JP2603022Y2 - Printed circuit board transmission line - Google Patents
Printed circuit board transmission lineInfo
- Publication number
- JP2603022Y2 JP2603022Y2 JP1990044363U JP4436390U JP2603022Y2 JP 2603022 Y2 JP2603022 Y2 JP 2603022Y2 JP 1990044363 U JP1990044363 U JP 1990044363U JP 4436390 U JP4436390 U JP 4436390U JP 2603022 Y2 JP2603022 Y2 JP 2603022Y2
- Authority
- JP
- Japan
- Prior art keywords
- ground
- lines
- signal
- line
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Description
【考案の詳細な説明】 「産業上の利用分野」 この考案はプリント基板に設けられ、互いに独立した
複数の伝送路よりなるプリント基板伝送路に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a printed circuit board transmission line provided on a printed circuit board and comprising a plurality of transmission lines independent of each other.
「従来の技術」 従来のプリント基板伝送路としては第５図に示すよう
にプリント基板にストリップライン構造の伝送線を形成
していた。第５図は多層基板の場合で誘電体層11,12間
に平行した信号線131,132,133が形成され、誘電体層11,
12の互いの外側にそれぞれ全面にわたって接地層14,15
が形成され、更に接地層15の他面に誘電体層16が形成さ
れ、誘電体層16に信号線134が形成され、これを挟んで
誘電体層17が形成され、誘電体層17の外側に全面にわた
って接地層18が形成されている。信号線131,132,133は
それぞれ接地層14,15と共に独立した３本のストリップ
伝送路を構成している。[Prior Art] As a conventional printed circuit board transmission line, a transmission line having a strip line structure is formed on a printed circuit board as shown in FIG. FIG. 5 shows a case of a multilayer substrate in which signal lines 13 1 , 13 2 , and 13 3 are formed in parallel between the dielectric layers 11 and 12, and the dielectric layers 11 and 13 are formed.
Ground layers 14 and 15 over the entire surface outside of each other
There is formed, further dielectric layer 16 is formed on the other surface of the ground layer 15, the signal line 13 4 is formed in the dielectric layer 16, dielectric layer 17 is formed across this dielectric layer 17 A ground layer 18 is formed over the entire surface on the outside. The signal lines 13 1 , 13 2 , and 13 3 together with the ground layers 14 and 15 constitute three independent strip transmission lines.
この従来のプリント基板伝送路においては共通の接地
層14,15間における信号線131,132,133の間隔が接近する
と隣接信号線間で信号干渉が発生する。このため信号線
の密度を上げることができなかった。In this conventional printed board transmission path signal interference occurs between the common signal line 13 1 between the ground layers 14 and 15, 13 2, 13 the spacing 3 approaches the adjacent signal lines. For this reason, the density of signal lines could not be increased.
この問題を解決するために、第６図に示すように信号
線131と132との間、信号線132と133との間にそれぞれ接
地線19を各信号線と平行に設けて、これら接地線19を接
地層14,15と同電位とすることが考えられる。このよう
にすれば確に隣接信号線間の信号干渉が小さくなり、信
号線の間隔を第６図に示した従来のものよりも小さくす
ることができる。しかし接地層14,15は厚さが薄いため
抵抗をもっており、各部が完全な接地電位とはならず、
信号線131,132,133をそれぞれ流れる信号に応じて接地
層14,15にそれぞれ電流が流れ、その電流により接地層1
4,15の各部の電位が変動し、接地層14,15を介して隣接
信号線間で信号干渉が生じる。To solve this problem, between the signal line 13 1 and 13 2 as shown in FIG. 6, each ground line 19 between the signal line 13 2 and 13 3 provided in parallel with the signal lines It is conceivable that these ground lines 19 have the same potential as the ground layers 14 and 15. In this way, the signal interference between adjacent signal lines is reduced, and the distance between the signal lines can be made smaller than that of the conventional signal line shown in FIG. However, since the ground layers 14 and 15 are thin and have resistance, each part does not have a complete ground potential,
A current flows through the ground layers 14 and 15 according to signals flowing through the signal lines 13 1 , 13 2 and 13 3 , respectively, and the current causes
The potentials of the portions 4 and 15 fluctuate, and signal interference occurs between adjacent signal lines via the ground layers 14 and 15.
このような点より第１図に示す伝送路を考えた。即ち
誘電体層11,12間に挟まれて信号線131、132が平行に形成
され、これら信号線131,132とそれぞれ誘電体層11,12を
介して対向した接地層141,142,151,152が形成される。
接地層141,142,151,152の各幅は信号線131,132の各幅よ
りも大であり、例えば７倍であり、また接地層141,142
間、接地層151,152間はそれぞれ互いに分離されてい
る。接地層141及び151間、接地層142及び152間はそれぞ
れ一般には電気的に同電位、つまり接地電位とされる。From such a point, the transmission path shown in FIG. 1 was considered. That is, the signal lines 13 1 and 13 2 are formed in parallel between the dielectric layers 11 and 12, and the ground layers 14 1 and 13 2 are opposed to the signal lines 13 1 and 13 2 via the dielectric layers 11 and 12, respectively. , 14 2 , 15 1 , 15 2 are formed.
The width of each of the ground layers 14 1 , 14 2 , 15 1 and 15 2 is larger than the width of each of the signal lines 13 1 and 13 2 , for example, seven times, and the width of the ground layers 14 1 and 14 2
During, between the ground layer 15 1, 15 2 are respectively separated from each other. Between the ground layer 14 1 and 15 1, electrically the same potential are each between ground layers 14 2 and 15 2 generally, that is, the ground potential.
この伝送路によれば接地層が信号線ごとに互いに分離
されているため接地層を通じて隣接信号線間で信号干渉
が生じるおそれはない。従って信号線間隔を小さくする
ことができる。またこの各伝送路の特性インピーダンス
は幾可学形状で決まり、所望の値のものを容易に作るこ
とができる。According to this transmission line, since the ground layer is separated from each other for each signal line, there is no possibility that signal interference will occur between adjacent signal lines through the ground layer. Therefore, the signal line interval can be reduced. The characteristic impedance of each transmission line is determined by some geometrical shape, and a desired value can be easily formed.
然し実際にはこの第１図に示した伝送路でも、特に周
波数が高くなると、隣接信号線間の信号干渉を十分に除
去することは困難であることが判明した。In practice, however, it has been found that it is difficult to sufficiently remove signal interference between adjacent signal lines even with the transmission line shown in FIG. 1, particularly when the frequency is increased.
「課題を解決するための手段」 この考案によるプリント基板伝送路は、間隔をおいて
平行に配列された複数の棒状の信号線と、上記信号線の
両側に上記信号線の幅のほぼ２倍の間隔をおいて配列さ
れ、上記信号線とほぼ同じ幅を有する複数対の接地線
と、上記複数対の接地線と上記複数の信号線とを共通に
内側に挟む第１、第２誘電体層と、上記各信号線とその
両側の対をなす上記接地線のその信号線の反対側の端縁
間の長さとほぼ同じ幅とされ、互いに平行に配列され、
上記第１、第２誘電体層を介して対向して設けられた複
数の第１、第２接地層と、上記第１又は第２誘電体層の
外側と、他の平行する複数の伝送路を構成する層の第１
又は第２誘電体層の外側との間に設けられた第３誘電体
層とよりなり、上記各信号線と、その両側の対をなす上
記接地線及び上下の対をなす上記第１、第２接地層毎
に、それぞれ独立した伝送路が構成されている。[Means for Solving the Problems] The printed circuit board transmission line according to the present invention includes a plurality of bar-shaped signal lines arranged in parallel at intervals, and approximately twice the width of the signal lines on both sides of the signal lines. And a plurality of pairs of ground lines having substantially the same width as the signal lines, and first and second dielectrics sandwiching the plurality of pairs of ground lines and the plurality of signal lines inward in common. Layer, each signal line and the ground line forming a pair on both sides thereof have a width substantially equal to the length between the opposite edges of the signal line, and are arranged in parallel with each other;
A plurality of first and second ground layers provided to face each other with the first and second dielectric layers interposed therebetween, an outside of the first or second dielectric layer, and a plurality of other parallel transmission paths; The first of the layers constituting
Or a third dielectric layer provided between the outside of the second dielectric layer, the signal lines, the ground lines forming pairs on both sides thereof, and the first and second pairs forming upper and lower pairs. Independent transmission lines are formed for each two ground layers.
「実施例」 本願考案は上記のような接地層を介した隣接信号線間
の信号干渉を小さくするための改良された接地層と、隣
接信号線間の信号干渉を小さくするための接地線とを総
合することにより、従来実現されていなかったプリント
基板伝送路を提供するものである。"Embodiment" The present invention relates to an improved ground layer for reducing signal interference between adjacent signal lines through the ground layer as described above, and a ground line for reducing signal interference between adjacent signal lines. Are provided to provide a printed circuit board transmission line that has not been realized conventionally.
第２図はこの考案の実施例を示し、第１図、第５図と
対応する部分に同一符号を付けてある。この例は多層配
線の場合で接地層151,152の外側に誘電体層21が形成さ
れ、更にその誘電体層21の外側に誘電体層16,17が順次
形成され、誘電体層16,17間に信号線134が形成され、そ
の信号線134と誘電体層16,17をそれぞれ介して対向し、
信号線134よりも幅の広い接地層22,23がそれぞれ形成さ
れている。この第２図の実施例では第１図に示したもの
よりも更に信号間干渉を小さくするものであって、各信
号線131,132,134の各両側にそれぞれその信号線と平行
に接地線241 251,242 252,244 254が設けられる。この
例では接地線241 251，は接地層141,151間にあり、かつ
これら接地線、接地層は互いに同電位とされ、同様に接
地線242 252,244 254はそれぞれ接地層142,152間、接地
層22,23間にあり、これら接地線、接地層の互いに対向
するものはそれぞれ同電位とされる。FIG. 2 shows an embodiment of the present invention, in which parts corresponding to those in FIGS. 1 and 5 are denoted by the same reference numerals. This example is a case of a multilayer wiring, in which a dielectric layer 21 is formed outside the ground layers 15 1 and 15 2 , and dielectric layers 16 and 17 are sequentially formed outside the dielectric layer 21. , the signal line 13 4 is formed between 17, the signal line 13 4 and the dielectric layers 16, 17 opposed to each other with each
Wide ground layers 22 and 23 in width than the signal line 13 4 are respectively formed. In the embodiment of Figure 2 be one which reduces the further signal interference than that shown in FIG. 1, respectively parallel to the signal line to each on both sides of each signal line 13 1, 13 2, 13 4 ground line 24 1 25 1, 24 2 25 2, 24 4 25 4 is provided. Ground line 24 1 25 1 In this example, is between the ground layer 14 1, 15 1, and these grounding lines, the ground layer is the same potential, similarly ground line 24 2 25 2, 24 4 25 4 each ground layer 14 2, 15 between 2, located between the ground layers 22 and 23, these grounding lines, are respectively intended to face each other in the ground layer the same potential.
この構成においては、例えば信号線131について見れ
ば、接地電位にある接地層141,151、接地線241,251でほ
ぼ囲まれているから、接地層と接地線との間の間隔が信
号線13１の伝送信号の波長より十分小さければ第３図に
示す同軸も伝送路と等価となり、隣接信号線間の信号間
干渉が一層小さくなり、それだけ信号線間隔を小さくす
ることができる。例えば接地層141,142,151,152の各幅W
1を1.5ミリ、接地層141,142の中心間隔D1を２ミリ、信
号線131、接地線241,251の各幅を0.2ミリとした場合、
第６図に示した従来のもので信号線131 132の中心間隔
を２ミリとした場合と比較して信号間干渉を約４分の１
以下にすることができた。In this configuration, for example, if you look at the signal line 13 1, the ground layer 14 1, 15 1 in the ground potential, because they are surrounded almost ground line 24 1, 25 1, between the ground line and the ground layer spacing also coaxial shown in Figure 3 is sufficiently smaller than the wavelength of the transmission signal of the signal line 13 1 becomes a transmission path equivalent, that the signal interference between adjacent signal line is further reduced to correspondingly reduce the signal line spacing it can. For example, each width W of the ground layers 14 1 , 14 2 , 15 1 , 15 2
1 is 1.5 mm, the center interval D 1 between the ground layers 14 1 and 14 2 is 2 mm, and the width of each of the signal line 13 1 and the ground lines 24 1 and 25 1 is 0.2 mm.
