JP2599762Y2 - Cooling plate - Google Patents
Cooling plateInfo
- Publication number
- JP2599762Y2 JP2599762Y2 JP1993075267U JP7526793U JP2599762Y2 JP 2599762 Y2 JP2599762 Y2 JP 2599762Y2 JP 1993075267 U JP1993075267 U JP 1993075267U JP 7526793 U JP7526793 U JP 7526793U JP 2599762 Y2 JP2599762 Y2 JP 2599762Y2
- Authority
- JP
- Japan
- Prior art keywords
- main body
- lid
- engaging
- cooling plate
- peripheral edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【０００１】[0001]
【産業上の利用分野】本考案は、各種の部品、例えば半
導体の製造に際して加熱処理後の基板、ウエハー等、の
冷却に用いる冷却板（クールプレート）に関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling plate (cool plate) used for cooling various components, for example, a substrate, a wafer, etc. after a heat treatment in the production of a semiconductor.
【０００２】[0002]
【従来技術】この種の冷却板として、図７に示すごと
く、その上面を被冷却物を載置するための平面とし、周
壁１３、凹部１４および突部１５を有し周壁１３および
突部１５にねじ孔７を形成した本体１に蓋２を対向さ
せ、ねじ孔７に挿入したビス８により蓋２と本体１とを
一体化し、凹部１４により内部空間Ｈを形成することに
より、内部空間Ｈに冷却媒体を充填し、冷却媒体を内部
空間Ｈと熱交換部との間を循環させ、冷却板を冷却し本
体１の表面を低温を維持して本体１に載置した被冷却物
（例えば、高温の基板）Ｍを冷却するよう構成されてい
る。2. Description of the Related Art As shown in FIG. 7, a cooling plate of this type has a top surface as a flat surface on which an object to be cooled is placed, and has a peripheral wall 13, a concave portion 14, and a protruding portion 15. The lid 2 is opposed to the main body 1 having the screw hole 7 formed therein, the lid 2 and the main body 1 are integrated by the screw 8 inserted into the screw hole 7, and the internal space H is formed by the concave portion 14, so that the internal space H Is filled with a cooling medium, the cooling medium is circulated between the internal space H and the heat exchange section, the cooling plate is cooled, the surface of the main body 1 is maintained at a low temperature, and the object to be cooled placed on the main body 1 (for example, , High-temperature substrate) M.
【０００３】[0003]
【従来技術の問題点】上述の冷却板においては、本体の
周壁１３および突起１５に形成したねじ孔７に挿入した
ビス８により蓋２と本体１とを一体化している。蓋２と
本体１との間にシール部材９を介装しているが、蓋２と
本体１との間の密封固定がビス８による締付けとシール
部材９によるもであるため、内部空間Ｈに冷却媒体とし
て高圧の冷却水を充填した場合には漏水のおそれがある
ため、冷却効果を高めるため高価な冷却媒体を使用して
いる。本考案は、蓋２と本体１との間を、完全に密封状
態として高圧の冷却水の使用を可能とすることを課題と
する。In the above-mentioned cooling plate, the lid 2 and the main body 1 are integrated with each other by screws 8 inserted into the screw holes 7 formed in the peripheral wall 13 and the projection 15 of the main body. Although the sealing member 9 is interposed between the lid 2 and the main body 1, since the sealing and fixing between the lid 2 and the main body 1 is performed by the screw 8 and the sealing member 9, the internal space H When high-pressure cooling water is filled as a cooling medium, there is a risk of water leakage. Therefore, an expensive cooling medium is used to enhance the cooling effect. An object of the present invention is to make it possible to use high-pressure cooling water by completely sealing the space between the lid 2 and the main body 1.
