplied. It is not fixed, but it is moved and fixed with an electromagnetic solenoid. Next, the bonding arm 4 supporting the connection tool 2 is moved to position the connection tool 2 on an electrode pad (not shown) of the semiconductor chip. Next, connection tool 2
Is lowered, and the spherical portion 14 of the wire 1 is pressed against the electrode pad and pressed. Next, as shown in FIG. 4A, the cut clamper 7 holding and fixing the wire 1 is loosened, and the connection tool 2 is raised. By this operation, wire 1
Is connected to one end of the wire 1 to the electrode pad, and the other end is kept wound around the spool 9 through the connection tool 2. Next, the bonding arm 4 is moved, and the connection tool 2 is positioned above the position where the internal lead of the lead frame (not shown) is to be welded. At this time, in order to prevent the wire 1 from being supplied excessively due to the slack of the wire, the frictional force of the felt tension 8 for tightening the wire 1 and the two arms 15 of the tension mechanism 10 and the center of the tension mechanism 10 in the direction of arrow A are directly used. By blowing air on the wire 1, tension is applied to the wire 1 to prevent the wire 1 from being loosened. Next, the connection tool 2 is lowered, and the wire 1 is crimp-connected to the internal lead of the lead frame. Next, as shown in FIG. 4B, the wire 1 is sandwiched and fixed again by the cut clamper 7, and then the connection tool 2 is raised. The wire 1 is cut near the welded end by applying tension between the connection end of the wire 1 and the portion fixed by the cut clamper 7 by the rising force of the connection tool 2. By the operation so far, one electrode pad and one internal lead of the lead frame are connected by the wire. Again, the tip of the wire 1 is formed into a spherical shape by discharging the torch rod. This series of operations is repeated a plurality of times to connect the plurality of electrode pads and the internal leads of the lead frame with the wires 1 to complete the wiring connection operation.
上述したワイヤーボンディング装置では、テンション
機構のワイヤー１に対する空気の吹き付ける方向及び空
気の当る量が常に一定せず、不安定であるため、ワイヤ
ー１の引張力が変動する。ときには、空気がワイヤー１
に充分当らず、操作中に弛むことがしばしば起きる。こ
の弛みがワイヤー１の過剰供給をさせ、電極パッドとリ
ードフレームの内部リードとを接続するワイヤーに弛み
を引起し、この弛んだワイヤーが他の電極やワイヤーに
接触するという問題がある。In the above-described wire bonding apparatus, the direction in which air is blown to the wire 1 by the tension mechanism and the amount of air hit are not always constant, and are unstable, so that the tensile force of the wire 1 fluctuates. Sometimes the air is wire 1
And loosening often occurs during operation. The slack causes the wire 1 to be excessively supplied, causing a slack in the wire connecting the electrode pad and the internal lead of the lead frame, and causing the slack wire to come into contact with another electrode or wire.
本発明の目的は、半導体チップの電極パッドとリード
フレームの内部フレームとを接続するワイヤーに過剰な
弛みを引起さない接続作業が行ない得るワイヤーボンデ
ィグ装置を供給することにある。An object of the present invention is to provide a wire bonding apparatus capable of performing a connection operation that does not cause excessive slack in a wire connecting an electrode pad of a semiconductor chip and an internal frame of a lead frame.
本発明のワイヤーボンディング装置は、半導体装置の
電極パッドとリードフレームとを金属細線で接続を行な
うワイヤーボンディング装置において、前記金属細線を
供給する細孔を有し、前記細孔の出入り口が互いに向き
合うテーパ状に形成され且つ前記部材の前記金属細線の
出口の外周囲がテーパ状に形成される第１の部材と、前
記第１の部材の内部形状と類似の内部形状に形成され且
つ前記第１の部材の前記細孔より大きい細孔を有する第
２の部材と、前記両部材を所定の間隔をもつて前記両部
材の外周囲を包んで固定する外郭部材と、前記外郭部材
の外周囲にあって前記両部材でなる前記間隔の空間に連
なる圧縮空気口が形成されてなるテンション機構を有
し、前記テンション機構が前記金属細線を巻き付けられ
たスプールの後段に位置する前記金属細線締付け機構と
カットクランパとの間に配置されることを含んで構成さ
れる。The wire bonding apparatus of the present invention is a wire bonding apparatus for connecting an electrode pad of a semiconductor device and a lead frame with a thin metal wire, wherein the wire bonding apparatus has a fine hole for supplying the thin metal wire, and a taper whose entrance and exit of the fine hole face each other. A first member having a tapered outer periphery of an outlet of the thin metal wire of the member, and a first member having an inner shape similar to the inner shape of the first member, A second member having pores larger than the pores of the member, a shell member that wraps and fixes the outer members around the outer members at a predetermined interval, and a second member that surrounds the outer members. And a tension mechanism formed with a compressed air port connected to the space defined by the two members, and the tension mechanism is located at a stage subsequent to the spool around which the thin metal wire is wound. Configured to include said arranged between the metal thin wires tightening mechanism and cut clamper to.
次に、本発明について図面を参照して説明する。 Next, the present invention will be described with reference to the drawings.
第１図は本発明の一実施例を示すワイヤーボンディン
グ装置の側面図、第２図はテンション機構のノズルの断
面図である。このワイヤーボンディング装置は、テンシ
ョン機構10を除いたスプール９、フェルトテンション
８、カットクランパ７、ボンディングアーム４及び接続
ツール２は従来例と同じである。第２図に示すように、
テンション機構10はノズル５とそれに接続する空気供給
管16及び空気流量を調節するバルブ６から構成されてい
る。まず、フェルトテンション８のワイヤー１を締付け
るときの摩擦力より小さい程度の張力が生ずる程度に、
外部から供給する空気流量をバルブ６を調整しノズル５
に圧縮空気を供給して、フェルトテンション８とノズル
５間のワイヤー１の弛みを一定にする。次に、ノズル５
の構造を説明すると、第２図に示すように、ノズル５は
中央にワイヤー１よりやや大きめの細孔24が貫通してお
り、この細孔24はワイヤーの直径より10〜60μｍ大きい
直径で開けられている。ワイヤー１の供給側すなわちフ
ェルトテンション８側に大きな口径をもつテーパ状の第
１の吸気孔17をもち、逆側にはより小いさめの口径をも
つテーパ状の、吹き出し口19をもっている。また、ノズ
ル５の外郭筒20中央の側面には、空気入口管16が取付け
られており、ノズル５の外郭筒20の内側に接するように
形成された溝21に通じている。溝21の一端はノズル５の
中央に位置するテーパ状の排気口18の側壁となり、他端
は第２の吸気口22の側壁に連なるように形成されてい
る。次に、ノズル５の作用を説明すると、まず、空気入
口管16より圧縮空気を導入すると、空気の流れは矢印Ｃ
から溝21を通り、矢印Ｄの方向に流れ、細孔24よりやや
大きめの穴23を矢印Ｅの方向に流れて吹き出し口19に排
出される。空気が矢印Ｃから矢印Ｅに流れることによ
り、第１の吸気孔17と吹き出し口19との間に圧力差が生
じ、空気は矢印Ｆの方向に導入され、導入された空気
は、細孔24を通り、排気口18を抜けて、矢印Ｃからの空
気と合流して吹き出し口19に排出される。この空気の流
体抵抗によりワイヤー１は常に空気の流れの方向に一定
の力で引張られるので、ノズル５によりフェルトエンシ
ョン８と接続ツール２との間のワイヤー１は常に一定の
引張力で張られていることになる。FIG. 1 is a side view of a wire bonding apparatus showing an embodiment of the present invention, and FIG. 2 is a sectional view of a nozzle of a tension mechanism. In this wire bonding apparatus, a spool 9, a felt tension 8, a cut clamper 7, a bonding arm 4, and a connection tool 2 excluding a tension mechanism 10 are the same as those in the conventional example. As shown in FIG.
The tension mechanism 10 includes a nozzle 5, an air supply pipe 16 connected to the nozzle 5, and a valve 6 for adjusting an air flow rate. First, to the extent that a tension smaller than the frictional force when tightening the wire 1 of the felt tension 8 is generated,
The air flow supplied from outside is adjusted by the valve 6 and the nozzle 5
Compressed air is supplied to the wire to make the slack of the wire 1 between the felt tension 8 and the nozzle 5 constant. Next, nozzle 5
As shown in FIG. 2, the nozzle 5 has a hole 24 slightly larger than the wire 1 penetrating the center of the nozzle 5, and the hole 24 is opened at a diameter 10 to 60 μm larger than the diameter of the wire. Have been. On the supply side of the wire 1, that is, on the felt tension 8 side, there is a tapered first intake hole 17 having a large diameter, and on the opposite side, a tapered outlet 19 having a smaller diameter. An air inlet pipe 16 is attached to the center side surface of the outer cylinder 20 of the nozzle 5, and communicates with a groove 21 formed to be in contact with the inside of the outer cylinder 20 of the nozzle 5. One end of the groove 21 is formed as a side wall of the tapered exhaust port 18 located at the center of the nozzle 5, and the other end is formed so as to be continuous with the side wall of the second intake port 22. Next, the operation of the nozzle 5 will be described. First, when compressed air is introduced from the air inlet pipe 16, the flow of air
Then, it flows through the groove 21 in the direction of arrow D, flows through the hole 23 slightly larger than the pore 24 in the direction of arrow E, and is discharged to the outlet 19. When the air flows from the arrow C to the arrow E, a pressure difference is generated between the first intake hole 17 and the outlet 19, and the air is introduced in the direction of the arrow F. Through the exhaust port 18, merges with the air from the arrow C and is discharged to the outlet 19. Since the wire 1 is always pulled by a constant force in the direction of the air flow due to the fluid resistance of the air, the wire 1 between the felt end 8 and the connection tool 2 is always drawn by the nozzle 5 with a constant pulling force. Will be.
以上説明したように本発明のワイヤーボンディング装
置は、ワイヤー給出するスプールとワイヤーを接続固定
する接続ツール間に、ワイヤーに一定の流体抵抗力によ
る引張力を与えるテンション機構を設けて、ワイヤーの
弛みをなくすことが出来るので、半導体チップの電極パ
ッドとリードフレームの内部リードの接続線に過剰な弛
み起さないで配線接続出来るワイヤーボンディング装置
が得られるという効果がある。As described above, the wire bonding apparatus of the present invention is provided with a tension mechanism that applies a tensile force due to a constant fluid resistance to a wire between a spool that feeds the wire and a connection tool that connects and fixes the wire. Therefore, there is an effect that a wire bonding apparatus capable of performing wiring connection without excessively loosening the connection line between the electrode pad of the semiconductor chip and the internal lead of the lead frame can be obtained.
第１図は本発明の一実施例を示すワイヤーボンディング
装置の側面図、第２図はテンション機構のノズルの断面
図、第３図は従来のワイヤーボンディング装置の側面
図、第４図（ａ）及び（ｂ）は第３図中のBB矢視図であ
る。FIG. 1 is a side view of a wire bonding apparatus showing one embodiment of the present invention, FIG. 2 is a sectional view of a nozzle of a tension mechanism, FIG. 3 is a side view of a conventional wire bonding apparatus, and FIG. And (b) is a view on arrow BB in FIG.
Claims (1)
とを金属細線で接続を行なうワイヤーボンディング装置
において、前記金属細線を供給する細孔を有し、前記細
孔の出入り口が互いに向き合うテーパ状に形成され且つ
前記部材の前記金属細線の出口の外周囲がテーパ状に形
成される第１の部材と、前記第１の部材の内部形状と類
似の内部形状に形成され且つ前記第１の部材の前記細孔
より大きい細孔を有する第２の部材と、前記両部材を所
定の間隔をもつて前記両部材の外周囲を包んで固定する
外郭部材と、前記外郭部材の外周囲にあって前記両部材
でなる前記間隔の空間に連なる圧縮空気口が形成されて
なるテンション機構を有し、前記テンション機構が前記
金属細線を巻き付けられたスプールの前段に位置する前
記金属細線締付け機構とカットクンランパとの間に配置
されることを特徴とするワイヤーボンディング装置。1. A wire bonding apparatus for connecting an electrode pad of a semiconductor device and a lead frame with a thin metal wire, wherein the wire bonding device has a fine hole for supplying the fine metal wire, and the entrance and exit of the fine hole are formed in a tapered shape facing each other. A first member having a tapered outer periphery of an outlet of the thin metal wire of the member, and an inner shape similar to the inner shape of the first member, and A second member having pores larger than the pores, an outer member for wrapping and fixing the outer members at predetermined intervals, and an outer member surrounding the outer members; A tension mechanism having a compressed air port formed in the space formed by the members, wherein the tension mechanism is positioned in front of a spool around which the metal wire is wound; Wire bonding apparatus characterized by being arranged between the structure and the cut Kun clamper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63277845A JP2617541B2 (en) | 1988-11-01 | 1988-11-01 | Wire bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63277845A JP2617541B2 (en) | 1988-11-01 | 1988-11-01 | Wire bonding equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02122639A JPH02122639A (en) | 1990-05-10 |
| JP2617541B2 true JP2617541B2 (en) | 1997-06-04 |
Family
ID=17589070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63277845A Expired - Lifetime JP2617541B2 (en) | 1988-11-01 | 1988-11-01 | Wire bonding equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2617541B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6595400B2 (en) | 2000-08-22 | 2003-07-22 | Kabushiki Kaisha Shinkawa | Wire bonding apparatus |
| WO2011077681A1 (en) * | 2009-12-25 | 2011-06-30 | アダマンド工業株式会社 | Air tension apparatus |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002083837A (en) * | 2000-09-07 | 2002-03-22 | Shinkawa Ltd | Wire bonding apparatus |
-
1988
- 1988-11-01 JP JP63277845A patent/JP2617541B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6595400B2 (en) | 2000-08-22 | 2003-07-22 | Kabushiki Kaisha Shinkawa | Wire bonding apparatus |
| WO2011077681A1 (en) * | 2009-12-25 | 2011-06-30 | アダマンド工業株式会社 | Air tension apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02122639A (en) | 1990-05-10 |
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