Sixth signal line 13 in which figure the conventional indicated 1 13 1 compared to inter-signal interference in the case where 2 of the center distance was 2 millimeters to about 4 minutes
I was able to:
第４図に１つの信号線131についてのみ示している
が、接地線241,251と接地層141,151との各間にそれぞれ
更に接地線26を設けてもよい。なお、接地層、接地線は
各信号線ごとにその伝送路の途中で他と完全に分離され
ていればよく、伝送路の一端または両端で複数の伝送路
の接地層が互いに接続されていてもよい。It is shown only for one signal line 13 1 in FIG. 4, the grounding line 24 1, 25 1 and the ground layer 14 1, 15 respectively may be further provided a ground line 26 between 1 and each of the. The ground layer and the ground line need only be completely separated from each other in the middle of the transmission line for each signal line, and the ground layers of a plurality of transmission lines are connected to each other at one end or both ends of the transmission line. Is also good.
「考案の効果」 以上述べたようにこの考案によれば各信号線ごとに接
地層が分離されているため、接地層を介して信号間干渉
が生じるおそれがなく、また接地線により隣接信号線間
の信号干渉は小さくなる。更に信号線と左右の接地線及
び上下の接地層とで構成される伝送路は、十分高い周波
数において遮蔽特性が同軸ケーブルと等価となり、信号
線間の信号干渉を更に小さくすることができる。このよ
うな構成をすることにより信号間干渉の少いプリント基
板伝送路とすることができ、また伝送路の間隔を小さく
することができる。更に形状が比較的単純であるから所
望の特性インピーダンスのものとすることも容易であ
る。[Effects of the Invention] As described above, according to the present invention, since the ground layer is separated for each signal line, there is no possibility of interference between signals through the ground layer, and the adjacent signal line is connected by the ground line. The signal interference between them is small. Further, the transmission line composed of the signal line, the left and right ground lines, and the upper and lower ground layers has a shielding characteristic equivalent to a coaxial cable at a sufficiently high frequency, so that signal interference between the signal lines can be further reduced. With such a configuration, a printed circuit board transmission line with less inter-signal interference can be provided, and the interval between the transmission lines can be reduced. Further, since the shape is relatively simple, it is easy to obtain a desired characteristic impedance.
【図面の簡単な説明】 第１図は提案されている分割された接地層を持つプリン
ト基板伝送路を示す斜視図、第２図はこの考案の実施例
の一部を示す斜視図、第３図は第２図中の１本の信号線
に対する伝送路と等価な同軸伝送路を示す断面図、第４
図はこの考案の更に他の実施例の一部を示す断面図、第
５図は従来のプリント基板伝送路の一部を示す斜視図、
第６図は提案されている接地線を持つプリント基板伝送
路を示す斜視図である。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a proposed printed circuit board transmission line having a divided ground layer, FIG. 2 is a perspective view showing a part of an embodiment of the present invention, FIG. FIG. 4 is a sectional view showing a coaxial transmission line equivalent to a transmission line for one signal line in FIG.
FIG. 5 is a cross-sectional view showing a part of another embodiment of the present invention, FIG. 5 is a perspective view showing a part of a conventional printed circuit board transmission line,
FIG. 6 is a perspective view showing a proposed printed circuit board transmission line having a ground line.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平１−277003（ＪＰ，Ａ) 特開 平２−87701（ＪＰ，Ａ) 特開 昭62−259500（ＪＰ，Ａ) 特開 昭56−158502（ＪＰ，Ａ) 特開 昭57−143901（ＪＰ，Ａ) ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-1-277003 (JP, A) JP-A-2-87701 (JP, A) JP-A-62-259500 (JP, A) JP-A-56- 158502 (JP, A) JP-A-57-143901 (JP, A)
Claims (1)
の信号線と、 上記信号線の両側に上記信号線の幅のほぼ２倍の間隔を
おいて配列され、上記信号線とほぼ同じ幅を有する複数
対の接地線と、 上記複数の信号線と上記複数対の接地線とを共通に内側
に挟む第１、第２誘電体層と、 上記各信号線とその両側の対をなす上記接地線のその信
号線の反対側の端縁間の長さとほぼ同じ幅とされ、互い
に平行に配列され、上記第１、第２誘電体層を介して対
向して設けられた複数の第１、第２接地層と、 上記第１又は第２誘電体層の外側と、他の平行する複数
の伝送路を構成する層の第１又は第２誘電体層の外側と
の間に設けられた第３誘電体層とよりなり、 上記各信号線と、その両側の対をなす上記接地線及び上
下の対をなす上記第１、第２接地層毎に、それぞれ独立
した伝送路が構成されているプリント基板伝送路。1. A plurality of bar-shaped signal lines arranged in parallel at an interval, and arranged on both sides of the signal line at an interval substantially twice as large as the width of the signal line. A plurality of pairs of ground lines having the same width; first and second dielectric layers sandwiching the plurality of signal lines and the plurality of pairs of ground lines in common; and a pair of the signal lines and both sides thereof A plurality of the ground lines are formed so as to have a width substantially equal to the length between the opposite edges of the signal line, arranged in parallel with each other, and provided to face each other with the first and second dielectric layers interposed therebetween. First and second ground layers, provided between the outside of the first or second dielectric layer and the outside of the first or second dielectric layer of other layers constituting a plurality of parallel transmission paths. The signal lines, the ground lines forming pairs on both sides thereof, and the first and second pairs forming upper and lower pairs. For each stratum, a printed circuit board transmission lines independent transmission path is configured.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990044363U JP2603022Y2 (en) | 1990-04-25 | 1990-04-25 | Printed circuit board transmission line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990044363U JP2603022Y2 (en) | 1990-04-25 | 1990-04-25 | Printed circuit board transmission line |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH044405U JPH044405U (en) | 1992-01-16 |
| JP2603022Y2 true JP2603022Y2 (en) | 2000-02-14 |
Family
ID=31557597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990044363U Expired - Lifetime JP2603022Y2 (en) | 1990-04-25 | 1990-04-25 | Printed circuit board transmission line |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2603022Y2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8288657B2 (en) * | 2009-10-12 | 2012-10-16 | International Business Machines Corporation | Noise coupling reduction and impedance discontinuity control in high-speed ceramic modules |
| JP2013510407A (en) * | 2009-11-06 | 2013-03-21 | モレックス インコーポレイテド | Multilayer circuit member and assembly therefor |
| JP2013089841A (en) * | 2011-10-20 | 2013-05-13 | Kyocer Slc Technologies Corp | Wiring board |
| JP7400941B2 (en) * | 2020-03-11 | 2023-12-19 | 株式会社村田製作所 | resin multilayer board |
| JPWO2023037852A1 (en) * | 2021-09-07 | 2023-03-16 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56158502A (en) * | 1980-05-12 | 1981-12-07 | Junkosha Co Ltd | Strip line |
| JPS57143901A (en) * | 1981-02-27 | 1982-09-06 | Junkosha Co Ltd | Strip line |
-
1990
- 1990-04-25 JP JP1990044363U patent/JP2603022Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH044405U (en) | 1992-01-16 |
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Legal Events
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| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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| EXPY | Cancellation because of completion of term |