JP2555376B2 - Ultrasonic probe and method of manufacturing the same - Google Patents
Ultrasonic probe and method of manufacturing the sameInfo
- Publication number
- JP2555376B2 JP2555376B2 JP62267445A JP26744587A JP2555376B2 JP 2555376 B2 JP2555376 B2 JP 2555376B2 JP 62267445 A JP62267445 A JP 62267445A JP 26744587 A JP26744587 A JP 26744587A JP 2555376 B2 JP2555376 B2 JP 2555376B2
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric
- backing material
- ultrasonic probe
- conductive paths
- divided
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Measurement Of Velocity Or Position Using Acoustic Or Ultrasonic Waves (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は超音波探触子を利用分野とし、特に、フレキ
シブルプリント基板（以下フレキシブル板とする）を利
用したコンベックス型の超音波探触子及びその製造方法
に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial application field) The present invention has an application field of an ultrasonic probe, and in particular, a convex type ultrasonic probe using a flexible printed circuit board (hereinafter referred to as a flexible plate). And a manufacturing method thereof.
（発明の背景） 超音波探触子は、医用、鉱工業及び水産業等の各分野
で、超音波診断、探傷及び探査装置の超音波の送受波源
として利用される。例えば生体を被検出体とした超音波
診断装置では、複数個の圧電片を並べてリニアあるいは
セクタ駆動して疾患部を検出する。近年では、リニア方
式に比較してセクタ方式は位相制御が煩雑で高価なこと
から、圧電片を曲面上に配列して所謂コンベックス状に
形成してリニア駆動し、セクタ方式と同様な効果を得る
即ち送受波領域を拡大する方式の超音波探触子が注目を
浴びている（参照：特開昭59−202058号公報「超音波検
査装置用探触子の製造方法） （従来技術） 第３図はこの種の一従来例を説明する超音波探触子の
図である。なお、第３図（ａ）は超音波探触子の正面
図、同図（ｂ）は同平面図、同図（ｃ）は圧電片の図で
ある。(Background of the Invention) An ultrasonic probe is used as an ultrasonic wave transmission / reception source for ultrasonic diagnosis, flaw detection, and an exploration device in various fields such as medical, mining and fisheries. For example, in an ultrasonic diagnostic apparatus using a living body as a detected body, a plurality of piezoelectric pieces are arranged and linear or sector driven to detect a diseased part. In recent years, the phase control of the sector method is complicated and expensive compared to the linear method. Therefore, the piezoelectric pieces are arranged on a curved surface to form a so-called convex shape and linearly driven to obtain the same effect as the sector method. That is, an ultrasonic probe of the type that expands the transmission / reception area is receiving attention (see Japanese Patent Laid-Open No. 59-202058, "Method for manufacturing probe for ultrasonic inspection apparatus") (Prior Art) 3A and 3B are diagrams of an ultrasonic probe for explaining a conventional example of this kind, wherein FIG. 3A is a front view of the ultrasonic probe, FIG. FIG. 6C is a diagram of the piezoelectric piece.
この超音波探触子は、湾曲した基台１の表面にバッキ
ング材２を敷設し、更にその上に複数の圧電片３の一方
の主面を固着して湾曲方向に配列してなる。両主面には
励振電極４が形成されて一方の主面の一端側に折り返し
電極５を形成している。一方の主面の一端側からは例え
ば共通接続したリード線６を、他端側からはそれぞれ独
立したリード線（以下独立リード線）７を導出した構成
とする。従って、このような構成の超音波探触子では、
送受波面を凸面とするので、例えば圧電片を順次リニア
駆動することにより超音波の送受波領域を広げることが
できてセクタ駆動と同等な効果を得る。In this ultrasonic probe, a backing material 2 is laid on the surface of a curved base 1, and one main surface of a plurality of piezoelectric pieces 3 is further fixed on the backing material 2 and arranged in the curving direction. The excitation electrodes 4 are formed on both main surfaces, and the folded electrode 5 is formed on one end side of one main surface. For example, a lead wire 6 commonly connected from one end side of one main surface, and an independent lead wire (hereinafter, independent lead wire) 7 is led out from the other end side. Therefore, in the ultrasonic probe having such a configuration,
Since the wave transmitting / receiving surface is convex, the ultrasonic wave transmitting / receiving area can be expanded by, for example, sequentially linearly driving the piezoelectric pieces, and an effect equivalent to sector driving can be obtained.
