JP2597063B2 - Pressure-sensitive adhesive sheet for thick film formation - Google Patents
Pressure-sensitive adhesive sheet for thick film formationInfo
- Publication number
- JP2597063B2 JP2597063B2 JP4232092A JP4232092A JP2597063B2 JP 2597063 B2 JP2597063 B2 JP 2597063B2 JP 4232092 A JP4232092 A JP 4232092A JP 4232092 A JP4232092 A JP 4232092A JP 2597063 B2 JP2597063 B2 JP 2597063B2
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- thick film
- paste
- sensitive adhesive
- adhesive sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【０００１】[0001]
【産業上の利用分野】本発明は、基板上に所望の厚膜パ
タ―ンなどを形成する際に使用する厚膜形成用の感圧性
接着シ―トに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pressure-sensitive adhesive sheet for forming a thick film used for forming a desired thick film pattern on a substrate.
【０００２】[0002]
【従来の技術】基板上に所望の厚膜パタ―ンを形成する
技術としては、たとえば、実開昭６２−１７８１４５号
公報や特開昭６３−８４０９５号公報などに紹介されて
いるように、スクリ―ン印刷法と加圧転写印刷法とが知
られている。2. Description of the Related Art As a technique for forming a desired thick film pattern on a substrate, for example, as disclosed in Japanese Utility Model Application Laid-Open No. Sho 62-178145 and Japanese Patent Application Laid-Open No. 63-84095, Screen printing and pressure transfer printing are known.
【０００３】スクリ―ン印刷法は、基板上にスクリ―ン
マスクを対向させ、スクリ―ンマスク上にペ―ストを置
いて、スキ―ジ（刷毛）でスクリ―ンマスクを通して基
板上にマスクパタ―ンのペ―ストを塗布するものであ
る。In the screen printing method, a screen mask is opposed to a substrate, a paste is placed on the screen mask, and a mask pattern is formed on the substrate through a screen mask with a squeegee (brush). Paste is applied.
【０００４】加圧転写印刷法は、基板上に転写フイルム
に設けた厚膜ペ―ストを対向させ、転写フイルム側から
先端が丸められたワイヤで加圧して、加圧した部分の厚
膜ペ―ストを基板上に転写するものである。[0004] In the pressure transfer printing method, a thick film paste provided on a transfer film is opposed to a substrate, and pressure is applied from the transfer film side with a wire having a rounded tip, and the thick film paste on the pressed portion is applied. -To transfer the strike on the substrate.
【０００５】このような方法で、たとえば、セラミツク
ス基板上に塗布または転写された厚膜ペ―ストは、最終
的に、８００℃，１０分といつた高温で加熱焼結され
て、所望パタ―ンの抵抗厚膜などとされ、ハイブリツド
ＩＣなどの電気回路として利用されるものである。[0005] In such a method, for example, a thick film paste applied or transferred onto a ceramics substrate is finally heated and sintered at a high temperature of 800 ° C for 10 minutes to obtain a desired pattern. And is used as an electric circuit such as a hybrid IC.
【０００６】[0006]
【発明が解決しようとする課題】しかるに、スクリ―ン
印刷法では、スクリ―ンマスクがペ―ストで目詰りを生
じやすく、スクリ―ンの取り扱いに手間がかかるだけで
なく、高い印刷精度が得られない。特に、同一スクリ―
ンマスクで印刷を繰り返すと、極端に精度が低下するた
め、スクリ―ンマスクをたびたび交換する必要があり、
量産性が悪い。また、ペ―ストは溶剤の蒸発で粘度が変
化しやすく、ペ―ストの木目の細かい管理が必要とな
り、さらにスキ―ジはスクリ―ンマスクとの摩擦で磨耗
するのでたびたび交換する必要があり、共に手間がかか
る。However, in the screen printing method, the screen mask is liable to cause clogging at the paste, not only takes time to handle the screen, but also provides high printing accuracy. I can't. In particular, the same screen
Repeating printing with the screen mask will greatly reduce the accuracy, so the screen mask needs to be replaced frequently.
Poor mass productivity. Also, the viscosity of the paste tends to change due to the evaporation of the solvent, and it is necessary to carefully control the grain of the paste. Both take time.
【０００７】これに対し、加圧転写印刷法では、スクリ
―ンマスクやスキ―ジがないので、これらを交換する手
間がかからず、量産性にすぐれている。しかし、ペ―ス
トを転写フイルムから基板上に直接転写するため、基板
に対する厚膜ペ―ストの結合力が弱く、良好な転写性が
得られなかつたり、加熱焼結時に剥離を生じやすく、高
精度な厚膜パタ―ンの形成が難しいという問題があつ
た。On the other hand, in the pressure transfer printing method, since there is no screen mask or squeegee, there is no need to replace them and the mass transferability is excellent. However, since the paste is directly transferred from the transfer film onto the substrate, the bonding strength of the thick film paste to the substrate is weak, and good transferability cannot be obtained. There is a problem that it is difficult to form a thick film pattern with high accuracy.
【０００８】本発明は、上記従来技術の問題に鑑み、ス
クリ―ン印刷法よりも量産性にすぐれる加圧転写印刷法
に注目し、この印刷法の難点とされる基板に対する厚膜
ペ―ストの結合力を強めることによつて、良好な転写性
を得ると共に、高精度な厚膜パタ―ンの形成を可能とす
ることを目的としている。In view of the above-mentioned problems of the prior art, the present invention focuses on a pressure transfer printing method which is more excellent in mass productivity than a screen printing method. It is an object of the present invention to obtain good transferability and to form a high-precision thick film pattern by increasing the bonding strength of the strike.
【０００９】[0009]
【課題を解決するための手段】本発明者らは、上記の目
的を達成するため鋭意検討した結果、基板上に厚膜ペ―
ストを転写する際に、あらかじめ基板上に特定構成の感
圧性接着シ―トを設けておくと、これが基板に対する厚
膜ペ―ストの結合力を強め、転写フイルム側から特定の
圧力で加圧したときに非常に良好な転写性を付与し、し
かもこの感圧性接着シ―トは転写後厚膜ペ―ストを高温
で加熱焼結する際に完全に炭化焼失し、これにより高精
度な厚膜パタ―ンの形成が可能となることを見い出し、
本発明に到達したものである。Means for Solving the Problems The present inventors have made intensive studies to achieve the above object and as a result, have found that a thick film
When transferring a paste, if a pressure-sensitive adhesive sheet with a specific configuration is provided on the substrate in advance, this will increase the bonding strength of the thick film paste to the substrate, and pressurize with a specific pressure from the transfer film side. When the thick film paste is heated and sintered at a high temperature after transfer, it is completely carbonized and burned, thereby providing a highly accurate transfer property. Found that a film pattern could be formed,
The present invention has been reached.
【００１０】すなわち、本発明は、上記良好な転写性を
付与し、また高精度な厚膜パタ―ンの形成を可能とする
感圧性接着シ―トを提供しようとするもので、その要旨
とするところは、基板上に、転写フイルムに設けた厚膜
ペ―ストを対向させ、転写フイルム側から１〜５０kg／
mm2 の圧力で加圧して上記ペ―ストを基板上に転写する
にあたり、基板と厚膜ペ―ストとの間に介在させて、基
板に対する厚膜ペ―ストの結合力を強くするための感圧
性接着シ―トであつて、常態で非粘着性であるが転写フ
イルム側からの加圧で強粘着性となる（メタ）アクリル
酸アルキルエステル系ポリマ―（以下、アクリル系ポリ
マ―という）を主成分とする厚膜形成用の感圧性接着シ
―トにある。That is, the present invention aims to provide a pressure-sensitive adhesive sheet which gives the above-mentioned good transferability and enables the formation of a high-precision thick film pattern. In this case, the thick film paste provided on the transfer film is opposed to the substrate, and 1 to 50 kg / m from the transfer film side.
When transferring the paste onto the substrate by pressing with a pressure of mm 2, the paste is interposed between the substrate and the thick paste to increase the bonding force of the thick paste to the substrate. A pressure-sensitive adhesive sheet that is normally non-tacky but becomes strongly tacky when pressed from the transfer film side (hereinafter referred to as "acrylic polymer"). In a pressure-sensitive adhesive sheet for forming a thick film mainly composed of
【００１１】[0011]
【発明の構成・作用】本発明において使用するアクリル
系ポリマ―は、（メタ）アクリル酸アルキルエステルを
主モノマ―とし、これに必要に応じて共重合可能な他の
エチレン性不飽和モノマ―を加えたものを、溶液重合、
乳化重合、塊状重合などの公知の方法で重合させること
により、得られるものである。The acrylic polymer used in the present invention comprises (meth) acrylic acid alkyl ester as a main monomer, and optionally another ethylenically unsaturated monomer copolymerizable therewith. Add the solution, solution polymerization,
It is obtained by polymerizing by a known method such as emulsion polymerization or bulk polymerization.
【００１２】（メタ）アクリル酸アルキルエステルとし
ては、アルキル基の炭素数が４〜１２の範囲にあるもの
が好ましく、たとえば、アクリル酸ブチル、アクリル酸
ノルマルヘキシル、アクリル酸２−エチルヘキシル、ア
クリル酸イソオクチル、アクリル酸イソノニル、アクリ
ル酸イソデシルなどのアクリル酸アルキルエステル、こ
れらと同じアルキル基を有するメタクリル酸アルキルエ
ステルを挙げることができ、これらのうちの１種または
２種以上が用いられる。As the alkyl (meth) acrylate, those having an alkyl group having 4 to 12 carbon atoms are preferable. For example, butyl acrylate, normal hexyl acrylate, 2-ethylhexyl acrylate, isooctyl acrylate Alkyl acrylates such as isononyl acrylate and isodecyl acrylate, and alkyl methacrylates having the same alkyl group as these. One or more of these are used.
【００１３】共重合可能な他のエチレン性不飽和モノマ
―は、上記の（メタ）アクリル酸アルキルエステルから
なる主モノマ―と共重合させることにより、アクリル系
ポリマ―の分子内に官能基や極性基を導入して、接着性
の改良を図つたり、アクリル系ポリマ―のガラス転移温
度をコントロ―ルして凝集力や耐熱性の改善を図るため
に、必要により用いられるものである。The other copolymerizable ethylenically unsaturated monomer is copolymerized with the above-mentioned main monomer comprising an alkyl (meth) acrylate to form a functional group or a polar group in the molecule of the acrylic polymer. It is used as necessary to improve the adhesiveness by introducing a group or to control the glass transition temperature of the acrylic polymer to improve the cohesive strength and heat resistance.
【００１４】このようなエチレン性不飽和モノマ―の具
体例としては、たとえば、（メタ）アクリル酸、マレイ
ン酸、イタコン酸などのカルボキシル基含有モノマ―、
（メタ）アクリル酸２−ヒドロキシエチル、（メタ）ア
クリル酸２−ヒドロキシプロピル、２−ヒドロキシビニ
ルエ―テルなどの水酸基含有モノマ―、Ｎ・Ｎ´−ジメ
チルアミノエチル（メタ）アクリレ―ト、Ｎ−ｔｅｒｔ
−ブチルアミノエチル（メタ）アクリレ―トなどのアミ
ノ基含有モノマ―、（メタ）アクリルアミドなどのアミ
ド基含有モノマ―、（メタ）グリシジルアクリレ―トな
どのグリシジル基含有モノマ―、その他スルホプロピル
（メタ）アクリレ―ト、Ｎ−ビニルカプロラクタム、
（メタ）アクリロニトリル、酢酸ビニルなどが挙げら
れ、これらのうちの１種または２種以上が用いられる。Specific examples of such ethylenically unsaturated monomers include, for example, carboxyl group-containing monomers such as (meth) acrylic acid, maleic acid and itaconic acid;
Hydroxyl-containing monomers such as 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and 2-hydroxyvinyl ether, N.N'-dimethylaminoethyl (meth) acrylate, N -Tert
Amino-containing monomers such as -butylaminoethyl (meth) acrylate, amide-containing monomers such as (meth) acrylamide, glycidyl-containing monomers such as (meth) glycidyl acrylate, and other sulfopropyl ( (Meth) acrylate, N-vinylcaprolactam,
(Meth) acrylonitrile, vinyl acetate and the like are mentioned, and one or more of these are used.
【００１５】主モノマ―の（メタ）アクリル酸アルキル
エステルと、これと共重合可能な他のエチレン性不飽和
モノマ―との使用割合としては、一般に、主モノマ―の
（メタ）アクリル酸アルキルエステルが７０〜１００重
量％、好ましくは７５〜９０重量％となり、共重合可能
な他のエチレン性不飽和モノマ―が３０〜０重量％、好
ましくは２５〜１０重量％となるようにするのが、接着
性、凝集力の点から好ましいものである。[0015] The proportion of the main monomer (meth) acrylic acid alkyl ester to the other ethylenically unsaturated monomer copolymerizable therewith is generally in the proportion of the main monomer (meth) acrylic acid alkyl ester. Is 70 to 100% by weight, preferably 75 to 90% by weight, and the other copolymerizable ethylenically unsaturated monomer is 30 to 0% by weight, preferably 25 to 10% by weight. It is preferable in terms of adhesiveness and cohesion.
【００１６】このようなモノマ―にて構成されるアクリ
ル系ポリマ―の分子量としては、重量平均で通常２０万
〜１５０万、好適には３０万〜８０万であるのがよい。The molecular weight of the acrylic polymer composed of such a monomer is usually 200,000 to 1,500,000, preferably 300,000 to 800,000 on a weight average.
【００１７】本発明においては、上記のアクリル系ポリ
マ―を主成分とし、これに必要により粘着付与樹脂、可
塑剤、乳化剤、軟化剤、充てん剤、顔料、染料などの公
知の添加剤のほか、多官能性のイソシアネ―ト化合物、
エポキシ化合物などの公知の架橋剤を加えた組成物を、
溶液状態で剥離紙上に塗布し、加熱乾燥することによ
り、厚膜形成用の感圧性接着シ―トとする。In the present invention, the above-mentioned acrylic polymer is used as a main component, and if necessary, in addition to known additives such as a tackifier resin, a plasticizer, an emulsifier, a softener, a filler, a pigment and a dye, Polyfunctional isocyanate compounds,
A composition containing a known crosslinking agent such as an epoxy compound,
It is applied on a release paper in a solution state and dried by heating to form a pressure-sensitive adhesive sheet for forming a thick film.
【００１８】このようにして得られる本発明の感圧性接
着シ―トは、常態では非粘着性であつて、加圧されたと
きにのみ強粘着性を示すという特異な性質を有してお
り、この性質は、アクリル系ポリマ―のモノマ―構成や
分子量、粘着付与樹脂などの添加剤成分の種類や添加
量、架橋剤による架橋の程度などを調整することによ
り、容易に得ることができる。The thus obtained pressure-sensitive adhesive sheet of the present invention has a unique property that it is non-tacky under normal conditions and shows strong tackiness only when pressed. This property can be easily obtained by adjusting the monomer structure and molecular weight of the acrylic polymer, the type and amount of additive components such as tackifier resin, the degree of crosslinking by the crosslinking agent, and the like.
【００１９】なお、ここにいう強粘着性とは、セラミツ
クス基板などの厚膜形成用の基板に対し、貼合せ圧力１
Kg／mm2 、剥離速度３００mm／分、２３℃における粘着
力が２０ｇ／cm以上、好ましくは５０〜５００ｇ／cmと
なることを意味する。また、常態で非粘着性とは、加圧
も加熱もされない通常状態での上記粘着力が５ｇ／cm以
下となり、粘着感がほとんどみられないことを意味す
る。The term "strong adhesiveness" as used herein means that a substrate for forming a thick film such as a ceramics substrate has a laminating pressure of one.
Kg / mm 2 , a peeling speed of 300 mm / min, and an adhesive force at 23 ° C. of 20 g / cm or more, preferably 50 to 500 g / cm. The term "non-adhesive in a normal state" means that the adhesive force in a normal state where neither pressure nor heating is applied becomes 5 g / cm or less, and almost no sticky feeling is observed.
【００２０】このような粘着特性を有していることによ
り、この感圧性接着シ―トを基板上に設け、この上に転
写フイルムに設けた厚膜ペ―ストを重ね合わせただけの
状態では、このペ―ストは上記シ―トに粘着しないが、
その状態で、転写フイルム側から先端が丸められたワイ
ヤを用いて加圧すると、加圧した部分の厚膜ペ―ストが
上記シ―トに強力に粘着することになり、その後転写フ
イルムを剥離すると、厚膜ペ―ストは上記シ―トを介し
て基板上に良好に転写されるのである。Due to having such adhesive properties, this pressure-sensitive adhesive sheet is provided on a substrate, and a thick film paste provided on a transfer film is merely superimposed thereon. , This paste does not stick to the above sheet,
In this state, if pressure is applied from the transfer film side using a wire whose tip is rounded, the thick film paste in the pressed portion will strongly adhere to the sheet, and then the transfer film is peeled off Then, the thick film paste is well transferred onto the substrate via the sheet.
【００２１】ここで、上記の粘着特性に基づく良好な転
写性を発揮させるために、本発明に用いる感圧性接着シ
―トとしては、その２０℃，周波数１Hzの剪断貯蔵弾性
率、つまり、レオメトリツクスフア―イ―スト（株）製
の動的粘弾性測定装置（ＲＤＳ）を用いて、平行円盤に
より周波数１Hzで、２０℃で測定される剪断貯蔵弾性率
（Ｇ´）が、一般に、８×１０5 〜３００×１０5 dyne
／cm2 の範囲にあるのが望ましい。この弾性率が小さく
なると、接着シ―トが柔らかくなつて転写形状の不良が
起きやすく、また逆に大きくなると、接着シ―トが固く
なつて厚膜ペ―ストの接着不良などが起こる。Here, in order to exhibit good transferability based on the above-mentioned adhesive properties, the pressure-sensitive adhesive sheet used in the present invention includes a shear storage modulus at 20 ° C. and a frequency of 1 Hz, that is, rheo. The shear storage modulus (G ′) measured at 20 ° C. at a frequency of 1 Hz using a parallel disk with a dynamic viscoelasticity measuring device (RDS) manufactured by Metrics Fast East Co., Ltd. is generally 8 × 10 5 to 300 × 10 5 dyne
/ Cm 2 is desirable. If the elastic modulus is low, the adhesive sheet becomes soft and the transfer shape is likely to be defective. On the contrary, if the elastic sheet is large, the adhesive sheet is hard and the thick film paste is poorly bonded.
【００２２】同様の観点から、本発明に用いる感圧性接
着シ―トとしては、その厚さが、通常２〜３０μｍ、好
ましくは５〜１５μｍの範囲にあるのがよい。薄すぎる
と、十分な接着力を得にくく、また厚くなりすぎると、
加圧時の接着シ―トへの沈み込みなどで正確な転写形状
を得にくくなる。From the same viewpoint, the pressure-sensitive adhesive sheet used in the present invention preferably has a thickness of usually 2 to 30 μm, preferably 5 to 15 μm. If it is too thin, it is difficult to obtain sufficient adhesive strength, and if it is too thick,
It is difficult to obtain an accurate transfer shape due to sinking into the adhesive sheet at the time of pressing.
【００２３】また、本発明では、転写フイルム側からの
加圧の程度が、転写形状に大きく影響するため、この圧
力を１〜５０kg／mm2 の範囲に設定することが肝要であ
る。１kg／mm2 より小さいと、十分な接着力が得られ
ず、ペ―ストの転写形状はワイヤの面積より著しく小さ
くなり、５０kg／mm2 より大きくなると、ワイヤ側にも
接着剤が付着し、また加圧部分の厚膜ペ―ストの押し出
しが強いため、転写形状だけでなくその断面形状も不良
となる。In the present invention, since the degree of pressurization from the transfer film side greatly affects the transfer shape, it is important to set this pressure in the range of 1 to 50 kg / mm 2 . If it is less than 1 kg / mm 2 , sufficient adhesive strength cannot be obtained, and the paste transfer shape becomes significantly smaller than the area of the wire, and if it exceeds 50 kg / mm 2 , the adhesive also adheres to the wire side, Further, since the thick film paste is strongly extruded at the pressurized portion, not only the transfer shape but also the cross-sectional shape becomes defective.
【００２４】このように、本発明の上記構成の感圧性接
着シ―トを用いて、これを上述のように、転写フイルム
に設けた厚膜ペ―ストと基板との間に介在させて、転写
フイルム側から１〜５０kg／mm2 の圧力で加圧すると、
加圧した部分の厚膜ペ―ストが上記シ―トを介して基板
上に強い結合力で接着するため、その後に転写フイルム
を剥離することにより、上記厚膜ペ―ストが高精度で転
写される。ここで、高精度とは、転写形状がワイヤの厚
膜ペ―ストとの接触面積の０．５〜２倍、特に好適には
１〜１．５倍の範囲で一定していることを意味する。As described above, by using the pressure-sensitive adhesive sheet having the above structure of the present invention, as described above, the sheet is interposed between the thick film paste provided on the transfer film and the substrate. When pressure is applied from the transfer film side at a pressure of 1 to 50 kg / mm 2 ,
The thick film paste of the pressurized portion adheres to the substrate with strong bonding force through the above-mentioned sheet, and then the thick film paste is transferred with high precision by peeling off the transfer film. Is done. Here, high precision means that the transfer shape is constant in the range of 0.5 to 2 times, particularly preferably 1 to 1.5 times, the contact area of the wire with the thick film paste. I do.
【００２５】本発明に適用される厚膜ペ―ストは、従来
と同様構成のものでよく、抵抗厚膜などの形成に用いら
れる銅ペ―ストや銀ペ―スト、つまり結合剤樹脂中に銅
粉や銀粉などを均一に混練してなる導電ペ―ストなどで
あつて、これを、ポリエチレンテレフタレ―トフイルム
などの厚さが通常６〜３８μｍ程度の転写フイルム上
に、乾燥後の厚さが通常５〜５０μｍ程度の高粘度状態
を維持した厚膜となるように、塗布，乾燥してなるもの
である。The thick film paste applied to the present invention may have the same structure as that of the prior art. Copper paste or silver paste used for forming a resistive thick film or the like, that is, a binder resin may be used. A conductive paste or the like obtained by uniformly kneading copper powder or silver powder, which is then dried on a transfer film of polyethylene terephthalate film or the like, which usually has a thickness of about 6 to 38 μm, after drying. Is usually applied and dried so as to form a thick film maintaining a high viscosity state of about 5 to 50 μm.
【００２６】この厚膜ペ―ストは、本発明の感圧性接着
シ―トを用いて、上述のように基板上に転写形成された
のち、たとえば、８００℃，１０分といつた高温加熱下
で焼結され、目的とする抵抗厚膜などに変換される。こ
のとき、基板と厚膜ペ―ストとの間に介在される感圧性
接着シ―トは、焼結操作中の上記ペ―ストの基板からの
剥離を防いで、厚膜パタ―ンの高精度化にさらに好結果
を与える。The thick film paste is transferred and formed on the substrate by using the pressure-sensitive adhesive sheet of the present invention as described above, and then heated at a high temperature of 800 ° C. for 10 minutes. And converted into the desired thick resistive film. At this time, the pressure-sensitive adhesive sheet interposed between the substrate and the thick film paste prevents the paste from peeling off from the substrate during the sintering operation, thereby increasing the height of the thick film pattern. Gives better results to accuracy.
【００２７】上記の８００℃，１０分という条件は、基
板がセラミツクスなどの場合、基板中のガラス成分が溶
解し、ペ―ストが接合するのに必要な条件であるが、そ
の際感圧性接着シ―トも完全に焼失しなければならな
い。よつて、前記の感圧性接着シ―トの作製にあたつて
は、その材料構成などについて、上記特性が得られるよ
うに適宜調整するのが望ましい。ここで、完全に焼失と
は、高温下で抵抗厚膜などとして使用する際に、この厚
膜などの浮きや流動などが実質的に起こらない程度に焼
失することを意味する。The above-mentioned condition of 800 ° C. for 10 minutes is a condition necessary for dissolving the glass component in the substrate and bonding the paste when the substrate is made of ceramics or the like. The sheet must also be completely burned. Therefore, in the production of the pressure-sensitive adhesive sheet, it is desirable to appropriately adjust the material composition and the like so as to obtain the above characteristics. Here, the term "completely burned out" means that when used as a thick resistive film at a high temperature, the thick film is burned to such an extent that the floating or flowing of the thick film does not substantially occur.
【００２８】[0028]
【発明の効果】以上のように、本発明の厚膜形成用の感
圧性接着シ―トを用いることにより、加圧転写印刷法の
難点とされていた厚膜ペ―ストの転写性を大幅に改善で
き、高精度な厚膜パタ―ンの形成が可能となる。As described above, by using the pressure-sensitive adhesive sheet for forming a thick film of the present invention, the transferability of a thick film paste, which has been a drawback of the pressure transfer printing method, is greatly improved. And a high-precision thick film pattern can be formed.
【００２９】[0029]
【実施例】つぎに、本発明の実施例を記載してより具体
的に説明する。なお、以下部とあるのは重量部を意味す
るものとする。Next, an embodiment of the present invention will be described in more detail. In addition, the following parts shall mean parts by weight.
【００３０】実施例１ アクリル酸イソノニルとアクリル酸との重量比９０：１
０の共重合体からなる重量平均分子量が５０万のアクリ
ル系ポリマ―の溶液に、アクリル系ポリマ―１００部に
対して３官能性イソシアネ―ト化合物を５部添加し、こ
れを剥離紙上に手塗りしたのち、加熱乾燥により溶剤で
ある酢酸エチルを揮散除去すると共に架橋処理して、厚
さが１０μｍの感圧性接着シ―トを作製した。Example 1 A weight ratio of isononyl acrylate to acrylic acid of 90: 1
To a solution of an acrylic polymer having a weight-average molecular weight of 500,000 and consisting of 100 parts of an acrylic polymer, 5 parts of a trifunctional isocyanate compound was added to 100 parts of the acrylic polymer, and this was manually applied on release paper. After coating, the solvent ethyl acetate was volatilized and removed by heating and drying, followed by cross-linking to prepare a pressure-sensitive adhesive sheet having a thickness of 10 μm.
【００３１】この感圧性接着シ―トは、常態で非粘着性
であつたが、セラミツクス基板上に押圧したときの粘着
力が、前記測定条件で２５０ｇ／cmとなり、強い粘着性
を示すものであつた。また、その剪断貯蔵弾性率（Ｇ
´）は２５×１０5 dyne／cm2であつた。Although this pressure-sensitive adhesive sheet was non-tacky under normal conditions, the pressure-sensitive adhesive force when pressed onto a ceramics substrate was 250 g / cm under the above measurement conditions, indicating strong tackiness. Atsuta. In addition, the shear storage modulus (G
') Was 25 × 10 5 dyne / cm 2 .
【００３２】つぎに、この感圧性接着シ―トをセラミツ
クス基板に貼り合せた。一方、厚さが２５μｍのポリエ
チレンテレフタレ―トフイルム製の転写フイルムに、銅
ペ―ストを塗布し、１００℃で３分間乾燥して、上記転
写フイルムに厚さが２０μｍの厚膜ペ―ストを設けた。
ついで、セラミツクス基板に感圧性接着シ―トを貼り合
せた面を上にして、これに上記転写フイルムに設けた厚
膜ペ―ストを重ね合せ、この状態で転写フイルム側から
直径１００μｍのワイヤで約２０kg／mm2 の圧力で押圧
した。Next, this pressure-sensitive adhesive sheet was bonded to a ceramics substrate. On the other hand, a copper paste is applied to a transfer film made of polyethylene terephthalate film having a thickness of 25 μm, and dried at 100 ° C. for 3 minutes, and a thick film paste having a thickness of 20 μm is applied to the transfer film. Provided.
Then, the thick film paste provided on the transfer film is superimposed on the ceramic substrate with the pressure-sensitive adhesive sheet bonded to the surface facing up, and in this state, a 100 μm diameter wire is used from the transfer film side. It was pressed at a pressure of about 20 kg / mm 2 .
【００３３】しかるのち、転写フイルムを剥離したとこ
ろ、セラミツクス基板上に感圧性接着シ―トを介して所
定パタ―ンの厚膜ペ―ストが転写された。この転写形状
を観察したところ、形状・大きさ共、ワイヤとほぼ同形
であつた。つぎに、この厚膜ペ―ストを８００℃，１０
分で加熱焼結したところ、この焼結操作中に感圧性接着
シ―トは完全に焼失し、パタ―ン形状の変化もなく、セ
ラミツク基板上に強固に接着した高精度な抵抗厚膜が得
られた。Thereafter, when the transfer film was peeled off, a thick film paste of a predetermined pattern was transferred onto the ceramics substrate via a pressure-sensitive adhesive sheet. Observation of the transferred shape revealed that the shape and size were almost the same as the wire. Next, this thick film paste was heated at 800 ° C. and 10 ° C.
In this sintering operation, the pressure-sensitive adhesive sheet is completely burned out during this sintering operation, there is no change in pattern shape, and a high-precision resistive thick film firmly adhered to the ceramic substrate is formed. Obtained.
【００３４】比較例１ 転写フイルム側からの圧力を５００ｇ／mm2 に変更した
以外は、実施例１と同様にして、厚膜ペ―ストのセラミ
ツクス基板への転写を試みたが、厚膜ペ―ストはセラミ
ツクス基板上に全く転写されず、そのままであつた。そ
こで、上記圧力を６０kg／mm2 に増大してみたところ、
厚膜ペ―ストの転写は可能となつたが、転写形状は円形
ではなく、大きさもワイヤの約３倍となり、高さも不均
一で偏りがあり、良好な転写形状が得られなかつた。Comparative Example 1 Transfer of a thick film paste to a ceramic substrate was attempted in the same manner as in Example 1 except that the pressure from the transfer film side was changed to 500 g / mm 2. -The strike was not transferred onto the ceramics substrate at all and was left as it was. Then, when the above pressure was increased to 60 kg / mm 2 ,
Although the transfer of the thick film paste became possible, the transfer shape was not circular, the size was about three times that of the wire, the height was uneven and uneven, and a good transfer shape could not be obtained.
【００３５】実施例２ アクリル酸２−エチルヘキシルとアクリル酸ｎ−ブチル
とアクリル酸との重量比８５：５：１０の共重合体から
なる重量平均分子量が６０万のアクリル系ポリマ―の溶
液に、アクリル系ポリマ―１００部に対して４官能性エ
ポキシ化合物を０．０１部添加し、これを剥離紙上に手
塗りしたのち、加熱乾燥により溶剤である酢酸エチルを
揮散除去すると共に架橋処理して、厚さが１５μｍの感
圧性接着シ―トを作製した。Example 2 A solution of an acrylic polymer having a weight average molecular weight of 600,000 consisting of a copolymer of 2-ethylhexyl acrylate, n-butyl acrylate and acrylic acid in a weight ratio of 85: 5: 10 was prepared. 0.01 part of a tetrafunctional epoxy compound is added to 100 parts of an acrylic polymer, and the resultant is hand-coated on a release paper. A pressure-sensitive adhesive sheet having a thickness of 15 μm was produced.
【００３６】この感圧性接着シ―トは、常態で非粘着性
であつたが、セラミツクス基板上に押圧したときの粘着
力が、前記の測定条件で１２０ｇ／cmとなり、強い粘着
性を示すものであつた。また、その剪断貯蔵弾性率（Ｇ
´）は２１０×１０5 dyne／cm2 であつた。Although this pressure-sensitive adhesive sheet was non-tacky under normal conditions, the pressure-sensitive adhesive force when pressed on a ceramics substrate was 120 g / cm under the above-mentioned measurement conditions, indicating strong tackiness. It was. In addition, the shear storage modulus (G
') Was 210 × 10 5 dyne / cm 2 .
【００３７】つぎに、この感圧性接着シ―トを用いて、
実施例１と同様にして、銅ペ―ストからなる厚膜ペ―ス
トをセラミツクス基板上に転写すると共に、この転写後
加熱焼結したところ、転写形状は、形状・大きさ共、ワ
イヤとほぼ同形であり、また焼結操作中に感圧性接着シ
―トは完全に焼失し、パタ―ン形状の変化もなく、セラ
ミツク基板上に強固に接着した高精度な抵抗厚膜が得ら
れた。Next, using this pressure-sensitive adhesive sheet,
In the same manner as in Example 1, a thick paste made of copper paste was transferred onto a ceramics substrate and heated and sintered after this transfer. The transferred shape was almost the same as that of the wire in both shape and size. The pressure-sensitive adhesive sheet was completely burned out during the sintering operation, and there was no change in the pattern shape, and a high-precision resistive thick film firmly adhered to the ceramic substrate was obtained.
【００３８】なお、上記の実施例２において、感圧性接
着シ―トの厚さを１μｍに変更したところ、転写形状は
かなりの部分が不良となりがちで、比較的良好な部分も
焼成後にペ―ストの離脱などがみられ、焼結が不十分と
なる傾向がみられた。また、上記シ―トの厚さを４０μ
ｍに変更したところ、転写形状はワイヤの大きさの約４
倍となり、良好なパタ―ン形状を得にくかつた。これら
の結果からも、感圧性接着シ―トの厚さとしては、本文
中で述べたように、２〜３０μｍの範囲に設定するのが
望ましいものであることがわかつた。In the above Example 2, when the thickness of the pressure-sensitive adhesive sheet was changed to 1 μm, a considerable portion of the transfer shape was likely to be defective, and the relatively good portion was also coated after firing. There was a tendency for the sintering to be insufficient due to detachment of the strike and the like. In addition, the thickness of the sheet is 40 μm.
m, the transfer shape is about 4 times the wire size.
It became difficult to obtain a good pattern shape. From these results, it was found that it is desirable to set the thickness of the pressure-sensitive adhesive sheet in the range of 2 to 30 μm as described in the text.
フロントページの続き (72)発明者 高橋 健一 茨城県竜ケ崎市向陽台５丁目２番地 日 立テクノエンジニアリング株式会社内 (72)発明者 薮野 光平 茨城県竜ケ崎市向陽台５丁目２番地 日 立テクノエンジニアリング株式会社内 (72)発明者 山田 行雄 茨城県竜ケ崎市向陽台５丁目２番地 日 立テクノエンジニアリング株式会社内Continuing on the front page (72) Inventor Kenichi Takahashi 5-2-2 Koyodai, Ryugasaki-shi, Ibaraki Pref. Inside the Hitachi Techno Engineering Co., Ltd. (72) Inventor Kohei Yabuno 5-2-2 Koyodai, Ryugasaki-shi, Ibaraki Pref. (72) Inventor Yukio Yamada 5-2-2 Koyodai, Ryugasaki-shi, Ibaraki Pref.
Claims (3)
―ストを対向させ、転写フイルム側から１〜５０kg／mm
2 の圧力で加圧して上記ペ―ストを基板上に転写するに
あたり、基板と厚膜ペ―ストとの間に介在させて、基板
に対する厚膜ペ―ストの結合力を強くするための感圧性
接着シ―トであつて、常態で非粘着性であるが転写フイ
ルム側からの加圧で強粘着性となる（メタ）アクリル酸
アルキルエステル系ポリマ―を主成分とする厚膜形成用
の感圧性接着シ―ト。A thick film paste provided on a transfer film is opposed to a substrate, and 1 to 50 kg / mm from the transfer film side.
When transferring the paste onto the substrate by applying the pressure of step 2, the paste is interposed between the substrate and the thick paste to increase the bonding strength of the thick paste to the substrate. A pressure-sensitive adhesive sheet for forming a thick film mainly composed of a (meth) acrylic acid alkyl ester-based polymer, which is non-tacky under normal conditions but becomes strongly tacky when pressed from the transfer film side. Pressure sensitive adhesive sheet.
８×１０5 〜３００×１０5 dyne／cm2 、厚さが２〜３
０μｍである請求項１に記載の厚膜形成用の感圧性接着
シ―ト。2. A shear storage elastic modulus at 20 ° C. and a frequency of 1 Hz is 8 × 10 5 to 300 × 10 5 dyne / cm 2 , and a thickness is 2 to 3
The pressure-sensitive adhesive sheet for forming a thick film according to claim 1, which has a thickness of 0 µm.
０℃，１０分で焼結して抵抗厚膜などとする際に、完全
に焼失する請求項１または請求項２に記載の厚膜形成用
の感圧性接着シ―ト。3. The thick film paste transferred onto the substrate is 80
The pressure-sensitive adhesive sheet for forming a thick film according to claim 1 or 2, which is completely burned off when sintering at 0 ° C for 10 minutes to form a resistance thick film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4232092A JP2597063B2 (en) | 1992-01-30 | 1992-01-30 | Pressure-sensitive adhesive sheet for thick film formation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4232092A JP2597063B2 (en) | 1992-01-30 | 1992-01-30 | Pressure-sensitive adhesive sheet for thick film formation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05218622A JPH05218622A (en) | 1993-08-27 |
| JP2597063B2 true JP2597063B2 (en) | 1997-04-02 |
Family
ID=12632726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4232092A Expired - Fee Related JP2597063B2 (en) | 1992-01-30 | 1992-01-30 | Pressure-sensitive adhesive sheet for thick film formation |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2597063B2 (en) |
-
1992
- 1992-01-30 JP JP4232092A patent/JP2597063B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05218622A (en) | 1993-08-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4825992B2 (en) | Acrylic pressure-sensitive adhesive composition, method for producing pressure-sensitive adhesive tape using the composition, and pressure-sensitive adhesive tape | |
| EP0898603B1 (en) | Adhesive compositions and methods of use | |
| JP5328103B2 (en) | Cooling peelable pressure-sensitive adhesive composition and cooling peelable pressure sensitive adhesive sheet using the same | |
| JP4610818B2 (en) | Adhesive tape | |
| JP2005534754A (en) | Acrylic pressure sensitive adhesive | |
| JP2004512567A (en) | Adhesive imagewise printing and coalescence limited polymerization method | |
| EP0902071B1 (en) | Thermosetting pressure-sensitive adhesive and adhesive sheets made by using the same | |
| EP0305161B1 (en) | Unified pressure-sensitive adhesive tape | |
| JP3204768B2 (en) | Acrylic pressure-sensitive adhesive composition and double-sided tape | |
| JP5379453B2 (en) | Temperature-sensitive adhesive tape and chip-type electronic component manufacturing method using the same | |
| WO2002055626A1 (en) | Removable adhesive compositions and process for producing the same | |
| CN108795340A (en) | Solvent-type acrylic ester pressure-sensitive, preparation method and the application of a kind of macromolecule and high conversion | |
| JP2007191520A (en) | Repeelable adhesive composition and repeelable adhesive sheet by using the same | |
| JP4673565B2 (en) | Cooling-peelable pressure-sensitive adhesive composition, cooling-peelable pressure-sensitive adhesive sheet, and method for producing electronic components using the same | |
| JP3864322B2 (en) | Curing tape | |
| JP2597063B2 (en) | Pressure-sensitive adhesive sheet for thick film formation | |
| JP4326092B2 (en) | Masking tape or sheet for painting | |
| CN115340835A (en) | High-stripping conductive polyacrylate pressure-sensitive adhesive and preparation method thereof | |
| JP2007056135A (en) | Pressure-sensitive adhesive resin composition | |
| JP3549168B2 (en) | Removable adhesive and its adhesive sheets | |
| JP4394877B2 (en) | Adhesive tape | |
| JP3498308B2 (en) | Resin composition for forming dielectric layer and film for forming dielectric layer | |
| JPH04161477A (en) | Pressure-sensitive adhesive composition | |
| JP3276167B2 (en) | Acrylic pressure-sensitive adhesive composition | |
| JP2013209667A (en) | Cooling-and-peeling type pressure sensitive adhesive composition and cooling-and-peeling type pressure sensitive adhesive sheet using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |