JP2584476Y2 - Printed board - Google Patents
Printed boardInfo
- Publication number
- JP2584476Y2 JP2584476Y2 JP1992006695U JP669592U JP2584476Y2 JP 2584476 Y2 JP2584476 Y2 JP 2584476Y2 JP 1992006695 U JP1992006695 U JP 1992006695U JP 669592 U JP669592 U JP 669592U JP 2584476 Y2 JP2584476 Y2 JP 2584476Y2
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- circuit board
- printed circuit
- solder
- solder pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本考案は、テレビジョン受信機等
の電子機器に用いられるプリント基板に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board used for electronic equipment such as a television receiver.
【０００２】[0002]
【従来の技術】テレビジョン受信機などに用いられるプ
リント基板に実装される回路で発振回路などを有するも
のには、回路からの電磁波の輻射を低減させるために図
２に示すようにプリント基板２２にシールドケース２４
が取り付けられる。その取付け方法として図３に示すよ
うにプリント基板２２の上面のシールドケース２４とプ
リント基板２２の下面のシールドケース２５でプリント
基板２２をはさみ、ビス２３で締め付ける構造がある。
この構造においてシールドケース２５はプリント基板２
２の下面の斜線部２６で示した部分で接触し、この斜線
部に回路のグランドに接続されている銅箔を配置するこ
とによりシールドケース２５はプリント基板の下面の回
路を電気的に遮蔽する。ここでシールドケース２５に銅
箔を確実に接触させるために銅箔上にはシールドケース
の変形や銅箔に付着するハンダの量のばらつきを考慮し
て図４に示すような直径２ｍｍ前後の円形のハンダパタ
ーン部１２を図３の斜線部パターン２６で示した部分に
設けられた図４の１１で示す銅箔上に多数配置する方法
が従来用いられた。2. Description of the Related Art A circuit mounted on a printed circuit board used for a television receiver or the like and having an oscillation circuit or the like includes a printed circuit board 22 as shown in FIG. 2 in order to reduce radiation of electromagnetic waves from the circuit. Shield case 24
Is attached. As a mounting method, as shown in FIG. 3, there is a structure in which the printed circuit board 22 is sandwiched between a shield case 24 on the upper surface of the printed circuit board 22 and a shield case 25 on the lower surface of the printed circuit board 22 and fastened with screws 23.
In this structure, the shield case 25 is
The shield case 25 electrically shields the circuit on the lower surface of the printed circuit board by making contact with the portion indicated by the hatched portion 26 on the lower surface of the printed circuit board 2 and arranging a copper foil connected to the ground of the circuit in the hatched portion. . Here, in order to ensure that the copper foil is in contact with the shield case 25, a circular shape having a diameter of about 2 mm as shown in FIG. 4 is formed on the copper foil in consideration of deformation of the shield case and variation in the amount of solder attached to the copper foil. Conventionally, a method of arranging a large number of the solder pattern portions 12 on the copper foil 11 shown in FIG. 4 provided in the portion indicated by the hatched portion pattern 26 in FIG. 3 has been used.
【０００３】[0003]
【考案が解決しようとする課題】図４に示す面積の広い
銅箔１１上に多数の小面積のハンダパターン部１２を配
置してなるプリント基板を、実装部品に適したハンダデ
ィップ時間及びハンダ温度に設定されたハンダディップ
槽でハンダディッピングを行うと、かなりの割合のハン
ダパターン部１２にハンダが付着せず、これらのハンダ
パターン部１２にはハンダディップ工程の後で手作業で
ハンダ盛りをする必要があった。このように全てのハン
ダパターン部１２にハンダが付着しないのはハンダパタ
ーン部１２の設けられた銅箔の面積が電子回路を形成す
るための一般の銅箔形状寸法に比較して広いために熱が
拡散しやすく従ってハンダパターン部の温度がその部分
にハンダが確実に付着するまでに十分に上昇しないこと
によるものである。SUMMARY OF THE INVENTION A printed circuit board having a large number of small-area solder pattern portions 12 arranged on a large-area copper foil 11 shown in FIG. When the solder dipping is performed in the solder dipping tank set in the above, the solder does not adhere to a considerable proportion of the solder pattern portions 12, and the solder pattern portions 12 are manually soldered after the solder dipping process. Needed. The reason why solder does not adhere to all of the solder pattern portions 12 is that the area of the copper foil on which the solder pattern portions 12 are provided is larger than the general copper foil shape for forming an electronic circuit. Is easily diffused, so that the temperature of the solder pattern portion does not rise sufficiently until the solder is securely attached to the portion.
【０００４】本考案は上記の問題点とその原因にかんが
み、図３に示すシールドケースのプリント基板への取付
け構造においてシールドケースと銅箔を接触させるため
のハンダパターン部にハンダディップ工程でハンダが確
実に付着するプリント基板を提供するものである。In view of the above problems and their causes, the present invention considers the above problem and its cause. In the structure for mounting the shield case to the printed circuit board shown in FIG. It is intended to provide a printed circuit board to which an adhesive is securely attached.
【０００５】[0005]
【課題を解決するための手段】本考案のプリント基板は
シールドケースをプリント基板２２の銅箔１に接触させ
るためのハンダパターン２が設けられた銅箔を、その銅
箔１の幅Ｗ１，Ｗ２，Ｗ３がハンダパターン部２の最大
寸法と同じか２倍程度以下とすることによりハンダディ
ップ時にハンダパターン部の温度が銅箔１による熱拡散
の影響を受けにくくしたことを特徴とする。The printed circuit board of the present invention is obtained by forming a copper foil provided with a solder pattern 2 for bringing a shield case into contact with a copper foil 1 of a printed circuit board 22 by using widths W1 and W2 of the copper foil 1. , And W3 are equal to or less than about twice the maximum dimension of the solder pattern portion 2 so that the temperature of the solder pattern portion is less affected by the thermal diffusion due to the copper foil 1 during solder dipping.
【０００６】[0006]
【作用】本考案のプリント基板によれば、プリント基板
に実装される部品に許容されるハンダディップ時間及び
ハンダ温度で銅箔上のハンダパターン部に確実にハンダ
を付着させることができるために手作業によるハンダ盛
りが不要となり作業工数を容易に低減させることができ
る。According to the printed circuit board of the present invention, the solder can be securely attached to the solder pattern on the copper foil at the solder dipping time and the solder temperature allowed for the components mounted on the printed circuit board. Soldering by work is not required, and the number of work steps can be easily reduced.
【０００７】[0007]
【実施例】以下本考案の実施例について、図面を参照し
ながら説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings.
【０００８】図１において、１はプリント基板内回路の
グランド回路に接続され更にプリント基板上に取付けら
れるシールドケース２４，２５に電気的に接続される銅
箔、２は銅箔上に設けられたハンダパターン部、３はシ
ールドケースをプリント基板に取り付けるためのビス用
の孔、６，７は銅箔無し部である。図１に示すように、
銅箔２の配置形状を幅Ｗ１，Ｗ２，Ｗ３がハンダパター
ン部２の最大寸法の２倍程度以下、長さがハンダパター
ンの最大寸法の２倍程度以上とし相互に連接することに
よりハンダディップ時のハンダパターン部２の熱が拡散
しにくくなりハンダパターン部２に確実にハンダを付着
させることができる。In FIG. 1, reference numeral 1 denotes a copper foil which is connected to a ground circuit of a circuit in a printed circuit board and which is electrically connected to shield cases 24 and 25 mounted on the printed circuit board, and 2 is provided on the copper foil. The solder pattern portion 3 has holes for screws for attaching the shield case to the printed circuit board, and the portions 6 and 7 have no copper foil. As shown in FIG.
The width W1, W2, and W3 of the copper foil 2 are about twice or less the maximum dimension of the solder pattern portion 2 and the length is about twice or more the maximum dimension of the solder pattern. The heat of the solder pattern portion 2 is not easily diffused, and the solder can be securely adhered to the solder pattern portion 2.
【０００９】[0009]
【考案の効果】以上のように本考案のプリント基板によ
ればプリント基板上に取り付けられるシールドケースと
プリント基板のグランド用銅箔とを接触させるためのハ
ンダパターン部にハンダディップ工程で確実にハンダが
付着するために、その後の手作業によるハンダ盛りが不
要となり作業工数を容易に低減させることができる。As described above, according to the printed circuit board of the present invention, the solder pattern is surely formed by the solder dip process in the solder pattern portion for bringing the shield case mounted on the printed circuit board into contact with the ground copper foil of the printed circuit board. Is attached, so that subsequent soldering by hand is not required, and the number of working steps can be easily reduced.
【図１】本考案の実施例におけるプリント基板の要部平
面図FIG. 1 is a plan view of a main part of a printed circuit board according to an embodiment of the present invention.
【図２】シールドケースが取り付けられたプリント基板
の斜視図FIG. 2 is a perspective view of a printed circuit board to which a shield case is attached.
【図３】プリント基板へシールドケースを取付ける方法
の斜視図FIG. 3 is a perspective view of a method of attaching a shield case to a printed circuit board.
【図４】シールドケースをプリント基板のグランド回路
に接続するための従来のプリント基板の銅箔及びハンダ
パターンの平面図FIG. 4 is a plan view of a copper foil and a solder pattern of a conventional printed circuit board for connecting a shield case to a ground circuit of the printed circuit board.
１ １１ ２６ 銅箔 ２ １２ ハンダパターン ６ ７ プリント基板 ２２ プリント基板 ２４ ２５ シールドケース 1 11 26 Copper foil 2 12 Solder pattern 6 7 Printed circuit board 22 Printed circuit board 24 25 Shield case
Claims (1)
続されて前記プリント基板上に接地パターンとして形成
された接地用銅箔部と、前記接地用銅箔部上に配置され
た多数の小面積のハンダパターン部と、前記接地用銅箔
部に電気的に端部が接続され前記プリント基板内回路を
シールドするためのシールドケースと、前記接地用銅箔
部内に形成された銅箔無し部とを備え、前記多数の小面
積のハンダパターン部が配置された周辺部における前記
接地用銅箔部のパターン幅が前記ハンダパターン部の最
大寸法の２倍以下になるように前記銅箔無し部を配設し
て前記ハンダパターン部が配置された前記銅箔部の熱容
量を小さくしたことを特徴とするプリント基板。1. A circuit connected to a ground circuit of a circuit in a printed circuit board.
Continued to form a ground pattern on the printed circuit board
Grounded copper foil portion, and disposed on the grounding copper foil portion.
A large number of small-area solder pattern portions and the grounding copper foil
The end of the printed circuit board is electrically connected to the
A shield case for shielding, and the copper foil for grounding
A copper foil-free portion formed in the portion, wherein the plurality of small surfaces
In the peripheral portion where the solder pattern portion of the product is disposed
The pattern width of the copper foil part for grounding is
Arrange the copper foil-free part so that it is less than twice the large dimension.
The heat capacity of the copper foil portion where the solder pattern portion is disposed
A printed circuit board characterized by a reduced amount .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1992006695U JP2584476Y2 (en) | 1992-02-19 | 1992-02-19 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1992006695U JP2584476Y2 (en) | 1992-02-19 | 1992-02-19 | Printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0567090U JPH0567090U (en) | 1993-09-03 |
| JP2584476Y2 true JP2584476Y2 (en) | 1998-11-05 |
Family
ID=11645479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1992006695U Expired - Lifetime JP2584476Y2 (en) | 1992-02-19 | 1992-02-19 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2584476Y2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0654838B2 (en) * | 1986-03-04 | 1994-07-20 | 松下電器産業株式会社 | Printed circuit board shielding method |
-
1992
- 1992-02-19 JP JP1992006695U patent/JP2584476Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0567090U (en) | 1993-09-03 |
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