JP2598589B2 - Chip type electronic component package - Google Patents
Chip type electronic component packageInfo
- Publication number
- JP2598589B2 JP2598589B2 JP4149199A JP14919992A JP2598589B2 JP 2598589 B2 JP2598589 B2 JP 2598589B2 JP 4149199 A JP4149199 A JP 4149199A JP 14919992 A JP14919992 A JP 14919992A JP 2598589 B2 JP2598589 B2 JP 2598589B2
- Authority
- JP
- Japan
- Prior art keywords
- seal
- type electronic
- storage pocket
- carrier tape
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Packaging Frangible Articles (AREA)
- Packages (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、チップ型電子部品を収
納、運搬や装着時に用いられる包装体に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package used for storing, transporting and mounting chip-type electronic components.
【０００２】[0002]
【従来の技術】従来、チップ型電子部品の収納等に用い
られるキャリアテープは、図７に示すように成形によっ
て連設された収納ポケット３にチップ型電子部品４を収
納し、カバーテープ５をシールして用いられている。シ
ール方法は例えば図８に示したようにシールコテを設け
たヒーターブロック８による熱に依る圧着方法であっ
て、シールコテ寸法の摩滅、コテの取り付け不良、シー
ル後の経時変化によってカバーテープが広い範囲にわた
り接着する欠点があり、安定した剥離強度が得られるチ
ップ型電子部品包装体が切望されている。2. Description of the Related Art Conventionally, as shown in FIG. 7, a carrier tape used for accommodating a chip-type electronic component contains a chip-type electronic component 4 in a storage pocket 3 continuously formed by molding, and a cover tape 5 is provided. It is used as a seal. The sealing method is, for example, a pressure bonding method using heat by a heater block 8 provided with a sealing iron as shown in FIG. 8. There is a long-felt need for a chip-type electronic component package having a defect of bonding and capable of obtaining a stable peel strength.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、前述の様な
問題を解決すべく鋭意研究した結果キャリアテープのシ
ールを行う部分のシールエリアに連続的に凸状の突起を
施した成形部分にカバーテープの表面から熱によるシー
ルさせることで安定した剥離強度が得られることを見い
だし本発明を完成させた。SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems. As a result of the intensive research, the present invention has been applied to a molding part in which a convex area is continuously formed in a sealing area of a part for sealing a carrier tape. It has been found that stable peel strength can be obtained by sealing with heat from the surface of the cover tape, and the present invention has been completed.
【０００４】[0004]
【課題を解決するための手段】本発明は、チップ型電子
部品を収納する収納ポケットを連続的に形成したプラス
チック製キャリアテープであって、該キャリアテープに
カバーテープがシールさせる部分のシールエリアに収納
ポケットが完全に包囲されるように連設された凸状のシ
ール突起を設け、該シール突起の平面形状が収納ポケッ
トの全周を囲むように六角状に設けられており、収納ポ
ケットと収納ポケットとの間に有するリブのシールエリ
ア部分におけるシール突起の平面形状は該リブの中心点
を交点とするＸ状となって連続的に設けられており、該
シール突起にカバーテープをシールしてなることを特徴
とするチップ型電子部品包装体である。キャリアテープ
のシール突起にカバーテープをシールする方法として
は、収納ポケットにチップ型電子部品を収納させた後カ
バーテープの表面からキャリアテープのシール突起にヒ
ートシールする方法である。SUMMARY OF THE INVENTION The present invention is a plastic carrier tape in which storage pockets for accommodating chip-type electronic components are continuously formed, and a sealing area of a portion where the cover tape is sealed to the carrier tape. A convex seal projection is provided so as to completely surround the storage pocket, and the planar shape of the seal projection is set in the storage pocket.
It is provided in a hexagonal shape so as to surround the entire circumference of the
Rib seal area between the bracket and storage pocket
The planar shape of the seal projection at the part
The chip-type electronic component packaging body is provided continuously in an X-shape with the intersection as an intersection, and the cover projection is sealed with the sealing projection. As a method of sealing the cover tape on the seal protrusion of the carrier tape, a method of storing the chip-type electronic component in the storage pocket and then heat sealing the surface of the cover tape to the seal protrusion of the carrier tape is used.
【０００５】以下図面によって詳しく説明する。図１は
本発明の包装体を示した斜視図であり、チップ型電子部
品４を収納ポケット３に収納したスプロケット２を有す
るキャリアテープ１にカバーテープ５をシールした包装
体であって、一部カバーテープ５を剥離している状態図
である。そして本発明の特徴であるシールエリア部分に
連続する凸状のシール突起６を設けている。図２及び図
３はシール突起６を設けたキャリアテープの断面図及び
平面図であり、図１にも示したように凸状のシール突起
６は収納ポケット３の全周を囲むように六角状に設けら
れており、収納ポケット３と収納ポケット３との間に有
するリブ９のシールエリア部分におけるシール突起６の
平面形状は該リブ９の中心点を交点とするＸ状となって
連続的に設けられている。又シール突起６の断面形状は
図２に示した逆凹状のものか、図４に示したような上部
が平坦な山型状（Ａ）又は半円状（Ｂ）のものが好まし
く、特に（Ａ）の山型状のものが好ましい。シール突起
の大きさは太さが０．５ｍｍを越え１．０ｍｍ以下で、
高さが０．５ｍｍを越え１．０ｍｍ以下のものが好まし
い。シール方法は図５又は図６に示したようにキャリア
テープ１にカバーテープ５を覆ぶせカバーテープ表面よ
りヒーターブロック８又はヒーターロール７を使用して
ヒートシールする方法が好ましい。得られた包装体にお
いて、シール後チップ型電子部品収納，運搬，チップ型
電子部品装着時にカバーテープの剥離が生じないために
は、シール突起形状がシール後も変形せず又キャリアテ
ープの表面に平行であることが必要である。Hereinafter, a detailed description will be given with reference to the drawings. FIG. 1 is a perspective view showing a package of the present invention, which is a package in which a cover tape 5 is sealed on a carrier tape 1 having a sprocket 2 in which a chip-type electronic component 4 is stored in a storage pocket 3, and is partially shown. FIG. 4 is a diagram showing a state in which a cover tape 5 is peeled off. Further, a convex seal protrusion 6 which is continuous with the seal area which is a feature of the present invention is provided. 2 and 3 are cross-sectional views of a carrier tape provided with a seal protrusion 6 and FIG.
Is a plan view, the seal projection 6 of convex as shown in FIG. 1 are provided in a hexagonal shape so as to surround the entire circumference of the housing pocket 3, between the housing pocket 3 and the storage pockets 3 The planar shape of the seal projection 6 in the seal area portion of the rib 9 has an X shape with the center point of the rib 9 as an intersection, and is provided continuously. The cross-sectional shape of the seal projection 6 is preferably an inverted concave shape shown in FIG. 2 , or a mountain shape (A) or a semicircular shape (B) having a flat upper portion as shown in FIG. The chevron shape of A) is preferred. The size of the seal protrusion is more than 0.5mm and less than 1.0mm,
Those having a height of more than 0.5 mm and not more than 1.0 mm are preferred. As a sealing method, as shown in FIG. 5 or FIG. 6, it is preferable to cover the carrier tape 1 with the cover tape 5 and heat seal the surface of the cover tape using the heater block 8 or the heater roll 7. In the obtained package, in order to prevent peeling of the cover tape during storage and transport of the chip-type electronic component after sealing and mounting of the chip-type electronic component, the shape of the seal projection is not deformed even after the sealing, and the surface of the carrier tape is not deformed. Must be parallel.
【０００６】[0006]
【実施例】本発明による詳細を実施例により説明するが
実施例中の強度等の測定方法、測定値はそれぞれ下記の
方法によって行ったものである。 （カバー材の剥離強度測定）ＧＰＤ社製ピールバックフ
ォーテスターにより引張速度３００ｍｍ/ｍｉｎ、角度
１８０度の剥離強度測定を行った。 （ネジリテスト）キャリアテープにカバー材をそれぞれ
シール行い、試料の長さ２５０ｍｍに切断し、試料の両
端２５ｍｍをつかみしろとして、図９に示すように片端
を固定し反対側を１８０度ねじりカバーテープの剥離の
有無を標線間２００ｍｍで確認した。 《実施例１》硬質塩化ビニールシート（住友ベークライ
ト株式会社製 スミライトＶＳＬ−３５５０Ｄ）を素材
とする幅２４ｍｍ，厚さ０．３ｍｍ，収納ポケット１４
ｍｍ角のキャリアテープのシールエリアに１ｍｍ幅で１
ｍｍの高さを有する連設した図４の（Ａ）の山型状のシ
ール突起を施したキャリアテープに図５に示す方法でカ
バーテープをヒートシールした。 《実施例２》硬質塩化ビニールシート（住友ベークライ
ト株式会社製 スミライトＶＳＬ−３５５０Ｄ）を素材
とする幅３２ｍｍ，厚さ０．３ｍｍ，収納ポケット２２
ｍｍ角のキャリアテープのシールエリアに１ｍｍ幅で１
ｍｍの高さを有する連設した図４の（Ａ）の山型状のシ
ール突起を施したキャリアテープに図６に示す方法でカ
バーテープをヒートシールした。 《比較例１》硬質塩化ビニールシート（住友ベークライ
ト株式会社製 スミライトＶＳＳ１３０５ＵＳ）を素材
とする幅８ｍｍ，厚さ０．２ｍｍ，収納ポケット３．２
ｍｍ角のキャリアテープに厚さ６５μのカバテープ（住
友ベークライト株式会社製スミライトＣＳＬ−Ｚ２７５
Ａ）を図８による方法（シールに使用したマシン：日東
工業製ＥＴ−２０００Ｎ）で、温度１４０℃ ３２ｍｍ
／ｓｅｃ 間欠方式においてヒートシールを行った。次
にシールしたサンプルを、剥離強度、ネジリテストにつ
いて観察し結果を表１に示す。EXAMPLES The details of the present invention will be described with reference to Examples, but the methods for measuring the strength and the like in the Examples and the measured values are respectively performed by the following methods. (Measurement of Peeling Strength of Cover Material) Peeling strength was measured at a tensile speed of 300 mm / min and an angle of 180 ° by a peel back fortester manufactured by GPD. (Torsion test) The cover material is sealed to a carrier tape, cut into a sample length of 250 mm, and the sample is cut to a length of 25 mm, and one end is fixed as shown in FIG. The presence or absence of peeling was confirmed at 200 mm between the marked lines. Example 1 24 mm wide, 0.3 mm thick, storage pocket 14 made of hard vinyl chloride sheet (Sumilite VSL-3550D manufactured by Sumitomo Bakelite Co., Ltd.)
1 mm width in the seal area of the carrier tape of 1 mm square
The cover tape was heat-sealed by the method shown in FIG. 5 to the carrier tape having a height of mm and having the mountain-shaped sealing projections of FIG. Example 2 32 mm wide, 0.3 mm thick, storage pocket 22 made of hard vinyl chloride sheet (Sumilite VSL-3550D manufactured by Sumitomo Bakelite Co., Ltd.)
1 mm width in the seal area of the carrier tape of 1 mm square
A cover tape was heat-sealed by a method shown in FIG. 6 to a carrier tape having a height of 1 mm and provided with a mountain-shaped seal projection of FIG. << Comparative Example 1 >> Made of hard vinyl chloride sheet (Sumilite VSS1305US manufactured by Sumitomo Bakelite Co., Ltd.), width 8 mm, thickness 0.2 mm, storage pocket 3.2
A 65 μm thick cover tape (Sumilite CSL-Z275 manufactured by Sumitomo Bakelite Co., Ltd.) is applied to an mm square carrier tape.
A) was obtained by a method according to FIG. 8 (machine used for sealing: ET-2000N manufactured by Nitto Kogyo) at a temperature of 140 ° C. and 32 mm
/ Sec Heat sealing was performed in an intermittent mode. Next, the sealed sample was observed for peel strength and torsion test, and the results are shown in Table 1.
【０００７】 注；測定個数ｎ＝３ ネジリテスト、シール状態の剥がれの有無で判定した。 ○印：異常なし ×印：剥がれ発生[0007] Note: Number of measurements n = 3 Torsion test, judgment was made based on the presence or absence of peeling of the seal state. ○ mark: No abnormality × mark: Peeling occurred
【００１１】[0011]
【発明の効果】本発明の包装体は、複雑な機械調整、複
雑加工をしたヒータブロックを必要とせずにシールが行
われて得られ、カバーテープの剥離強度の安定化が図れ
た。The package of the present invention can be obtained by performing sealing without the need for a complicated mechanical adjustment and complicatedly processed heater block, and the peel strength of the cover tape can be stabilized.
【図１】本発明のチップ型電子部品包装体の一例を示す
斜視図FIG. 1 is a perspective view showing an example of a chip-type electronic component package of the present invention.
【図２】本発明に係るキャリアテープの断面図FIG. 2 is a cross-sectional view of the carrier tape according to the present invention.
【図３】本発明に係るキャリアテープの平面図FIG. 3 is a plan view of the carrier tape according to the present invention.
【図４】本発明に係るシール突起の他の形状の一例を示
す拡大断面図FIG. 4 is an enlarged sectional view showing an example of another shape of the seal projection according to the present invention.
【図５】本発明に係るシール方法を示す説明断面図FIG. 5 is an explanatory sectional view showing a sealing method according to the present invention.
【図６】本発明に係るシール方法の他の例を示す説明断
面図FIG. 6 is an explanatory sectional view showing another example of the sealing method according to the present invention.
【図７】従来のチップ型電子部品包装体の一例を示す斜
視図FIG. 7 is a perspective view showing an example of a conventional chip-type electronic component package.
【図８】従来のシール方法の一例を示す説明断面図FIG. 8 is an explanatory sectional view showing an example of a conventional sealing method.
【図９】本発明に係るキャリアテープネジリテストのキ
ャリアテープ常態を示す斜視図及びネジリ状態を示す斜
視図FIG. 9 is a perspective view showing a normal state of a carrier tape in a carrier tape torsion test according to the present invention, and a perspective view showing a torsion state.
Claims (1)
トを連続的に形成したプラスチック製キャリアテープで
あって、該キャリアテープとカバーテープとのシールを
行う部分に収納ポケットが完全に包囲されるように連設
された凸状のシール突起を設け、該シール突起の平面形
状が収納ポケットの全周を囲むように六角状に設けられ
ており、収納ポケットと収納ポケットとの間に有するリ
ブのシールエリア部分におけるシール突起の平面形状は
該リブの中心点を交点とするＸ状となって連続的に設け
られており、該シール突起にカバーテープをシールして
なることを特徴とするチップ型電子部品包装体。1. A plastic carrier tape in which storage pockets for accommodating chip-type electronic components are continuously formed, wherein the storage pocket is completely surrounded by a portion for sealing the carrier tape and the cover tape. A rib seal is provided between the storage pocket and the storage pocket, wherein a convex seal protrusion is provided continuously with the storage pocket, and a planar shape of the seal protrusion is provided in a hexagonal shape so as to surround the entire circumference of the storage pocket. A chip type electronic device characterized in that the planar shape of the seal projection in the area portion is continuously provided in an X shape having the center point of the rib as an intersection, and a cover tape is sealed on the seal projection. Parts packaging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4149199A JP2598589B2 (en) | 1992-06-09 | 1992-06-09 | Chip type electronic component package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4149199A JP2598589B2 (en) | 1992-06-09 | 1992-06-09 | Chip type electronic component package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05338683A JPH05338683A (en) | 1993-12-21 |
| JP2598589B2 true JP2598589B2 (en) | 1997-04-09 |
Family
ID=15469994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4149199A Expired - Lifetime JP2598589B2 (en) | 1992-06-09 | 1992-06-09 | Chip type electronic component package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2598589B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106143993A (en) * | 2016-08-01 | 2016-11-23 | 苏州市东苏发五金粘胶制品有限公司 | A kind of full-automatic carrier tape packaging machine |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002019832A (en) * | 2000-07-11 | 2002-01-23 | Oki Electric Ind Co Ltd | Embossed carrier tape |
| JP5530412B2 (en) * | 2011-09-21 | 2014-06-25 | 日本航空電子工業株式会社 | Electronic component wrapping band |
| WO2020129692A1 (en) * | 2018-12-20 | 2020-06-25 | 株式会社村田製作所 | Electronic component tray |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0249983A (en) * | 1987-11-20 | 1990-02-20 | Matsushita Electric Ind Co Ltd | Capacity control device for compressor |
-
1992
- 1992-06-09 JP JP4149199A patent/JP2598589B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106143993A (en) * | 2016-08-01 | 2016-11-23 | 苏州市东苏发五金粘胶制品有限公司 | A kind of full-automatic carrier tape packaging machine |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05338683A (en) | 1993-12-21 |
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