【０００４】[0004]
【問題点を解決するための手段】本考案は、蓋２および
本体１をアルミ材質により製作し、蓋２の周縁２１と係
合する段部１１を、本体１の上面周縁部に形成し、本体
１の突部１５の先端に係合部１２を形成し、蓋２に本体
１の前記係合部１２と係合する係合孔２２を形成し、蓋
２の周縁２１と本体１の段部１１と、および本体１の係
合部１２と蓋２と係合孔２２とを、それぞれ係合状態で
電子ビーム溶接により固定して一体化して、高圧の冷却
水を冷却媒体として使用するものである。According to the present invention, the lid 2 and the main body 1 are made of an aluminum material, and the step 11 which engages with the peripheral edge 21 of the lid 2 is formed on the upper peripheral edge of the main body 1. An engaging portion 12 is formed at the tip of the protrusion 15 of the main body 1, an engaging hole 22 for engaging with the engaging portion 12 of the main body 1 is formed in the lid 2, and a peripheral edge 21 of the lid 2 and a step of the main body 1 are formed. Using the high-pressure cooling water as a cooling medium by integrally fixing the portion 11, the engaging portion 12, the lid 2, and the engaging hole 22 of the main body 1 in an engaged state by electron beam welding. It is.
【０００５】[0005]
【実施例】図面に示す実施例にもとづいて本考案を説明
する。図１および図２を参照して、その上面を被冷却物
Ｍを載置するための平面とした蓋２と、周壁１３、凹部
１４および突部１５を有する本体１とを対向させて固定
して、蓋２と本体１とを一体化し凹部１４により内部空
間Ｈを形成し、内部空間Ｈに冷却媒体を充填し本体１の
表面を低温を維持して本体１に載置した被冷却物Ｍを冷
却するよう構成することは、公知の冷却板と同様であ
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described based on an embodiment shown in the drawings. Referring to FIGS. 1 and 2, cover 2, the upper surface of which is a flat surface on which object to be cooled M is placed, and main body 1 having peripheral wall 13, concave portion 14, and protrusion 15 are fixed to face each other. Then, the lid 2 and the main body 1 are integrated, an internal space H is formed by the concave portion 14, a cooling medium is filled in the internal space H, the surface of the main body 1 is maintained at a low temperature, and the object M to be cooled placed on the main body 1 is maintained. Is configured to be cooled in the same manner as a known cooling plate.
【０００６】蓋２および本体１をアルミ材質により製作
し、蓋２の周縁２１と係合する段部１１を、本体１の上
面周縁部に形成し、本体１の突部１５の先端に係合部１
２を形成し、蓋２に本体１の前記係合部１２と係合する
係合孔２２を形成する。蓋２の中心部に流入口３を設
け、蓋２の周辺隅部に流出口４を設け、流入口３より冷
却媒体（冷却水）を複数個の流出口４へ誘導して、本体
１の表面を均一に冷却すべく構成する。The lid 2 and the main body 1 are made of an aluminum material, and a step 11 which engages with the peripheral edge 21 of the lid 2 is formed on the peripheral edge of the upper surface of the main body 1 and engages with the tip of the projection 15 of the main body 1. Part 1
2 is formed, and an engaging hole 22 for engaging with the engaging portion 12 of the main body 1 is formed in the lid 2. An inlet 3 is provided at the center of the lid 2, an outlet 4 is provided at a peripheral corner of the lid 2, and a cooling medium (cooling water) is guided from the inlet 3 to the plurality of outlets 4, and The surface is configured to cool uniformly.
【０００７】本考案の冷却板の製作にあたっては、図１
ないし図６を参照して、本体１の上面に蓋２を置くこと
により、蓋２の周縁２１と本体１の段部１１と、および
本体１の係合部１２と蓋２と係合孔２２とを、それぞれ
係合状態とする。つぎに、蓋２の周縁２１と本体１の段
部１１と、および本体１の係合部１２と蓋２と係合孔２
２とを、電子ビーム溶接Ｗにより固定して一体化するこ
とにより、密封状態の内部空間Ｈを形成して、冷却板を
完成する。なお、図１および図２を参照して、６は温度
センサーである。In manufacturing the cooling plate of the present invention, FIG.
6, by placing lid 2 on the upper surface of main body 1, peripheral edge 21 of lid 2, step 11 of main body 1, and engaging portion 12 of main body 1, lid 2, and engaging hole 22 Are respectively engaged. Next, the peripheral edge 21 of the lid 2 and the step 11 of the main body 1, and the engaging portion 12 of the main body 1, the lid 2 and the engaging hole 2
2 are fixed and integrated by electron beam welding W, thereby forming a sealed internal space H and completing the cooling plate. Referring to FIGS. 1 and 2, reference numeral 6 denotes a temperature sensor.
【０００８】内部空間Ｈに、高圧の冷却水を冷却媒体と
して使用し、流入口３より高圧の冷却水を内部空間Ｈに
入れ、流出口４より流出することで、高圧の冷却水が内
部空間Ｈと熱交換機との間で循環することにより、冷却
板を冷却し本体１の表面を低温に維持して本体１に載置
した被冷却物（例えば、高温の基板）Ｍを冷却する。In the internal space H, high-pressure cooling water is used as a cooling medium, high-pressure cooling water is introduced from the inlet 3 into the internal space H, and flows out from the outlet 4 so that the high-pressure cooling water is By circulating between H and the heat exchanger, the cooling plate is cooled, the surface of the main body 1 is kept at a low temperature, and the object to be cooled (for example, a high-temperature substrate) M placed on the main body 1 is cooled.
【０００９】図５および図６を参照して、蓋２における
流入口３の隣接部分２ａおよび流出口４の隣接部分２ｂ
にワッシャー状の銅片を置き電子ビームを照射すること
で、前記部分２ａ、２ｂを電子ビーム溶接で、銅合金と
すると、流入口３、流出口４を構成する銅製パイプと蓋
２とを固定するためのネジ孔を隣接部分２ａ、隣接部分
２ｂに形成するにあたり、ネジ孔の耐久性を高め流入口
３、流出口４を構成する銅製パイプの交換を容易にする
とともに、本体１の耐久性を高めることができる。Referring to FIGS. 5 and 6, adjacent portion 2a of inlet 3 and adjacent portion 2b of outlet 4 in lid 2 will be described.
When the parts 2a and 2b are made of a copper alloy by irradiating an electron beam by placing a washer-shaped copper piece on the copper pipe, the copper pipe constituting the inlet 3 and the outlet 4 and the lid 2 are fixed. When the screw holes for forming the screw holes are formed in the adjacent portions 2a and 2b, the durability of the screw holes is increased, the exchange of the copper pipes constituting the inlet 3 and the outlet 4 is facilitated, and the durability of the main body 1 is improved. Can be increased.
【００１０】[0010]
【効果】本考案は、蓋２の周縁２１と係合する段部１１
を、本体１の上面周縁部に形成し、本体１の突部１５の
先端に係合部１２を形成し、蓋２に本体１の前記係合部
１２と係合する係合孔２２を形成し、蓋２の周縁２１と
本体１の段部１１と、および本体１の係合部１２と蓋２
の係合孔２２とを、それぞれ係合状態で電子ビーム溶接
により固定して一体化することにより、内部空間を完全
に密封状態として、高圧の冷却水を冷却媒体として使用
することを可能として、冷却板の運転コストおよび保守
コストを低減する効果を有する。According to the present invention, the stepped portion 11 engaging with the peripheral edge 21 of the lid 2 is
Is formed at the peripheral edge of the upper surface of the main body 1, the engaging portion 12 is formed at the tip of the projection 15 of the main body 1, and the engaging hole 22 is formed in the lid 2 for engaging with the engaging portion 12 of the main body 1. The peripheral edge 21 of the lid 2 and the step 11 of the main body 1, and the engaging portion 12 of the main body 1 and the lid 2
By integrally fixing the engagement holes 22 with the engagement holes 22 by electron beam welding in the engagement state, the internal space is completely sealed, and high-pressure cooling water can be used as a cooling medium. This has the effect of reducing the operating and maintenance costs of the cooling plate.
【図１】本発明の実施例を示す冷却板の平面図。FIG. 1 is a plan view of a cooling plate according to an embodiment of the present invention.
【図２】同じく縦断面図。FIG. 2 is a longitudinal sectional view of the same.
【図３】冷却板の本体の平面図。FIG. 3 is a plan view of a main body of the cooling plate.
【図４】同じく縦断面図。FIG. 4 is a longitudinal sectional view of the same.
【図５】冷却板の蓋の平面図。FIG. 5 is a plan view of a lid of the cooling plate.
【図６】同じく縦断面図。FIG. 6 is a longitudinal sectional view of the same.
【図７】従来技術の冷却板の縦断面図。FIG. 7 is a longitudinal sectional view of a cooling plate according to the related art.
１ 本体 ２ 蓋 １１ 段部 １２ 係合部 Ｈ 空間Ｈ Ｗ 電子ビーム溶接 DESCRIPTION OF SYMBOLS 1 Main body 2 Lid 11 Step 12 Engagement part H Space HW Electron beam welding
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) F25D 1/02 F25D 9/00 H01L 21/324 H01L 23/46 H05K 7/20 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 6 , DB name) F25D 1/02 F25D 9/00 H01L 21/324 H01L 23/46 H05K 7/20
Claims (2)
とし、周壁１３、凹部１４および突部１５を有する本体
１に、蓋２を対向させて固定し、蓋２と本体１とを一体
化し凹部１４により内部空間Ｈを形成し、内部空間Ｈに
冷却媒体を充填し本体１の表面を低温を維持して本体１
に載置した被冷却物Ｍを冷却するよう構成されたた冷却
板において、 蓋２および本体１をアルミ材質により製作し、 蓋２の周縁２１と係合する段部１１を、本体１の上面周
縁部に形成し、 本体１の突部１５の先端に係合部１２を形成し、 蓋２に本体１の前記係合部１２と係合する係合孔２２を
形成し、 蓋２の周縁２１と本体１の段部１１と、および本体１の
係合部１２と蓋２と係合孔２２とを、それぞれ係合状態
で電子ビーム溶接により固定して一体化して、 高圧の冷却水を冷却媒体として使用可能とすることを特
徴とする冷却板。An upper surface thereof is a flat surface on which an object to be cooled is placed, and a lid 2 is fixed to a main body 1 having a peripheral wall 13, a concave portion 14, and a projection 15 so as to face each other. And an internal space H is formed by the concave portion 14, the internal space H is filled with a cooling medium, and the surface of the main body 1 is maintained at a low temperature to maintain the main body 1.
The lid 2 and the main body 1 are made of an aluminum material, and the step 11 which engages with the peripheral edge 21 of the lid 2 is formed on the upper surface of the main body 1. Formed on the peripheral edge, an engaging portion 12 is formed at the tip of the projection 15 of the main body 1, an engaging hole 22 is formed on the lid 2 for engaging with the engaging portion 12 of the main body 1, and a peripheral edge of the lid 2 is formed. 21 and the step portion 11 of the main body 1, and the engaging portion 12, the lid 2 and the engaging hole 22 of the main body 1 are fixed and integrated by electron beam welding in the engaged state, respectively. A cooling plate characterized by being usable as a cooling medium.
び流出口４の隣接部分２ｂを銅合金とたことを特徴とす
る請求項１に記載する冷却板。2. The cooling plate according to claim 1, wherein the portion 2a adjacent to the inlet 3 and the portion 2b adjacent to the outlet 4 in the lid 2 are made of a copper alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1993075267U JP2599762Y2 (en) | 1993-12-31 | 1993-12-31 | Cooling plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1993075267U JP2599762Y2 (en) | 1993-12-31 | 1993-12-31 | Cooling plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0742919U JPH0742919U (en) | 1995-08-11 |
| JP2599762Y2 true JP2599762Y2 (en) | 1999-09-20 |
Family
ID=13571283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1993075267U Expired - Fee Related JP2599762Y2 (en) | 1993-12-31 | 1993-12-31 | Cooling plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2599762Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10006215A1 (en) * | 2000-02-11 | 2001-08-16 | Abb Semiconductors Ag Baden | Cooling device for a high-performance semiconductor module |
| JP5813300B2 (en) * | 2010-08-23 | 2015-11-17 | 三桜工業株式会社 | Cooling system |
-
1993
- 1993-12-31 JP JP1993075267U patent/JP2599762Y2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0742919U (en) | 1995-08-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |