JP2595211B2 - Plating equipment - Google Patents

Description

【発明の詳細な説明】 ［産業上の利用分野］ この発明は、金属部品のメッキ装置に関し、例えば密
閉型メッキ室内にメッキ液を流しながらメッキを行なう
高速メッキ装置に利用して効果的な技術に関する。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plating apparatus for metal parts, and is an effective technique for use in, for example, a high-speed plating apparatus that performs plating while flowing a plating solution into a closed plating chamber. About.

［従来技術］ 従来、金属部品の表面へのメッキ処理は、メッキ液の
入った液槽内に陽極となる電極を挿入すると共に、非メ
ッキ物（以下、ワークと称する）を陰極として浸漬し
て、電極とワークとの間に電流を流してメッキを行なう
方法が一般的であった。上記の場合、メッキを続けると
ワーク周囲のメッキ液の濃度が下がるので、液槽内のメ
ッキ液をかくはんさせるようなことが行なわれる。ま
た、メッキ処理品の量産化を図るため一つの液槽内に多
数のワークを浸漬して同時にメッキを進行させる方法も
ある。[Prior art] Conventionally, a plating process on a surface of a metal component is performed by inserting an electrode serving as an anode into a liquid tank containing a plating solution, and immersing a non-plated material (hereinafter, referred to as a work) as a cathode. In general, plating is performed by passing a current between an electrode and a work. In the above case, if the plating is continued, the concentration of the plating solution around the work decreases, so that the plating solution in the solution tank is stirred. Also, there is a method in which a large number of works are immersed in one liquid tank to perform plating at the same time in order to achieve mass production of plated products.

これに対し、密閉型の処理室内にワークを収容し、処
理室内にメッキ液を供給してワークの周囲にメッキ液を
流しながら電気メッキを行なうことにより、ワーク表面
に常に新鮮なメッキ液を接触させることで短時間のうち
に均質なメッキ被膜を形成できるようにした高速メッキ
装置が提案されている（特公昭60−1958号）。On the other hand, the work is accommodated in a closed processing chamber, and the plating solution is supplied into the processing chamber and electroplating is performed while flowing the plating solution around the work. There has been proposed a high-speed plating apparatus capable of forming a uniform plating film in a short period of time (Japanese Patent Publication No. 60-1958).

［発明が解決しようとする問題点］ 本発明者らは、上記のような高速メッキ装置を利用し
て、さらにメッキ処理品の量産化を図る技術について検
討した。[Problems to be Solved by the Invention] The present inventors have studied a technique for further mass-producing a plated product using the high-speed plating apparatus as described above.

その場合、前述した液槽型メッキ装置において、一つ
の液槽内に複数のワークを浸漬して同時にメッキ処理を
施して量産化を図るという考え方をそのまま適用して、
密閉型メッキ室内に複数のワークを収容してメッキ液を
流し、これによって複数のワークに同時にメッキ処理を
施すという方法が考えられる。In that case, in the above-mentioned liquid tank type plating apparatus, the concept of immersing a plurality of works in one liquid tank and simultaneously performing plating treatment to achieve mass production is applied as it is,
A method is considered in which a plurality of works are accommodated in a closed plating chamber and a plating solution is flowed, and thereby a plurality of works are subjected to a plating process at the same time.

しかしながら、従来の液槽型メッキ装置では、複数の
密閉型メッキ室内にワーク（被処理物）を夫々挿脱する
被処理物挿脱手段と、各メッキ室に充填されるメッキ液
が漏れないように密閉するメッキ室密閉手段と、各メッ
キ室および各ワークに通電する通電手段とがそれぞれ別
々に必要であり、装置構造が複雑となるとともに、部品
点数が増大して製造コストが嵩むという難点があった。However, in the conventional liquid tank type plating apparatus, the processing object insertion / removal means for inserting / removing a work (object) into / from a plurality of closed-type plating chambers and a plating solution filled in each plating chamber do not leak. It is necessary to separately provide a plating chamber sealing means for enclosing the plating chamber and an energizing means for supplying electricity to each plating chamber and each work, which complicates the apparatus structure, increases the number of parts, and increases the manufacturing cost. there were.

また、上記従来の液槽型メッキ装置では、被処理物の
挿脱動作とメッキ室の密閉，開放動作が別々に行われて
いたため、メッキを行なうための工程は、各メッキ室
内にワークを取り込み、各メッキ室を密閉し、メッ
キ液を各メッキ室内に充填し、各メッキ室およびワー
クに通電し、各メッキ室内のメッキ液を抜き、各メ
ッキ室を開放し、メッキ済の各ワークをメッキ室から
取り出すというように工程数が多くなり、メッキ処理品
の量産化を妨げともなるという欠点もあった。In addition, in the above-mentioned conventional liquid tank type plating apparatus, the insertion / removal operation of the object to be processed and the sealing / opening operation of the plating chamber are performed separately. , Each plating room is sealed, filling plating solution into each plating room, energizing each plating room and work, draining plating solution from each plating room, opening each plating room and plating each plated work. There is also a drawback that the number of steps is increased, such as removal from the chamber, which hinders mass production of plated products.

［発明の目的］ この発明の目的は、メッキ装置の部品点数を減らして
構造を単純化でき、メッキを行なうための工程数を低減
してメッキ処理品を効率良く量産できるメッキ装置を提
供することにある。[Object of the Invention] An object of the present invention is to provide a plating apparatus capable of simplifying the structure by reducing the number of parts of the plating apparatus, reducing the number of steps for performing plating, and efficiently mass-producing plated products. It is in.

［問題点を解決するための手段］ 本発明に係るメッキ装置は、各々密閉可能な複数のメ
ッキ室に対してメッキ液を同一流量で流通させるメッキ
液循環手段と、各メッキ室に被処理物を挿脱する被処理
物挿脱手段とを備えるメッキ装置において、前記各メッ
キ室は、両端に開口部を有する導電性の筒状体を含み、
前記被処理物挿脱手段は、前記各開口部の一方側からメ
ッキ室を貫通して他方の開口部側との間を往復動可能な
第１の被処理物保持部材と、該第１の被処理物保持部材
との間に被処理物を挟みこんだ状態で第１の被処理物保
持部材と連動して往復動可能な第２の被処理物保持部材
を備え、前記第1,第２の各被処理物保持部材の所定部位
は、各被処理物をメッキ室内に取り込んだ状態で前記各
開口部と嵌合して各メッキ室を密閉する形状に成され、
かつ、前記第1,第２の被処理物保持部材の少なくとも一
方が導電体で形成され、上記密閉状態でメッキ室内にメ
ッキ液を流通させながら上記メッキ室の導電性の筒状体
と上記導電体で形成された被処理物保持部材との間に電
圧を印加して被処理物にメッキ処理可能に構成されてい
る。[Means for Solving the Problems] A plating apparatus according to the present invention includes a plating solution circulating unit that circulates a plating solution at the same flow rate to a plurality of sealing chambers that can be sealed, and an object to be processed in each plating chamber. In the plating apparatus comprising a workpiece insertion and removal means for inserting and removing, each of the plating chambers includes a conductive tubular body having openings at both ends,
The workpiece insertion / removal means includes a first workpiece holding member which can reciprocate between one side of each of the openings, penetrates the plating chamber, and the other side of the opening. A second processing object holding member that can reciprocate in conjunction with the first processing object holding member in a state where the processing object is sandwiched between the processing object holding member and the first processing object; 2, a predetermined portion of each workpiece holding member is formed into a shape that fits with each of the openings and seals each plating chamber in a state where each workpiece is taken into the plating chamber;
In addition, at least one of the first and second workpiece holding members is formed of a conductor, and while the plating solution flows through the plating chamber in the sealed state, the conductive tubular body of the plating chamber and the conductive cylinder are connected to each other. A voltage is applied between the workpiece and a workpiece holding member formed of a body so that the workpiece can be plated.

［作用］ この発明に係るメッキ装置によると、被処理物挿脱手
段を構成する第1,第２の各被処理物保持部材の所定部位
は、各被処理物をメッキ室内に取り込んだ状態で前記各
開口部と嵌合して各メッキ室を密閉する形状に成されて
いるため、従来のような各メッキ室の密閉手段を別途設
けることなく、被処理物挿脱手段がメッキ室の密閉手段
を兼ねるため、メッキ装置の部品点数を減らしてメッキ
装置の構造を簡略化でき、製造コストを低減することが
できる。[Operation] According to the plating apparatus of the present invention, the predetermined portions of the first and second workpiece holding members constituting the workpiece insertion / removal means are in a state where each workpiece is taken into the plating chamber. Since each of the plating chambers is fitted to each of the openings, the plating chambers are hermetically sealed, so that there is no need to separately provide a sealing means for each of the plating chambers as in the related art. Since it also serves as a means, the number of parts of the plating apparatus can be reduced, the structure of the plating apparatus can be simplified, and the manufacturing cost can be reduced.

また、被処理物挿脱手段が各被処理物をメッキ室内に
取り込んだ際に各メッキ室を密閉できるので、メッキを
行なう工程において、メッキ室の密閉，開放の動作を被
処理物の挿脱動作に付随させて同時に行なうことが可能
となり、工程数を低減してメッキ処理品を効率良く量産
することができる。In addition, since each of the plating chambers can be sealed when the workpiece insertion / removal means takes in each of the workpieces into the plating chamber, the operation of sealing and opening the plating chamber is performed in the step of performing plating. This can be performed simultaneously with the operation, so that the number of steps can be reduced and a plated product can be efficiently mass-produced.

また、各メッキ室は、両端に開口部を有する導電性の
筒状体を含み、かつ、第1,第２の被処理物保持部材の少
なくとも一方が導電体で形成されているため、両者を電
極として被処理物にメッキ処理を行なうことにより、メ
ッキ用の電極を別途設ける必要がなくなり、メッキ装置
の構造を簡単にすることができる。Each plating chamber includes a conductive tubular body having openings at both ends, and at least one of the first and second workpiece holding members is formed of a conductor. By performing plating on an object to be processed as an electrode, it is not necessary to separately provide an electrode for plating, and the structure of the plating apparatus can be simplified.

また、特許請求の範囲第２項に記載したように、各メ
ッキ室の開口部には、メッキ室内に被処理物を取り込ん
だ状態において前記第1,第２の被処理物保持部材の所定
部位と上記開口部との間からメッキ液が外部に漏れない
ようにするエアシール手段がそれぞれ設けられる場合に
は、メッキ室からの液漏れを完全に防止することができ
る。Further, as described in claim 2, the opening of each plating chamber has a predetermined portion of the first and second workpiece holding members in a state where the workpiece is taken into the plating chamber. In the case where air sealing means for preventing the plating solution from leaking to the outside from between the opening and the opening are provided, the solution leakage from the plating chamber can be completely prevented.

［実施例］ この発明に係るメッキ装置10は、例えば、第７図に示
すように、複数個ずつの被処理物の一例としてのワーク
２を一定方向へ搬送させながら、順次、脱脂、水
洗、逆電、水洗、メッキ、水洗の各処理を行な
った後、乾燥させて仕上げる一連の工程におけるメッ
キの処理を行う装置部分に適用可能である。[Embodiment] As shown in FIG. 7, for example, a plating apparatus 10 according to the present invention sequentially degreasing, rinsing, and washing a plurality of workpieces 2 as an example of an object to be processed in a certain direction. The present invention can be applied to an apparatus portion that performs a plating process in a series of steps of performing a reverse voltage, a washing, a plating, and a washing, and then drying and finishing.

この一連の工程に用いられる装置において、（１）複
数個ずつのワーク２を一定方向へ搬送させながら脱脂
の後水洗の処理を行なう構成部分と、（２）逆電の
後水洗の処理を行なう構成部分と、（３）メッキの
後水洗の処理を行なう構成部分とは略同様であるの
で、重複説明を避けるため、上記（３）の部分について
だけ第１図〜第６図および第８図に基づいて説明し、他
の（１）および（２）の部分については（３）と相違す
る部分についてのみ説明する。In the apparatus used in this series of steps, (1) a component for performing degreasing and water washing while transporting a plurality of works 2 in a fixed direction, and (2) a post-water washing and reverse power treatment. Since the constituent parts are substantially the same as the constituent parts for performing the washing process after plating (3), only the above-mentioned part (3) will be described with reference to FIGS. 1 to 6 and FIG. The other parts (1) and (2) will be described only for the parts different from (3).

上記（３）のうち、先ず、メッキ装置10の実施例につ
いて説明し、その後にそれに付随する搬送装置および水
洗装置の部分について概略説明する。In the above (3), first, an embodiment of the plating apparatus 10 will be described, and thereafter, a portion of a transporting apparatus and a washing apparatus associated therewith will be schematically described.

即ち、メッキ装置10は、第１図に示すように、ワーク
２の搬送ライン30から一方側に張り出させて搬送ライン
方向に並べて複数（この実施例では５つ）設置された密
閉型処理室としての液密なメッキ室11と、搬送ライン30
に沿って運ばれてきた複数のワーク２を各メッキ室11内
に１つずつ同時に取り込んでメッキ処理後に再び同時に
搬送ライン30上に戻す一対の被処理物挿脱手段の一実施
例としての把持装置40、45とを具え、各メッキ室11のメ
ッキ液流入用入口側にはメッキ液槽50のメッキ液を各メ
ッキ室11中に均等に分配流入させる分配管26（第３図〜
第５図）が連通接続され（第２図、第８図）、各メッキ
室11中のメッキ液を均等にメッキ液槽50中に戻す、分配
管26と略同じ構成の集合管27が接続されている。そし
て、メッキ液槽50とメッキ室11との間に配置されたポン
プ51（第１図）によって、メッキ処理中にはその間にお
いてメッキ液を定常的に循環させるようにするととも
に、メッキ処理後には各メッキ室11中のメッキ液をメッ
キ液槽50中に全て回収させるようになっている。That is, as shown in FIG. 1, the plating apparatus 10 is provided with a plurality of (five in this embodiment) sealed processing chambers arranged so as to protrude from the transfer line 30 of the work 2 to one side and be arranged in the transfer line direction. Liquid-tight plating chamber 11 and transfer line 30
Gripping as one embodiment of a pair of workpiece insertion / removal means which takes in a plurality of works 2 carried along along one by one into the respective plating chambers 11 and returns them to the transport line 30 simultaneously after the plating process. A distribution pipe 26 (FIGS. 3 to 3) for distributing and flowing the plating solution in the plating solution tank 50 evenly into the plating chambers 11 at the inlet side of the plating solution in each plating chamber 11;
(FIG. 5) is connected to each other (FIGS. 2 and 8), and a collecting pipe 27 having substantially the same configuration as the distribution pipe 26 is connected to evenly return the plating solution in each plating chamber 11 to the plating solution tank 50. Have been. The plating solution is constantly circulated during the plating process by a pump 51 (FIG. 1) disposed between the plating solution tank 50 and the plating chamber 11, and after the plating process, The plating solution in each plating chamber 11 is all collected in the plating solution tank 50.

前記メッキ室11はそれぞれ円筒状の電極12を具えてお
り、各電極12は陽極となるように電気接続されている。Each of the plating chambers 11 has a cylindrical electrode 12, and each electrode 12 is electrically connected to serve as an anode.

これらメッキ室11中にメッキ液を均等に分配流入させ
る前記分配管26は、第３図〜第５図に示すように、その
長手方向に沿って断面積が比較的大きい一端開口の集合
通路26aと、その途中から分岐した比較的断面積の小さ
い複数の分岐分配通路26bとを具えている。そして、前
記集合通路26aの開口部が図示省略の管を介して、前記
メッキ液槽50の出口側に連通接続され、前記各分岐分配
通路26bの開口部が前記各メッキ室11の流入口（図示省
略）と連通するように接続されている。前記各分岐分配
通路26bの断面積は、各メッキ室11内へのメッキ液の流
入量が相互に等しくなるように略等しい断面積をしてい
る。しかし、それでも流入量が等しくならない場合があ
ることを考慮して、集合通路26aと分配通路26bとの間に
バルブ孔26cを設け、その中に、流量調整手段、例え
ば、横断面が半月状をしたバルブ体（図示省略）を回転
操作可能に嵌挿させ、その回転操作によって集合通路26
aから分岐分配通路26bにいたる流路面積を調整できるよ
うにしておいてもよい。As shown in FIGS. 3 to 5, the distribution pipe 26 for uniformly distributing and flowing the plating solution into the plating chamber 11 has a collecting passage 26a having one end opening having a relatively large cross-sectional area along its longitudinal direction. And a plurality of branch distribution passages 26b having a relatively small cross-sectional area branched from the middle thereof. The opening of the collecting passage 26a is connected to the outlet side of the plating solution tank 50 through a tube (not shown), and the opening of each branch distribution passage 26b is connected to the inlet of each plating chamber 11 ( (Not shown). The cross-sectional area of each of the branch distribution passages 26b has substantially the same cross-sectional area so that the amount of the plating solution flowing into each of the plating chambers 11 is equal to each other. However, in consideration of the fact that the inflow may not be the same, a valve hole 26c is provided between the collecting passage 26a and the distribution passage 26b, and the flow rate adjusting means therein, for example, has a half-moon cross section. The inserted valve body (not shown) is rotatably inserted into the collective passage 26 by the rotation operation.
The flow passage area from a to the branch distribution passage 26b may be adjustable.

また、前記集合管27も分配管26と略同じ構成となって
いるが、前記バルブ体を用いる必要はない。この場合、
バルブ孔26cを設けないか、或いはバルブ孔26cの開口部
からメッキ液が漏れないようにその開口部を塞いでおく
必要がある。そして集合管27の場合、分配管26の集合通
路26aの名称はそのまま集合通路27aの名称で用いるが、
分岐分配通路26bの名称は分岐回収通路27bという名称を
用いて説明することとする。Although the collecting pipe 27 has substantially the same configuration as the distribution pipe 26, it is not necessary to use the valve body. in this case,
It is necessary not to provide the valve hole 26c, or to close the opening so that the plating solution does not leak from the opening of the valve hole 26c. And in the case of the collecting pipe 27, the name of the collecting passage 26a of the distribution pipe 26 is used as it is as the name of the collecting passage 27a,
The name of the branch distribution passage 26b will be described using the name of the branch collection passage 27b.

また、前記把持装置40、45は第１図に示すように、ピ
ストンシリンダ装置42、47のピストンロッド43、48に取
り付けられている。そして、それらの有する第1,第２の
被処理物保持部材としての保持部41、46がピストンシリ
ンダ装置42、47の働きで第１図中略実線で示す位置から
鎖線で示す位置まで変位可能である。そして、保持部4
1、46の共働作業により、搬送ライン30上をそれと直交
する向きに搬送されてきた複数のワーク２をそれぞれそ
の長手方向両端から互いに押圧するように保持してメッ
キ室11内に取り込み、メッキ処理後に再び搬送ライン30
上に戻す。The gripping devices 40 and 45 are attached to piston rods 43 and 48 of piston cylinder devices 42 and 47, as shown in FIG. The holding portions 41, 46 as the first and second holding members for the workpiece to be processed can be displaced from the position shown by a substantially solid line in FIG. 1 to the position shown by a chain line in FIG. is there. And the holding unit 4
By the cooperative operation of 1, 46, the plurality of works 2 conveyed on the conveyance line 30 in a direction orthogonal to the work are held in the plating chamber 11 while being pressed from both ends in the longitudinal direction thereof, and are taken into the plating chamber 11, and plated. Transport line 30 again after processing
Return to top.

前記一方の把持装置40の保持部41が導電体でできてい
て陰極となるように電気接続されており、メッキ処理時
には、その保持部41を介してメッキ室11内のワーク２を
陰極とさせる。その場合、他方の把持装置45の保持部46
は非導電体で作っておく。The holding portion 41 of the one gripping device 40 is made of a conductor and is electrically connected so as to be a cathode. During the plating process, the work 2 in the plating chamber 11 is made a cathode through the holding portion 41. . In that case, the holding portion 46 of the other gripping device 45
Is made of a non-conductive material.

そして、第１図に示すように、複数のワーク２が保持
部41、46に挟まれた状態で、ピストンシリンダ装置42、
47の動作に伴って、鎖線で示される位置から、実線で示
される位置に変位されると、各保持部41は各メッキ室11
の上方側の開口部を塞ぎ、各保持部46は各メッキ室11の
下方側の開口部をそれぞれ塞ぐため、各メッキ室11,11
・・・は各ワーク2,2・・・を取り込むと同時に密閉状
態とされる。したがって、メッキ室11にワークを取り込
む工程と、メッキ室11を密閉する工程とを一度に行なう
ことができるためメッキを行なう工程を少なくでき、メ
ッキを高速に効率良く行なうことができる。Then, as shown in FIG. 1, in a state where the plurality of works 2 are sandwiched between the holding portions 41, 46, the piston cylinder device 42,
When displaced from the position shown by the dashed line to the position shown by the solid line with the operation of 47, each holding portion 41
In order to close the opening on the upper side of the plating chamber 11 and to close the opening on the lower side of the plating chamber 11 respectively, each of the plating chambers 11 and 11 is closed.
.. Are taken in at the same time as each work 2, 2,. Therefore, the step of loading the work into the plating chamber 11 and the step of sealing the plating chamber 11 can be performed at once, so that the number of plating steps can be reduced, and the plating can be performed quickly and efficiently.

そして、密閉された各メッキ室11中にメッキ液が充填
されると、保持部41を介して陰極となったワーク２と前
記陽極となった円筒状の電極12との間の電気作用で、ワ
ーク２の表面にメッキ層が形成される。このように、メ
ッキを行なうために電極を別途設ける必要がないため、
メッキ装置10の部品点数が減って構造が簡単になり製造
コストを低減することができる。Then, when the plating solution is filled in each of the sealed plating chambers 11, the electric action between the workpiece 2 serving as the cathode and the cylindrical electrode 12 serving as the anode via the holding unit 41, A plating layer is formed on the surface of the work 2. As described above, since it is not necessary to separately provide an electrode to perform plating,
The number of parts of the plating apparatus 10 is reduced, the structure is simplified, and the manufacturing cost can be reduced.

なお、前記保持部41、46とそれら保持部が貫通するメ
ッキ室11の開口孔中に嵌合配置されたシール部材13、13
（第２図）との間には、そこからメッキ液を外部に漏ら
さないように液密にするためのいわゆるエアシールがな
されている。そのエアシール用の空気の供給孔14、14が
メッキ室11の開口両端部に設けられている。The holding members 41 and 46 and the sealing members 13 and 13 fitted and arranged in the opening holes of the plating chamber 11 through which the holding members penetrate.
A so-called air seal is provided between the substrate and (FIG. 2) to make the plating solution liquid-tight so that the plating solution does not leak to the outside. Air supply holes 14 for the air seal are provided at both ends of the opening of the plating chamber 11.

他方、搬送する装置部分は次のように構成されてい
る。On the other hand, the transporting device is configured as follows.

即ち、第６図に示すように、それぞれピニオン３、
４、５の回動によって昇降される第１、第２、および第
３の昇降棚６、７、８がワーク２の搬送方向に沿ってワ
ーク２の受取り用凹溝6a、7a、8aが一定ピッチで複数
（この実施例では５つ）設けられている。That is, as shown in FIG.
The first, second and third elevating shelves 6, 7, 8 which are raised and lowered by the rotation of the 4, 5 have the receiving grooves 6a, 7a, 8a for receiving the work 2 constant along the transfer direction of the work 2. A plurality (five in this embodiment) is provided at a pitch.

また、昇降棚６、７、８の上方位置には、ピニオン９
によってワーク２の搬送方向に進退される水平移動棚60
が設置されている。この水平移動棚60の後半部と前半部
とには前記昇降棚６、７、８の凹溝6a（7a、8a）と同じ
ピッチをもって凹溝60aが複数（この実施例では５つ）
設けられている。また、水平移動棚60の上方でそれより
前方へ進んだ位置にはピニオン71によってワーク２の搬
送方向に進退される水平移動把持棚70が設置されてい
る。この水平移動把持棚70の後部と前部の下面側には水
平移動棚６、７、８の凹溝6a、7a、8aと同じピッチをも
って把持用凹部70aが複数（この実施例では５つずつ）
設けられ、かつ中間部の下面側には送り用凹溝70bが所
定ピッチをもって複数（この実施では４つ）設けられて
いる。In addition, a pinion 9 is located above the elevating shelves 6, 7, 8.
Moving shelf 60 which is moved back and forth in the direction of conveyance of work 2 by
Is installed. The second half and the first half of the horizontal moving shelf 60 are provided with a plurality of grooves (five in this embodiment) at the same pitch as the grooves 6a (7a, 8a) of the lifting shelves 6, 7, 8.
Is provided. At a position above the horizontally movable shelf 60 and further forward therefrom, a horizontally movable gripping shelf 70 which is moved forward and backward in the transport direction of the work 2 by the pinion 71 is installed. A plurality of gripping recesses 70a (five in this embodiment) are provided on the lower side of the rear and front portions of the horizontal moving holding shelf 70 at the same pitch as the concave grooves 6a, 7a, 8a of the horizontal moving shelves 6, 7, 8. )
A plurality of (four in this embodiment) feed concave grooves 70b are provided at a predetermined pitch on the lower surface side of the intermediate portion.

また、前記昇降棚７と同位相で前記水平移動棚60の上
方位置には、メッキ処理等を行なう表面処理装置が、さ
らにその上方位置にはピストンシリンダ機構からなる押
え装置80が設置されている。In addition, a surface treatment device for performing a plating process or the like is provided above the horizontal moving shelf 60 in the same phase as the elevating rack 7, and a holding device 80 including a piston cylinder mechanism is further installed above the horizontal moving shelf 60. .

また、前記水平移動把持棚70の略中間位相位置には水
洗装置90が配設されている。そして、図外の搬送装置に
より複数本（この実施例では５本）ずつ一定間隔をもっ
て運ばれてきた丸棒状ワーク２が、昇降棚６の上昇時
に、その上端凹溝6aにてそのままの間隔を保った状態で
受け取られる。これらワーク２は、昇降棚６の下降時
に、後退してその下方に至る水平移動棚60の凹溝60a上
にそのままの間隔を保った状態で乗せられ、その水平移
動棚60の前進によってメッキ装置10と同位相位置でメッ
キ装置10の前記処理室と同じ高さ位置まで上昇される。
そして、その位置で前記押え装置80のロッドの先端で動
かないように押えられてから、前記把持装置40、45によ
り把持されて処理室内に取り込まれ、その中で表面処理
がなされた後、再び昇降棚７の凹溝7a上に戻されて下降
される。そのとき後退してくる水平移動棚60の前半部上
に同じ間隔を保ったまま乗せられて前方へ運ばれる。そ
して、上昇する昇降棚８の凹溝8aにてそのままの間隔を
保った状態で受け取られ、後退してくる水平移動把持棚
70の後部下面の把持用凹部70aにて把持され、さらに水
洗装置40により４段階にわたって十分に水洗処理された
ワーク２は水平移動把持棚70の前部の凹溝12aによって
一定間隔を保った状態で複数（この実施例では５つ）ず
つ次の処理部へ運ばれる。In addition, a water washing device 90 is provided at a substantially intermediate phase position of the horizontal moving holding shelf 70. When a plurality of (five in this embodiment) round bar-shaped workpieces 2 are transported at a constant interval by a transport device (not shown), when the lifting shelf 6 is lifted, the rounded workpieces 2 are kept at their upper concave grooves 6a. It is received while being kept. When the work 2 is lowered, the work 2 is placed on the concave groove 60a of the horizontal moving shelf 60 which retreats and goes below the work 2 while keeping the same distance, and the plating apparatus is moved by the horizontal moving shelf 60 moving forward. At the same phase position as 10, the plating apparatus 10 is raised to the same height position as the processing chamber.
Then, at that position, after being pressed by the tip of the rod of the pressing device 80 so as not to move, it is gripped by the gripping devices 40 and 45, taken into the processing chamber, and subjected to surface treatment therein. It is returned to the concave groove 7a of the lifting shelf 7 and descends. At that time, it is carried on the front half of the retreating horizontal moving shelf 60 while maintaining the same interval, and is carried forward. The horizontal moving gripping shelf is received in the concave groove 8a of the ascending lifting / lowering shelf 8 while keeping the same distance, and retreats.
The work 2 gripped by the gripping recess 70a on the lower surface of the rear part of the rear part 70 and fully washed with water for four steps by the water washing device 40 is maintained at a constant interval by the concave groove 12a at the front part of the horizontally movable gripping shelf 70. Are transferred to the next processing unit by a plurality (five in this embodiment).

水洗装置90は搬送ラインに沿って相互に分離して並置
された複数（この実施例では４つ）の水洗槽91と各水洗
槽91にワーク２を出し入れする昇降受皿92とこれら昇降
受皿92を昇降させるピストンシリンダ装置93とからな
る。そして、前記水平移動把持棚70によって運ばれてき
たワーク２を昇降皿92が上昇して受け取る。しかる後、
昇降皿92が下降して水洗槽91中に漬されたときに水洗さ
れ、再び上昇したときに、順次搬送ライン方向に移動す
る水平移動把持棚70の前記送り用凹溝70bにて次の水洗
槽91の昇降受皿92へ移されて水洗される。そして、水洗
が修了すると、水平移動把持棚70の前部の把持用凹部70
aに受け取られて次の処理行程へと搬送される。The washing device 90 includes a plurality (four in this embodiment) of washing tanks 91 which are separated and juxtaposed along the transport line, an elevating tray 92 for putting the work 2 into and out of each of the washing tanks 91, and these elevating trays 92. And a piston cylinder device 93 that moves up and down. Then, the work 92 carried by the horizontally movable holding shelf 70 is received by the elevating plate 92 ascending. After a while
When the ascending / descending tray 92 descends and is immersed in the washing tank 91, it is washed with water. It is moved to the elevating tray 92 of the tank 91 and washed with water. When the washing is completed, the holding recess 70 at the front of the horizontally moving holding shelf 70 is used.
It is received by a and transported to the next processing step.

そして、全ての処理行程が終了した後、表面処理され
たワーク２が乾燥されて仕上がる。After all the processing steps are completed, the surface-treated workpiece 2 is dried and finished.

［発明の効果］ この発明に係るメッキ装置によれば、被処理物挿脱手
段を構成する第1,第２の各被処理物保持部材の所定部位
は、各被処理物をメッキ室内に取り込んだ状態で前記各
開口部と嵌合してメッキ室を密閉する形状に成されてい
るため、従来のように各メッキ室の密閉手段を別途設け
ることなく、被処理物挿脱手段がメッキ室の密閉手段を
兼ねるため、メッキ装置の部品点数を減らしてメッキ装
置の構造を簡略化でき、製造コストを低減することがで
きるという効果がある。[Effects of the Invention] According to the plating apparatus of the present invention, the predetermined portions of the first and second workpiece holding members constituting the workpiece insertion / removal means take each workpiece into the plating chamber. In this state, each of the openings is fitted to each of the openings to hermetically seal the plating chamber. , The number of parts of the plating apparatus can be reduced, the structure of the plating apparatus can be simplified, and the production cost can be reduced.

また、被処理物挿脱手段が各被処理物をメッキ室内に
取り込んだ際に各メッキ室を密閉できるので、メッキを
行なう工程において、メッキ室の密閉，開放の動作を被
処理物の挿脱動作に付随させて同時に行なうことが可能
となり、工程数を低減してメッキ処理品を効率良く量産
することができるという効果がある。In addition, since each of the plating chambers can be sealed when the workpiece insertion / removal means takes in each of the workpieces into the plating chamber, the operation of sealing and opening the plating chamber is performed in the step of performing plating. This can be performed simultaneously with the operation, and there is an effect that the number of steps can be reduced and plated products can be efficiently mass-produced.

また、各メッキ室は、両端に開口部を有する導電性の
筒状体を含み、かつ、第1,第２の被処理物保持部材の少
なくとも一方が導電体で形成されているため、メッキ処
理を施すための電極を別途設ける必要がなくなり、メッ
キ装置の構造を簡単にすることができる。In addition, each plating chamber includes a conductive tubular body having openings at both ends, and at least one of the first and second workpiece holding members is formed of a conductor. It is not necessary to separately provide an electrode for performing plating, and the structure of the plating apparatus can be simplified.

【図面の簡単な説明】[Brief description of the drawings]

第１図〜第８図は、この発明の実施例を示すもので、そ
のうち、 第１図は、部分平断面をとって示すメッキ装置の説明
図、 第２図は、メッキ装置の主要構造図、 第３図は、分配管の正面図、 第４図は、第３図のIV−IV線に沿った断面図、 第５図は、その下面図、 第６図は、メッキ装置と搬送装置と水洗装置との相互関
係を示す説明図、 第７図は、一連のメッキ処理工程を示すブロック図、 第８図は、メッキ室への分配管の接続状態を示す正面図
である。 ２……ワーク（被処理品）、10……メッキ装置、 11……メッキ室、12……円筒状の電極、 40,45……把持装置（被処理物挿脱手段）、 42,47……ピストンシリンダ装置、 41,46……保持部（第１の被処理物保持部材，第２の被
処理物保持部材）。1 to 8 show an embodiment of the present invention, in which FIG. 1 is an explanatory view of a plating apparatus showing a partial plan section, and FIG. 2 is a main structural diagram of the plating apparatus. , FIG. 3 is a front view of the distribution pipe, FIG. 4 is a sectional view taken along the line IV-IV of FIG. 3, FIG. 5 is a bottom view thereof, and FIG. FIG. 7 is a block diagram showing a series of plating processing steps, and FIG. 8 is a front view showing a connection state of a distribution pipe to a plating chamber. 2 ... Work (workpiece), 10 ... Plating equipment, 11 ... Plating chamber, 12 ... Cylindrical electrode, 40,45 ... Gripping equipment (workpiece insertion / removal means), 42,47 ... ... Piston cylinder device, 41,46 ... Holding parts (first workpiece holding member, second workpiece holding member).

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】各々密閉可能な複数のメッキ室と、各メッ
キ室に対してメッキ液を同一流量で流通させるメッキ液
循環手段と、各メッキ室に被処理物を挿脱する被処理物
挿脱手段とを備えるメッキ装置において、 前記各メッキ室は、両端に開口部を有する導電性の筒状
体を含み、 前記被処理物挿脱手段は、前記各開口部の一方側からメ
ッキ室を貫通して他方の開口部側との間を往復動可能な
第１の被処理物保持部材と、該第１の被処理物保持部材
との間に被処理物を挟みこんだ状態で第１の被処理物保
持部材と連動して往復動可能な第２の被処理物保持部材
を備え、前記第1,第２の各被処理物保持部材の所定部位
は、各被処理物をメッキ室内に取り込んだ状態で前記各
開口部と嵌合して各メッキ室を密閉する形状に成され、
かつ、前記第1,第２の被処理物保持部材の少なくとも一
方が導電体で形成され、上記密閉状態でメッキ室内にメ
ッキ液を流通させながら上記メッキ室の導電性の筒状体
と上記導電体で形成された被処理物保持部材との間に電
圧を印加して被処理物にメッキ処理可能に構成されてい
ることを特徴とするメッキ装置。1. A plurality of plating chambers each capable of being sealed, a plating solution circulating means for flowing a plating solution through each plating chamber at the same flow rate, and a workpiece insertion / removal for inserting / removing a workpiece into / from each plating chamber. In each of the plating apparatuses, the plating chamber includes a conductive tubular body having openings at both ends, and the processing object inserting / removing means removes the plating chamber from one side of each of the openings. A first processing object holding member which can penetrate and reciprocate between the other opening side; and a first processing object sandwiched between the first processing object holding member and the first processing object holding member. A second processing object holding member that can reciprocate in conjunction with the processing object holding member, and a predetermined portion of each of the first and second processing object holding members transfers each processing object to the plating chamber. In the state taken in, it is formed in a shape that fits with each of the openings and seals each plating chamber,
In addition, at least one of the first and second workpiece holding members is formed of a conductor, and while the plating solution flows through the plating chamber in the sealed state, the conductive tubular body of the plating chamber and the conductive cylinder are connected to each other. A plating apparatus characterized in that a voltage can be applied to a workpiece holding member formed of a body to apply a plating process to the workpiece. 【請求項２】前記各メッキ室の開口部には、メッキ室内
に被処理物を取り込んだ状態において前記第1,第２の被
処理物保持部材の所定部位と上記開口部との間からメッ
キ液が外部に漏れないようにするエアシール手段がそれ
ぞれ設けられていることを特徴とする特許請求の範囲第
１項記載のメッキ装置。2. An opening of each of the plating chambers is provided with a plating object between a predetermined portion of the first and second workpiece holding members and the opening when the workpiece is taken into the plating chamber. 2. The plating apparatus according to claim 1, further comprising air sealing means for preventing the liquid from leaking to the outside.