JP2600178B2 - Electronic circuit device - Google Patents
Electronic circuit deviceInfo
- Publication number
- JP2600178B2 JP2600178B2 JP16451887A JP16451887A JP2600178B2 JP 2600178 B2 JP2600178 B2 JP 2600178B2 JP 16451887 A JP16451887 A JP 16451887A JP 16451887 A JP16451887 A JP 16451887A JP 2600178 B2 JP2600178 B2 JP 2600178B2
- Authority
- JP
- Japan
- Prior art keywords
- metal case
- electronic circuit
- resin
- circuit device
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Casings For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は車載用部品等の電子回路装置に関するもので
ある。Description: TECHNICAL FIELD The present invention relates to an electronic circuit device such as a vehicle-mounted component.
従来の技術 従来、この種の電子回路装置としては、第3図,第4
図に示すように構成されていた。すなわち、第3図,第
4図において、21はプリント基板22に抵抗,コンデンサ
等の電子部品23,トランジスタ等の発熱部品24を実装
し、所定の電気配線を行って構成した電子回路本体であ
り、この電子回路本体21には、リード線25が接続されて
いる。この電子回路本体21は、外面に放熱用のフィン26
aを有する有底状のダイキャスト成型よりなる金属ケー
ス26内に収納され、そしてこの金属ケース26内に熱硬化
性の樹脂27が充填されている。なお、電子回路本体21の
リード線25は金属ケース26の側面に嵌合した保持板28に
より保持され、外部に引出されている。2. Description of the Related Art Conventionally, as this type of electronic circuit device, FIGS.
The configuration was as shown in the figure. That is, in FIGS. 3 and 4, reference numeral 21 denotes an electronic circuit main body configured by mounting electronic components 23 such as resistors and capacitors and heat generating components 24 such as transistors on a printed circuit board 22 and performing predetermined electrical wiring. A lead wire 25 is connected to the electronic circuit main body 21. The electronic circuit body 21 has a radiating fin 26 on its outer surface.
The metal case 26 is housed in a metal case 26 made of a bottomed die-cast molding having a, and the metal case 26 is filled with a thermosetting resin 27. The lead wire 25 of the electronic circuit main body 21 is held by a holding plate 28 fitted on the side surface of the metal case 26, and is led out.
発明が解決しようとする問題点 このような従来の装置の場合、金属ケース26の開口部
側が機器への取付け部となり、樹脂面側部が機器に接す
るため、放熱効率が悪く、また組立時、電子回路本体21
部分を構成した後金属ケース26内に収納し、樹脂27を充
填するというように、1個1個の組立となり、生産性が
悪く、量産が難しく低価格化が困難であるという問題が
あった。Problems to be Solved by the Invention In the case of such a conventional device, the opening side of the metal case 26 serves as a mounting portion to the device, and the resin surface side portion is in contact with the device. Electronic circuit body 21
After the parts are configured, they are housed in a metal case 26 and filled with a resin 27, so that they are assembled one by one, and there is a problem that productivity is poor, mass production is difficult, and cost reduction is difficult. .
本発明はこのような問題点を解決するもので、生産性
の向上を図ることを目的としている。The present invention has been made to solve such a problem, and has as its object to improve productivity.
問題点を解決するための手段 この問題点を解決するために本発明は、押出成形によ
り形成されかつ外面に押出方向と平行になるように複数
のフィンを形成したU字状の金属ケース内に、リード端
子を有する電気回路本体を挿入配置し、金属ケース内部
に樹脂を充填し、かつ金属ケースに複数個の気孔を設け
たものである。Means for Solving the Problems In order to solve this problem, the present invention provides a U-shaped metal case formed by extrusion and having a plurality of fins formed on an outer surface thereof so as to be parallel to the extrusion direction. An electric circuit body having lead terminals is inserted and arranged, a metal case is filled with resin, and a plurality of pores are provided in the metal case.
作 用 この構成により、長尺の金属ケース部材を準備し、そ
の金属ケース部材内に複数の電子回路本体を挿入配置
し、樹脂を充填した後、個々に分割するか、または長尺
の金属ケース部材から金属ケースを得た後、電子回路本
体を挿入配置し、樹脂を充填すればよく、高い生産性が
得られる。また、U字状の金属ケースの一面が機器への
取付け部となり、従来のように樹脂部が取付け部となる
場合に比べ、放熱効率が良好となる。According to this configuration, a long metal case member is prepared, a plurality of electronic circuit bodies are inserted and arranged in the metal case member, and after filling with resin, the electronic circuit bodies are individually divided or the long metal case member is separated. After obtaining the metal case from the member, the electronic circuit main body may be inserted and arranged and filled with resin, and high productivity can be obtained. Further, one surface of the U-shaped metal case serves as a mounting portion to the device, and the heat radiation efficiency is improved as compared with the conventional case where the resin portion serves as the mounting portion.
さらに、金属ケースの気孔により、放熱性が良好とな
る。Further, the heat dissipation is improved by the pores of the metal case.
実施例 以下、本発明の一実施例を示す第1図及び第2図の図
面を用いて説明する。Embodiment Hereinafter, an embodiment of the present invention will be described with reference to FIGS. 1 and 2. FIG.
第1図,第2図に本発明の一実施例による電子回路装
置を示しており、図において、1は電子回路本体であ
り、プリント基板2にコンデンサ,抵抗等の電子部品3
とトランジスタ等の発熱部品4を実装し、所定の電気配
線を行うことにより構成されている。また、プリント基
板2には、外部機器との接続用の板状のリード端子5が
半田付け等により直接接続固定されている。1 and 2 show an electronic circuit device according to one embodiment of the present invention. In the drawings, reference numeral 1 denotes an electronic circuit main body, and a printed circuit board 2 has electronic components 3 such as capacitors and resistors.
And a heat-generating component 4 such as a transistor. A plate-like lead terminal 5 for connection to an external device is directly connected and fixed to the printed circuit board 2 by soldering or the like.
6は押出成型により形成した両端面及び底面が開放し
たU字状の金属ケースであり、この金属ケース6の外面
において、一側面及び上面には押出成型時の押出方向と
平行になるように、複数の放熱用のフィン6aが一体に設
けられている。この金属ケース6内に前記電子回路本体
1が、リード端子5が金属ケース6の底面開口部より外
部に突出するように挿入配置されている。Reference numeral 6 denotes a U-shaped metal case formed by extrusion and having open ends and a bottom surface. On the outer surface of the metal case 6, one side surface and the upper surface are parallel to the extrusion direction at the time of extrusion. A plurality of heat dissipating fins 6a are provided integrally. The electronic circuit body 1 is inserted and arranged in the metal case 6 such that the lead terminals 5 protrude outside from the bottom opening of the metal case 6.
また、この金属ケース6の内面のフィン6aと相対する
位置には、フィン6aと平行になるようにフィン6aに沿っ
て複数の溝6bが設けられ、さらに金属ケース6内の上面
部には、前記電子回路本体1の発熱部品4の放熱部が嵌
合する凹部を形成する突出壁6cが設けられている。Further, a plurality of grooves 6b are provided along the fins 6a at positions on the inner surface of the metal case 6 facing the fins 6a so as to be parallel to the fins 6a. A protruding wall 6c is provided which forms a recess into which the heat radiating portion of the heat generating component 4 of the electronic circuit body 1 is fitted.
さらに金属ケース6のU字状を形成している壁の肉厚
部には、複数個の気孔9が設けられ、放熱効果を更に高
める役割を果している。Further, a plurality of pores 9 are provided in a thick portion of the U-shaped wall of the metal case 6 to play a role of further improving the heat radiation effect.
また金属ケース6のフィン6aを形成していない一側面
には、この側面を上面側に延長した取付部7が設けられ
ており、外部機器への取付部はこの側面側となり、ボル
トとナット等により取付けられる。On one side surface of the metal case 6 where the fins 6a are not formed, there is provided a mounting portion 7 extending this side surface to the upper surface side. Mounted by
8は金属ケース6内に注入される熱硬化性の樹脂であ
り、電子回路本体1の保護,防水や放熱補助の役目を果
している。Reference numeral 8 denotes a thermosetting resin injected into the metal case 6 and serves to protect the electronic circuit body 1, waterproof, and assist heat radiation.
発明の効果 以上のように本発明によれば、押出成型により長尺の
金属ケース部材を準備し、その金属ケース部材内に複数
の電子回路本体を挿入配置し、樹脂を充填した後、完成
品として個々に分割するか、または長尺の金属ケース部
材から個々の金属ケースを得た後、電子回路本体を挿入
配置し、樹脂を充填することができ、高い生産性で電子
回路装置を得ることができ、また金属ケースのU字状壁
肉厚部に複数個の気孔を有していることから放熱効果を
高めることができる。Effects of the Invention As described above, according to the present invention, a long metal case member is prepared by extrusion molding, a plurality of electronic circuit bodies are inserted and arranged in the metal case member, and after filling with resin, a finished product is formed. After individually dividing or obtaining individual metal cases from a long metal case member, the electronic circuit body can be inserted and arranged, filled with resin, and an electronic circuit device can be obtained with high productivity. In addition, since the metal case has a plurality of pores in the U-shaped wall thick portion, the heat radiation effect can be enhanced.
第1図は本発明の一実施例による電子回路装置を一部を
切欠いて示す斜視図、第2図は同断面図、第3図及び第
4図は従来の電子回路装置を示す斜視図及び断面図であ
る。 1……電子回路本体、2……プリント基板、3……電子
部品、4……発熱部品、5……リード端子、6……金属
ケース、6a……フィン、8……樹脂、9……気孔。FIG. 1 is a partially cutaway perspective view showing an electronic circuit device according to an embodiment of the present invention, FIG. 2 is a sectional view of the same, FIGS. 3 and 4 are perspective views showing a conventional electronic circuit device, and It is sectional drawing. DESCRIPTION OF SYMBOLS 1 ... Electronic circuit main body, 2 ... Printed circuit board, 3 ... Electronic component, 4 ... Heat-generating component, 5 ... Lead terminal, 6 ... Metal case, 6a ... Fin, 8 ... Resin, 9 ... Stomata.
Claims (1)
面に、押出方向と平行になるように複数個の放熱用フィ
ンを形成し、その金属ケース内に、外部電極と接続でき
る端子を有する電子回路本体を挿入配置すると共に、樹
脂を注入することにより構成され、かつ金属ケースに複
数個の気孔を設けた電子回路装置。An electronic circuit having a plurality of heat dissipating fins formed on an outer surface of a metal case formed by extrusion molding so as to be parallel to the extrusion direction, and having a terminal connectable to an external electrode in the metal case. An electronic circuit device in which a main body is inserted and arranged, resin is injected, and a plurality of pores are provided in a metal case.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16451887A JP2600178B2 (en) | 1987-07-01 | 1987-07-01 | Electronic circuit device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16451887A JP2600178B2 (en) | 1987-07-01 | 1987-07-01 | Electronic circuit device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS649698A JPS649698A (en) | 1989-01-12 |
JP2600178B2 true JP2600178B2 (en) | 1997-04-16 |
Family
ID=15794686
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16451887A Expired - Lifetime JP2600178B2 (en) | 1987-07-01 | 1987-07-01 | Electronic circuit device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2600178B2 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0329867Y2 (en) * | 1988-01-21 | 1991-06-25 | ||
JPH02281797A (en) * | 1989-04-24 | 1990-11-19 | Matsushita Electric Ind Co Ltd | Electronic circuit device and its manufacture |
JPH02281796A (en) * | 1989-04-24 | 1990-11-19 | Matsushita Electric Ind Co Ltd | Electronic circuit device and its manufacture |
US6434005B1 (en) * | 2000-10-27 | 2002-08-13 | Vlt Corporation | Power converter packaging |
JP4639831B2 (en) * | 2005-02-04 | 2011-02-23 | 株式会社デンソー | Housing, housing molding method, housing molding apparatus, and housing molding die |
JP2013243251A (en) * | 2012-05-21 | 2013-12-05 | Sinfonia Technology Co Ltd | Electronic module and manufacturing method of the same |
-
1987
- 1987-07-01 JP JP16451887A patent/JP2600178B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS649698A (en) | 1989-01-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN110915312B (en) | Circuit structure and electrical connection box | |
CN108029216A (en) | Circuit structure and electric connection box | |
JPH0376026B2 (en) | ||
JP2600178B2 (en) | Electronic circuit device | |
JP3169578B2 (en) | Substrate for electronic components | |
JP3629811B2 (en) | Wiring board with connection terminal | |
JP2502592B2 (en) | Electronic circuit device | |
JP2537863B2 (en) | Electronic circuit device and method of manufacturing the same | |
JPH07120863B2 (en) | Electronic circuit device | |
JPH09246433A (en) | Radiation structure of module | |
JPH037985Y2 (en) | ||
JPH0451486Y2 (en) | ||
JPH02281797A (en) | Electronic circuit device and its manufacture | |
JPH0628786Y2 (en) | Electronic parts | |
JPS598364Y2 (en) | Insulating case for electronic equipment | |
JPS6011650Y2 (en) | electronic circuit equipment | |
JP3127032B2 (en) | Mounting method of lead terminal in hybrid integrated circuit device | |
JP2851656B2 (en) | Manufacturing method of electronic equipment | |
JPH0132377Y2 (en) | ||
JPH0741179Y2 (en) | Circuit board | |
JPH0217873U (en) | ||
JPS6314447Y2 (en) | ||
JPH01118474U (en) | ||
JPS5821178Y2 (en) | Packaged semiconductor device | |
JPS6338512Y2 (en) |