（従来技術の欠点） ところで、上記構成の超音波探触子では、圧電片３の
厚みｔ及びその幅ｗを小さくし（一般には厚みの0.6以
下）、振動周波数を高めて副振動を除去するとともに点
音源に近づけて検出精度を高めるようにしている。例え
ば超音波周波数を4MHzとすると、圧電片３の幅ｗは役0,
25mm、その間隔ｄは0.05mmになる。従って、各圧電片３
の励振電極４から独立リード線７を一本づつ取出す作業
は困難を極めその効率を低下させる。このため、一般に
は平坦形のものでは既に実施されている導電路が印刷さ
れたフレキシブル基板の利用が考えられる。(Disadvantage of Prior Art) By the way, in the ultrasonic probe having the above-mentioned configuration, the thickness t and the width w of the piezoelectric piece 3 are reduced (generally, 0.6 or less of the thickness), and the vibration frequency is increased to remove the sub-vibration. At the same time, the detection accuracy is improved by bringing it closer to the point sound source. For example, if the ultrasonic frequency is 4 MHz, the width w of the piezoelectric piece 3 is 0,
25 mm, the distance d becomes 0.05 mm. Therefore, each piezoelectric piece 3
It is extremely difficult to take out the individual lead wires 7 from the excitation electrode 4 one by one, and the efficiency is lowered. For this reason, in general, it is considered to use a flexible substrate on which conductive paths are printed, which has already been implemented in the flat type.
すなわち、第４図に示したように、フレキシブル基板
９「同図（ａ）」の共通線路部10に圧電板11の一端側を
接続して可撓性のバッキング材12に取着するとともにフ
レキシブル基板９を折り曲げ「同図（ｂ）」、導電路13
間の圧電板11と共通線路部10とを一体的に切断分割して
励振電極を独立して導出する方法である。なお、図中の
符号14は外部との接続端子孔である。しかしながら、こ
の方法では、フレキシブル基板９の折曲部に歪みを生ず
る「同図（ｃ）」ため、バッキング材12を湾曲して図示
しない基台に固着することができない。That is, as shown in FIG. 4, one end side of the piezoelectric plate 11 is connected to the common line portion 10 of the flexible substrate 9 “(a) in FIG. The board 9 is bent "(b) in the same figure", the conductive path 13
This is a method in which the piezoelectric plate 11 and the common line portion 10 between them are integrally cut and divided to derive the excitation electrodes independently. Reference numeral 14 in the drawing is a connection terminal hole to the outside. However, according to this method, the backing material 12 cannot be curved and fixed to a base not shown because "b" of FIG.
そのため、第５図に示したように、フレキシブル基板
９を予め所定数の導電路13の形成された複数の単位フレ
キシブル基板（以下分割基板）15に分割し「同図
（ａ）」、圧電板11と接続した後バッキング材12に取着
し「同図（ｂ）」、折曲時の歪みを小さくする必要があ
る。しかし、この場合においてはフレキシブル基板９を
単位基板15に分割する際、導電路間隔ｄが極めて小さい
のでその切断が困難で作業性を低下させる。また、分割
後の単位基板15の両側の被覆幅も狭くて例えば被覆破損
等を生じて導電路を露出する問題等があった。Therefore, as shown in FIG. 5, the flexible substrate 9 is divided into a plurality of unit flexible substrates (hereinafter referred to as divided substrates) 15 in which a predetermined number of conductive paths 13 are formed, and the piezoelectric plate is shown in FIG. After connecting with 11, it is necessary to attach it to the backing material 12 "(b) in the same figure" to reduce distortion at the time of bending. However, in this case, when the flexible substrate 9 is divided into the unit substrates 15, since the conductive path interval d is extremely small, it is difficult to cut the conductive substrate and the workability is deteriorated. In addition, the coating width on both sides of the unit substrate 15 after division is also narrow, and there is a problem that, for example, coating damage occurs and the conductive paths are exposed.
（発明の目的） 本発明は、フレキシブル基板を利用して圧電片の励振
電極を導出し、しかも作業性を良好とするコンベックス
型の超音波探触子及びその製造方法を提供することを目
的とする。(Object of the Invention) An object of the present invention is to provide a convex-type ultrasonic probe that utilizes a flexible substrate to derive an excitation electrode of a piezoelectric piece and has good workability, and a method for manufacturing the same. To do.
（解決手段） 本発明の第１発明は、湾曲したバッキング材上に両主
面に電極の形成された複数の圧電片の一方の主面を固着
して湾曲方向に列設し、前記圧電片の所定数を一グルー
プとして一方の主面の電極を前記圧電片の両側から交互
に独立したフレキシブルプリント分割基板により導出し
たことを解決手段とする。(Solution) According to a first aspect of the present invention, one main surface of a plurality of piezoelectric pieces having electrodes formed on both main surfaces is fixed on a curved backing material, and the piezoelectric pieces are arranged in a line in a curving direction. The solution is that the electrodes on one main surface are alternately led out from both sides of the piezoelectric piece by independent flexible printed circuit boards as a predetermined number of groups.
本発明の第２発明は、並列する第１と第２の共通導電
路から互いに反対方向の外側に複数の導電路が形成され
た分割基板を交互に延出したフレキシブル基板に、両主
面に電極が形成された圧電板の一方の主面の両端部を前
記第１と第２の共通導電路に接続して可撓性のバッキン
グ材上に固着し、前記圧電板と第１と第２の共通導電路
を前記導電路間から一体的に切断分割して前記バッキン
グ材上に複数の圧電片を形成し、前記バッキング材を湾
曲させて基台表面に取着した製造方法を解決手段とす
る。A second aspect of the present invention is a flexible substrate in which divided substrates having a plurality of conductive paths formed on the outer sides in opposite directions from each other are alternately extended from the parallel first and second common conductive paths on both main surfaces. Both ends of one main surface of the piezoelectric plate on which the electrode is formed are connected to the first and second common conductive paths and fixed on a flexible backing material, and the piezoelectric plate and the first and second And a method for solving the problem, in which a plurality of piezoelectric pieces are formed by integrally cutting and dividing the common conductive path between the conductive paths to form a plurality of piezoelectric pieces on the backing material, and the backing material is curved and attached to a surface of a base. To do.
以下、本発明の第１及び第２発明の実施例を説明す
る。Examples of the first and second aspects of the invention will be described below.
（第１発明の実施例） 第１図は本発明の第１発明の一実施例を説明する図
で、第１図（ａ）は超音波探触子の正面図、同図（ｂ）
同背面図、同図（ｃ）は同平面図、同図（ｄ）は圧電片
の図である。なお、従来例図と同一部分には同番号を付
与する。(Embodiment of the first invention) FIG. 1 is a view for explaining an embodiment of the first invention of the present invention, FIG. 1 (a) is a front view of an ultrasonic probe, and FIG.
The same rear view, the same figure (c) are the same plan views, and the same figure (d) is a view of the piezoelectric piece. The same numbers are assigned to the same parts as those of the conventional example.
超音波を送受波する矩形状の圧電片３は前述同様にPZ
Tからなる。圧電片３は例えば厚みｔを0.1〜0.5mm、長
さｌを５〜15mm、幅ｗを0.05〜0.4mmとし、両主面に励
振電極４が形成される。一方の主面側は曲率半径を５〜
100mmRとする湾曲したバッキング材20上に固着し、湾曲
方向と幅方向が一致して配列する。バッキング材20は例
えばフェライトゴム等の可撓性材からなり、曲率半径が
略等しい基台21上に取着される。各圧電片３の一方の主
面とバッキング材20との間には、圧電片３の所定数を一
グループとしてその両端側から交互に分割基板22が介在
する。すなわち、ｎ番目のクループは圧電片３の一端側
から、ｎ＋１番目のグループは他端側から分割基板22を
導出する。分割基板22は例えばポリイミド等の樹脂体に
一グループの圧電片３の数に等しい複数の導電路を間隔
ａとして印刷形成してなり、圧電片３の一方の主面の励
振電極４と電気的に接続する。そして、バッキング材20
及び基台21の側面に固着して基台下方に延出する。圧電
片３の他方の主面の一端部側にはリード線24が取着され
て励振電極４を共通接続し、その上部に図示しない音響
整合層が形成される。The rectangular piezoelectric piece 3 for transmitting and receiving ultrasonic waves is PZ as described above.
Composed of T. The piezoelectric piece 3 has, for example, a thickness t of 0.1 to 0.5 mm, a length 1 of 5 to 15 mm, and a width w of 0.05 to 0.4 mm, and the excitation electrodes 4 are formed on both main surfaces. One major surface side has a radius of curvature of 5 to
It is fixed on a curved backing material 20 having a diameter of 100 mmR, and the curved direction and the width direction are aligned and arranged. The backing material 20 is made of, for example, a flexible material such as ferrite rubber, and is attached to a base 21 having substantially the same radius of curvature. Between one main surface of each piezoelectric piece 3 and the backing material 20, a predetermined number of piezoelectric pieces 3 are grouped and the divided substrates 22 are alternately arranged from both ends thereof. That is, the divided substrate 22 is led out from the one end side of the piezoelectric piece 3 for the nth group and the other end side of the n + 1th group. The divided substrate 22 is formed by printing on a resin body such as polyimide, for example, with a plurality of conductive paths equal to the number of the piezoelectric pieces 3 in one group at intervals a, and is electrically connected to the excitation electrode 4 on one main surface of the piezoelectric piece 3. Connect to. And the backing material 20
Also, it is fixed to the side surface of the base 21 and extends below the base. A lead wire 24 is attached to one end of the other main surface of the piezoelectric piece 3 to commonly connect the excitation electrodes 4, and an acoustic matching layer (not shown) is formed on the lead wire 24.
従って、このような構成の超音波探触子では、複数の
圧電片３を一グループとしてグループ毎に両端部から交
互に分割基板22を導出したので、バッキング材20を湾曲
状にして分割基板22を容易に折り曲げることができる。
そして、分割基板22は交互に延出するので導電路間を切
断する必要がなく、両外側の導電路23と辺縁との間隔
ｄ′を必要に応じて充分に大きくできてその絶縁を確実
にする。Therefore, in the ultrasonic probe having such a configuration, since the plurality of piezoelectric pieces 3 are grouped and the divided substrates 22 are alternately led out from both ends of each group, the divided substrate 22 is curved. Can be easily folded.
Since the divided substrates 22 extend alternately, there is no need to cut between the conductive paths, and the distance d'between the conductive paths 23 on both outer sides and the edges can be made sufficiently large as necessary to ensure the insulation. To
（第２発明の実施例） 第２図は第２発明の一実施例を説明する製造工程図で
ある。(Embodiment of Second Invention) FIG. 2 is a manufacturing process diagram for explaining an embodiment of the second invention.
先ず、両端が連結部30により結合して並列した第１と
第２の共通導電路31、32から、分割基板33a、33b、33
c、33dがそれぞれ反対方向の外側へ交互に延出したフレ
キシブル基板34を利用する。なお、分割基板33の先端側
はその内側面領域（以下先端側面領域）35が突出して隣
接する分割基板33の側面に連結する。先端側面領域35に
は端子孔36が設けられ、分割基板33に形成された所定数
の導電路37がこの端子孔36に延出する。そして、両端側
の分割基板33a、33dの対向側には補助基板38を設け、導
電路37a、37bの延長上に位置決め用導電路39が形成され
ている。また、分割基板33の先端及び共通線路部31、32
からは連結部41が突出し外枠40と一体的に結合する「第
２図（ａ）」。First, from the first and second common conductive paths 31 and 32 whose both ends are connected by the connecting portion 30 and are arranged in parallel, the divided boards 33a, 33b and 33 are formed.
A flexible substrate 34 in which c and 33d alternately extend outward in opposite directions is used. The tip side of the divided substrate 33 is connected to the side surface of the adjacent divided substrate 33 with an inner side surface region (hereinafter referred to as a tip side region) 35 protruding. A terminal hole 36 is provided in the tip side surface region 35, and a predetermined number of conductive paths 37 formed in the divided substrate 33 extend into the terminal hole 36. An auxiliary substrate 38 is provided on the opposite side of the divided substrates 33a, 33d on both ends, and a positioning conductive path 39 is formed on an extension of the conductive paths 37a, 37b. In addition, the tip of the divided substrate 33 and the common line portions 31, 32
A connecting portion 41 projects from the outer frame 40 and is integrally connected to the outer frame 40 (FIG. 2 (a)).
次に、圧電板42の一方の主面の両側を共通導電路31、
32に半田等により接続し、フレキシブル基板付き圧電板
（フレキ付き圧電板とする）43を形成する。圧電板42は
両主面にのみ図示しない励振電極が形成され、矩形状の
PZTからなる「同図（ｂ）」。Next, on both sides of one main surface of the piezoelectric plate 42, the common conductive path 31,
By connecting to 32 with solder or the like, a piezoelectric plate with a flexible substrate (hereinafter referred to as a flexible piezoelectric plate) 43 is formed. The piezoelectric plate 42 has excitation electrodes (not shown) formed on both main surfaces, and has a rectangular shape.
"Figure (b)" consisting of PZT.
次に、フレキ付き圧電板43を可撓性のバッキング材44
に取着する。そして、導電路37間となる圧電板上から所
定の間隔でバッキング材44に到達する切れ目45を設け
る。このとき、圧電板42とともに共通導電路31、32が分
割切断されて、各導電路37に接続した複数個の短冊状の
圧電片46が形成される。なお、分割基板33の導電路間は
共通線路部からの延出部のみが分割切断される「同図
（ｃ）」。Next, the flexible piezoelectric plate 43 is attached to the flexible backing material 44.
Attach to. Then, cuts 45 reaching the backing material 44 are provided at predetermined intervals from above the piezoelectric plate that is between the conductive paths 37. At this time, the common conductive paths 31 and 32 are divided and cut together with the piezoelectric plate 42, and a plurality of strip-shaped piezoelectric pieces 46 connected to the conductive paths 37 are formed. It should be noted that between the conductive paths of the divided substrate 33, only the extending portion from the common line portion is divided and cut "(c) in the same figure".
次に、分割基板33の連結した先端側側面領域部及び外
枠を分離してそれぞれ独立させる「同図（ｄ）」。そし
て、圧電片46と分割基板33の積層されたバッキング材44
を湾曲し、基台の凸面状の湾曲面に固着する。そして、
分割基板33をそれぞれバッキング材及び基台の側面に折
曲して例えば固着して下方部に延出する「第１図（ａ）
（ｂ）参照」。Next, "the same figure (d)" which separates the front-end side surface area part and outer frame which the division | segmentation board | substrate 33 connected and is made independent respectively. Then, the backing material 44 in which the piezoelectric piece 46 and the divided substrate 33 are laminated
Is curved and fixed to the convex curved surface of the base. And
The divided substrates 33 are bent to the backing material and the side surface of the base, and are fixed, for example, and extended to the lower portion (see FIG. 1 (a)).
See (b). "
従って、このような超音波探触子の製造方法によれ
ば、共通線路部31、32から互いに反対方向の外側に交互
に分割基板33の延出したフレキシブル基板を採用したの
で、その作業を容易にしてコンベックス形の超音波探触
子を製造できる。そして、フレキシブル基板34は最後に
枠40が除去されるので、作業上の取扱を簡単にする。ま
た、導電路37a、37bの延長上に位置決め用導電路39を設
けたので、例えばブレードソウの基準線ととして作用
し、圧電板42を高精度の短冊状に切断できる。Therefore, according to such a method of manufacturing an ultrasonic probe, since the flexible substrate in which the divided substrates 33 are alternately extended from the common line portions 31 and 32 to the outside in the opposite directions is adopted, the work is easy. Thus, a convex ultrasonic probe can be manufactured. Then, since the frame 40 is finally removed from the flexible substrate 34, the handling in work is simplified. In addition, since the positioning conductive path 39 is provided on the extension of the conductive paths 37a and 37b, it acts as a reference line of the blade saw, for example, and the piezoelectric plate 42 can be cut into a highly precise strip shape.
（他の事項） なお、上記実施例図では説明の便宜上、分割基板を交
互に二つ延出し、又各分割基板に２本の導電路を示して
説明したが、更に多数の分割基板及び導電路を形成あっ
てもよい。また、バッキング材は一方向にのみ湾曲した
凸面の基台上に取着したが、例えば環状であっても又は
凹面や凹凸面であってもよいことは勿論である。さら
に、圧電片の所定数を１グループとしたが、各圧電片は
共通接続した複数の圧電エレメントから構成されてあっ
てもよく、本発明はその趣旨を逸脱しない範囲内で適宜
自在に変更可能である。(Other Matters) For convenience of description, in the above embodiment, two divided substrates are alternately extended and two conductive paths are shown in each divided substrate. However, a larger number of divided substrates and conductive layers are provided. You may form a road. Further, although the backing material is attached on the convex base which is curved only in one direction, it is needless to say that the backing material may be, for example, an annular shape, a concave surface or an uneven surface. Further, although the predetermined number of piezoelectric pieces is one group, each piezoelectric piece may be composed of a plurality of piezoelectric elements that are commonly connected, and the present invention can be appropriately changed without departing from the spirit of the invention. Is.
（発明の効果） 本発明の第１発明は、湾曲したバッキング材上に両主
面に電極の形成された複数の圧電片の一方の主面を固着
して湾曲方向に列設し、前記圧電片の所定数を一グルー
プとして一方の主面の電極を前記圧電片の両側から交互
に独立したフレキシブルプリント分割基板により導出
し、第２発明は、並列する第１と第２の共通導電路から
互いに反対方向の外側に複数の導電路が形成された分割
基板を交互に延出したフレキシブ基板に、両主面に電極
が形成された圧電板の一方の主面の両端部を前記第１と
第２の共通導電路に接続して可撓性のバッキング材上に
固着し、前記圧電板と第１と第２の共通導電路を前記導
電路間から一体的に切断分割して前記バッキング材上に
複数の圧電片を形成し、前記バッキング材を湾曲させて
基台表面に取着したので、作業性を良好とするコンベッ
クス型の超音波探触子及びその製造方法を提供できる。(Effects of the Invention) A first aspect of the present invention is that one main surface of a plurality of piezoelectric pieces having electrodes formed on both main surfaces is fixed on a curved backing material, and the piezoelectric pieces are arranged in a line in the curving direction. With a predetermined number of pieces as one group, the electrodes on one main surface are led out from both sides of the piezoelectric piece alternately by independent flexible printed circuit boards, and the second invention is from parallel first and second common conductive paths. A flexible substrate in which a plurality of divided substrates, each having a plurality of conductive paths formed on opposite sides thereof, are alternately extended, and both end portions of one main surface of a piezoelectric plate having electrodes formed on both main surfaces are formed on the flexible substrate. The backing material is connected to a second common conductive path and fixed on a flexible backing material, and the piezoelectric plate and the first and second common conductive paths are integrally cut and divided from between the conductive paths. Form a plurality of piezoelectric pieces on top and bend the backing material Since it is attached to the surface, it is possible to provide a convex type ultrasonic probe having good workability and a manufacturing method thereof.
第１図は本発明の第１発明の一実施例を説明する図で、
第１図（ａ）は超音波探触子の正面図、同図（ｂ）同背
面図、同図（ｃ）は同平面図、同図（ｄ）は圧電片の図
である。 第２図（ａ）（ｂ）（ｃ）（ｄ）は本発明の第２発明の
一実施例を説明する製造工程図である。 第３図はこの種の一従来例を説明する超音波探触子の図
で、同図（ａ）は超音波探触子の正面図、同図（ｂ）同
平面図、同図（ｃ）は圧電片の図である。第４図（ａ）
（ｂ）（ｃ）、第５図（ａ）（ｂ）は他の超音波探触子
の従来例を説明する図である。 ３、46……圧電板、４……励振電極、20……バッキング
材、21……基台、22、33……分割基板、23……導電路、
30、41……連結部、31、32……共通導電路、34……フレ
キシブル基板、40……枠、42……圧電板、43……フレキ
付き圧電板。FIG. 1 is a diagram for explaining an embodiment of the first invention of the present invention.
FIG. 1A is a front view of the ultrasonic probe, FIG. 1B is a rear view thereof, FIG. 1C is a plan view thereof, and FIG. 1D is a diagram of a piezoelectric piece. 2 (a), (b), (c), and (d) are manufacturing process diagrams for explaining one embodiment of the second invention of the present invention. FIG. 3 is a diagram of an ultrasonic probe for explaining a conventional example of this kind. FIG. 3 (a) is a front view of the ultrasonic probe, FIG. 3 (b) is a plan view thereof, and FIG. ) Is a diagram of a piezoelectric piece. Figure 4 (a)
(B) (c), FIG. 5 (a) (b) is a figure explaining the conventional example of another ultrasonic probe. 3, 46 ... Piezoelectric plate, 4 ... Excitation electrode, 20 ... Backing material, 21 ... Base, 22, 33 ... Divided substrate, 23 ... Conductive path,
30, 41 ...... Coupling part, 31, 32 ...... Common conductive path, 34 …… Flexible substrate, 40 …… Frame, 42 …… Piezoelectric plate, 43 …… Flexible piezoelectric plate.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 梅田 和冶 埼玉県狭山市大字上広瀬1275番地 日本 電波工業株式会社狭山工場内 審査官 尾崎 淳史 (56)参考文献 特開 昭62−152438（ＪＰ，Ａ) 特開 昭57−60799（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kazumi Umeda 1275 Uehirose, Sayama City, Saitama Prefecture Saitama Plant, Japan Radio Industry Co., Ltd. Atsushi Ozaki (56) Reference JP 62-152438 (JP, JP, 152,438) A) JP-A-57-60799 (JP, A)
Claims (2)
形成された一方の主面を前記バッキング材上に固着して
湾曲方向に列設した複数の圧電片と、前記圧電片の一方
の主面の電極を導出するフレキシブルプリント基板を具
備した超音波探触子において、前記フレキシブルプリン
ト基板は前記圧電片の所定数を一グループとして一方の
主面の電極を前記圧電片の両側から前記グループ毎に交
互に導出する独立した分割基板を有するとともに、両側
においてそれぞれ隣接する分割基板は互いに間隙を有す
ることを特徴とする超音波探触子。1. A curved backing material, a plurality of piezoelectric pieces in which one main surface having electrodes on both main surfaces thereof is fixed on the backing material and arranged in a line in a curved direction, and one of the piezoelectric pieces. In the ultrasonic probe provided with a flexible printed circuit board for leading out electrodes on the main surface of the flexible printed circuit board, the flexible printed circuit board has a predetermined number of the piezoelectric pieces as a group and has electrodes on one main surface from both sides of the piezoelectric piece. An ultrasonic probe characterized in that it has independent divided substrates that are alternately lead out for each group, and that adjacent divided substrates on both sides have a gap between each other.
に反対方向の外側に複数の導電路が形成され、両側にお
いて互いに間隙を有する分割基板を交互に延出したフレ
キシブルプリント基板に、両主面に電極が形成された圧
電板の一方の主面の両端部を前記第１と第２の共通導電
路に接続して可撓性のバッキング材上に固着し、前記圧
電板と第１と第２の共通導電路を前記導電路間から一体
的に切断分割して前記バッキング材上に複数の圧電片を
形成し、前記バッキング材を湾曲させるとともに前記両
側の分割基板をそれぞれ該バッキング材側に折り曲げた
ことを特徴とする超音波探触子の製造方法。2. A flexible printed circuit board in which a plurality of conductive paths are formed outwardly in mutually opposite directions from first and second common line portions arranged in parallel, and divided substrates having a gap on both sides are alternately extended. Both ends of one main surface of the piezoelectric plate having electrodes formed on both main surfaces are connected to the first and second common conductive paths and fixed on a flexible backing material, and the piezoelectric plate and the The first and second common conductive paths are integrally cut and divided between the conductive paths to form a plurality of piezoelectric pieces on the backing material, the backing material is curved, and the divided substrates on both sides are respectively backed by the backing material. A method for manufacturing an ultrasonic probe, which is characterized in that it is bent to the material side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62267445A JP2555376B2 (en) | 1987-10-22 | 1987-10-22 | Ultrasonic probe and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62267445A JP2555376B2 (en) | 1987-10-22 | 1987-10-22 | Ultrasonic probe and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01109279A JPH01109279A (en) | 1989-04-26 |
| JP2555376B2 true JP2555376B2 (en) | 1996-11-20 |
Family
ID=17444943
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62267445A Expired - Fee Related JP2555376B2 (en) | 1987-10-22 | 1987-10-22 | Ultrasonic probe and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2555376B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11793489B2 (en) * | 2017-09-20 | 2023-10-24 | Olympus Corporation | Ultrasound endoscope with flexure relay substrate |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017199861A1 (en) | 2016-05-20 | 2017-11-23 | オリンパス株式会社 | Ultrasonic transducer module, ultrasonic endoscope, and method for manufacturing ultrasonic transducer module |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5760799A (en) * | 1980-09-29 | 1982-04-12 | Hitachi Medical Corp | Ultrasonic probe |
| JPS62152438A (en) * | 1985-12-27 | 1987-07-07 | 株式会社東芝 | Flexible electrode plate |
-
1987
- 1987-10-22 JP JP62267445A patent/JP2555376B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11793489B2 (en) * | 2017-09-20 | 2023-10-24 | Olympus Corporation | Ultrasound endoscope with flexure relay substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01109279A (en) | 1989-04-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0145429B1 (en) | Curvilinear array of ultrasonic transducers | |
| US4385255A (en) | Linear array ultrasonic transducer | |
| EP0872285A2 (en) | Composite transducer with connective backing block | |
| US20060071580A1 (en) | Ultrasonic transducer and manufacturing method thereof | |
| JPH07231890A (en) | Two-dimensional acoustic array and its production | |
| KR100666976B1 (en) | Ultrasonic probe and method for fabricating the probe | |
| JP2013501405A (en) | Ultrasonic imaging transducer acoustic stack with integrated electrical connections | |
| JPS5920240B2 (en) | Ultrasonic probe and method for manufacturing the ultrasonic probe | |
| JP2555376B2 (en) | Ultrasonic probe and method of manufacturing the same | |
| JP2517331B2 (en) | Ultrasonic probe | |
| JP2002359897A (en) | Array-type ultrasonic wave probe | |
| JPH09215095A (en) | Ultrasonic wave transducer and its manufacture | |
| JPH07274295A (en) | Ultrasonic probe and its manufacture | |
| JPH0614396A (en) | Ultrasonic probe | |
| JP3507696B2 (en) | Ultrasonic probe manufacturing method and ultrasonic probe | |
| JP2896819B2 (en) | Ultrasonic probe | |
| JPS63212299A (en) | Ultrasonic wave probe and its production | |
| JPH01146499A (en) | Supersonic wave probe | |
| JP2945978B2 (en) | Array type ultrasonic probe | |
| JPH03207350A (en) | Ultrasonic probe | |
| JP2589542B2 (en) | Array type ultrasonic probe | |
| JP2004328099A (en) | Conductive board and ultrasonic probe employing the same | |
| JP3248924B2 (en) | Ultrasonic probe manufacturing method | |
| JP3363999B2 (en) | Ultrasonic transducer | |
| JP3469095B2 (en) | Ultrasonic probe manufacturing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |