JP2574700B2 - Flat thermal fuse - Google Patents
Flat thermal fuseInfo
- Publication number
- JP2574700B2 JP2574700B2 JP1109791A JP10979189A JP2574700B2 JP 2574700 B2 JP2574700 B2 JP 2574700B2 JP 1109791 A JP1109791 A JP 1109791A JP 10979189 A JP10979189 A JP 10979189A JP 2574700 B2 JP2574700 B2 JP 2574700B2
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- thermal fuse
- low melting
- alloy
- point fusible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- Fuses (AREA)
Description
【発明の詳細な説明】 ＜産業上の利用分野＞ 本発明は平型の合金型温度ヒューズに関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a flat alloy type thermal fuse.
＜従来の技術＞ 合金型温度ヒューズにおいては、ヒューズエレメント
に低融点可溶合金片を使用しており、保護しようとする
電気機器の過電流に基づく発生熱でヒューズエレメント
が融点にまで加熱されると、ヒューズエレメントの溶断
で電気機器への通電を遮断し、電気機器の異常発熱、ひ
いては火災の発生を未然に防止している。<Prior Art> In an alloy type thermal fuse, a low melting point fusible alloy piece is used for a fuse element, and the fuse element is heated to a melting point by heat generated based on an overcurrent of an electric device to be protected. Then, the current to the electric equipment is cut off by the fusing of the fuse element, thereby preventing the abnormal heat generation of the electric equipment and hence the occurrence of fire.
従来、合金型温度ヒューズには、第３図に示すよう
に、リード導体１′,1′間に低融点可溶合金片２′を接
続し、この低融点可溶合金片２′にフラックス３′を塗
布し、このフラックス塗布低融点可溶合金片上にセラミ
ックス絶縁筒５′を挿通し、セラミックス絶縁筒５′の
各端と各リード導体１′との間を封止材４′（通常、エ
ポキシ樹脂が使用されている）で封止した筒型の合金型
温度ヒューズで伝統的に使用されている。Conventionally, as shown in FIG. 3, a low melting point fusible alloy piece 2 'is connected between lead conductors 1', 1 'and a flux 3 , And a ceramic insulating tube 5 ′ is inserted through the flux-coated low-melting-point fusible alloy piece, and a sealing material 4 ′ (usually, between each end of the ceramic insulating tube 5 ′ and each lead conductor 1 ′) It is traditionally used in tubular alloy-type thermal fuses sealed with epoxy resin.
この筒型の合金型温度ヒューズの寸法は、通常、筒長
さが6.0±0.5mm〜11.5±0.5mm、筒外径が2.0±0.1mm〜
3.3±0.2mmであり、リード導体間の間隔、すなわち、低
融点可溶合金片の長さは、ほぼ5.0mm〜8.0mmとされてい
る。The dimensions of this cylindrical alloy type thermal fuse are usually 6.0 ± 0.5mm to 11.5 ± 0.5mm in cylinder length and 2.0 ± 0.1mm to outside diameter of cylinder.
The distance between the lead conductors, that is, the length of the low-melting-point fusible alloy piece is approximately 5.0 mm to 8.0 mm.
本出願人においては、合金型温度ヒューズの薄型化を
図るために、セラミックス基板の片面に互いに並行な一
対の帯状電極を設け、これらの電極間に低融点可溶合金
片を接続し、この低融点可溶合金片上にフラックスを塗
布し、セラミックス基板片面を気密に覆う樹脂被覆層を
設けて成る基板型の合金型温度ヒューズを開発し、開発
途上において発生した種々の問題を解決してきた（実公
平４−36029号、実公平５−14433号、実公平５−14439
号等）。In order to reduce the thickness of the alloy-type thermal fuse, the present applicant provided a pair of strip electrodes parallel to each other on one side of a ceramic substrate, and connected a low melting point fusible alloy piece between these electrodes. We have developed a board-type alloy-type thermal fuse that consists of applying a flux onto a melting-point fusible alloy piece and providing a resin coating layer that airtightly covers one side of the ceramic substrate, and has solved various problems that occurred during development (actually, No.4-36029, No.5-14433, No.5-14439
No.).
＜発明が解決しようとする課題＞ ところで、上記筒型の合金型温度ヒューズにおいて
は、上述した通り電極間の間隔（リード導体間の間隔）
が通常、5.0〜8.0mm程度とされている。<Problems to be Solved by the Invention> Meanwhile, in the cylindrical alloy-type thermal fuse, as described above, the distance between the electrodes (the distance between the lead conductors).
Is usually about 5.0 to 8.0 mm.
而るに、本発明者等においては、上記基板型の合金型
温度ヒューズにつき平面寸法の小型化を図るために、電
極間の間隔を4.5mm以下にすることを試みたところ、作
動迅速性（低融点可溶合金片が溶断し始めてから通電が
完全に遮断されるまでの時間）の低下が観られた。The present inventors attempted to reduce the distance between the electrodes to 4.5 mm or less in order to reduce the planar size of the substrate-type alloy type thermal fuse. (The time from when the low-melting-point fusible alloy piece started to melt until the current was completely cut off) was reduced.
筒型の合金型温度ヒューズで確立されている合金型温
度ヒューズの作動機構は、低融点可溶合金片が溶融さ
れ、この溶融金属が電極側に所謂濡れ現象により引っ張
られて分断されることにある。しかしながら、基板型の
合金型温度ヒューズにおいては、低融点可溶合金片が溶
融されると、その溶融金属が基板に接触しているため、
溶融金属の全てが電極側に引っ張られるのではなく、溶
融金属の一部が電極間に離島状に残存し易く、電極間の
距離を4.5mm以下というように短縮したもとで離島現象
が生じると、電極間の電気ストレス（電位傾度）がその
短縮度に応じて高くなっているために、離島ギャツプが
放電して再導通し易い。The operating mechanism of the alloy type thermal fuse established by the cylindrical alloy type thermal fuse is that the low melting point fusible alloy piece is melted, and this molten metal is pulled by the so-called wetting phenomenon on the electrode side and cut off. is there. However, in the substrate type alloy type thermal fuse, when the low melting point fusible alloy piece is melted, the molten metal is in contact with the substrate,
Not all of the molten metal is pulled to the electrode side, but a part of the molten metal is likely to remain in an island shape between the electrodes, and the island phenomenon occurs when the distance between the electrodes is shortened to 4.5 mm or less In addition, since the electrical stress (potential gradient) between the electrodes increases in accordance with the degree of shortening, the island gap easily discharges and easily conducts again.
而して、基板型の合金型温度ヒューズにおいて電極間
の距離を4.5mm以下というように短縮する場合に作動迅
速性が低下する理由は、離島ギャツプの放電による再導
通が原因であると推定される（基板型の合金型温度ヒュ
ーズにおいて電極間の間隔が広いと、離島現象が生じて
も、電位傾度が低いために離島ギャツプでの放電が発生
せず、作動迅速性への影響はない）。Therefore, it is presumed that when the distance between the electrodes is shortened to 4.5 mm or less in the substrate type alloy type thermal fuse, the operation speed is reduced due to the re-conduction due to the discharge of the island gap. (If the distance between the electrodes in the substrate-type alloy type thermal fuse is large, even if the island phenomenon occurs, the potential gradient is low, so no discharge occurs in the island gap and there is no effect on the operation speed.) .
本発明の目的は、基板型の合金型温度ヒューズにおい
て、電極間の距離を4.5mm以下といった短間隔にして
も、作動時での溶融ヒューズエレメントの離島現象を排
除し、再導通を防止して作動迅速性を保持させることに
ある。The object of the present invention is to eliminate the island phenomenon of the molten fuse element during operation and prevent re-conduction even when the distance between the electrodes is as short as 4.5 mm or less in the substrate type alloy type thermal fuse. The purpose is to maintain quick operation.
＜課題を解決するための手段＞ 本発明に係る平型温度ヒューズは、絶縁基板の片面に
互いに並行な一対の帯状導体を設け、これらの帯状導体
間に低融点可溶金属片を接続せる温度ヒューズにおい
て、導体間距離Ｄ（mm）を1.0mm〜4.5mm、低融点可溶金
属片の直径Ｒ（mm）を0.4mm〜1.0mmとし、しかも、各導
体巾Ｗ（mm）と導体間距離Ｄ（mm）と低融点可溶金属片
の直径Ｒ（mm）との間に、0.67≦W/R2Dの関係を与えた
ことを特徴とする構成である。なお、低融点可溶金属片
の断面が非円形である場合は、低融点可溶金属片の直径
Ｒ（mm）は、同一断面積の断面円形片の直径が相当す
る。<Means for Solving the Problems> A flat thermal fuse according to the present invention is provided with a pair of parallel strip conductors on one surface of an insulating substrate, and a temperature at which a low melting point fusible metal piece is connected between these strip conductors. In the fuse, the distance D (mm) between the conductors is 1.0 mm to 4.5 mm, the diameter R (mm) of the low melting point fusible metal piece is 0.4 mm to 1.0 mm, and each conductor width W (mm) and the distance between the conductors are set. The structure is characterized in that a relationship of 0.67 ≦ W / R 2 D is given between D (mm) and the diameter R (mm) of the low melting point fusible metal piece. When the cross section of the low-melting-point fusible metal piece is non-circular, the diameter R (mm) of the low-melting-point fusible metal piece corresponds to the diameter of a circular cross-section piece having the same cross-sectional area.
本発明における0.67≦W/R2Dの限定根拠は、次の通り
である。The grounds for limiting 0.67 ≦ W / R 2 D in the present invention are as follows.
第１図は平型温度ヒューズの基本的構造を示し、基板
上に設けられた帯状導体の巾をＷ、導体間距離をＤ、低
融点可溶金属片の直径をＲとする。FIG. 1 shows the basic structure of a flat type thermal fuse, in which the width of a strip-shaped conductor provided on a substrate is W, the distance between the conductors is D, and the diameter of a low melting point fusible metal piece is R.
この合金型温度ヒューズにおいて低融点可溶金属片が
溶融すると、導体１と溶融低融点金属との表面エネルギ
ーに基づく濡れ性により溶融金属が帯状導体側に濡れ拡
がりつつ移動していく。而して、帯状導体への濡れ拡が
りにより移動する溶融金属の量は帯状導体巾Ｗに応じて
増減すると推察でき、その量Q1は、 Q1＝kW で表し得る。而るに、導体間の低融点可溶金属片量Q2は Q2＝πR2D/4 であり、Q2/2＞Q1であれば、導体間に溶融金属の一部が
残留し、 Q2/2＞Q1 であれば、その残留はないことになる。When the low melting point fusible metal piece is melted in this alloy type thermal fuse, the molten metal moves while spreading on the strip-shaped conductor side due to wettability based on the surface energy of the conductor 1 and the molten low melting point metal. Thus, it can be inferred that the amount of the molten metal moving due to the spread of the wet to the strip conductor increases or decreases according to the width W of the strip conductor, and the quantity Q 1 can be expressed by Q 1 = kW. The而Ru, low melting point soluble metal piece quantity Q 2 between the conductors Q 2 = .pi.R a 2 D / 4, if Q 2/2> Q 1, and the residual part of the molten metal between the conductors , if Q 2/2> Q 1, so that the residue is not.
而して、電極間に溶融金属が残留しない条件は、，
，式より、 π／（8k）＜W/（R2D） となる。Therefore, the conditions under which molten metal does not remain between the electrodes are as follows:
From the formula, π / (8k) <W / (R 2 D).
本発明者等は式の妥当性を検証し、未知数ｋを確定
するために、線径が0.4mm、1.0mmの低融点可溶金属線
（組成はPb:31重量％、Sn:19重量％、Bi:50重量％、融
点98℃）のそれぞれにつき、帯状導体間間隔Ｄ及び帯状
導体巾Ｗを変えて、上記溶融金属の残留の有無を調べた
ところ次の通りであった。加熱には、100℃の恒温炉を
使用した。The present inventors have verified the validity of the formula, and in order to determine the unknown k, a low melting point soluble metal wire having a wire diameter of 0.4 mm and 1.0 mm (composition: Pb: 31% by weight, Sn: 19% by weight) , Bi: 50% by weight, melting point: 98 ° C.), and the presence or absence of the above-mentioned molten metal was examined by changing the interval D between the strip-shaped conductors and the width W of the strip-shaped conductor. A 100 ° C. constant temperature furnace was used for heating.
（１）線径1.0mmの低融点可溶金属線を用いた場合は、
第１表の通りであった（○は残留無し、×は残留有りを
示す）。（２）線径0.4mmの低融点可溶金属線を用いた
場合は、第２表の通りであった。(1) When a low melting point metal wire with a wire diameter of 1.0 mm is used,
The results were as shown in Table 1 (o indicates no residue, x indicates residual). (2) When a low melting point soluble metal wire having a wire diameter of 0.4 mm was used, the results were as shown in Table 2.
これらの表において、溶融金属の残留の境界におけ
る、W/（R2D）を算出したところ、各表の（ ）内に示
す通りであり、0.67≦W/R2Dを充足すれば、溶融金属の
残留がないことが明らかであり、上記式の妥当性を認
識できた。In these tables, the residual of the boundary of the molten metal was calculated in W / (R 2 D), is as shown in each table (), if satisfies 0.67 ≦ W / R 2 D, the molten It was clear that no metal remained, and the validity of the above equation could be recognized.
また、低融点可溶金属の組成の影響を調べるために、
Sn:50重量％、Pb:32重量％、Cd:18重量％、融点145℃の
低融点可溶合金についても、上記式の妥当性を検証
し、合金組成に影響されないことを確認した。Also, to investigate the effect of the composition of the low melting point soluble metal,
The validity of the above formula was also verified for a low melting point fusible alloy having Sn: 50% by weight, Pb: 32% by weight, Cd: 18% by weight and a melting point of 145 ° C., and it was confirmed that the alloy was not affected by the alloy composition.
＜実施例の説明＞ 第２図は本発明の実施例を示し、耐熱性の絶縁基板５
上に一対の帯状導体1,1（電極）形成し、（銅箔貼着絶
縁基板の銅箔のエッチング、導電性ペーストの印刷・焼
付け等により形成できる）、電極間に低融点可溶金属片
２（丸線または扁平線）を接続し、該低融点可溶金属片
２上にフラックス３を塗布し、各電極1,1にリード線10,
10を接続し、絶縁基板５上に絶縁層をモールド成形し、
電極1,1間の距離を1.0mm〜4.5mm、低融点可溶金属片の
直径を0.4mm〜1.0mm、帯状導体の巾を0.5mm〜3.5mmと
し、しかも、各導体巾Ｗ（mm）と導体間距離Ｄ（mm）と
低融点可溶金属片の直径Ｒ（mm）との間に、0.67≦W/R2
Dの関係を付与してあり、電極1,1間の距離を1.0mm〜4.5
mmとしているのは、1.0mm以下では、低融点可溶金属片
溶断後での使用電圧に対する電極間の絶縁を確保し難
く、4.5mm以上では、平型温度ヒューズの小型化を図り
難いためである。帯状導体の巾を0.5mm〜3.5mmしている
のは、平型温度ヒューズの小型化を図るためである。<Description of Embodiment> FIG. 2 shows an embodiment of the present invention, in which a heat-resistant insulating substrate 5 is provided.
A pair of strip-shaped conductors 1 and 1 (electrodes) are formed on the upper surface (which can be formed by etching copper foil on an insulating substrate with copper foil, printing or baking a conductive paste), and a low-melting soluble metal piece between the electrodes. 2 (round wire or flat wire), apply flux 3 on the low melting point soluble metal piece 2,
10 is connected, and an insulating layer is molded on the insulating substrate 5,
The distance between the electrodes 1 and 1 is 1.0mm to 4.5mm, the diameter of the low melting point fusible metal piece is 0.4mm to 1.0mm, the width of the strip conductor is 0.5mm to 3.5mm, and each conductor width W (mm) 0.67 ≦ W / R 2 between the distance D (mm) between the conductor and the diameter R (mm) of the low melting point fusible metal piece.
The relationship of D is given, and the distance between the electrodes 1 and 1 is 1.0mm to 4.5
The reason why the thickness is mm is that if the thickness is 1.0 mm or less, it is difficult to secure insulation between the electrodes with respect to the operating voltage after the low melting point fusible metal piece is blown. is there. The reason why the width of the strip conductor is 0.5 mm to 3.5 mm is to reduce the size of the flat thermal fuse.
＜発明の効果＞ 本発明に係る平型の合金型温度ヒューズにおいては、
電極間の距離を1.0〜4.5mmに狭くしても、低融点可溶金
属片の溶断時での離島化現象を防止でき、離島ギャップ
での放電に基づく再導通を排除できるから、作動迅速性
をよく保証できる。<Effect of the Invention> In the flat alloy type thermal fuse according to the present invention,
Even if the distance between the electrodes is narrowed to 1.0 to 4.5 mm, it is possible to prevent the islanding phenomenon at the time of fusing the low melting point fusible metal piece, and to eliminate re-conduction due to discharge in the island gap, so that operation is quick. Can be well guaranteed.
第１図は本発明に係る平型温度ヒューズの寸法関係を示
す説明図、第２図は本発明に係る実施例を示す説明図、
第３図は従来の筒型の合金型温度ヒューズを示す説明図
である。 １……帯状導体、２……低融点可溶金属片、５……絶縁
基板。FIG. 1 is an explanatory view showing a dimensional relationship of a flat thermal fuse according to the present invention, FIG. 2 is an explanatory view showing an embodiment according to the present invention,
FIG. 3 is an explanatory view showing a conventional cylindrical alloy-type thermal fuse. 1 ... strip-shaped conductor, 2 ... low melting point soluble metal piece, 5 ... insulating substrate.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 山中 仁 大阪府大阪市中央区島之内１丁目11番28 号 内橋エステック株式会社内 (72)発明者 山口 光 大阪府大阪市中央区島之内１丁目11番28 号 内橋エステック株式会社内 (72)発明者 豊田 一実 大阪府大阪市中央区島之内１丁目11番28 号 内橋エステック株式会社内 (56)参考文献 特開 昭63−139739（ＪＰ，Ａ) 特開 昭63−99643（ＪＰ，Ａ) 特開 昭63−106041（ＪＰ，Ａ) ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Jin Yamanaka 1-11-28 Shimanouchi, Chuo-ku, Osaka-shi, Osaka Uchibashi ESTEC Corporation (72) Inventor Hikaru Yamaguchi 1-1-11 Shimanouchi, Chuo-ku, Osaka, Osaka No. 28 Uchihashi Estec Co., Ltd. (72) Inventor Kazumi Toyoda 1-11-28 Shimanouchi, Chuo-ku, Osaka City, Osaka Prefecture Uchihashi Estec Co., Ltd. (56) References JP-A-63-139739 (JP, A) JP-A-63-99643 (JP, A) JP-A-63-106041 (JP, A)
Claims (1)
導体を設け、これらの帯状導体間に低融点可溶金属片を
接続せる温度ヒューズにおいて、導体間距離Ｄ（mm）を
1.0mm〜4.5mm、低融点可溶金属片の直径Ｒ（mm）を0.4m
m〜1.0mmとし、しかも、各導体巾Ｗ（mm）と導体間距離
Ｄ（mm）と低融点可溶金属片の直径Ｒ（mm）との間に、
0.67≦W/R2Dの関係を与えたことを特徴とする平型温度
ヒューズ。1. A thermal fuse in which a pair of strip conductors parallel to each other is provided on one surface of an insulating substrate and a low melting point fusible metal piece is connected between the strip conductors.
1.0mm to 4.5mm, the diameter R (mm) of the low melting point fusible metal piece is 0.4m
m to 1.0 mm, and between each conductor width W (mm), the distance between conductors D (mm), and the diameter R (mm) of the low melting point fusible metal piece.
Flat type thermal fuse characterized by giving a relation of 0.67 ≦ W / R 2 D.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1109791A JP2574700B2 (en) | 1989-04-28 | 1989-04-28 | Flat thermal fuse |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1109791A JP2574700B2 (en) | 1989-04-28 | 1989-04-28 | Flat thermal fuse |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02288124A JPH02288124A (en) | 1990-11-28 |
| JP2574700B2 true JP2574700B2 (en) | 1997-01-22 |
Family
ID=14519313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1109791A Expired - Fee Related JP2574700B2 (en) | 1989-04-28 | 1989-04-28 | Flat thermal fuse |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2574700B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0656734B2 (en) * | 1989-05-19 | 1994-07-27 | 株式会社フジクラ | Thermal fuse |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0711393Y2 (en) * | 1987-03-04 | 1995-03-15 | 内橋エステック株式会社 | Substrate type thermal fuse |
-
1989
- 1989-04-28 JP JP1109791A patent/JP2574700B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02288124A (en) | 1990-11-28 |
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