JP2597885B2 - Structure of solder connection part of metal core wiring board - Google Patents
Structure of solder connection part of metal core wiring boardInfo
- Publication number
- JP2597885B2 JP2597885B2 JP63138080A JP13808088A JP2597885B2 JP 2597885 B2 JP2597885 B2 JP 2597885B2 JP 63138080 A JP63138080 A JP 63138080A JP 13808088 A JP13808088 A JP 13808088A JP 2597885 B2 JP2597885 B2 JP 2597885B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- hole
- metal core
- solder connection
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は高密度化されたプリント配線或はハイブリッ
ドIC等に使用されるメタルコア配線板に関し、特にコア
材とフレキシブルプリント基板との電気的接続部におけ
るハンダ接続を容易にし、しかも信頼性を向上させるこ
とを可能にしたメタルコア配線板のハンダ接続部の構造
に関する。Description: FIELD OF THE INVENTION The present invention relates to a metal core wiring board used for a high-density printed wiring or a hybrid IC, and more particularly, to an electrical connection between a core material and a flexible printed circuit board. The present invention relates to a structure of a solder connection portion of a metal core wiring board which facilitates solder connection in a portion and can improve reliability.
（従来の技術） メタルコア配線板は、第３図（ａ）に示すような鉄か
ら成るコア材１を第３図（ｂ）に示すようにフレキシブ
ルプリント板２の裏面に接着し、且つスルーホールを介
してプリント板上の所要配線パターン例えばアースパタ
ーンとコア材とを電気的に接続するとともに同図（ｃ）
に示すごとくフレキシブルプリント板２の中央部を折曲
げて両コア材を重ね合せた状態にて樹脂モールドにて成
型一体化した構成を有する。(Prior Art) A metal core wiring board is formed by bonding a core material 1 made of iron as shown in FIG. 3A to the back surface of a flexible printed board 2 as shown in FIG. The required wiring pattern on the printed board, for example, the ground pattern and the core material are electrically connected via the
As shown in the figure, the flexible printed board 2 has a configuration in which the central portion is bent and molded integrally with a resin mold in a state where both core materials are overlapped.
コア材１は、プリント板２の裏面に添設される板部分
３と、板部分３から多数突出されたリード端子４と、各
リード端子４を接続一体化する接続帯（後に切離すこと
によってリード端子を電気的に独立させる）５とから成
る。プリント板２上には例えば配線パターンの他に実装
されたIC6等の電子部品が搭載されている。The core material 1 includes a plate portion 3 attached to the back surface of the printed board 2, lead terminals 4 protruding from the plate portion 3, and a connection band that connects and integrates the respective lead terminals 4 (by being separated later). (The lead terminals are electrically independent) 5. On the printed board 2, for example, electronic components such as an IC 6 mounted in addition to the wiring pattern are mounted.
上記のようなメタルコア配線板においてコア材１とプ
リント板２上の配線パターンとの電気的接続を得るため
の従来の方法として、第４図（ａ）に示すようにコア材
１とプリント板２を貫通するスルーホール８を板部分３
とリード端子４との境界部に形成し、このスルーホール
８内に線材７を挿入してハンダ９を充填するハンダ接続
方法と、同図（ｂ）に示すようにハトメ10をスルーホー
ル８内に差込み両開口端部を押圧・固定してハンダ接続
する方法と、同図（ｃ）に示すようにスルーホール８の
両端部から超音波溶接電極12を圧接して超音波溶接する
方法等が行なわれている。なお、第３図中符号11はフレ
キシブルプリント板をコア板に付着せしめるための溶着
剤、或は該プリント板が両面パターンを有する場合の絶
縁層である。As a conventional method for obtaining an electrical connection between the core material 1 and the wiring pattern on the printed board 2 in the metal core wiring board as described above, as shown in FIG. The through hole 8 penetrating through the plate portion 3
A solder connection method of forming a wire 7 at the boundary between the lead terminal 4 and filling the solder 9 by inserting the wire 7 into the through hole 8, and connecting the eyelet 10 to the inside of the through hole 8 as shown in FIG. And a method of pressing and fixing both ends of the opening and soldering, and a method of ultrasonic welding by pressing the ultrasonic welding electrodes 12 from both ends of the through hole 8 as shown in FIG. Is being done. Reference numeral 11 in FIG. 3 denotes a welding agent for attaching the flexible printed board to the core board, or an insulating layer when the printed board has a double-sided pattern.
しかしながら、上記各方法は夫々次のような問題点を
有している。However, each of the above methods has the following problems.
即ち、まず同図（ａ）のハンダ接続方法はスルーホー
ル８内に含浸するハンダの量が多い場合ハンダの変質に
起因して長期的信頼性に欠けるばかりでなく、スルーホ
ール内に気泡が発生することが多く、スルーホール内を
完全にハンダで充填することが困難であり、気泡が混入
するとハンダ層が不連続となり、電気的導通が不完全と
なるという問題があった。That is, first, in the solder connection method shown in FIG. 3A, when the amount of solder impregnated in the through hole 8 is large, not only long-term reliability is lost due to deterioration of the solder, but also bubbles are generated in the through hole. Therefore, it is difficult to completely fill the inside of the through-hole with solder, and when air bubbles are mixed in, the solder layer becomes discontinuous, resulting in incomplete electrical conduction.
また、同図（ｂ）のハトメによる接続方法は、微細部
位における加工作業が困難であり、作業効率が極端に低
下する。Further, in the connection method using eyelets shown in FIG. 2B, it is difficult to perform a machining operation on a fine portion, and the operation efficiency is extremely reduced.
同図（ｃ）の超音波溶接は、コストが高くなる割には
微小スペース部分における接着強度が弱く、信頼性が低
いという問題を有している。この意味では、上記２つの
ハンダ付け方法における欠点さえ解消されれば、ハンダ
付け方法が最も適した接続方法であるということができ
る。The ultrasonic welding shown in FIG. 3C has a problem that, although the cost is high, the bonding strength in a minute space portion is weak and the reliability is low. In this sense, it can be said that the soldering method is the most suitable connection method as long as the disadvantages of the above two soldering methods are eliminated.
（発明の目的） 本発明は上記に鑑みてなされたものであり、ハンダ接
続によってコア材とプリント板との電気的接続を実現す
る際に、ハンダ量過多、気泡の発生等による不具合を解
消して信頼性の高いハンダ接続を実現することができる
メタルコア配線板のハンダ接続部の構造を提供すること
を目的としている。(Object of the Invention) The present invention has been made in view of the above, and solves problems caused by an excessive amount of solder, generation of bubbles, and the like when realizing electrical connection between a core material and a printed board by solder connection. It is an object of the present invention to provide a structure of a solder connection portion of a metal core wiring board capable of realizing reliable and reliable solder connection.
（発明の概要） 上記目的を達成するため、本考案のメタルコア配線板
のハンダ接続部の構造は、プリント板とコア材とを接合
して両者の所定部位同志をスルーホール接続するように
したメタルコア配線板において、上記所定部位に対応す
るプリント板部分には貫通孔を形成し、該所定部位に対
応するコア材部分には該貫通孔内へ向けて突出する突出
部を屈曲形成し、該突出部と該貫通孔との間には気泡抜
き穴を形成したことを特徴としている。(Summary of the Invention) In order to achieve the above object, the structure of the solder connection portion of the metal core wiring board of the present invention is a metal core in which a printed board and a core material are joined to connect predetermined portions of both to through holes. In the wiring board, a through-hole is formed in a printed board portion corresponding to the predetermined portion, and a protruding portion projecting into the through-hole is formed in a core material portion corresponding to the predetermined portion by bending. A bubble vent hole is formed between the portion and the through hole.
（実施例） 以下、本発明のメタルコア配線板のハンダ接続部の構
造を添付図面に基いて詳細に説明する。(Example) Hereinafter, the structure of the solder connection part of the metal core wiring board of the present invention will be described in detail with reference to the accompanying drawings.
第１図（ａ）及び（ｂ）は本発明の要部であるハンダ
接続部の構成を示す平面図及び断面図であり、フレキシ
ブル配線板20に形成されたスルーホール（貫通孔）21に
対してメタルコア22のコア材23を接続する際に、スルー
ホール21に対応するコア材23部分を打抜いて突出部25を
形成するとともに、該突出部25とスルーホール21内壁と
の間に気泡抜き穴としての空隙を形成した構成に特徴を
有する。FIGS. 1 (a) and 1 (b) are a plan view and a sectional view showing a configuration of a solder connection portion which is a main part of the present invention. When connecting the core material 23 of the metal core 22 by pressing, the core material 23 corresponding to the through hole 21 is punched to form a projection 25, and air bubbles are removed between the projection 25 and the inner wall of the through hole 21. It is characterized by a configuration in which a void is formed as a hole.
突出部25の形成方法としては例えばまず第２図（ａ）
に示すようにコア材３に金型プレスによる打抜き加工、
或は化学的エッチング方法等を施すことにより斜線で示
した打抜き部23aを除去するとともに残余部分23bを上方
に90度曲げ起して突出片23bを形成する。As a method of forming the protrusion 25, for example, first, FIG. 2 (a)
As shown in the figure, the core material 3 is punched by a die press,
Alternatively, the punched portion 23a indicated by oblique lines is removed by applying a chemical etching method or the like, and the remaining portion 23b is bent upward by 90 degrees to form a protruding piece 23b.
突出片23bの幅ａは、スルーホール内壁との間に充分
な間隙を有してスルーホール内に突出可能となるように
寸法設定する。突出部25の突出長ｂは例えばコア材23の
厚さｔの１〜1.5倍程度に設定するのが好ましい。The width a of the protruding piece 23b is set such that there is a sufficient gap between the protruding piece 23b and the inner wall of the through hole so that the protruding piece can protrude into the through hole. It is preferable that the protruding length b of the protruding portion 25 is set to, for example, about 1 to 1.5 times the thickness t of the core material 23.
突出部25を除いたコア材23は絶縁接着シート30を介し
てフレキシブル配線板20と熱圧着される。また、スルー
ホール21の周縁部分にはハンダ接続を容易化するため
に、金メッキ或はハンダメッキ等の表面処理31が施され
る。The core material 23 excluding the protrusions 25 is thermocompression-bonded to the flexible wiring board 20 via the insulating adhesive sheet 30. The periphery of the through hole 21 is subjected to a surface treatment 31 such as gold plating or solder plating in order to facilitate solder connection.
突き上げ部25の上端部は、結果としてフレキシブル配
線板20の肉厚の範囲内或は多少上方へ突出した状態とな
る。As a result, the upper end of the push-up portion 25 projects in the range of the thickness of the flexible wiring board 20 or slightly upward.
上記のような構造の被接続部位に対してメタルマスク
を用いてクリームハンダを塗布し、リフロー炉で加熱溶
融することによって、第１図（ｂ）に図示するような気
泡のないハンダ層35を得ることができる。Cream solder is applied to the connected portion having the above structure using a metal mask, and is heated and melted in a reflow furnace to form a solder layer 35 having no bubbles as shown in FIG. 1 (b). Obtainable.
このようにして得られたハンダ接続部分は、ハンダの
量が必要最小限に抑えられているばかりでなく、気泡抜
き穴26の存在によってスルーホール内に気泡が留ること
がなく、全体として完全なハンダ接続状態となってい
る。このため、高い電気的導通と、機械的特性（接続強
度）を得ることができ、信頼性向上を図ることができ
る。The solder connection portion obtained in this way not only minimizes the amount of solder required, but also prevents bubbles from remaining in the through hole due to the presence of the bubble vent hole 26, and is completely complete as a whole. Solder connection state. For this reason, high electrical conduction and mechanical characteristics (connection strength) can be obtained, and reliability can be improved.
本発明における突出部を形成するための加工は、プレ
ス金型によって同時加工すれば、またハンダはメタルマ
スクを用いた同時塗布後にリフローされるため、一括処
理が可能であり、製造が容易となる。In the present invention, the processing for forming the protruding portion is performed by simultaneous processing using a press die, and since the solder is reflowed after the simultaneous application using a metal mask, batch processing is possible and manufacturing is facilitated. .
また、ハンダ接続されるプリント板部分には予め表面
処理が施されて接着コンディションを良好化しているた
め、ハンダ接続状態は完全となる。In addition, since the printed board portion to be soldered is subjected to a surface treatment in advance to improve the adhesive condition, the solder connection state is completed.
このため、本発明によるメタルコア配線板は、安価に
大量に製造することができ、しかも高品質である。For this reason, the metal core wiring board according to the present invention can be mass-produced at low cost and is of high quality.
（発明の効果） 以上のように本発明のメタルコア配線板のハンダ接続
部の構造によれば、ハンダ接続によってコア材とプリン
ト板との電気的接続を実現する際に、ハンダ量過多、気
泡の発生等による不具合を解消して信頼性の高いハンダ
接続を実現することができる。(Effects of the Invention) As described above, according to the structure of the solder connection portion of the metal core wiring board of the present invention, when the electrical connection between the core material and the printed board is realized by the solder connection, an excessive amount of solder and bubbles It is possible to realize a highly reliable solder connection by eliminating a trouble due to occurrence or the like.
第１図（ａ）及び（ｂ）は本発明の要部の構成を示す平
面図及びそのＸ−Ｘ断面図、第２図（ａ）（ｂ）は突出
部の加工工程の説明図、第３図（ａ）（ｂ）（ｃ）はメ
タルコア配線板の説明図、第４図（ａ）（ｂ）（ｃ）は
従来の接続方法を示す説明図である。 20……フレキシブル配線板、21……スルーホール、22…
…メタルコア、23……コア材、23a……打抜き部、23b…
…突出片、25……突出部、26……気泡抜き穴、30……絶
縁接着シート、31……表面処理部1 (a) and 1 (b) are a plan view showing a configuration of a main part of the present invention and a sectional view taken along line XX, and FIGS. 2 (a) and 2 (b) are explanatory views of a processing step of a projection. 3 (a), 3 (b) and 3 (c) are explanatory views of a metal core wiring board, and FIGS. 4 (a), 4 (b) and 4 (c) are explanatory views showing a conventional connection method. 20 ... flexible wiring board, 21 ... through hole, 22 ...
... Metal core, 23 ... Core material, 23a ... Punched part, 23b ...
... projecting piece, 25 ... projecting part, 26 ... air vent hole, 30 ... insulating adhesive sheet, 31 ... surface treatment part
Claims (1)
定部位同志をスルーホール接続するようにしたメタルコ
ア配線板において、 上記所定部位に対応するプリント板部分には貫通孔を形
成し、該所定部位に対応するコア材部分には該貫通孔内
へ向けて突出する突出部を屈曲形成し、該突出部と該貫
通孔との間には空隙を形成したことを特徴とするメタル
コア配線板のハンダ接続部の構造。1. A metal core wiring board in which predetermined portions of both a printed board and a core material are connected to each other through holes, wherein a through hole is formed in a printed board portion corresponding to the predetermined portion. A metal core wiring board, characterized in that a protruding portion protruding into the through hole is formed in a core material portion corresponding to a predetermined portion, and a gap is formed between the protruding portion and the through hole. The structure of the solder connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63138080A JP2597885B2 (en) | 1988-06-03 | 1988-06-03 | Structure of solder connection part of metal core wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63138080A JP2597885B2 (en) | 1988-06-03 | 1988-06-03 | Structure of solder connection part of metal core wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01307289A JPH01307289A (en) | 1989-12-12 |
| JP2597885B2 true JP2597885B2 (en) | 1997-04-09 |
Family
ID=15213489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63138080A Expired - Lifetime JP2597885B2 (en) | 1988-06-03 | 1988-06-03 | Structure of solder connection part of metal core wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2597885B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2775553B1 (en) * | 1998-03-02 | 2000-05-19 | Valeo Electronique | CONNECTION OF A POINT OF AN ELECTRONIC CARD WITH A PRINTED CIRCUIT ON A METAL SUBSTRATE WHICH CARRIES SAID CARD |
-
1988
- 1988-06-03 JP JP63138080A patent/JP2597885B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01307289A (en) | 1989-12-12 |
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